JP2012060132A - 熱移送のための電気構成要素組立体 - Google Patents

熱移送のための電気構成要素組立体 Download PDF

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Publication number
JP2012060132A
JP2012060132A JP2011197269A JP2011197269A JP2012060132A JP 2012060132 A JP2012060132 A JP 2012060132A JP 2011197269 A JP2011197269 A JP 2011197269A JP 2011197269 A JP2011197269 A JP 2011197269A JP 2012060132 A JP2012060132 A JP 2012060132A
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JP
Japan
Prior art keywords
thermal
electrical component
thermal bridge
assembly
bridge
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011197269A
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English (en)
Japanese (ja)
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JP2012060132A5 (enExample
Inventor
R Fields Chris
クリス・アール・フィールズ
Keller Jerry
ジェリー・ケラー
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Honeywell International Inc
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Honeywell International Inc
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Filing date
Publication date
Application filed by Honeywell International Inc filed Critical Honeywell International Inc
Publication of JP2012060132A publication Critical patent/JP2012060132A/ja
Publication of JP2012060132A5 publication Critical patent/JP2012060132A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4338—Pistons, e.g. spring-loaded members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structure Of Printed Boards (AREA)
JP2011197269A 2010-09-10 2011-09-09 熱移送のための電気構成要素組立体 Pending JP2012060132A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/879,229 2010-09-10
US12/879,229 US8957316B2 (en) 2010-09-10 2010-09-10 Electrical component assembly for thermal transfer

Publications (2)

Publication Number Publication Date
JP2012060132A true JP2012060132A (ja) 2012-03-22
JP2012060132A5 JP2012060132A5 (enExample) 2014-10-23

Family

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Family Applications (1)

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JP2011197269A Pending JP2012060132A (ja) 2010-09-10 2011-09-09 熱移送のための電気構成要素組立体

Country Status (3)

Country Link
US (1) US8957316B2 (enExample)
EP (1) EP2428990A3 (enExample)
JP (1) JP2012060132A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013084674A (ja) * 2011-10-06 2013-05-09 Shindengen Electric Mfg Co Ltd 発熱電子デバイスの放熱構造
JP2017063097A (ja) * 2015-09-24 2017-03-30 古河電気工業株式会社 サーマルコネクタ
JP2017204503A (ja) * 2016-05-09 2017-11-16 昭和電工株式会社 伝熱構造体、絶縁積層材、絶縁回路基板およびパワーモジュール用ベース
JP2022537532A (ja) * 2019-06-19 2022-08-26 インターナショナル・ビジネス・マシーンズ・コーポレーション 低温デバイスの熱化のための極低温包装

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9163883B2 (en) 2009-03-06 2015-10-20 Kevlin Thermal Technologies, Inc. Flexible thermal ground plane and manufacturing the same
US10049959B2 (en) * 2011-03-25 2018-08-14 Philips Lighting Holding B.V. Thermal interface pad material with perforated liner
CN203279336U (zh) * 2013-04-27 2013-11-06 中兴通讯股份有限公司 一种内散热的终端
US9478473B2 (en) * 2013-05-21 2016-10-25 Globalfoundries Inc. Fabricating a microelectronics lid using sol-gel processing
JP5805838B1 (ja) 2014-09-29 2015-11-10 株式会社日立製作所 発熱体の冷却構造、電力変換器ユニットおよび電力変換装置
EP3194157A4 (en) * 2014-09-15 2018-04-25 The Regents of The University of Colorado, A Body Corporate Vacuum-enhanced heat spreader
US9921004B2 (en) 2014-09-15 2018-03-20 Kelvin Thermal Technologies, Inc. Polymer-based microfabricated thermal ground plane
US20190390919A1 (en) * 2014-09-15 2019-12-26 Kelvin Thermal Technologies, Inc. Polymer-based microfabricated thermal ground plane
EP3194113B1 (en) 2014-09-17 2022-06-08 The Regents Of The University Of Colorado, A Body Corporate, A Colorado Non-Profit Micropillar-enabled thermal ground plane
US12385697B2 (en) 2014-09-17 2025-08-12 Kelvin Thermal Technologies, Inc. Micropillar-enabled thermal ground plane
US11988453B2 (en) 2014-09-17 2024-05-21 Kelvin Thermal Technologies, Inc. Thermal management planes
US11598594B2 (en) 2014-09-17 2023-03-07 The Regents Of The University Of Colorado Micropillar-enabled thermal ground plane
US10083894B2 (en) * 2015-12-17 2018-09-25 International Business Machines Corporation Integrated die paddle structures for bottom terminated components
US12104856B2 (en) 2016-10-19 2024-10-01 Kelvin Thermal Technologies, Inc. Method and device for optimization of vapor transport in a thermal ground plane using void space in mobile systems
EP3539156A4 (en) 2016-11-08 2020-07-15 Kelvin Thermal Technologies, Inc. METHOD AND DEVICE FOR DISTRIBUTING HIGH HEAT FLOWS ON THERMAL GROUND SURFACES
US20180235069A1 (en) * 2016-12-16 2018-08-16 Hamilton Sundstrand Corporation Pressure limiting heat sink
WO2018208801A1 (en) 2017-05-08 2018-11-15 Kelvin Thermal Technologies, Inc. Thermal management planes
US9992911B1 (en) * 2017-05-17 2018-06-05 Northrop Grumman Systems Corporation Controllable conductance thermal interface
WO2020056165A1 (en) * 2018-09-14 2020-03-19 Raytheon Company Module base with integrated thermal spreader and heat sink for thermal and structural management of high-performance integrated circuits or other devices
CN115997099A (zh) 2020-06-19 2023-04-21 开尔文热技术股份有限公司 折叠式热接地平面
EP4096376B1 (en) * 2021-05-24 2025-09-24 Aptiv Technologies AG Cooling device and heatsink assembly incorporating the same
RU206203U1 (ru) * 2021-06-02 2021-08-30 Общество с ограниченной ответственностью "Т8 Сенсор" (ООО "Т8 Сенсор") Лазерный модуль

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6486541A (en) * 1986-10-24 1989-03-31 Bicc Plc Heat-conductive module
JP2000269671A (ja) * 1999-03-19 2000-09-29 Toshiba Corp 電子機器
JP2001057494A (ja) * 1999-08-18 2001-02-27 Ando Electric Co Ltd プリント基板の冷却構造
US20040218362A1 (en) * 2003-02-19 2004-11-04 Amaro Allen J. System and apparatus for heat removal
JP2005129934A (ja) * 2003-10-21 2005-05-19 Hewlett-Packard Development Co Lp 熱伝達インターフェース
US20050128715A1 (en) * 2003-12-16 2005-06-16 Rafael - Armament Development Authority Ltd. Integrated-circuit cooling system
JP2007129201A (ja) * 2005-11-04 2007-05-24 Advanced Energy Technology Inc サーマルビアを有するヒートスプレッダ
US20090165302A1 (en) * 2007-12-31 2009-07-02 Slaton David S Method of forming a heatsink

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61290743A (ja) 1985-06-19 1986-12-20 Hitachi Ltd 半導体デバイスの冷却装置
JPH0547968A (ja) 1991-08-20 1993-02-26 Fujitsu Ltd 電子装置の冷却構造
US5844784A (en) * 1997-03-24 1998-12-01 Qualcomm Incorporated Brace apparatus and method for printed wiring board assembly
JP2874684B2 (ja) 1997-03-27 1999-03-24 日本電気株式会社 プラグインユニットの放熱構造
US6917525B2 (en) 2001-11-27 2005-07-12 Nanonexus, Inc. Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs
US6181556B1 (en) * 1999-07-21 2001-01-30 Richard K. Allman Thermally-coupled heat dissipation apparatus for electronic devices
US6249435B1 (en) 1999-08-16 2001-06-19 General Electric Company Thermally efficient motor controller assembly
US6400565B1 (en) * 2000-04-21 2002-06-04 Dell Products L.P. Thermally conductive interface member
US7952373B2 (en) 2000-05-23 2011-05-31 Verigy (Singapore) Pte. Ltd. Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
KR101022583B1 (ko) * 2001-05-24 2011-03-16 프라이즈 메탈즈, 인크. 방열재 및 땜납 프리폼
US7019266B1 (en) * 2001-07-20 2006-03-28 Cape Simulations, Inc. Substantially-uniform-temperature annealing
US6750084B2 (en) * 2002-06-21 2004-06-15 Delphi Technologies, Inc. Method of mounting a leadless package and structure therefor
US7187076B2 (en) 2003-08-07 2007-03-06 Airborn, Inc. Interposer with integral heat sink
TWI244182B (en) 2004-11-12 2005-11-21 Via Tech Inc Heat-dissipation device
US7327569B2 (en) 2004-12-13 2008-02-05 Hewlett-Packard Development Company, L.P. Processor module with thermal dissipation device
US7289328B2 (en) 2004-12-21 2007-10-30 Hewlett-Packard Development Company, L.P. Multi-chip module with power system and pass-thru holes
US7349221B2 (en) 2006-07-20 2008-03-25 Honeywell International Inc. Device for increased thermal conductivity between a printed wiring assembly and a chassis
US7808788B2 (en) * 2007-06-29 2010-10-05 Delphi Technologies, Inc. Multi-layer electrically isolated thermal conduction structure for a circuit board assembly
US8009429B1 (en) * 2010-03-22 2011-08-30 Honeywell International Inc. Electrical component thermal management

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6486541A (en) * 1986-10-24 1989-03-31 Bicc Plc Heat-conductive module
JP2000269671A (ja) * 1999-03-19 2000-09-29 Toshiba Corp 電子機器
JP2001057494A (ja) * 1999-08-18 2001-02-27 Ando Electric Co Ltd プリント基板の冷却構造
US20040218362A1 (en) * 2003-02-19 2004-11-04 Amaro Allen J. System and apparatus for heat removal
JP2005129934A (ja) * 2003-10-21 2005-05-19 Hewlett-Packard Development Co Lp 熱伝達インターフェース
US20050128715A1 (en) * 2003-12-16 2005-06-16 Rafael - Armament Development Authority Ltd. Integrated-circuit cooling system
JP2007129201A (ja) * 2005-11-04 2007-05-24 Advanced Energy Technology Inc サーマルビアを有するヒートスプレッダ
US20090165302A1 (en) * 2007-12-31 2009-07-02 Slaton David S Method of forming a heatsink

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013084674A (ja) * 2011-10-06 2013-05-09 Shindengen Electric Mfg Co Ltd 発熱電子デバイスの放熱構造
JP2017063097A (ja) * 2015-09-24 2017-03-30 古河電気工業株式会社 サーマルコネクタ
JP2017204503A (ja) * 2016-05-09 2017-11-16 昭和電工株式会社 伝熱構造体、絶縁積層材、絶縁回路基板およびパワーモジュール用ベース
JP2022537532A (ja) * 2019-06-19 2022-08-26 インターナショナル・ビジネス・マシーンズ・コーポレーション 低温デバイスの熱化のための極低温包装
JP7479404B2 (ja) 2019-06-19 2024-05-08 インターナショナル・ビジネス・マシーンズ・コーポレーション 低温デバイスの熱化のための極低温包装
US12219737B2 (en) 2019-06-19 2025-02-04 International Business Machines Corporation Cryogenic packaging for thermalization of low temperature devices

Also Published As

Publication number Publication date
US8957316B2 (en) 2015-02-17
EP2428990A3 (en) 2013-11-27
EP2428990A2 (en) 2012-03-14
US20120061127A1 (en) 2012-03-15

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