FI20085053A0 - Menetelmä termisen ruiskutuksen suorittamiseksi ja menetelmän mukaiset sovellukset - Google Patents
Menetelmä termisen ruiskutuksen suorittamiseksi ja menetelmän mukaiset sovelluksetInfo
- Publication number
- FI20085053A0 FI20085053A0 FI20085053A FI20085053A FI20085053A0 FI 20085053 A0 FI20085053 A0 FI 20085053A0 FI 20085053 A FI20085053 A FI 20085053A FI 20085053 A FI20085053 A FI 20085053A FI 20085053 A0 FI20085053 A0 FI 20085053A0
- Authority
- FI
- Finland
- Prior art keywords
- discrete
- procedure
- thermal spraying
- layer
- applications according
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 4
- 238000007751 thermal spraying Methods 0.000 title 1
- 238000001816 cooling Methods 0.000 abstract 2
- 239000011810 insulating material Substances 0.000 abstract 2
- 239000004020 conductor Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/04—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the coating material
- C23C4/10—Oxides, borides, carbides, nitrides or silicides; Mixtures thereof
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/18—After-treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/142—Metallic substrates having insulating layers
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
- H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0102—Calcium [Ca]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01025—Manganese [Mn]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01046—Palladium [Pd]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01057—Lanthanum [La]
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- H01L2924/01079—Gold [Au]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15182—Fan-in arrangement of the internal vias
- H01L2924/15183—Fan-in arrangement of the internal vias in a single layer of the multilayer substrate
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/30107—Inductance
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
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- H01L2924/3011—Impedance
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1333—Deposition techniques, e.g. coating
- H05K2203/1344—Spraying small metal particles or droplets of molten metal
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1333—Deposition techniques, e.g. coating
- H05K2203/1366—Spraying coating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T50/00—Aeronautics or air transport
- Y02T50/60—Efficient propulsion technologies, e.g. for aircraft
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Plasma & Fusion (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Coating By Spraying Or Casting (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20085053A FI20085053A0 (fi) | 2008-01-22 | 2008-01-22 | Menetelmä termisen ruiskutuksen suorittamiseksi ja menetelmän mukaiset sovellukset |
PCT/FI2009/050042 WO2009092851A1 (en) | 2008-01-22 | 2009-01-19 | Method for arranging cooling for a component and a cooling element |
US12/864,137 US20110044002A1 (en) | 2008-01-22 | 2009-01-19 | Method for arranging cooling for a component and a cooling element |
CN2009801028567A CN101971718A (zh) | 2008-01-22 | 2009-01-19 | 用于为部件布置冷却的方法和冷却元件 |
EP09704679A EP2245913A4 (en) | 2008-01-22 | 2009-01-19 | METHOD FOR ARRANGING COOLING FOR A COMPONENT AND COOLING ELEMENT |
PCT/FI2009/050057 WO2009092863A1 (en) | 2008-01-22 | 2009-01-22 | A method for utilising thermal spraying in the production of structures containing electrical components |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20085053A FI20085053A0 (fi) | 2008-01-22 | 2008-01-22 | Menetelmä termisen ruiskutuksen suorittamiseksi ja menetelmän mukaiset sovellukset |
Publications (1)
Publication Number | Publication Date |
---|---|
FI20085053A0 true FI20085053A0 (fi) | 2008-01-22 |
Family
ID=39004353
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI20085053A FI20085053A0 (fi) | 2008-01-22 | 2008-01-22 | Menetelmä termisen ruiskutuksen suorittamiseksi ja menetelmän mukaiset sovellukset |
Country Status (5)
Country | Link |
---|---|
US (1) | US20110044002A1 (fi) |
EP (1) | EP2245913A4 (fi) |
CN (1) | CN101971718A (fi) |
FI (1) | FI20085053A0 (fi) |
WO (2) | WO2009092851A1 (fi) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8659042B2 (en) * | 2010-12-21 | 2014-02-25 | Palo Alto Research Center Incorporated | Integrated reflector and thermal spreader and thermal spray fabrication method |
DE102011004171A1 (de) * | 2011-02-15 | 2012-08-16 | Brose Fahrzeugteile GmbH & Co. Kommanditgesellschaft, Würzburg | Temperierelement und Verfahren zur Befestigung eines Elektrobauteils an dem Temperierelement |
DE102011084303A1 (de) * | 2011-10-11 | 2013-04-11 | Continental Automotive Gmbh | Verfahren zur Herstellung eines Trägers für eine leistungselektronische Baugruppe und Träger für eine solche Baugruppe |
CN104185825A (zh) | 2011-11-15 | 2014-12-03 | 汉高知识产权控股有限责任公司 | 装配有隔热层的电子设备 |
EP2780775A4 (en) | 2011-11-15 | 2015-08-26 | Henkel IP & Holding GmbH | ELECTRONIC DEVICES ASSEMBLED WITH THERMAL INSULATION LAYERS |
US20130306293A1 (en) * | 2012-05-21 | 2013-11-21 | Hamilton Sundstrand Space Systems International | Extruded matching set radiators |
US20130308273A1 (en) * | 2012-05-21 | 2013-11-21 | Hamilton Sundstrand Space Systems International | Laser sintered matching set radiators |
US9223363B2 (en) * | 2013-03-16 | 2015-12-29 | Henkel IP & Holding GmbH | Electronic devices assembled with heat absorbing and/or thermally insulating composition |
TWI657132B (zh) | 2013-12-19 | 2019-04-21 | 德商漢高智慧財產控股公司 | 具有基質及經密封相變材料分散於其中之組合物及以其組裝之電子裝置 |
DE102014214784A1 (de) * | 2014-07-28 | 2016-02-11 | Continental Automotive Gmbh | Schaltungsträger, elektronische Baugruppe, Verfahren zum Herstellen eines Schaltungsträgers |
FR3036918B1 (fr) * | 2015-05-29 | 2018-08-10 | Thales | Carte electronique et procede de fabrication associe |
US10629513B2 (en) * | 2015-06-04 | 2020-04-21 | Eaton Intelligent Power Limited | Ceramic plated materials for electrical isolation and thermal transfer |
CN205606257U (zh) * | 2016-04-05 | 2016-09-28 | 讯芯电子科技(中山)有限公司 | Led灯管 |
JP2017195258A (ja) * | 2016-04-19 | 2017-10-26 | 市光工業株式会社 | 光源装置、移動体用発光装置 |
DE102019215793A1 (de) | 2019-10-14 | 2021-04-15 | Vitesco Technologies GmbH | Verdrahtungssubstrat für ein Halbleiterbauteil und Verfahren zur Herstellung eines Verdrahtungssubstrats |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
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GB1265007A (fi) * | 1968-12-09 | 1972-03-01 | ||
JPS57122592A (en) * | 1981-01-23 | 1982-07-30 | Tokyo Shibaura Electric Co | Method of producing hybrid integrated circuit |
US4869936A (en) * | 1987-12-28 | 1989-09-26 | Amoco Corporation | Apparatus and process for producing high density thermal spray coatings |
JPH02164093A (ja) * | 1988-12-19 | 1990-06-25 | Mitsubishi Electric Corp | 回路基板の製造方法 |
US5290606A (en) * | 1989-01-30 | 1994-03-01 | Svein Hestevik | Method for manufacturing a substrate for a printed circuit board |
JPH0760874B2 (ja) * | 1990-04-17 | 1995-06-28 | 日立化成工業株式会社 | 半導体装置 |
JPH07283499A (ja) * | 1994-04-05 | 1995-10-27 | Nippon Carbide Ind Co Inc | 電子部品用複合基板 |
US6331680B1 (en) * | 1996-08-07 | 2001-12-18 | Visteon Global Technologies, Inc. | Multilayer electrical interconnection device and method of making same |
US5762711A (en) * | 1996-11-15 | 1998-06-09 | Honeywell Inc. | Coating delicate circuits |
EP0843508A3 (en) * | 1996-11-15 | 2000-04-19 | Honeywell Inc. | Coating circuits to dissipate heat |
US6194246B1 (en) * | 1999-08-25 | 2001-02-27 | Motorola Inc. | Process for fabricating electronic devices having a thermally conductive substrate |
US6576861B2 (en) * | 2000-07-25 | 2003-06-10 | The Research Foundation Of State University Of New York | Method and apparatus for fine feature spray deposition |
US20020139472A1 (en) * | 2001-03-29 | 2002-10-03 | Albert Wojewnik | Method of forming an electrical circuit on a substrate |
US6863930B2 (en) * | 2002-09-06 | 2005-03-08 | Delphi Technologies, Inc. | Refractory metal mask and methods for coating an article and forming a sensor |
US6838157B2 (en) * | 2002-09-23 | 2005-01-04 | Siemens Westinghouse Power Corporation | Method and apparatus for instrumenting a gas turbine component having a barrier coating |
US7196459B2 (en) * | 2003-12-05 | 2007-03-27 | International Resistive Co. Of Texas, L.P. | Light emitting assembly with heat dissipating support |
DE102004058806B4 (de) * | 2004-12-07 | 2013-09-05 | Robert Bosch Gmbh | Verfahren zur Herstellung von Schaltungsstrukturen auf einem Kühlkörper und Schaltungsstruktur auf einem Kühlkörper |
US7510951B2 (en) * | 2005-05-12 | 2009-03-31 | Lg Chem, Ltd. | Method for forming high-resolution pattern with direct writing means |
DE102005062271B3 (de) * | 2005-12-24 | 2007-03-08 | Leoni Ag | Verfahren zum Aufbringen von Material auf ein Bauteil sowie Bauteil |
JP4880358B2 (ja) * | 2006-05-23 | 2012-02-22 | 株式会社光波 | 光源用基板及びこれを用いた照明装置 |
EP2025209B1 (de) * | 2006-06-07 | 2013-03-27 | Ab Mikroelektronik Gesellschaft Mit Beschränkter Haftung | Verfahren zur herstellung eines schaltungsträgers |
-
2008
- 2008-01-22 FI FI20085053A patent/FI20085053A0/fi not_active Application Discontinuation
-
2009
- 2009-01-19 CN CN2009801028567A patent/CN101971718A/zh active Pending
- 2009-01-19 US US12/864,137 patent/US20110044002A1/en not_active Abandoned
- 2009-01-19 WO PCT/FI2009/050042 patent/WO2009092851A1/en active Application Filing
- 2009-01-19 EP EP09704679A patent/EP2245913A4/en not_active Withdrawn
- 2009-01-22 WO PCT/FI2009/050057 patent/WO2009092863A1/en active Application Filing
Also Published As
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WO2009092863A1 (en) | 2009-07-30 |
US20110044002A1 (en) | 2011-02-24 |
WO2009092851A1 (en) | 2009-07-30 |
EP2245913A4 (en) | 2011-01-26 |
CN101971718A (zh) | 2011-02-09 |
EP2245913A1 (en) | 2010-11-03 |
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