JP2014165210A - モジュール基板 - Google Patents

モジュール基板 Download PDF

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Publication number
JP2014165210A
JP2014165210A JP2013032450A JP2013032450A JP2014165210A JP 2014165210 A JP2014165210 A JP 2014165210A JP 2013032450 A JP2013032450 A JP 2013032450A JP 2013032450 A JP2013032450 A JP 2013032450A JP 2014165210 A JP2014165210 A JP 2014165210A
Authority
JP
Japan
Prior art keywords
board
sub
external electrode
substrate
module substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2013032450A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014165210A5 (enExample
Inventor
Tatsuya Kakehashi
達也 梯
Masakazu Muranaga
正和 村永
Shinya Yamamoto
真哉 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Component Ltd
Original Assignee
Fujitsu Component Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Component Ltd filed Critical Fujitsu Component Ltd
Priority to JP2013032450A priority Critical patent/JP2014165210A/ja
Priority to US14/184,958 priority patent/US9468104B2/en
Publication of JP2014165210A publication Critical patent/JP2014165210A/ja
Publication of JP2014165210A5 publication Critical patent/JP2014165210A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49833—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the chip support structure consisting of a plurality of insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Combinations Of Printed Boards (AREA)
JP2013032450A 2013-02-21 2013-02-21 モジュール基板 Pending JP2014165210A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2013032450A JP2014165210A (ja) 2013-02-21 2013-02-21 モジュール基板
US14/184,958 US9468104B2 (en) 2013-02-21 2014-02-20 Module board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013032450A JP2014165210A (ja) 2013-02-21 2013-02-21 モジュール基板

Publications (2)

Publication Number Publication Date
JP2014165210A true JP2014165210A (ja) 2014-09-08
JP2014165210A5 JP2014165210A5 (enExample) 2016-04-07

Family

ID=51350999

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013032450A Pending JP2014165210A (ja) 2013-02-21 2013-02-21 モジュール基板

Country Status (2)

Country Link
US (1) US9468104B2 (enExample)
JP (1) JP2014165210A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020512688A (ja) * 2017-03-09 2020-04-23 華為技術有限公司Ｈｕａｗｅｉ Ｔｅｃｈｎｏｌｏｇｉｅｓ Ｃｏ．，Ｌｔｄ． 消費者向け電子製品のメインボードおよび端末

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9363892B2 (en) * 2013-07-19 2016-06-07 Google Technology Holdings LLC Circuit assembly and corresponding methods
DE102015220676A1 (de) * 2015-10-22 2017-04-27 Zf Friedrichshafen Ag Leiterplatte und Anordnung mit einer Leiterplatte
DE102017206099A1 (de) * 2017-04-10 2018-10-11 BSH Hausgeräte GmbH Leiterplatten-Anordnung sowie Verfahren zur Herstellung einer Leiterplatten-Anordnung
US11553616B2 (en) * 2018-12-07 2023-01-10 Delta Electronics, Inc. Module with power device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06111869A (ja) * 1992-09-29 1994-04-22 Fujitsu Ltd 表面実装用端子
JP2007066936A (ja) * 2005-08-29 2007-03-15 Matsushita Electric Ind Co Ltd 高周波モジュールとその製造方法

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US6525414B2 (en) * 1997-09-16 2003-02-25 Matsushita Electric Industrial Co., Ltd. Semiconductor device including a wiring board and semiconductor elements mounted thereon
US6137164A (en) * 1998-03-16 2000-10-24 Texas Instruments Incorporated Thin stacked integrated circuit device
SG77652A1 (en) * 1998-03-18 2001-01-16 Hitachi Cable Semiconductor device lead-patterning substrate and electronics device and method for fabricating same
JP2001167969A (ja) * 1999-12-06 2001-06-22 Tdk Corp 三次元搭載用多端子積層セラミックコンデンサ
US6528870B2 (en) * 2000-01-28 2003-03-04 Kabushiki Kaisha Toshiba Semiconductor device having a plurality of stacked wiring boards
WO2001071806A1 (en) * 2000-03-21 2001-09-27 Mitsubishi Denki Kabushiki Kaisha Semiconductor device, method of manufacturing electronic device, electronic device, and portable information terminal
US6528408B2 (en) * 2001-05-21 2003-03-04 Micron Technology, Inc. Method for bumped die and wire bonded board-on-chip package
US7087988B2 (en) * 2002-07-30 2006-08-08 Kabushiki Kaisha Toshiba Semiconductor packaging apparatus
JP2004303944A (ja) 2003-03-31 2004-10-28 Matsushita Electric Ind Co Ltd モジュール基板及びその製造方法
PL200759B1 (pl) * 2003-04-25 2009-02-27 Adb Polska Sp Zestaw płytek z obwodami drukowanymi
JP2005277355A (ja) * 2004-03-26 2005-10-06 Sanyo Electric Co Ltd 回路装置
JP2005286057A (ja) * 2004-03-29 2005-10-13 Sanyo Electric Co Ltd 回路装置およびその製造方法
JP4421436B2 (ja) * 2004-09-30 2010-02-24 太陽誘電株式会社 面実装コイル部品
JP4864419B2 (ja) * 2005-10-28 2012-02-01 株式会社東芝 プリント回路板および電子機器
JP4740765B2 (ja) * 2006-02-24 2011-08-03 エルピーダメモリ株式会社 半導体装置及びその製造方法
JP2007281276A (ja) * 2006-04-10 2007-10-25 Nec Electronics Corp 半導体装置
US20070241441A1 (en) * 2006-04-17 2007-10-18 Stats Chippac Ltd. Multichip package system
JP2007294560A (ja) * 2006-04-24 2007-11-08 Nec Electronics Corp 半導体装置およびその製造方法
JP5154262B2 (ja) * 2008-02-26 2013-02-27 太陽誘電株式会社 電子部品
TWI362732B (en) * 2008-04-07 2012-04-21 Nanya Technology Corp Multi-chip stack package
KR20100046760A (ko) * 2008-10-28 2010-05-07 삼성전자주식회사 반도체 패키지
CN102369600B (zh) * 2009-04-02 2014-09-10 株式会社村田制作所 电路基板
JP5234521B2 (ja) * 2009-08-21 2013-07-10 Ｔｄｋ株式会社 電子部品及びその製造方法
JP2011171427A (ja) * 2010-02-17 2011-09-01 Canon Inc 積層型半導体装置
US8847376B2 (en) * 2010-07-23 2014-09-30 Tessera, Inc. Microelectronic elements with post-assembly planarization
JP2012079876A (ja) * 2010-09-30 2012-04-19 Fujitsu Ltd 電子装置の製造方法及び電子装置
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JP5788166B2 (ja) * 2010-11-02 2015-09-30 新光電気工業株式会社 接続端子構造及びその製造方法、並びにソケット
JP5360158B2 (ja) * 2011-08-05 2013-12-04 株式会社村田製作所 チップ部品構造体
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JP2015195263A (ja) * 2014-03-31 2015-11-05 マイクロン テクノロジー， インク． 半導体装置及びその製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06111869A (ja) * 1992-09-29 1994-04-22 Fujitsu Ltd 表面実装用端子
JP2007066936A (ja) * 2005-08-29 2007-03-15 Matsushita Electric Ind Co Ltd 高周波モジュールとその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020512688A (ja) * 2017-03-09 2020-04-23 華為技術有限公司Ｈｕａｗｅｉ Ｔｅｃｈｎｏｌｏｇｉｅｓ Ｃｏ．，Ｌｔｄ． 消費者向け電子製品のメインボードおよび端末

Also Published As

Publication number Publication date
US20140233191A1 (en) 2014-08-21
US9468104B2 (en) 2016-10-11

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