JP2015528204A5 - - Google Patents
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- Publication number
- JP2015528204A5 JP2015528204A5 JP2015518584A JP2015518584A JP2015528204A5 JP 2015528204 A5 JP2015528204 A5 JP 2015528204A5 JP 2015518584 A JP2015518584 A JP 2015518584A JP 2015518584 A JP2015518584 A JP 2015518584A JP 2015528204 A5 JP2015528204 A5 JP 2015528204A5
- Authority
- JP
- Japan
- Prior art keywords
- mol
- circuit board
- polyimide
- metal layer
- electrically insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004642 Polyimide Substances 0.000 claims description 88
- 229920001721 polyimide Polymers 0.000 claims description 88
- 239000010410 layer Substances 0.000 claims description 66
- 239000002184 metal Substances 0.000 claims description 32
- 229910052751 metal Inorganic materials 0.000 claims description 32
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 claims description 24
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 claims description 13
- NVKGJHAQGWCWDI-UHFFFAOYSA-N 4-[4-amino-2-(trifluoromethyl)phenyl]-3-(trifluoromethyl)aniline Chemical compound FC(F)(F)C1=CC(N)=CC=C1C1=CC=C(N)C=C1C(F)(F)F NVKGJHAQGWCWDI-UHFFFAOYSA-N 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- 239000011231 conductive filler Substances 0.000 claims description 11
- 229910052802 copper Inorganic materials 0.000 claims description 11
- 239000010949 copper Substances 0.000 claims description 11
- 239000000945 filler Substances 0.000 claims description 11
- 239000000203 mixture Substances 0.000 claims description 11
- 238000003475 lamination Methods 0.000 claims description 6
- 239000012790 adhesive layer Substances 0.000 claims description 4
- 238000010292 electrical insulation Methods 0.000 claims description 2
- 239000012777 electrically insulating material Substances 0.000 claims description 2
- JPZRPCNEISCANI-UHFFFAOYSA-N 4-(4-aminophenyl)-3-(trifluoromethyl)aniline Chemical compound C1=CC(N)=CC=C1C1=CC=C(N)C=C1C(F)(F)F JPZRPCNEISCANI-UHFFFAOYSA-N 0.000 claims 2
- 239000006229 carbon black Substances 0.000 description 28
- 239000006224 matting agent Substances 0.000 description 21
- 239000000049 pigment Substances 0.000 description 21
- HFACYLZERDEVSX-UHFFFAOYSA-N benzidine Chemical compound C1=CC(N)=CC=C1C1=CC=C(N)C=C1 HFACYLZERDEVSX-UHFFFAOYSA-N 0.000 description 10
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 10
- 239000002245 particle Substances 0.000 description 6
Applications Claiming Priority (11)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261663270P | 2012-06-22 | 2012-06-22 | |
| US201261663291P | 2012-06-22 | 2012-06-22 | |
| US201261663258P | 2012-06-22 | 2012-06-22 | |
| US201261663254P | 2012-06-22 | 2012-06-22 | |
| US201261663280P | 2012-06-22 | 2012-06-22 | |
| US61/663,270 | 2012-06-22 | ||
| US61/663,254 | 2012-06-22 | ||
| US61/663,280 | 2012-06-22 | ||
| US61/663,258 | 2012-06-22 | ||
| US61/663,291 | 2012-06-22 | ||
| PCT/US2013/046933 WO2013192467A1 (en) | 2012-06-22 | 2013-06-21 | Circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2015528204A JP2015528204A (ja) | 2015-09-24 |
| JP2015528204A5 true JP2015528204A5 (enExample) | 2016-07-14 |
Family
ID=48746133
Family Applications (8)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015518585A Expired - Fee Related JP6139676B2 (ja) | 2012-06-22 | 2013-06-21 | 回路基板 |
| JP2015518586A Expired - Fee Related JP6105724B2 (ja) | 2012-06-22 | 2013-06-21 | ポリイミド金属張積層体 |
| JP2015518588A Expired - Fee Related JP6100892B2 (ja) | 2012-06-22 | 2013-06-21 | ポリイミド金属張積層体 |
| JP2015518590A Expired - Fee Related JP6258931B2 (ja) | 2012-06-22 | 2013-06-21 | 回路基板 |
| JP2015518589A Expired - Fee Related JP6258930B2 (ja) | 2012-06-22 | 2013-06-21 | 回路基板 |
| JP2015518592A Expired - Fee Related JP6114387B2 (ja) | 2012-06-22 | 2013-06-21 | 回路基板 |
| JP2015518587A Pending JP2015523730A (ja) | 2012-06-22 | 2013-06-21 | 回路基板 |
| JP2015518584A Pending JP2015528204A (ja) | 2012-06-22 | 2013-06-21 | 回路基板 |
Family Applications Before (7)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015518585A Expired - Fee Related JP6139676B2 (ja) | 2012-06-22 | 2013-06-21 | 回路基板 |
| JP2015518586A Expired - Fee Related JP6105724B2 (ja) | 2012-06-22 | 2013-06-21 | ポリイミド金属張積層体 |
| JP2015518588A Expired - Fee Related JP6100892B2 (ja) | 2012-06-22 | 2013-06-21 | ポリイミド金属張積層体 |
| JP2015518590A Expired - Fee Related JP6258931B2 (ja) | 2012-06-22 | 2013-06-21 | 回路基板 |
| JP2015518589A Expired - Fee Related JP6258930B2 (ja) | 2012-06-22 | 2013-06-21 | 回路基板 |
| JP2015518592A Expired - Fee Related JP6114387B2 (ja) | 2012-06-22 | 2013-06-21 | 回路基板 |
| JP2015518587A Pending JP2015523730A (ja) | 2012-06-22 | 2013-06-21 | 回路基板 |
Country Status (5)
| Country | Link |
|---|---|
| US (8) | US20150147567A1 (enExample) |
| EP (8) | EP2865251A1 (enExample) |
| JP (8) | JP6139676B2 (enExample) |
| CN (8) | CN104541587B (enExample) |
| WO (6) | WO2013192467A1 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI481649B (zh) * | 2013-09-09 | 2015-04-21 | Taimide Technology Inc | 黑色聚醯亞胺膜及其加工方法 |
| WO2016093816A1 (en) * | 2014-12-10 | 2016-06-16 | E. I. Du Pont De Nemours And Company | A multilayer film |
| JP6237706B2 (ja) * | 2015-06-05 | 2017-11-29 | 富士通オプティカルコンポーネンツ株式会社 | 光モジュール及び光送受信装置 |
| KR102229738B1 (ko) * | 2015-08-21 | 2021-03-18 | 아사히 가세이 가부시키가이샤 | 감광성 수지 조성물, 폴리이미드의 제조 방법 및 반도체 장치 |
| US11021606B2 (en) * | 2017-09-13 | 2021-06-01 | E I Du Pont De Nemours And Company | Multilayer film for electronic circuitry applications |
| JP7520338B2 (ja) * | 2018-10-19 | 2024-07-23 | ユニチカ株式会社 | 積層フィルム |
| KR20230017760A (ko) * | 2020-05-29 | 2023-02-06 | 도요보 가부시키가이샤 | 투명 고내열 필름을 포함하는 적층체 |
| US12441084B2 (en) | 2021-10-20 | 2025-10-14 | Unison Industries, Llc | Thermal insulation system |
Family Cites Families (47)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4709468A (en) * | 1986-01-31 | 1987-12-01 | Texas Instruments Incorporated | Method for producing an integrated circuit product having a polyimide film interconnection structure |
| JPH11333376A (ja) * | 1997-06-23 | 1999-12-07 | Unitika Ltd | ポリイミド前駆体溶液並びにそれから得られる塗膜及びその製造方法 |
| KR20000035259A (ko) * | 1998-11-05 | 2000-06-26 | 다케다 마사토시 | 폴리이미드 필름 및 이를 사용한 전기/전자 기기용 기판 |
| WO2004094499A1 (ja) | 2003-04-18 | 2004-11-04 | Kaneka Corporation | 熱硬化性樹脂組成物、それを用いてなる積層体、回路基板 |
| JP2005166828A (ja) * | 2003-12-01 | 2005-06-23 | Nitto Denko Corp | 両面配線基板用積層体及びその製造方法 |
| JP4031756B2 (ja) * | 2003-12-22 | 2008-01-09 | 日東電工株式会社 | 配線回路基板 |
| US7316791B2 (en) * | 2003-12-30 | 2008-01-08 | E.I. Du Pont De Nemours And Company | Polyimide based substrate comprising doped polyaniline |
| US7495887B2 (en) * | 2004-12-21 | 2009-02-24 | E.I. Du Pont De Nemours And Company | Capacitive devices, organic dielectric laminates, and printed wiring boards incorporating such devices, and methods of making thereof |
| JP2006206756A (ja) * | 2005-01-28 | 2006-08-10 | Sony Chem Corp | ポリイミド化合物及びフレキシブル配線板 |
| WO2006114901A1 (ja) * | 2005-04-18 | 2006-11-02 | Toyo Boseki Kabushiki Kaisha | 薄膜積層ポリイミドフィルム及びフレキシブルプリント配線板 |
| TWI286148B (en) * | 2005-05-30 | 2007-09-01 | Chang Chun Plastics Co Ltd | Novel polyimide resin and its preparation method |
| US7550194B2 (en) * | 2005-08-03 | 2009-06-23 | E. I. Du Pont De Nemours And Company | Low color polyimide compositions useful in optical type applications and methods and compositions relating thereto |
| KR101045149B1 (ko) * | 2005-08-04 | 2011-06-30 | 가부시키가이샤 가네카 | 금속 피복 폴리이미드 필름 |
| KR20070058812A (ko) * | 2005-12-05 | 2007-06-11 | 주식회사 코오롱 | 폴리이미드 필름 |
| JP2007268917A (ja) * | 2006-03-31 | 2007-10-18 | Kurabo Ind Ltd | 熱可塑性ポリイミド層を有するフレキシブル積層板及びその製造方法 |
| JP5119401B2 (ja) * | 2007-02-01 | 2013-01-16 | 倉敷紡績株式会社 | 熱可塑性ポリイミド層を有するフレキシブル積層板及びその製造方法 |
| KR20090004894A (ko) * | 2006-03-31 | 2009-01-12 | 구라시키 보세키 가부시키가이샤 | 열가소성 폴리이미드층을 갖는 연성 적층판 및 그의 제조 방법 |
| CN101484500A (zh) * | 2006-07-06 | 2009-07-15 | 东丽株式会社 | 热塑性聚酰亚胺、使用该聚酰亚胺的层合聚酰亚胺薄膜以及金属箔层合聚酰亚胺薄膜 |
| WO2008004496A1 (fr) * | 2006-07-06 | 2008-01-10 | Toray Industries, Inc. | Polyimide thermoplastique, film de polyimide laminé et film de polyimide laminé sur feuille métallique utilisant ledit polyimide thermoplastique |
| WO2008091011A1 (ja) * | 2007-01-26 | 2008-07-31 | Honshu Chemical Industry Co., Ltd. | 新規なエステル基含有テトラカルボン酸二無水物類、それから誘導される新規なポリエステルイミド前駆体及びポリエステルイミド |
| JP4888719B2 (ja) * | 2007-07-13 | 2012-02-29 | 東レ・デュポン株式会社 | 銅張り板 |
| JP5383343B2 (ja) * | 2008-06-26 | 2014-01-08 | 新日鉄住金化学株式会社 | 白色ポリイミドフィルム |
| JP5524475B2 (ja) * | 2008-11-28 | 2014-06-18 | 株式会社有沢製作所 | ２層両面フレキシブル金属積層板及びその製造方法 |
| JP2010195983A (ja) * | 2009-02-26 | 2010-09-09 | Fujifilm Corp | 樹脂組成物、該樹脂組成物を用いた硬化物、フレキシブル銅張積層板、フレキシブルプリント基板、及びフレキシブルプリント基板の製造方法 |
| JP2010201625A (ja) * | 2009-02-27 | 2010-09-16 | Nippon Steel Chem Co Ltd | フレキシブル基板用積層体及び熱伝導性ポリイミドフィルム |
| JP5100716B2 (ja) * | 2009-07-27 | 2012-12-19 | 住友電気工業株式会社 | ネガ型感光性樹脂組成物及びそれを用いたポリイミド樹脂膜、フレキシブルプリント配線板 |
| WO2012011970A1 (en) * | 2010-07-23 | 2012-01-26 | E. I. Du Pont De Nemours And Company | Matte finish polyimide films and methods relating thereto |
| US8574720B2 (en) * | 2009-08-03 | 2013-11-05 | E.I. Du Pont De Nemours & Company | Matte finish polyimide films and methods relating thereto |
| US20130196134A1 (en) * | 2009-08-03 | 2013-08-01 | E I Du Pont De Nemours And Company | Matte finish polyimide films and methods relating thereto |
| US8541107B2 (en) * | 2009-08-13 | 2013-09-24 | E. I. Du Pont De Nemours And Company | Pigmented polyimide films and methods relating thereto |
| US10321840B2 (en) | 2009-08-14 | 2019-06-18 | Brainscope Company, Inc. | Development of fully-automated classifier builders for neurodiagnostic applications |
| JP2011060622A (ja) * | 2009-09-11 | 2011-03-24 | Nippon Steel Chem Co Ltd | 透明導電性膜積層体およびその製造方法 |
| WO2011051412A1 (en) * | 2009-10-29 | 2011-05-05 | Sun Chemical B.V. | Polyamideimide adhesives for printed circuit boards |
| CN102712753B (zh) * | 2009-11-20 | 2015-08-26 | E·I·内穆尔杜邦公司 | 热稳定的且尺寸稳定的聚酰亚胺薄膜及与其相关的方法 |
| US20110123796A1 (en) * | 2009-11-20 | 2011-05-26 | E.I. Dupont De Nemours And Company | Interposer films useful in semiconductor packaging applications, and methods relating thereto |
| JPWO2011089922A1 (ja) * | 2010-01-25 | 2013-05-23 | 三井化学株式会社 | ポリイミド樹脂組成物、それを含む接着剤、積層体およびデバイス |
| JP2011209521A (ja) * | 2010-03-30 | 2011-10-20 | Asahi Kasei E-Materials Corp | ポジ型感光性樹脂組成物 |
| KR101140626B1 (ko) * | 2010-05-31 | 2012-05-02 | 가부시키가이샤 아리사와 세이사쿠쇼 | 폴리이미드 수지용 조성물 및 그 폴리이미드 수지용 조성물로 이루어지는 폴리이미드 수지 |
| JP2012006200A (ja) * | 2010-06-23 | 2012-01-12 | Asahi Kasei E-Materials Corp | ポリイミド金属積層体、及びそれを用いたプリント配線板 |
| US9309132B2 (en) * | 2010-08-16 | 2016-04-12 | Board Of Trustees Of Michigan State University | Water and oil separation system |
| US8853723B2 (en) * | 2010-08-18 | 2014-10-07 | E. I. Du Pont De Nemours And Company | Light emitting diode assembly and thermal control blanket and methods relating thereto |
| CN103081145B (zh) * | 2010-08-18 | 2016-11-16 | E·I·内穆尔杜邦公司 | 发光二极管组件和热控制覆盖层以及与其相关的方法 |
| JP5345116B2 (ja) * | 2010-09-30 | 2013-11-20 | 日本化薬株式会社 | 銅張積層板及びその製造方法、並びに該銅張積層板を含む配線基板 |
| JP5469578B2 (ja) * | 2010-10-01 | 2014-04-16 | 日本化薬株式会社 | プライマー層を有する銅張積層板及びそれを用いた配線基板 |
| JP2012089315A (ja) * | 2010-10-18 | 2012-05-10 | Ube Ind Ltd | フレキシブルフラットケーブルおよびその製造方法 |
| JP2012102215A (ja) * | 2010-11-09 | 2012-05-31 | Kaneka Corp | ポリアミド酸溶液の製造方法及びポリイミド |
| US20120141758A1 (en) | 2010-12-07 | 2012-06-07 | E.I. Du Pont De Nemours And Company | Filled polyimide films and coverlays comprising such films |
-
2013
- 2013-06-21 WO PCT/US2013/046933 patent/WO2013192467A1/en not_active Ceased
- 2013-06-21 CN CN201380042709.1A patent/CN104541587B/zh not_active Expired - Fee Related
- 2013-06-21 WO PCT/US2013/046941 patent/WO2013192474A1/en not_active Ceased
- 2013-06-21 WO PCT/US2013/046943 patent/WO2013192476A1/en not_active Ceased
- 2013-06-21 JP JP2015518585A patent/JP6139676B2/ja not_active Expired - Fee Related
- 2013-06-21 CN CN201380042674.1A patent/CN104541590B/zh not_active Expired - Fee Related
- 2013-06-21 US US14/409,974 patent/US20150147567A1/en not_active Abandoned
- 2013-06-21 JP JP2015518586A patent/JP6105724B2/ja not_active Expired - Fee Related
- 2013-06-21 EP EP13733502.2A patent/EP2865251A1/en not_active Withdrawn
- 2013-06-21 JP JP2015518588A patent/JP6100892B2/ja not_active Expired - Fee Related
- 2013-06-21 US US14/410,294 patent/US20150342044A1/en not_active Abandoned
- 2013-06-21 JP JP2015518590A patent/JP6258931B2/ja not_active Expired - Fee Related
- 2013-06-21 EP EP13733508.9A patent/EP2865247A1/en not_active Withdrawn
- 2013-06-21 JP JP2015518589A patent/JP6258930B2/ja not_active Expired - Fee Related
- 2013-06-21 CN CN201380042689.8A patent/CN104541585B/zh not_active Expired - Fee Related
- 2013-06-21 US US14/410,115 patent/US20150336354A1/en not_active Abandoned
- 2013-06-21 EP EP13733506.3A patent/EP2865245A1/en not_active Withdrawn
- 2013-06-21 US US14/410,116 patent/US9585249B2/en not_active Expired - Fee Related
- 2013-06-21 EP EP13733509.7A patent/EP2865248A1/en not_active Withdrawn
- 2013-06-21 CN CN201380042730.1A patent/CN104541588B/zh not_active Expired - Fee Related
- 2013-06-21 US US14/409,965 patent/US9596757B2/en not_active Expired - Fee Related
- 2013-06-21 CN CN201380042678.XA patent/CN104584696B/zh not_active Expired - Fee Related
- 2013-06-21 CN CN201380042695.3A patent/CN104541586B/zh not_active Expired - Fee Related
- 2013-06-21 EP EP13733503.0A patent/EP2865243A1/en not_active Withdrawn
- 2013-06-21 US US14/410,289 patent/US20150342041A1/en not_active Abandoned
- 2013-06-21 EP EP13733507.1A patent/EP2865246A1/en not_active Withdrawn
- 2013-06-21 CN CN201380042680.7A patent/CN104541583B/zh not_active Expired - Fee Related
- 2013-06-21 JP JP2015518592A patent/JP6114387B2/ja not_active Expired - Fee Related
- 2013-06-21 CN CN201380042685.XA patent/CN104541584B/zh not_active Expired - Fee Related
- 2013-06-21 WO PCT/US2013/046934 patent/WO2013192468A1/en not_active Ceased
- 2013-06-21 US US14/410,283 patent/US20150342043A1/en not_active Abandoned
- 2013-06-21 JP JP2015518587A patent/JP2015523730A/ja active Pending
- 2013-06-21 JP JP2015518584A patent/JP2015528204A/ja active Pending
- 2013-06-21 WO PCT/US2013/046940 patent/WO2013192473A1/en not_active Ceased
- 2013-06-21 EP EP13733511.3A patent/EP2865249A1/en not_active Withdrawn
- 2013-06-21 US US14/409,958 patent/US20150342042A1/en not_active Abandoned
- 2013-06-21 EP EP13733504.8A patent/EP2865244A1/en not_active Withdrawn
- 2013-06-21 WO PCT/US2013/046938 patent/WO2013192471A1/en not_active Ceased
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