GB8625472D0 - Circuit board installation - Google Patents

Circuit board installation

Info

Publication number
GB8625472D0
GB8625472D0 GB8625472A GB8625472A GB8625472D0 GB 8625472 D0 GB8625472 D0 GB 8625472D0 GB 8625472 A GB8625472 A GB 8625472A GB 8625472 A GB8625472 A GB 8625472A GB 8625472 D0 GB8625472 D0 GB 8625472D0
Authority
GB
United Kingdom
Prior art keywords
circuit board
board installation
installation
circuit
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
GB8625472A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Balfour Beatty PLC
Original Assignee
BICC PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BICC PLC filed Critical BICC PLC
Priority to GB8625472A priority Critical patent/GB8625472D0/en
Publication of GB8625472D0 publication Critical patent/GB8625472D0/en
Priority to GB8724682A priority patent/GB2197538B/en
Priority to DE8714174U priority patent/DE8714174U1/de
Priority to DE19873735985 priority patent/DE3735985A1/en
Priority to FR8714714A priority patent/FR2605829A1/en
Priority to JP26765487A priority patent/JPS6486541A/en
Pending legal-status Critical Current

Links

GB8625472A 1986-10-24 1986-10-24 Circuit board installation Pending GB8625472D0 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
GB8625472A GB8625472D0 (en) 1986-10-24 1986-10-24 Circuit board installation
GB8724682A GB2197538B (en) 1986-10-24 1987-10-21 An improved circuit board installation
DE8714174U DE8714174U1 (en) 1986-10-24 1987-10-23
DE19873735985 DE3735985A1 (en) 1986-10-24 1987-10-23 HEAT-CONDUCTING MODULE FOR PRINTED CIRCUIT BOARD ARRANGEMENT
FR8714714A FR2605829A1 (en) 1986-10-24 1987-10-23 THERMALLY CONDUCTIVE MODULE FOR LOCALLY EXTRACTING THE HEAT FROM AN ELECTRICAL COMPONENT, PARTICULARLY IN A PRINTED CIRCUIT BOARD INSTALLATION AND PRINTED CIRCUIT BOARD INSTALLATION PROVIDED WITH SUCH MODULES
JP26765487A JPS6486541A (en) 1986-10-24 1987-10-24 Heat-conductive module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8625472A GB8625472D0 (en) 1986-10-24 1986-10-24 Circuit board installation

Publications (1)

Publication Number Publication Date
GB8625472D0 true GB8625472D0 (en) 1986-11-26

Family

ID=10606235

Family Applications (2)

Application Number Title Priority Date Filing Date
GB8625472A Pending GB8625472D0 (en) 1986-10-24 1986-10-24 Circuit board installation
GB8724682A Expired GB2197538B (en) 1986-10-24 1987-10-21 An improved circuit board installation

Family Applications After (1)

Application Number Title Priority Date Filing Date
GB8724682A Expired GB2197538B (en) 1986-10-24 1987-10-21 An improved circuit board installation

Country Status (4)

Country Link
JP (1) JPS6486541A (en)
DE (2) DE3735985A1 (en)
FR (1) FR2605829A1 (en)
GB (2) GB8625472D0 (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4040288A1 (en) * 1990-12-17 1992-07-02 Ant Nachrichtentech Electronic module with metal housing - has circuit board with integrated circuit element in thermal contact with housing
DE9100467U1 (en) * 1991-01-16 1992-05-21 Robert Bosch Gmbh, 7000 Stuttgart, De
DE4104888C2 (en) * 1991-02-18 1994-09-08 Ant Nachrichtentech Electronic assembly with metal housing
DE4118398C2 (en) * 1991-06-05 1994-07-21 Ant Nachrichtentech Electronics assembly with metal housing
GB2259408A (en) * 1991-09-07 1993-03-10 Motorola Israel Ltd A heat dissipation device
DE4404035A1 (en) * 1994-02-09 1995-08-10 Sel Alcatel Ag Thermal conduction device for electrical components
DE19901445C2 (en) * 1999-01-15 2002-07-11 Siemens Ag Semiconductor cooling arrangement
US6501658B2 (en) * 2001-02-16 2002-12-31 Intel Corporation Heatsink mounting with shock absorbers
DE10142975B4 (en) * 2001-09-01 2009-05-07 Conti Temic Microelectronic Gmbh Heat sink for elktronische components and method for attaching the same
US8024936B2 (en) 2004-11-16 2011-09-27 Halliburton Energy Services, Inc. Cooling apparatus, systems, and methods
WO2006060673A1 (en) 2004-12-03 2006-06-08 Halliburton Energy Services, Inc. Rechargeable energy storage device in a downhole operation
US7242593B2 (en) * 2005-07-08 2007-07-10 Ims Inc. Thermally efficient motor housing assembly
US8957316B2 (en) * 2010-09-10 2015-02-17 Honeywell International Inc. Electrical component assembly for thermal transfer
EP2634798A1 (en) * 2012-02-29 2013-09-04 Siemens Aktiengesellschaft Electric device with cooling housing
EP2669943A1 (en) * 2012-05-28 2013-12-04 Alcatel Lucent Methods and apparatus for providing transfer of a heat load between a heat source and a heat receiver
EP2811515A1 (en) * 2013-06-07 2014-12-10 Alcatel Lucent Thermal connector and heat distribution device for a thermal connector
EP3098557B1 (en) * 2015-05-26 2019-03-27 Advantech Co., Ltd. Dynamic heat conduction system
US20240090131A1 (en) * 2022-09-14 2024-03-14 Hamilton Sundstrand Corporation Thermal management for flat no lead packages

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4092697A (en) * 1976-12-06 1978-05-30 International Business Machines Corporation Heat transfer mechanism for integrated circuit package
US4193445A (en) * 1978-06-29 1980-03-18 International Business Machines Corporation Conduction cooled module
US4249034A (en) * 1978-11-27 1981-02-03 General Electric Company Semiconductor package having strengthening and sealing upper chamber
US4246597A (en) * 1979-06-29 1981-01-20 International Business Machines Corporation Air cooled multi-chip module having a heat conductive piston spring loaded against the chips
DE3477101D1 (en) * 1983-03-25 1989-04-13 Mitsubishi Electric Corp Heat radiator assembly for cooling electronic parts

Also Published As

Publication number Publication date
GB8724682D0 (en) 1987-11-25
GB2197538B (en) 1990-04-04
DE3735985A1 (en) 1988-05-11
FR2605829A1 (en) 1988-04-29
DE8714174U1 (en) 1988-03-03
JPS6486541A (en) 1989-03-31
DE3735985C2 (en) 1992-10-15
GB2197538A (en) 1988-05-18

Similar Documents

Publication Publication Date Title
GB8721695D0 (en) Circuit boards
GB8614547D0 (en) Circuit board
EP0249688A3 (en) Printed circuit board
GB8624027D0 (en) Circuit arrangement
GB8625472D0 (en) Circuit board installation
GB2197131B (en) Enclosed circuit board assembly
GB8630314D0 (en) Circuit arrangement
GB8306478D0 (en) Circuit board installation
GB8723024D0 (en) Circuit arrangement
GB8719076D0 (en) Circuit board
GB8417978D0 (en) Circuit board assembly
GB8705309D0 (en) Circuit arrangement
GB8620789D0 (en) Printed circuit board
EP0268497A3 (en) Printed circuit board
GB8711155D0 (en) Terminal board
GB8701361D0 (en) Circuit board supporting arrangement
GB8715744D0 (en) Printed circuit boards
GB8722177D0 (en) Circuit arrangement
GB2191046B (en) Circuit board mounting devices
GB2190795B (en) Circuit arrangement
GB8524355D0 (en) Circuit board
GB8727453D0 (en) Circuit arrangement
GB8713521D0 (en) Circuit arrangement
GB8630407D0 (en) Circuit arrangement
KR910001786B1 (en) Circuit board