JP2014053603A - 光通信モジュールにおける放熱のための方法及びシステム - Google Patents

光通信モジュールにおける放熱のための方法及びシステム Download PDF

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Publication number
JP2014053603A
JP2014053603A JP2013172995A JP2013172995A JP2014053603A JP 2014053603 A JP2014053603 A JP 2014053603A JP 2013172995 A JP2013172995 A JP 2013172995A JP 2013172995 A JP2013172995 A JP 2013172995A JP 2014053603 A JP2014053603 A JP 2014053603A
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JP
Japan
Prior art keywords
heat dissipation
heat
optical communication
communication module
block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
JP2013172995A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014053603A5 (enExample
Inventor
Seng-Kum Chan
セン−クン・チャン
J K Meadowcroft David
デイヴィッド・ジェイ・ケイ・ミドウクロフト
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Avago Technologies International Sales Pte Ltd
Original Assignee
Avago Technologies General IP Singapore Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Avago Technologies General IP Singapore Pte Ltd filed Critical Avago Technologies General IP Singapore Pte Ltd
Publication of JP2014053603A publication Critical patent/JP2014053603A/ja
Publication of JP2014053603A5 publication Critical patent/JP2014053603A5/ja
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268—Cooling
    • G02B6/4269—Cooling with heat sinks or radiation fins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10174—Diode
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/2049—Pressing means used to urge contact, e.g. springs

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Semiconductor Lasers (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Optical Communication System (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2013172995A 2012-08-31 2013-08-23 光通信モジュールにおける放熱のための方法及びシステム Ceased JP2014053603A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/600,334 US9146368B2 (en) 2012-08-31 2012-08-31 Methods and systems for dissipating heat in optical communications modules
US13/600,334 2012-08-31

Publications (2)

Publication Number Publication Date
JP2014053603A true JP2014053603A (ja) 2014-03-20
JP2014053603A5 JP2014053603A5 (enExample) 2015-10-15

Family

ID=50187309

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013172995A Ceased JP2014053603A (ja) 2012-08-31 2013-08-23 光通信モジュールにおける放熱のための方法及びシステム

Country Status (2)

Country Link
US (1) US9146368B2 (enExample)
JP (1) JP2014053603A (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9063305B2 (en) * 2012-11-26 2015-06-23 Avago Technologies General Ip (Singapore) Pte. Ltd. Methods and systems for dissipating heat in optical communications modules
US9750158B2 (en) * 2014-05-02 2017-08-29 Honeywell International Inc. Reduced thermal transfer to Peltier cooled FETs
US9645333B2 (en) * 2014-10-17 2017-05-09 Lumentum Operations Llc Optomechanical assembly
US10177527B2 (en) * 2015-05-28 2019-01-08 Vixar Inc. VCSELS and VCSEL arrays designed for improved performance as illumination sources and sensors
WO2017019025A1 (en) 2015-07-27 2017-02-02 Hewlett Packard Enterprise Development Lp Socket to support boards in a spaced relation
WO2017023257A1 (en) 2015-07-31 2017-02-09 Hewlett Packard Enterprise Development Lp Multi-chip module
KR101925476B1 (ko) * 2015-11-25 2018-12-05 주식회사 옵텔라 광학 모듈 및 이를 포함하는 광학 엔진
WO2017188971A1 (en) 2016-04-29 2017-11-02 Hewlett Packard Enterprise Development Lp First and second shields for thermal isolation

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002094170A (ja) * 2000-09-13 2002-03-29 Hitachi Ltd 光モジュール
JP2007012856A (ja) * 2005-06-30 2007-01-18 Toyoda Gosei Co Ltd Ｌｅｄ装置及びｌｅｄ装置用筐体
US20100266236A1 (en) * 2009-04-15 2010-10-21 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. optical communications device having a mounting core and method
JP2010250293A (ja) * 2009-03-10 2010-11-04 Avago Technologies Fiber Ip (Singapore) Pte Ltd 放熱を行い、微粒子およびハンドリングからモジュールのコンポーネントを保護する放熱システムを有する並列光トランシーバモジュール
JP2011081343A (ja) * 2009-07-07 2011-04-21 Avago Technologies Fiber Ip (Singapore) Pte Ltd 溶接可能な挿入部を有する並列光通信装置
US20110206326A1 (en) * 2010-02-23 2011-08-25 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Method and apparatus for mounting and positioning parallel optical transceiver modules in a mid-plane mounting configuration with improved mounting density and alignment accuracy
JP2011253180A (ja) * 2010-05-03 2011-12-15 Avago Technologies Fiber Ip (Singapore) Pte Ltd 並列光トランシーバ・モジュールと共に使用する、浮遊物体からこのモジュールの部品を保護するための保護ソケット

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6859470B2 (en) 2002-02-27 2005-02-22 Jds Uniphase Corporation Air trench that limits thermal coupling between laser and laser driver
US6773532B2 (en) 2002-02-27 2004-08-10 Jds Uniphase Corporation Method for improving heat dissipation in optical transmitter
GB2405993A (en) 2003-09-11 2005-03-16 Agilent Technologies Inc An arrangement for dissipating heat in an electro-optical system
US7331720B1 (en) * 2006-10-19 2008-02-19 Avago Technologies Fiber Ip Pte Ltd Transceiver module for optical communications and method for transmitting and receiving data
US7543994B2 (en) * 2006-10-19 2009-06-09 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Multi-optical fiber connector module for use with a transceiver module and method for coupling optical signals between the transceiver module and multiple optical fibers
KR101491138B1 (ko) 2007-12-12 2015-02-09 엘지이노텍 주식회사 다층 기판 및 이를 구비한 발광 다이오드 모듈
US8559824B2 (en) * 2008-09-30 2013-10-15 Avago Technologies General Ip (Singapore) Pte. Ltd. Parallel optical transceiver module having a balanced laser driver arrangement
US8563918B2 (en) * 2011-01-06 2013-10-22 Avago Technologies General Ip (Singapore) Pte. Ltd. Laser hammering technique for aligning members of a constructed array of optoelectronic devices
US9063305B2 (en) * 2012-11-26 2015-06-23 Avago Technologies General Ip (Singapore) Pte. Ltd. Methods and systems for dissipating heat in optical communications modules

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002094170A (ja) * 2000-09-13 2002-03-29 Hitachi Ltd 光モジュール
JP2007012856A (ja) * 2005-06-30 2007-01-18 Toyoda Gosei Co Ltd Ｌｅｄ装置及びｌｅｄ装置用筐体
JP2010250293A (ja) * 2009-03-10 2010-11-04 Avago Technologies Fiber Ip (Singapore) Pte Ltd 放熱を行い、微粒子およびハンドリングからモジュールのコンポーネントを保護する放熱システムを有する並列光トランシーバモジュール
US20100266236A1 (en) * 2009-04-15 2010-10-21 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. optical communications device having a mounting core and method
JP2011081343A (ja) * 2009-07-07 2011-04-21 Avago Technologies Fiber Ip (Singapore) Pte Ltd 溶接可能な挿入部を有する並列光通信装置
US20110206326A1 (en) * 2010-02-23 2011-08-25 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Method and apparatus for mounting and positioning parallel optical transceiver modules in a mid-plane mounting configuration with improved mounting density and alignment accuracy
JP2011253180A (ja) * 2010-05-03 2011-12-15 Avago Technologies Fiber Ip (Singapore) Pte Ltd 並列光トランシーバ・モジュールと共に使用する、浮遊物体からこのモジュールの部品を保護するための保護ソケット

Also Published As

Publication number Publication date
US9146368B2 (en) 2015-09-29
US20140063743A1 (en) 2014-03-06

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