JP6703937B2 - 基板堆積システム、ロボット移送装置、及び電子デバイス製造のための方法 - Google Patents

基板堆積システム、ロボット移送装置、及び電子デバイス製造のための方法 Download PDF

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Publication number
JP6703937B2
JP6703937B2 JP2016502480A JP2016502480A JP6703937B2 JP 6703937 B2 JP6703937 B2 JP 6703937B2 JP 2016502480 A JP2016502480 A JP 2016502480A JP 2016502480 A JP2016502480 A JP 2016502480A JP 6703937 B2 JP6703937 B2 JP 6703937B2
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Japan
Prior art keywords
end effector
scara
upper arm
height
electronic device
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Japanese (ja)
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JP2016512398A (ja
JP2016512398A5 (https=
Inventor
ウィリアム ティー. ウィーバー,
ウィリアム ティー. ウィーバー,
ジュニア, マルコム エヌ. ダニエル
ジュニア, マルコム エヌ. ダニエル
ロバート ビー. ヴォパト,
ロバート ビー. ヴォパト,
ジェーソン エム. シャーラー,
ジェーソン エム. シャーラー,
ジェイコブ ニューマン,
ジェイコブ ニューマン,
ディネーシュ カナワデ,
ディネーシュ カナワデ,
アンドリュー ジェー. コンスタント,
アンドリュー ジェー. コンスタント,
スティーヴン シー. ヒッカーソン,
スティーヴン シー. ヒッカーソン,
ジェフリー シー. ハジェンズ,
ジェフリー シー. ハジェンズ,
マーヴィン エル. フリーマン,
マーヴィン エル. フリーマン,
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Applied Materials Inc
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Applied Materials Inc
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25JMANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00Manipulators not otherwise provided for
    • B25J11/0095Manipulators transporting wafers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25JMANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00Program-controlled manipulators
    • B25J9/02Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041Cylindrical coordinate type
    • B25J9/042Cylindrical coordinate type comprising an articulated arm
    • B25J9/043Cylindrical coordinate type comprising an articulated arm double selective compliance articulated robot arms [SCARA]
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25JMANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00Program-controlled manipulators
    • B25J9/16Program controls
    • B25J9/1679Program controls characterised by the tasks executed
    • B25J9/1682Dual arm manipulator; Coordination of several manipulators
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04Apparatus for manufacture or treatment
    • H10P72/0451Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04Apparatus for manufacture or treatment
    • H10P72/0451Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04Apparatus for manufacture or treatment
    • H10P72/0451Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04Apparatus for manufacture or treatment
    • H10P72/0451Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0466Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the load-lock chamber
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302Mechanical parts of transfer devices
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S901/00Robots
    • Y10S901/27Arm part
    • Y10S901/28Joint
    • Y10S901/29Wrist
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T74/00Machine element or mechanism
    • Y10T74/20Control lever and linkage systems
    • Y10T74/20207Multiple controlling elements for single controlled element
    • Y10T74/20305Robotic arm

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
JP2016502480A 2013-03-15 2014-03-14 基板堆積システム、ロボット移送装置、及び電子デバイス製造のための方法 Active JP6703937B2 (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US201361787117P 2013-03-15 2013-03-15
US61/787,117 2013-03-15
US201361868795P 2013-08-22 2013-08-22
US61/868,795 2013-08-22
US201361879076P 2013-09-17 2013-09-17
US61/879,076 2013-09-17
PCT/US2014/027567 WO2014143662A1 (en) 2013-03-15 2014-03-14 Substrate deposition systems, robot transfer apparatus, and methods for electronic device manufacturing

Publications (3)

Publication Number Publication Date
JP2016512398A JP2016512398A (ja) 2016-04-25
JP2016512398A5 JP2016512398A5 (https=) 2017-04-27
JP6703937B2 true JP6703937B2 (ja) 2020-06-03

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JP2016502480A Active JP6703937B2 (ja) 2013-03-15 2014-03-14 基板堆積システム、ロボット移送装置、及び電子デバイス製造のための方法

Country Status (6)

Country Link
US (2) US10427303B2 (https=)
JP (1) JP6703937B2 (https=)
KR (2) KR20210014778A (https=)
CN (2) CN105164799B (https=)
TW (1) TWI614102B (https=)
WO (1) WO2014143662A1 (https=)

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CN105164799B (zh) 2020-04-07
KR102214394B1 (ko) 2021-02-08
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JP2016512398A (ja) 2016-04-25
TW201438858A (zh) 2014-10-16
WO2014143662A1 (en) 2014-09-18
TWI614102B (zh) 2018-02-11
CN111489987A (zh) 2020-08-04
KR20210014778A (ko) 2021-02-09
US20190375105A1 (en) 2019-12-12
US10427303B2 (en) 2019-10-01
CN105164799A (zh) 2015-12-16

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