KR102214394B1 - 기판 증착 시스템, 로봇 이송 장치, 및 전자 디바이스 제조 방법 - Google Patents

기판 증착 시스템, 로봇 이송 장치, 및 전자 디바이스 제조 방법 Download PDF

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KR102214394B1
KR102214394B1 KR1020157028049A KR20157028049A KR102214394B1 KR 102214394 B1 KR102214394 B1 KR 102214394B1 KR 1020157028049 A KR1020157028049 A KR 1020157028049A KR 20157028049 A KR20157028049 A KR 20157028049A KR 102214394 B1 KR102214394 B1 KR 102214394B1
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South Korea
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end effector
coupled
facet
upper arm
height
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KR20150131117A (ko
Inventor
윌리엄 티. 위버
말콤 엔. 주니어 다니엘
로버트 비. 보팻
제이슨 엠. 샬러
제이콥 뉴맨
디네쉬 카나와데
앤드류 제이. 콘스탄트
스티븐 씨. 히커슨
제프리 씨. 허진스
마빈 엘. 프리맨
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어플라이드 머티어리얼스, 인코포레이티드
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    • H01L21/67742—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/02—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • B25J9/043—Cylindrical coordinate type comprising an articulated arm double selective compliance articulated robot arms [SCARA]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/16—Program controls
    • B25J9/1679—Program controls characterised by the tasks executed
    • B25J9/1682—Dual arm manipulator; Coordination of several manipulators
    • H01L21/67161—
    • H01L21/6719—
    • H01L21/67196—
    • H01L21/67201—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0466—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S901/00—Robots
    • Y10S901/27—Arm part
    • Y10S901/28—Joint
    • Y10S901/29—Wrist
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T74/00—Machine element or mechanism
    • Y10T74/20—Control lever and linkage systems
    • Y10T74/20207—Multiple controlling elements for single controlled element
    • Y10T74/20305—Robotic arm

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
KR1020157028049A 2013-03-15 2014-03-14 기판 증착 시스템, 로봇 이송 장치, 및 전자 디바이스 제조 방법 Active KR102214394B1 (ko)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US201361787117P 2013-03-15 2013-03-15
US61/787,117 2013-03-15
US201361868795P 2013-08-22 2013-08-22
US61/868,795 2013-08-22
US201361879076P 2013-09-17 2013-09-17
US61/879,076 2013-09-17
PCT/US2014/027567 WO2014143662A1 (en) 2013-03-15 2014-03-14 Substrate deposition systems, robot transfer apparatus, and methods for electronic device manufacturing

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020217003363A Division KR20210014778A (ko) 2013-03-15 2014-03-14 기판 증착 시스템, 로봇 이송 장치, 및 전자 디바이스 제조 방법

Publications (2)

Publication Number Publication Date
KR20150131117A KR20150131117A (ko) 2015-11-24
KR102214394B1 true KR102214394B1 (ko) 2021-02-08

Family

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KR1020157028049A Active KR102214394B1 (ko) 2013-03-15 2014-03-14 기판 증착 시스템, 로봇 이송 장치, 및 전자 디바이스 제조 방법
KR1020217003363A Ceased KR20210014778A (ko) 2013-03-15 2014-03-14 기판 증착 시스템, 로봇 이송 장치, 및 전자 디바이스 제조 방법

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Country Status (6)

Country Link
US (2) US10427303B2 (https=)
JP (1) JP6703937B2 (https=)
KR (2) KR102214394B1 (https=)
CN (2) CN111489987A (https=)
TW (1) TWI614102B (https=)
WO (1) WO2014143662A1 (https=)

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US20190375105A1 (en) 2019-12-12
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