JP2014053603A5 - - Google Patents

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Publication number
JP2014053603A5
JP2014053603A5 JP2013172995A JP2013172995A JP2014053603A5 JP 2014053603 A5 JP2014053603 A5 JP 2014053603A5 JP 2013172995 A JP2013172995 A JP 2013172995A JP 2013172995 A JP2013172995 A JP 2013172995A JP 2014053603 A5 JP2014053603 A5 JP 2014053603A5
Authority
JP
Japan
Prior art keywords
heat dissipation
heat
dissipation layer
layer
communication module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
JP2013172995A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014053603A (ja
Filing date
Publication date
Priority claimed from US13/600,334 external-priority patent/US9146368B2/en
Application filed filed Critical
Publication of JP2014053603A publication Critical patent/JP2014053603A/ja
Publication of JP2014053603A5 publication Critical patent/JP2014053603A5/ja
Ceased legal-status Critical Current

Links

JP2013172995A 2012-08-31 2013-08-23 光通信モジュールにおける放熱のための方法及びシステム Ceased JP2014053603A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/600,334 US9146368B2 (en) 2012-08-31 2012-08-31 Methods and systems for dissipating heat in optical communications modules
US13/600,334 2012-08-31

Publications (2)

Publication Number Publication Date
JP2014053603A JP2014053603A (ja) 2014-03-20
JP2014053603A5 true JP2014053603A5 (enExample) 2015-10-15

Family

ID=50187309

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013172995A Ceased JP2014053603A (ja) 2012-08-31 2013-08-23 光通信モジュールにおける放熱のための方法及びシステム

Country Status (2)

Country Link
US (1) US9146368B2 (enExample)
JP (1) JP2014053603A (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9063305B2 (en) * 2012-11-26 2015-06-23 Avago Technologies General Ip (Singapore) Pte. Ltd. Methods and systems for dissipating heat in optical communications modules
US9750158B2 (en) * 2014-05-02 2017-08-29 Honeywell International Inc. Reduced thermal transfer to Peltier cooled FETs
US9645333B2 (en) * 2014-10-17 2017-05-09 Lumentum Operations Llc Optomechanical assembly
US10177527B2 (en) * 2015-05-28 2019-01-08 Vixar Inc. VCSELS and VCSEL arrays designed for improved performance as illumination sources and sensors
WO2017019025A1 (en) 2015-07-27 2017-02-02 Hewlett Packard Enterprise Development Lp Socket to support boards in a spaced relation
WO2017023257A1 (en) 2015-07-31 2017-02-09 Hewlett Packard Enterprise Development Lp Multi-chip module
KR101925476B1 (ko) * 2015-11-25 2018-12-05 주식회사 옵텔라 광학 모듈 및 이를 포함하는 광학 엔진
WO2017188971A1 (en) 2016-04-29 2017-11-02 Hewlett Packard Enterprise Development Lp First and second shields for thermal isolation

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002094170A (ja) * 2000-09-13 2002-03-29 Hitachi Ltd 光モジュール
US6859470B2 (en) 2002-02-27 2005-02-22 Jds Uniphase Corporation Air trench that limits thermal coupling between laser and laser driver
US6773532B2 (en) 2002-02-27 2004-08-10 Jds Uniphase Corporation Method for improving heat dissipation in optical transmitter
GB2405993A (en) 2003-09-11 2005-03-16 Agilent Technologies Inc An arrangement for dissipating heat in an electro-optical system
JP2007012856A (ja) * 2005-06-30 2007-01-18 Toyoda Gosei Co Ltd Ｌｅｄ装置及びｌｅｄ装置用筐体
US7331720B1 (en) * 2006-10-19 2008-02-19 Avago Technologies Fiber Ip Pte Ltd Transceiver module for optical communications and method for transmitting and receiving data
US7543994B2 (en) * 2006-10-19 2009-06-09 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Multi-optical fiber connector module for use with a transceiver module and method for coupling optical signals between the transceiver module and multiple optical fibers
KR101491138B1 (ko) 2007-12-12 2015-02-09 엘지이노텍 주식회사 다층 기판 및 이를 구비한 발광 다이오드 모듈
US8559824B2 (en) * 2008-09-30 2013-10-15 Avago Technologies General Ip (Singapore) Pte. Ltd. Parallel optical transceiver module having a balanced laser driver arrangement
US8351794B2 (en) * 2009-03-10 2013-01-08 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Parallel optical transceiver module having a heat dissipation system that dissipates heat and protects components of the module from particulates and handling
US8041160B2 (en) * 2009-04-15 2011-10-18 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Optical communications device having a mounting core and method
US8280203B2 (en) * 2009-07-07 2012-10-02 Avago Technologies Fiber Ip (Singapore) Pte. Ltd Parallel optical communications device having weldable inserts
US8936402B2 (en) * 2010-02-23 2015-01-20 Avago Technologies General Ip (Singapore) Pte. Ltd. Method and apparatus for mounting and positioning parallel optical transceiver modules in a mid-plane mounting configuration with improved mounting density and alignment accuracy
US8414309B2 (en) * 2010-05-03 2013-04-09 Avago Technologies Fiber Ip (Singapore) Pte. Ltd Receptacle for an optical transceiver module for protecting the module from airborne particles
US8563918B2 (en) * 2011-01-06 2013-10-22 Avago Technologies General Ip (Singapore) Pte. Ltd. Laser hammering technique for aligning members of a constructed array of optoelectronic devices
US9063305B2 (en) * 2012-11-26 2015-06-23 Avago Technologies General Ip (Singapore) Pte. Ltd. Methods and systems for dissipating heat in optical communications modules

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