JP2016512398A5 - - Google Patents

Download PDF

Info

Publication number
JP2016512398A5
JP2016512398A5 JP2016502480A JP2016502480A JP2016512398A5 JP 2016512398 A5 JP2016512398 A5 JP 2016512398A5 JP 2016502480 A JP2016502480 A JP 2016502480A JP 2016502480 A JP2016502480 A JP 2016502480A JP 2016512398 A5 JP2016512398 A5 JP 2016512398A5
Authority
JP
Japan
Prior art keywords
substrate
load lock
carousel
substrates
double width
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2016502480A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016512398A (ja
JP6703937B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2014/027567 external-priority patent/WO2014143662A1/en
Publication of JP2016512398A publication Critical patent/JP2016512398A/ja
Publication of JP2016512398A5 publication Critical patent/JP2016512398A5/ja
Application granted granted Critical
Publication of JP6703937B2 publication Critical patent/JP6703937B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2016502480A 2013-03-15 2014-03-14 基板堆積システム、ロボット移送装置、及び電子デバイス製造のための方法 Active JP6703937B2 (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US201361787117P 2013-03-15 2013-03-15
US61/787,117 2013-03-15
US201361868795P 2013-08-22 2013-08-22
US61/868,795 2013-08-22
US201361879076P 2013-09-17 2013-09-17
US61/879,076 2013-09-17
PCT/US2014/027567 WO2014143662A1 (en) 2013-03-15 2014-03-14 Substrate deposition systems, robot transfer apparatus, and methods for electronic device manufacturing

Publications (3)

Publication Number Publication Date
JP2016512398A JP2016512398A (ja) 2016-04-25
JP2016512398A5 true JP2016512398A5 (https=) 2017-04-27
JP6703937B2 JP6703937B2 (ja) 2020-06-03

Family

ID=51527659

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016502480A Active JP6703937B2 (ja) 2013-03-15 2014-03-14 基板堆積システム、ロボット移送装置、及び電子デバイス製造のための方法

Country Status (6)

Country Link
US (2) US10427303B2 (https=)
JP (1) JP6703937B2 (https=)
KR (2) KR20210014778A (https=)
CN (2) CN105164799B (https=)
TW (1) TWI614102B (https=)
WO (1) WO2014143662A1 (https=)

Families Citing this family (68)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102326244B (zh) 2009-01-11 2014-12-17 应用材料公司 用于在电子器件制造中传输基板的机械手系统、装置及方法
CN104428884B (zh) * 2012-07-05 2017-10-24 应用材料公司 吊杆驱动装置、多臂机械手装置、电子器件处理系统及用于在电子器件制造系统中传送基板的方法
US9190306B2 (en) * 2012-11-30 2015-11-17 Lam Research Corporation Dual arm vacuum robot
CN103192384B (zh) * 2013-03-11 2015-08-19 上海交通大学 一种集成旋转变压器的静态真空轴系装置
TWI624897B (zh) 2013-03-15 2018-05-21 Applied Materials, Inc. 多位置批次負載鎖定裝置與系統,以及包括該裝置與系統的方法
WO2014157358A1 (ja) * 2013-03-28 2014-10-02 株式会社日立国際電気 基板処理装置、半導体装置の製造方法及び記録媒体
CN105580124B (zh) 2013-09-26 2018-05-18 应用材料公司 用于基板处理的混合平台式设备、系统以及方法
KR102323370B1 (ko) 2014-01-05 2021-11-05 어플라이드 머티어리얼스, 인코포레이티드 전자 디바이스 제조에서 기판들을 운송하기 위한 로봇 장치, 구동 조립체들, 및 방법들
CN106463438B (zh) * 2014-01-28 2019-09-10 布鲁克斯自动化公司 基板运输设备
KR20170084240A (ko) 2014-11-14 2017-07-19 마퍼 리쏘그라피 아이피 비.브이. 리소그래피 시스템에서 기판을 이송하기 위한 로드 로크 시스템 및 방법
WO2016172003A1 (en) * 2015-04-20 2016-10-27 Applied Materials, Inc. Buffer chamber wafer heating mechanism and supporting robot
US9799544B2 (en) 2015-10-23 2017-10-24 Applied Materials, Inc. Robot assemblies, substrate processing apparatus, and methods for transporting substrates in electronic device manufacturing
CN105702607B (zh) * 2016-03-17 2018-09-25 东方晶源微电子科技(北京)有限公司 机械臂和检查系统
TWI707754B (zh) 2016-06-28 2020-10-21 美商應用材料股份有限公司 包括間隔上臂與交錯腕部的雙機器人以及包括該者之方法
US10099377B2 (en) 2016-06-29 2018-10-16 Applied Materials, Inc. Methods and systems providing misalignment correction in robots
US11270904B2 (en) * 2016-07-12 2022-03-08 Brooks Automation Us, Llc Substrate processing apparatus
US10186449B2 (en) 2016-12-31 2019-01-22 Applied Materials, Inc. Apparatus and methods for wafer rotation to improve spatial ALD process uniformity
TW202412162A (zh) * 2017-02-07 2024-03-16 美商布魯克斯自動機械美國公司 基材運送方法及設備
US10580682B2 (en) * 2017-02-15 2020-03-03 Persimmon Technologies, Corp. Material-handling robot with multiple end-effectors
US10224224B2 (en) 2017-03-10 2019-03-05 Micromaterials, LLC High pressure wafer processing systems and related methods
JP6881010B2 (ja) * 2017-05-11 2021-06-02 東京エレクトロン株式会社 真空処理装置
US10622214B2 (en) 2017-05-25 2020-04-14 Applied Materials, Inc. Tungsten defluorination by high pressure treatment
US10361099B2 (en) * 2017-06-23 2019-07-23 Applied Materials, Inc. Systems and methods of gap calibration via direct component contact in electronic device manufacturing systems
JP6947914B2 (ja) 2017-08-18 2021-10-13 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated 高圧高温下のアニールチャンバ
US10276411B2 (en) 2017-08-18 2019-04-30 Applied Materials, Inc. High pressure and high temperature anneal chamber
CN111095524B (zh) 2017-09-12 2023-10-03 应用材料公司 用于使用保护阻挡物层制造半导体结构的设备和方法
US10453725B2 (en) 2017-09-19 2019-10-22 Applied Materials, Inc. Dual-blade robot including vertically offset horizontally overlapping frog-leg linkages and systems and methods including same
KR102585074B1 (ko) 2017-11-11 2023-10-04 마이크로머티어리얼즈 엘엘씨 고압 프로세싱 챔버를 위한 가스 전달 시스템
SG11202003438QA (en) 2017-11-16 2020-05-28 Applied Materials Inc High pressure steam anneal processing apparatus
JP2021503714A (ja) 2017-11-17 2021-02-12 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated 高圧処理システムのためのコンデンサシステム
CN111902929B (zh) 2018-03-09 2025-09-19 应用材料公司 用于含金属材料的高压退火处理
US10950429B2 (en) 2018-05-08 2021-03-16 Applied Materials, Inc. Methods of forming amorphous carbon hard mask layers and hard mask layers formed therefrom
US10943805B2 (en) * 2018-05-18 2021-03-09 Applied Materials, Inc. Multi-blade robot apparatus, electronic device manufacturing apparatus, and methods adapted to transport multiple substrates in electronic device manufacturing
TWI680532B (zh) * 2018-07-04 2019-12-21 環球晶圓股份有限公司 製程設備及其晶圓承載盤
US10748783B2 (en) 2018-07-25 2020-08-18 Applied Materials, Inc. Gas delivery module
US10675581B2 (en) 2018-08-06 2020-06-09 Applied Materials, Inc. Gas abatement apparatus
JP7183635B2 (ja) * 2018-08-31 2022-12-06 東京エレクトロン株式会社 基板搬送機構、基板処理装置及び基板搬送方法
JP7231721B2 (ja) * 2018-10-04 2023-03-01 アプライド マテリアルズ インコーポレイテッド 搬送システム
WO2020117462A1 (en) 2018-12-07 2020-06-11 Applied Materials, Inc. Semiconductor processing system
US10998209B2 (en) 2019-05-31 2021-05-04 Applied Materials, Inc. Substrate processing platforms including multiple processing chambers
US11850742B2 (en) 2019-06-07 2023-12-26 Applied Materials, Inc. Dual robot including splayed end effectors and systems and methods including same
CN110255156A (zh) * 2019-06-29 2019-09-20 苏州精濑光电有限公司 一种中转装置
KR102240925B1 (ko) * 2019-07-17 2021-04-15 세메스 주식회사 기판 처리 설비 및 기판 반송 장치
TWI797461B (zh) * 2019-07-26 2023-04-01 日商新川股份有限公司 封裝裝置
CN112582318B (zh) * 2019-09-30 2025-07-25 沈阳芯源微电子设备股份有限公司 涂胶显影设备
EP4022239A1 (en) 2019-10-03 2022-07-06 LPE S.p.A. Treating arrangement with loading/unloading group and epitaxial reactor
US12522949B2 (en) 2019-10-03 2026-01-13 Lpe S.P.A. Treating arrangement with storage chamber and epitaxial reactor
WO2021064650A1 (en) 2019-10-03 2021-04-08 Lpe S.P.A. Treating arrangement with transfer chamber and epitaxial reactor
US11901222B2 (en) 2020-02-17 2024-02-13 Applied Materials, Inc. Multi-step process for flowable gap-fill film
US11557496B2 (en) * 2020-03-23 2023-01-17 Applied Materials, Inc. Load lock with integrated features
CN113829377B (zh) * 2020-06-24 2023-08-18 拓荆科技股份有限公司 一种衬底的装载和拾取装置及衬底的装载和拾取方法
US12080571B2 (en) 2020-07-08 2024-09-03 Applied Materials, Inc. Substrate processing module and method of moving a workpiece
US11817331B2 (en) 2020-07-27 2023-11-14 Applied Materials, Inc. Substrate holder replacement with protective disk during pasting process
US11749542B2 (en) 2020-07-27 2023-09-05 Applied Materials, Inc. Apparatus, system, and method for non-contact temperature monitoring of substrate supports
US11600507B2 (en) 2020-09-09 2023-03-07 Applied Materials, Inc. Pedestal assembly for a substrate processing chamber
US11610799B2 (en) 2020-09-18 2023-03-21 Applied Materials, Inc. Electrostatic chuck having a heating and chucking capabilities
CN112249685B (zh) * 2020-10-27 2022-04-01 光驰科技(上海)有限公司 进行基板快速交互搬送的机构及其搬送方法
US11996307B2 (en) * 2020-12-23 2024-05-28 Applied Materials, Inc. Semiconductor processing tool platform configuration with reduced footprint
US12195314B2 (en) 2021-02-02 2025-01-14 Applied Materials, Inc. Cathode exchange mechanism to improve preventative maintenance time for cluster system
US11674227B2 (en) 2021-02-03 2023-06-13 Applied Materials, Inc. Symmetric pump down mini-volume with laminar flow cavity gas injection for high and low pressure
US11358809B1 (en) * 2021-03-01 2022-06-14 Applied Materials, Inc. Vacuum robot apparatus for variable pitch access
US12002668B2 (en) 2021-06-25 2024-06-04 Applied Materials, Inc. Thermal management hardware for uniform temperature control for enhanced bake-out for cluster tool
WO2023129142A1 (en) * 2021-12-28 2023-07-06 Applied Materials, Inc. Electronic device manufacturing systems having paired deposition chambers for enhanced deposition uniformity
KR102431664B1 (ko) * 2022-02-15 2022-08-12 (주) 티로보틱스 진공 챔버에서 기판을 이송하기 위한 기판 이송 로봇
KR102431679B1 (ko) * 2022-02-15 2022-08-12 (주) 티로보틱스 진공 챔버에서 기판을 이송하기 위한 기판 이송 로봇
US20250002268A1 (en) * 2023-06-29 2025-01-02 Kabushiki Kaisha Yaskawa Denki Apparatus and method for optimizing swap time
TW202539833A (zh) * 2023-09-28 2025-10-16 荷蘭商Asm Ip私人控股有限公司 基板搬運腔室前驅體及製造基板搬運腔室之方法
KR102729360B1 (ko) 2024-08-16 2024-11-13 (주) 티로보틱스 진공 챔버 내에서 기판을 이송하는 기판 이송 장치

Family Cites Families (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5447409A (en) 1989-10-20 1995-09-05 Applied Materials, Inc. Robot assembly
US20040005211A1 (en) 1996-02-28 2004-01-08 Lowrance Robert B. Multiple independent robot assembly and apparatus and control system for processing and transferring semiconductor wafers
US5789878A (en) 1996-07-15 1998-08-04 Applied Materials, Inc. Dual plane robot
US6722834B1 (en) 1997-10-08 2004-04-20 Applied Materials, Inc. Robot blade with dual offset wafer supports
US6267549B1 (en) 1998-06-02 2001-07-31 Applied Materials, Inc. Dual independent robot blades with minimal offset
US6582175B2 (en) 2000-04-14 2003-06-24 Applied Materials, Inc. Robot for handling semiconductor wafers
US6379095B1 (en) 2000-04-14 2002-04-30 Applied Materials, Inc. Robot for handling semiconductor wafers
JP2002158272A (ja) * 2000-11-17 2002-05-31 Tatsumo Kk ダブルアーム基板搬送装置
US20020098072A1 (en) 2001-01-19 2002-07-25 Applied Materials, Inc. Dual bladed robot apparatus and associated method
US7891935B2 (en) * 2002-05-09 2011-02-22 Brooks Automation, Inc. Dual arm robot
JP2004282002A (ja) * 2003-02-27 2004-10-07 Tokyo Electron Ltd 基板処理装置及び基板処理方法
JP4411025B2 (ja) * 2003-07-11 2010-02-10 株式会社ダイヘン 2アーム式搬送ロボット
JP2004080053A (ja) 2003-11-07 2004-03-11 Hitachi Kokusai Electric Inc 半導体製造装置
US8376685B2 (en) * 2004-06-09 2013-02-19 Brooks Automation, Inc. Dual scara arm
CN1942288B (zh) 2005-02-12 2010-12-22 应用材料公司 一种多轴真空电机组件
US20060231388A1 (en) 2005-04-14 2006-10-19 Ravi Mullapudi Multi-station sputtering and cleaning system
TWI342597B (en) * 2005-11-21 2011-05-21 Applied Materials Inc Methods and apparatus for transferring substrates during electronic device manufacturing
KR20080004118A (ko) 2006-07-04 2008-01-09 피에스케이 주식회사 기판 처리 설비
CN101535010B (zh) 2006-08-11 2013-02-27 应用材料公司 用于机械手肘关节组件的方法和装置
WO2008150484A1 (en) 2007-05-31 2008-12-11 Applied Materials, Inc. Methods and apparatus for extending the reach of a dual scara robot linkage
KR100850436B1 (ko) 2007-06-20 2008-08-05 주식회사 싸이맥스 반도체 제조설비
US20090194026A1 (en) 2008-01-31 2009-08-06 Burrows Brian H Processing system for fabricating compound nitride semiconductor devices
US8777547B2 (en) 2009-01-11 2014-07-15 Applied Materials, Inc. Systems, apparatus and methods for transporting substrates
CN102326244B (zh) 2009-01-11 2014-12-17 应用材料公司 用于在电子器件制造中传输基板的机械手系统、装置及方法
US8264187B2 (en) 2009-01-11 2012-09-11 Applied Materials, Inc. Systems, apparatus and methods for making an electrical connection
TWI394224B (zh) 2009-02-24 2013-04-21 Intevac Inc 載送及處理基板之裝置與方法
JP2011077399A (ja) 2009-09-30 2011-04-14 Tokyo Electron Ltd 被処理体の搬送方法及び被処理体処理装置
JP5314765B2 (ja) 2009-11-09 2013-10-16 東京エレクトロン株式会社 基板処理装置及び基板処理装置の制御方法
JP5518550B2 (ja) * 2010-04-12 2014-06-11 東京エレクトロン株式会社 被処理体処理装置
JP2013544034A (ja) * 2010-11-10 2013-12-09 ブルックス オートメーション インコーポレイテッド 双腕ロボット
JP2011139074A (ja) * 2011-01-07 2011-07-14 Applied Materials Inc 基板の破損及び移動中の基板のずれを動的に検出するセンサ
WO2012125572A2 (en) * 2011-03-11 2012-09-20 Brooks Automation, Inc. Substrate processing tool
JP5940342B2 (ja) * 2011-07-15 2016-06-29 東京エレクトロン株式会社 基板搬送装置、基板処理システムおよび基板搬送方法、ならびに記憶媒体
US9076829B2 (en) 2011-08-08 2015-07-07 Applied Materials, Inc. Robot systems, apparatus, and methods adapted to transport substrates in electronic device manufacturing
US9076830B2 (en) 2011-11-03 2015-07-07 Applied Materials, Inc. Robot systems and apparatus adapted to transport dual substrates in electronic device manufacturing with wrist drive motors mounted to upper arm
US9202733B2 (en) * 2011-11-07 2015-12-01 Persimmon Technologies Corporation Robot system with independent arms
US20130149076A1 (en) 2011-12-12 2013-06-13 Applied Materials, Inc. Fully-independent robot systems, apparatus, and methods adapted to transport multiple substrates in electronic device manufacturing
TWI615341B (zh) * 2011-12-16 2018-02-21 Brooks Automation, Inc. 輸送設備
TWI629743B (zh) * 2012-02-10 2018-07-11 布魯克斯自動機械公司 基材處理設備
CN104428884B (zh) 2012-07-05 2017-10-24 应用材料公司 吊杆驱动装置、多臂机械手装置、电子器件处理系统及用于在电子器件制造系统中传送基板的方法
WO2014085479A1 (en) * 2012-11-30 2014-06-05 Applied Materials, Inc Multi-axis robot apparatus with unequal length forearms, electronic device manufacturing systems, and methods for transporting substrates in electronic device manufacturing
US9190306B2 (en) * 2012-11-30 2015-11-17 Lam Research Corporation Dual arm vacuum robot
US9281222B2 (en) * 2013-03-15 2016-03-08 Applied Materials, Inc. Wafer handling systems and methods
US9245783B2 (en) 2013-05-24 2016-01-26 Novellus Systems, Inc. Vacuum robot with linear translation carriage
US10157763B2 (en) * 2013-08-29 2018-12-18 Varian Semiconductor Equipment Associates, Inc. High throughput substrate handling endstation and sequence

Similar Documents

Publication Publication Date Title
JP2016512398A5 (https=)
JP2017108112A5 (https=)
CN1711369B (zh) 用于真空处理两维加长基片的装置及加工这种基片的方法
US8741064B2 (en) Heat treatment method and heat treatment apparatus
JP6972852B2 (ja) 真空搬送モジュール及び基板処理装置
US9717147B2 (en) Electronic device manufacturing system
WO2009050849A1 (ja) 基板処理装置
TW201546930A (zh) 具有多站處理及前處理及/或後處理站之緊密的基板處理工具
US20140216658A1 (en) Vacuum processing device
KR20150131117A (ko) 기판 증착 시스템, 로봇 이송 장치, 및 전자 디바이스 제조 방법
WO2008039943A3 (en) Wafer processing system with dual wafer robots capable of asynchronous motion
JP2013513239A5 (https=)
TWI345817B (en) Cartesian robot cluster tool architecture
KR20130000333A (ko) 듀얼 웨이퍼 트랜스포트에서 웨이퍼 포지셔닝 방법, 듀얼 웨이퍼―처리 유니트 및 듀얼 웨이퍼-처리 장치
JP2010153808A5 (ja) 基板処理装置及び半導体装置の製造方法
JP2012518902A5 (https=)
JP2009545171A (ja) 八角形搬送チャンバ
US20150228520A1 (en) Substrate Transfer Robot and Substrate Processing Apparatus Using The Same
KR20210027503A (ko) 워크피스 처리를 위한 시스템 및 방법
RU2017106187A (ru) Робот и робототехническая система
JP2016172881A5 (https=)
US9962840B2 (en) Substrate conveyance apparatus
CN106078676A (zh) 工业用机器人以及制造系统
JP2012182458A5 (https=)
TWI464284B (zh) 濺鍍裝置及濺鍍方法