JP2012060132A5 - - Google Patents
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- Publication number
- JP2012060132A5 JP2012060132A5 JP2011197269A JP2011197269A JP2012060132A5 JP 2012060132 A5 JP2012060132 A5 JP 2012060132A5 JP 2011197269 A JP2011197269 A JP 2011197269A JP 2011197269 A JP2011197269 A JP 2011197269A JP 2012060132 A5 JP2012060132 A5 JP 2012060132A5
- Authority
- JP
- Japan
- Prior art keywords
- thermal bridge
- thermal
- circuit board
- printed circuit
- electrical component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/879,229 | 2010-09-10 | ||
| US12/879,229 US8957316B2 (en) | 2010-09-10 | 2010-09-10 | Electrical component assembly for thermal transfer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2012060132A JP2012060132A (ja) | 2012-03-22 |
| JP2012060132A5 true JP2012060132A5 (enExample) | 2014-10-23 |
Family
ID=44720621
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011197269A Pending JP2012060132A (ja) | 2010-09-10 | 2011-09-09 | 熱移送のための電気構成要素組立体 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US8957316B2 (enExample) |
| EP (1) | EP2428990A3 (enExample) |
| JP (1) | JP2012060132A (enExample) |
Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9163883B2 (en) | 2009-03-06 | 2015-10-20 | Kevlin Thermal Technologies, Inc. | Flexible thermal ground plane and manufacturing the same |
| US10049959B2 (en) * | 2011-03-25 | 2018-08-14 | Philips Lighting Holding B.V. | Thermal interface pad material with perforated liner |
| JP2013084674A (ja) * | 2011-10-06 | 2013-05-09 | Shindengen Electric Mfg Co Ltd | 発熱電子デバイスの放熱構造 |
| CN203279336U (zh) * | 2013-04-27 | 2013-11-06 | 中兴通讯股份有限公司 | 一种内散热的终端 |
| US9478473B2 (en) * | 2013-05-21 | 2016-10-25 | Globalfoundries Inc. | Fabricating a microelectronics lid using sol-gel processing |
| JP5805838B1 (ja) | 2014-09-29 | 2015-11-10 | 株式会社日立製作所 | 発熱体の冷却構造、電力変換器ユニットおよび電力変換装置 |
| EP3194157A4 (en) * | 2014-09-15 | 2018-04-25 | The Regents of The University of Colorado, A Body Corporate | Vacuum-enhanced heat spreader |
| US9921004B2 (en) | 2014-09-15 | 2018-03-20 | Kelvin Thermal Technologies, Inc. | Polymer-based microfabricated thermal ground plane |
| US20190390919A1 (en) * | 2014-09-15 | 2019-12-26 | Kelvin Thermal Technologies, Inc. | Polymer-based microfabricated thermal ground plane |
| EP3194113B1 (en) | 2014-09-17 | 2022-06-08 | The Regents Of The University Of Colorado, A Body Corporate, A Colorado Non-Profit | Micropillar-enabled thermal ground plane |
| US12385697B2 (en) | 2014-09-17 | 2025-08-12 | Kelvin Thermal Technologies, Inc. | Micropillar-enabled thermal ground plane |
| US11988453B2 (en) | 2014-09-17 | 2024-05-21 | Kelvin Thermal Technologies, Inc. | Thermal management planes |
| US11598594B2 (en) | 2014-09-17 | 2023-03-07 | The Regents Of The University Of Colorado | Micropillar-enabled thermal ground plane |
| JP6696750B2 (ja) * | 2015-09-24 | 2020-05-20 | 古河電気工業株式会社 | サーマルコネクタ |
| US10083894B2 (en) * | 2015-12-17 | 2018-09-25 | International Business Machines Corporation | Integrated die paddle structures for bottom terminated components |
| JP6738193B2 (ja) * | 2016-05-09 | 2020-08-12 | 昭和電工株式会社 | 伝熱構造体、絶縁積層材、絶縁回路基板およびパワーモジュール用ベース |
| US12104856B2 (en) | 2016-10-19 | 2024-10-01 | Kelvin Thermal Technologies, Inc. | Method and device for optimization of vapor transport in a thermal ground plane using void space in mobile systems |
| EP3539156A4 (en) | 2016-11-08 | 2020-07-15 | Kelvin Thermal Technologies, Inc. | METHOD AND DEVICE FOR DISTRIBUTING HIGH HEAT FLOWS ON THERMAL GROUND SURFACES |
| US20180235069A1 (en) * | 2016-12-16 | 2018-08-16 | Hamilton Sundstrand Corporation | Pressure limiting heat sink |
| WO2018208801A1 (en) | 2017-05-08 | 2018-11-15 | Kelvin Thermal Technologies, Inc. | Thermal management planes |
| US9992911B1 (en) * | 2017-05-17 | 2018-06-05 | Northrop Grumman Systems Corporation | Controllable conductance thermal interface |
| WO2020056165A1 (en) * | 2018-09-14 | 2020-03-19 | Raytheon Company | Module base with integrated thermal spreader and heat sink for thermal and structural management of high-performance integrated circuits or other devices |
| US12219737B2 (en) | 2019-06-19 | 2025-02-04 | International Business Machines Corporation | Cryogenic packaging for thermalization of low temperature devices |
| CN115997099A (zh) | 2020-06-19 | 2023-04-21 | 开尔文热技术股份有限公司 | 折叠式热接地平面 |
| EP4096376B1 (en) * | 2021-05-24 | 2025-09-24 | Aptiv Technologies AG | Cooling device and heatsink assembly incorporating the same |
| RU206203U1 (ru) * | 2021-06-02 | 2021-08-30 | Общество с ограниченной ответственностью "Т8 Сенсор" (ООО "Т8 Сенсор") | Лазерный модуль |
Family Cites Families (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61290743A (ja) | 1985-06-19 | 1986-12-20 | Hitachi Ltd | 半導体デバイスの冷却装置 |
| GB8625472D0 (en) * | 1986-10-24 | 1986-11-26 | Bicc Plc | Circuit board installation |
| JPH0547968A (ja) | 1991-08-20 | 1993-02-26 | Fujitsu Ltd | 電子装置の冷却構造 |
| US5844784A (en) * | 1997-03-24 | 1998-12-01 | Qualcomm Incorporated | Brace apparatus and method for printed wiring board assembly |
| JP2874684B2 (ja) | 1997-03-27 | 1999-03-24 | 日本電気株式会社 | プラグインユニットの放熱構造 |
| JP2000269671A (ja) * | 1999-03-19 | 2000-09-29 | Toshiba Corp | 電子機器 |
| US6917525B2 (en) | 2001-11-27 | 2005-07-12 | Nanonexus, Inc. | Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs |
| US6181556B1 (en) * | 1999-07-21 | 2001-01-30 | Richard K. Allman | Thermally-coupled heat dissipation apparatus for electronic devices |
| US6249435B1 (en) | 1999-08-16 | 2001-06-19 | General Electric Company | Thermally efficient motor controller assembly |
| JP4089098B2 (ja) * | 1999-08-18 | 2008-05-21 | 横河電機株式会社 | プリント基板の冷却構造 |
| US6400565B1 (en) * | 2000-04-21 | 2002-06-04 | Dell Products L.P. | Thermally conductive interface member |
| US7952373B2 (en) | 2000-05-23 | 2011-05-31 | Verigy (Singapore) Pte. Ltd. | Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies |
| KR101022583B1 (ko) * | 2001-05-24 | 2011-03-16 | 프라이즈 메탈즈, 인크. | 방열재 및 땜납 프리폼 |
| US7019266B1 (en) * | 2001-07-20 | 2006-03-28 | Cape Simulations, Inc. | Substantially-uniform-temperature annealing |
| US6750084B2 (en) * | 2002-06-21 | 2004-06-15 | Delphi Technologies, Inc. | Method of mounting a leadless package and structure therefor |
| TW200500838A (en) * | 2003-02-19 | 2005-01-01 | Nisvara Inc | System and apparatus for heat removal |
| US7187076B2 (en) | 2003-08-07 | 2007-03-06 | Airborn, Inc. | Interposer with integral heat sink |
| JP2005129934A (ja) * | 2003-10-21 | 2005-05-19 | Hewlett-Packard Development Co Lp | 熱伝達インターフェース |
| IL159399A0 (en) * | 2003-12-16 | 2004-06-01 | Rafael Armament Dev Authority | Integrated-circuit cooling system |
| TWI244182B (en) | 2004-11-12 | 2005-11-21 | Via Tech Inc | Heat-dissipation device |
| US7327569B2 (en) | 2004-12-13 | 2008-02-05 | Hewlett-Packard Development Company, L.P. | Processor module with thermal dissipation device |
| US7289328B2 (en) | 2004-12-21 | 2007-10-30 | Hewlett-Packard Development Company, L.P. | Multi-chip module with power system and pass-thru holes |
| US7303005B2 (en) * | 2005-11-04 | 2007-12-04 | Graftech International Holdings Inc. | Heat spreaders with vias |
| US7349221B2 (en) | 2006-07-20 | 2008-03-25 | Honeywell International Inc. | Device for increased thermal conductivity between a printed wiring assembly and a chassis |
| US7808788B2 (en) * | 2007-06-29 | 2010-10-05 | Delphi Technologies, Inc. | Multi-layer electrically isolated thermal conduction structure for a circuit board assembly |
| US20090165302A1 (en) * | 2007-12-31 | 2009-07-02 | Slaton David S | Method of forming a heatsink |
| US8009429B1 (en) * | 2010-03-22 | 2011-08-30 | Honeywell International Inc. | Electrical component thermal management |
-
2010
- 2010-09-10 US US12/879,229 patent/US8957316B2/en not_active Expired - Fee Related
-
2011
- 2011-09-08 EP EP11180649.3A patent/EP2428990A3/en not_active Withdrawn
- 2011-09-09 JP JP2011197269A patent/JP2012060132A/ja active Pending