JP2016012707A5 - - Google Patents
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- JP2016012707A5 JP2016012707A5 JP2014134918A JP2014134918A JP2016012707A5 JP 2016012707 A5 JP2016012707 A5 JP 2016012707A5 JP 2014134918 A JP2014134918 A JP 2014134918A JP 2014134918 A JP2014134918 A JP 2014134918A JP 2016012707 A5 JP2016012707 A5 JP 2016012707A5
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- JP
- Japan
- Prior art keywords
- photoelectric component
- electrode
- component unit
- photoelectric
- unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004065 semiconductor Substances 0.000 claims 6
- 239000000758 substrate Substances 0.000 claims 6
- 230000003287 optical effect Effects 0.000 claims 2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014134918A JP6529223B2 (ja) | 2014-06-30 | 2014-06-30 | 光電部品 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014134918A JP6529223B2 (ja) | 2014-06-30 | 2014-06-30 | 光電部品 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019091081A Division JP6843916B2 (ja) | 2019-05-14 | 2019-05-14 | 光電部品 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016012707A JP2016012707A (ja) | 2016-01-21 |
| JP2016012707A5 true JP2016012707A5 (enExample) | 2017-08-10 |
| JP6529223B2 JP6529223B2 (ja) | 2019-06-12 |
Family
ID=55229215
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014134918A Active JP6529223B2 (ja) | 2014-06-30 | 2014-06-30 | 光電部品 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6529223B2 (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110476262A (zh) * | 2017-04-04 | 2019-11-19 | 昕诺飞控股有限公司 | 固态发光器封装件、灯、灯具以及制造固态发光器封装件的方法 |
| JP6928233B2 (ja) | 2017-04-05 | 2021-09-01 | 日亜化学工業株式会社 | 発光装置 |
| JP7233859B2 (ja) * | 2017-06-20 | 2023-03-07 | 旭化成エレクトロニクス株式会社 | 赤外線発光ダイオード |
| JP6822429B2 (ja) | 2018-02-19 | 2021-01-27 | 日亜化学工業株式会社 | 発光素子 |
| JP6717324B2 (ja) | 2018-02-27 | 2020-07-01 | 日亜化学工業株式会社 | 発光素子 |
| JP7206628B2 (ja) * | 2018-04-27 | 2023-01-18 | セイコーエプソン株式会社 | 発光装置およびプロジェクター |
| CN113454857B (zh) | 2019-02-26 | 2024-11-01 | 新唐科技日本株式会社 | 半导体激光装置以及半导体激光元件 |
| JP6843916B2 (ja) * | 2019-05-14 | 2021-03-17 | 晶元光電股▲ふん▼有限公司Epistar Corporation | 光電部品 |
| JP7319551B2 (ja) * | 2020-03-31 | 2023-08-02 | 日亜化学工業株式会社 | 発光装置 |
| JP7177360B2 (ja) | 2020-07-22 | 2022-11-24 | 日亜化学工業株式会社 | 発光素子及び発光装置 |
| JP7223046B2 (ja) * | 2021-02-24 | 2023-02-15 | 晶元光電股▲ふん▼有限公司 | 光電部品 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4045767B2 (ja) * | 2001-09-28 | 2008-02-13 | 日亜化学工業株式会社 | 半導体発光装置 |
| JP3822545B2 (ja) * | 2002-04-12 | 2006-09-20 | 士郎 酒井 | 発光装置 |
| JP2004356237A (ja) * | 2003-05-27 | 2004-12-16 | Matsushita Electric Works Ltd | 半導体発光素子 |
| WO2006098545A2 (en) * | 2004-12-14 | 2006-09-21 | Seoul Opto Device Co., Ltd. | Light emitting device having a plurality of light emitting cells and package mounting the same |
| US7221044B2 (en) * | 2005-01-21 | 2007-05-22 | Ac Led Lighting, L.L.C. | Heterogeneous integrated high voltage DC/AC light emitter |
| TWI244228B (en) * | 2005-02-03 | 2005-11-21 | United Epitaxy Co Ltd | Light emitting device and manufacture method thereof |
| JP2008135694A (ja) * | 2006-10-31 | 2008-06-12 | Hitachi Cable Ltd | Ledモジュール |
| CN101226972B (zh) * | 2007-01-16 | 2011-01-12 | 台达电子工业股份有限公司 | 发光二极管装置及其制造方法 |
| JP2010521807A (ja) * | 2007-03-13 | 2010-06-24 | ソウル オプト デバイス カンパニー リミテッド | 交流駆動型の発光ダイオード |
| DE102008021403A1 (de) * | 2007-09-28 | 2009-04-02 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterkörper und Verfahren zu dessen Herstellung |
| TWI414088B (zh) * | 2009-12-16 | 2013-11-01 | 晶元光電股份有限公司 | 發光元件及其製造方法 |
| KR20110130851A (ko) * | 2010-05-28 | 2011-12-06 | 삼성전자주식회사 | 발광 장치, 이를 포함하는 발광 시스템, 및 이들의 제조 방법 |
| US9070851B2 (en) * | 2010-09-24 | 2015-06-30 | Seoul Semiconductor Co., Ltd. | Wafer-level light emitting diode package and method of fabricating the same |
| US8299488B2 (en) * | 2010-12-16 | 2012-10-30 | King Dragon International Inc. | LED chip |
| US8735189B2 (en) * | 2012-05-17 | 2014-05-27 | Starlite LED Inc | Flip light emitting diode chip and method of fabricating the same |
| CN103975451B (zh) * | 2012-07-18 | 2016-10-12 | 世迈克琉明有限公司 | 制造半导体发光器件的方法 |
| KR20140073351A (ko) * | 2012-12-06 | 2014-06-16 | 엘지이노텍 주식회사 | 발광 소자 |
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2014
- 2014-06-30 JP JP2014134918A patent/JP6529223B2/ja active Active