CN109479384A - 散热结构、电子装置、云台及飞行器 - Google Patents
散热结构、电子装置、云台及飞行器 Download PDFInfo
- Publication number
- CN109479384A CN109479384A CN201680087787.7A CN201680087787A CN109479384A CN 109479384 A CN109479384 A CN 109479384A CN 201680087787 A CN201680087787 A CN 201680087787A CN 109479384 A CN109479384 A CN 109479384A
- Authority
- CN
- China
- Prior art keywords
- heat
- circuit board
- heating device
- radiator structure
- radiator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims abstract description 80
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 9
- 230000005611 electricity Effects 0.000 claims description 6
- 238000003384 imaging method Methods 0.000 claims description 4
- 230000005855 radiation Effects 0.000 claims description 4
- 229910052582 BN Inorganic materials 0.000 claims description 3
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 3
- 229910021389 graphene Inorganic materials 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 description 10
- 230000000694 effects Effects 0.000 description 6
- RZVHIXYEVGDQDX-UHFFFAOYSA-N 9,10-anthraquinone Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3C(=O)C2=C1 RZVHIXYEVGDQDX-UHFFFAOYSA-N 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B64—AIRCRAFT; AVIATION; COSMONAUTICS
- B64U—UNMANNED AERIAL VEHICLES [UAV]; EQUIPMENT THEREFOR
- B64U20/00—Constructional aspects of UAVs
- B64U20/90—Cooling
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Remote Sensing (AREA)
- Aviation & Aerospace Engineering (AREA)
Abstract
一种散热结构(10),用于对电路板(11)上的发热器件(13)散热,所述散热结构(10)包括散热器件(15),所述散热器件(15)能够设置在所述发热器件(13)上,其中,所述散热器件(15)包括相互连接的散热器本体(150)及导热件(155),所述导热件(155)与所述电路板(11)及/或所述电路板(11)上的发热器件(13)直接接触。另外提供一种具有该散热结构(10)的电子装置(100)、云台以及包括所述电子装置(100)或云台的飞行器。
Description
PCT国内申请,说明书已公开。
Claims (19)
- PCT国内申请,权利要求书已公开。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201621082727.XU CN206118273U (zh) | 2016-09-27 | 2016-09-27 | 散热结构、电子装置、云台及飞行器 |
CN201621082727X | 2016-09-27 | ||
PCT/CN2016/104857 WO2018058746A1 (zh) | 2016-09-27 | 2016-11-07 | 散热结构、电子装置、云台及飞行器 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN109479384A true CN109479384A (zh) | 2019-03-15 |
Family
ID=58520998
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201621082727.XU Expired - Fee Related CN206118273U (zh) | 2016-09-27 | 2016-09-27 | 散热结构、电子装置、云台及飞行器 |
CN201680087787.7A Pending CN109479384A (zh) | 2016-09-27 | 2016-11-07 | 散热结构、电子装置、云台及飞行器 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201621082727.XU Expired - Fee Related CN206118273U (zh) | 2016-09-27 | 2016-09-27 | 散热结构、电子装置、云台及飞行器 |
Country Status (2)
Country | Link |
---|---|
CN (2) | CN206118273U (zh) |
WO (1) | WO2018058746A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111751804A (zh) * | 2019-03-29 | 2020-10-09 | 深圳市速腾聚创科技有限公司 | 激光雷达装置 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108716516B (zh) * | 2018-05-15 | 2020-06-26 | 汶上海纬机车配件有限公司 | 一种弧形散热板条合金钢制动盘及其制作方法 |
WO2021189441A1 (zh) * | 2020-03-27 | 2021-09-30 | 深圳市大疆创新科技有限公司 | 测距装置及可移动平台 |
CN112118718B (zh) * | 2020-10-31 | 2023-05-26 | Oppo广东移动通信有限公司 | 电子设备及其散热方法 |
CN112533461A (zh) * | 2020-12-25 | 2021-03-19 | 东莞市李群自动化技术有限公司 | 驱控一体板、控制系统和机器人 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62291158A (ja) * | 1986-06-11 | 1987-12-17 | Toshiba Corp | Icパツケ−ジ |
CN2461057Y (zh) * | 2000-12-25 | 2001-11-21 | 神达电脑股份有限公司 | 中央处理器泄波散热装置 |
CN2901579Y (zh) * | 2005-12-09 | 2007-05-16 | 英业达股份有限公司 | 导热元件 |
CN101426357A (zh) * | 2007-10-31 | 2009-05-06 | 鸿富锦精密工业(深圳)有限公司 | 散热装置 |
CN203120363U (zh) * | 2013-02-07 | 2013-08-07 | 刘友辉 | 一种高导热导电的电子调速器 |
CN203814117U (zh) * | 2014-04-21 | 2014-09-03 | 启碁科技股份有限公司 | 导热垫以及主板 |
CN104813760A (zh) * | 2014-03-18 | 2015-07-29 | 华为终端有限公司 | 一种散热组件及电子设备 |
CN105517903A (zh) * | 2014-09-24 | 2016-04-20 | 深圳市大疆创新科技有限公司 | 云台及其使用的成像装置、以及无人机 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040227230A1 (en) * | 2003-05-13 | 2004-11-18 | Ming-Ching Chou | Heat spreaders |
CN102480899A (zh) * | 2010-11-26 | 2012-05-30 | 鸿富锦精密工业(深圳)有限公司 | 散热装置 |
CN105667818A (zh) * | 2016-01-05 | 2016-06-15 | 零度智控(北京)智能科技有限公司 | 一种云台 |
-
2016
- 2016-09-27 CN CN201621082727.XU patent/CN206118273U/zh not_active Expired - Fee Related
- 2016-11-07 WO PCT/CN2016/104857 patent/WO2018058746A1/zh active Application Filing
- 2016-11-07 CN CN201680087787.7A patent/CN109479384A/zh active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62291158A (ja) * | 1986-06-11 | 1987-12-17 | Toshiba Corp | Icパツケ−ジ |
CN2461057Y (zh) * | 2000-12-25 | 2001-11-21 | 神达电脑股份有限公司 | 中央处理器泄波散热装置 |
CN2901579Y (zh) * | 2005-12-09 | 2007-05-16 | 英业达股份有限公司 | 导热元件 |
CN101426357A (zh) * | 2007-10-31 | 2009-05-06 | 鸿富锦精密工业(深圳)有限公司 | 散热装置 |
CN203120363U (zh) * | 2013-02-07 | 2013-08-07 | 刘友辉 | 一种高导热导电的电子调速器 |
CN104813760A (zh) * | 2014-03-18 | 2015-07-29 | 华为终端有限公司 | 一种散热组件及电子设备 |
CN203814117U (zh) * | 2014-04-21 | 2014-09-03 | 启碁科技股份有限公司 | 导热垫以及主板 |
CN105517903A (zh) * | 2014-09-24 | 2016-04-20 | 深圳市大疆创新科技有限公司 | 云台及其使用的成像装置、以及无人机 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111751804A (zh) * | 2019-03-29 | 2020-10-09 | 深圳市速腾聚创科技有限公司 | 激光雷达装置 |
CN111751804B (zh) * | 2019-03-29 | 2024-04-09 | 深圳市速腾聚创科技有限公司 | 激光雷达装置 |
Also Published As
Publication number | Publication date |
---|---|
CN206118273U (zh) | 2017-04-19 |
WO2018058746A1 (zh) | 2018-04-05 |
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190315 |