JP2015521800A5 - - Google Patents

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Publication number
JP2015521800A5
JP2015521800A5 JP2015518590A JP2015518590A JP2015521800A5 JP 2015521800 A5 JP2015521800 A5 JP 2015521800A5 JP 2015518590 A JP2015518590 A JP 2015518590A JP 2015518590 A JP2015518590 A JP 2015518590A JP 2015521800 A5 JP2015521800 A5 JP 2015521800A5
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JP
Japan
Prior art keywords
mol
metal layer
imaged metal
circuit board
coverlay
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2015518590A
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English (en)
Japanese (ja)
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JP2015521800A (ja
JP6258931B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2013/046941 external-priority patent/WO2013192474A1/en
Publication of JP2015521800A publication Critical patent/JP2015521800A/ja
Publication of JP2015521800A5 publication Critical patent/JP2015521800A5/ja
Application granted granted Critical
Publication of JP6258931B2 publication Critical patent/JP6258931B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2015518590A 2012-06-22 2013-06-21 回路基板 Expired - Fee Related JP6258931B2 (ja)

Applications Claiming Priority (11)

Application Number Priority Date Filing Date Title
US201261663270P 2012-06-22 2012-06-22
US201261663291P 2012-06-22 2012-06-22
US201261663258P 2012-06-22 2012-06-22
US201261663254P 2012-06-22 2012-06-22
US201261663280P 2012-06-22 2012-06-22
US61/663,270 2012-06-22
US61/663,254 2012-06-22
US61/663,280 2012-06-22
US61/663,258 2012-06-22
US61/663,291 2012-06-22
PCT/US2013/046941 WO2013192474A1 (en) 2012-06-22 2013-06-21 Circuit board

Publications (3)

Publication Number Publication Date
JP2015521800A JP2015521800A (ja) 2015-07-30
JP2015521800A5 true JP2015521800A5 (enExample) 2016-06-16
JP6258931B2 JP6258931B2 (ja) 2018-01-10

Family

ID=48746133

Family Applications (8)

Application Number Title Priority Date Filing Date
JP2015518585A Expired - Fee Related JP6139676B2 (ja) 2012-06-22 2013-06-21 回路基板
JP2015518586A Expired - Fee Related JP6105724B2 (ja) 2012-06-22 2013-06-21 ポリイミド金属張積層体
JP2015518588A Expired - Fee Related JP6100892B2 (ja) 2012-06-22 2013-06-21 ポリイミド金属張積層体
JP2015518590A Expired - Fee Related JP6258931B2 (ja) 2012-06-22 2013-06-21 回路基板
JP2015518589A Expired - Fee Related JP6258930B2 (ja) 2012-06-22 2013-06-21 回路基板
JP2015518592A Expired - Fee Related JP6114387B2 (ja) 2012-06-22 2013-06-21 回路基板
JP2015518587A Pending JP2015523730A (ja) 2012-06-22 2013-06-21 回路基板
JP2015518584A Pending JP2015528204A (ja) 2012-06-22 2013-06-21 回路基板

Family Applications Before (3)

Application Number Title Priority Date Filing Date
JP2015518585A Expired - Fee Related JP6139676B2 (ja) 2012-06-22 2013-06-21 回路基板
JP2015518586A Expired - Fee Related JP6105724B2 (ja) 2012-06-22 2013-06-21 ポリイミド金属張積層体
JP2015518588A Expired - Fee Related JP6100892B2 (ja) 2012-06-22 2013-06-21 ポリイミド金属張積層体

Family Applications After (4)

Application Number Title Priority Date Filing Date
JP2015518589A Expired - Fee Related JP6258930B2 (ja) 2012-06-22 2013-06-21 回路基板
JP2015518592A Expired - Fee Related JP6114387B2 (ja) 2012-06-22 2013-06-21 回路基板
JP2015518587A Pending JP2015523730A (ja) 2012-06-22 2013-06-21 回路基板
JP2015518584A Pending JP2015528204A (ja) 2012-06-22 2013-06-21 回路基板

Country Status (5)

Country Link
US (8) US20150147567A1 (enExample)
EP (8) EP2865251A1 (enExample)
JP (8) JP6139676B2 (enExample)
CN (8) CN104541587B (enExample)
WO (6) WO2013192467A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI481649B (zh) * 2013-09-09 2015-04-21 Taimide Technology Inc 黑色聚醯亞胺膜及其加工方法
WO2016093816A1 (en) * 2014-12-10 2016-06-16 E. I. Du Pont De Nemours And Company A multilayer film
JP6237706B2 (ja) * 2015-06-05 2017-11-29 富士通オプティカルコンポーネンツ株式会社 光モジュール及び光送受信装置
KR102229738B1 (ko) * 2015-08-21 2021-03-18 아사히 가세이 가부시키가이샤 감광성 수지 조성물, 폴리이미드의 제조 방법 및 반도체 장치
US11021606B2 (en) * 2017-09-13 2021-06-01 E I Du Pont De Nemours And Company Multilayer film for electronic circuitry applications
JP7520338B2 (ja) * 2018-10-19 2024-07-23 ユニチカ株式会社 積層フィルム
KR20230017760A (ko) * 2020-05-29 2023-02-06 도요보 가부시키가이샤 투명 고내열 필름을 포함하는 적층체
US12441084B2 (en) 2021-10-20 2025-10-14 Unison Industries, Llc Thermal insulation system

Family Cites Families (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4709468A (en) * 1986-01-31 1987-12-01 Texas Instruments Incorporated Method for producing an integrated circuit product having a polyimide film interconnection structure
JPH11333376A (ja) * 1997-06-23 1999-12-07 Unitika Ltd ポリイミド前駆体溶液並びにそれから得られる塗膜及びその製造方法
KR20000035259A (ko) * 1998-11-05 2000-06-26 다케다 마사토시 폴리이미드 필름 및 이를 사용한 전기/전자 기기용 기판
WO2004094499A1 (ja) 2003-04-18 2004-11-04 Kaneka Corporation 熱硬化性樹脂組成物、それを用いてなる積層体、回路基板
JP2005166828A (ja) * 2003-12-01 2005-06-23 Nitto Denko Corp 両面配線基板用積層体及びその製造方法
JP4031756B2 (ja) * 2003-12-22 2008-01-09 日東電工株式会社 配線回路基板
US7316791B2 (en) * 2003-12-30 2008-01-08 E.I. Du Pont De Nemours And Company Polyimide based substrate comprising doped polyaniline
US7495887B2 (en) * 2004-12-21 2009-02-24 E.I. Du Pont De Nemours And Company Capacitive devices, organic dielectric laminates, and printed wiring boards incorporating such devices, and methods of making thereof
JP2006206756A (ja) * 2005-01-28 2006-08-10 Sony Chem Corp ポリイミド化合物及びフレキシブル配線板
WO2006114901A1 (ja) * 2005-04-18 2006-11-02 Toyo Boseki Kabushiki Kaisha 薄膜積層ポリイミドフィルム及びフレキシブルプリント配線板
TWI286148B (en) * 2005-05-30 2007-09-01 Chang Chun Plastics Co Ltd Novel polyimide resin and its preparation method
US7550194B2 (en) * 2005-08-03 2009-06-23 E. I. Du Pont De Nemours And Company Low color polyimide compositions useful in optical type applications and methods and compositions relating thereto
KR101045149B1 (ko) * 2005-08-04 2011-06-30 가부시키가이샤 가네카 금속 피복 폴리이미드 필름
KR20070058812A (ko) * 2005-12-05 2007-06-11 주식회사 코오롱 폴리이미드 필름
JP2007268917A (ja) * 2006-03-31 2007-10-18 Kurabo Ind Ltd 熱可塑性ポリイミド層を有するフレキシブル積層板及びその製造方法
JP5119401B2 (ja) * 2007-02-01 2013-01-16 倉敷紡績株式会社 熱可塑性ポリイミド層を有するフレキシブル積層板及びその製造方法
KR20090004894A (ko) * 2006-03-31 2009-01-12 구라시키 보세키 가부시키가이샤 열가소성 폴리이미드층을 갖는 연성 적층판 및 그의 제조 방법
CN101484500A (zh) * 2006-07-06 2009-07-15 东丽株式会社 热塑性聚酰亚胺、使用该聚酰亚胺的层合聚酰亚胺薄膜以及金属箔层合聚酰亚胺薄膜
WO2008004496A1 (fr) * 2006-07-06 2008-01-10 Toray Industries, Inc. Polyimide thermoplastique, film de polyimide laminé et film de polyimide laminé sur feuille métallique utilisant ledit polyimide thermoplastique
WO2008091011A1 (ja) * 2007-01-26 2008-07-31 Honshu Chemical Industry Co., Ltd. 新規なエステル基含有テトラカルボン酸二無水物類、それから誘導される新規なポリエステルイミド前駆体及びポリエステルイミド
JP4888719B2 (ja) * 2007-07-13 2012-02-29 東レ・デュポン株式会社 銅張り板
JP5383343B2 (ja) * 2008-06-26 2014-01-08 新日鉄住金化学株式会社 白色ポリイミドフィルム
JP5524475B2 (ja) * 2008-11-28 2014-06-18 株式会社有沢製作所 ２層両面フレキシブル金属積層板及びその製造方法
JP2010195983A (ja) * 2009-02-26 2010-09-09 Fujifilm Corp 樹脂組成物、該樹脂組成物を用いた硬化物、フレキシブル銅張積層板、フレキシブルプリント基板、及びフレキシブルプリント基板の製造方法
JP2010201625A (ja) * 2009-02-27 2010-09-16 Nippon Steel Chem Co Ltd フレキシブル基板用積層体及び熱伝導性ポリイミドフィルム
JP5100716B2 (ja) * 2009-07-27 2012-12-19 住友電気工業株式会社 ネガ型感光性樹脂組成物及びそれを用いたポリイミド樹脂膜、フレキシブルプリント配線板
WO2012011970A1 (en) * 2010-07-23 2012-01-26 E. I. Du Pont De Nemours And Company Matte finish polyimide films and methods relating thereto
US8574720B2 (en) * 2009-08-03 2013-11-05 E.I. Du Pont De Nemours & Company Matte finish polyimide films and methods relating thereto
US20130196134A1 (en) * 2009-08-03 2013-08-01 E I Du Pont De Nemours And Company Matte finish polyimide films and methods relating thereto
US8541107B2 (en) * 2009-08-13 2013-09-24 E. I. Du Pont De Nemours And Company Pigmented polyimide films and methods relating thereto
US10321840B2 (en) 2009-08-14 2019-06-18 Brainscope Company, Inc. Development of fully-automated classifier builders for neurodiagnostic applications
JP2011060622A (ja) * 2009-09-11 2011-03-24 Nippon Steel Chem Co Ltd 透明導電性膜積層体およびその製造方法
WO2011051412A1 (en) * 2009-10-29 2011-05-05 Sun Chemical B.V. Polyamideimide adhesives for printed circuit boards
CN102712753B (zh) * 2009-11-20 2015-08-26 E·I·内穆尔杜邦公司 热稳定的且尺寸稳定的聚酰亚胺薄膜及与其相关的方法
US20110123796A1 (en) * 2009-11-20 2011-05-26 E.I. Dupont De Nemours And Company Interposer films useful in semiconductor packaging applications, and methods relating thereto
JPWO2011089922A1 (ja) * 2010-01-25 2013-05-23 三井化学株式会社 ポリイミド樹脂組成物、それを含む接着剤、積層体およびデバイス
JP2011209521A (ja) * 2010-03-30 2011-10-20 Asahi Kasei E-Materials Corp ポジ型感光性樹脂組成物
KR101140626B1 (ko) * 2010-05-31 2012-05-02 가부시키가이샤 아리사와 세이사쿠쇼 폴리이미드 수지용 조성물 및 그 폴리이미드 수지용 조성물로 이루어지는 폴리이미드 수지
JP2012006200A (ja) * 2010-06-23 2012-01-12 Asahi Kasei E-Materials Corp ポリイミド金属積層体、及びそれを用いたプリント配線板
US9309132B2 (en) * 2010-08-16 2016-04-12 Board Of Trustees Of Michigan State University Water and oil separation system
US8853723B2 (en) * 2010-08-18 2014-10-07 E. I. Du Pont De Nemours And Company Light emitting diode assembly and thermal control blanket and methods relating thereto
CN103081145B (zh) * 2010-08-18 2016-11-16 E·I·内穆尔杜邦公司 发光二极管组件和热控制覆盖层以及与其相关的方法
JP5345116B2 (ja) * 2010-09-30 2013-11-20 日本化薬株式会社 銅張積層板及びその製造方法、並びに該銅張積層板を含む配線基板
JP5469578B2 (ja) * 2010-10-01 2014-04-16 日本化薬株式会社 プライマー層を有する銅張積層板及びそれを用いた配線基板
JP2012089315A (ja) * 2010-10-18 2012-05-10 Ube Ind Ltd フレキシブルフラットケーブルおよびその製造方法
JP2012102215A (ja) * 2010-11-09 2012-05-31 Kaneka Corp ポリアミド酸溶液の製造方法及びポリイミド
US20120141758A1 (en) 2010-12-07 2012-06-07 E.I. Du Pont De Nemours And Company Filled polyimide films and coverlays comprising such films

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