JP2014165210A5 - - Google Patents

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Publication number
JP2014165210A5
JP2014165210A5 JP2013032450A JP2013032450A JP2014165210A5 JP 2014165210 A5 JP2014165210 A5 JP 2014165210A5 JP 2013032450 A JP2013032450 A JP 2013032450A JP 2013032450 A JP2013032450 A JP 2013032450A JP 2014165210 A5 JP2014165210 A5 JP 2014165210A5
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JP
Japan
Prior art keywords
substrate
sub
module
board
main
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2013032450A
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English (en)
Japanese (ja)
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JP2014165210A (ja
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Publication date
Application filed filed Critical
Priority to JP2013032450A priority Critical patent/JP2014165210A/ja
Priority claimed from JP2013032450A external-priority patent/JP2014165210A/ja
Priority to US14/184,958 priority patent/US9468104B2/en
Publication of JP2014165210A publication Critical patent/JP2014165210A/ja
Publication of JP2014165210A5 publication Critical patent/JP2014165210A5/ja
Pending legal-status Critical Current

Links

JP2013032450A 2013-02-21 2013-02-21 モジュール基板 Pending JP2014165210A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2013032450A JP2014165210A (ja) 2013-02-21 2013-02-21 モジュール基板
US14/184,958 US9468104B2 (en) 2013-02-21 2014-02-20 Module board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013032450A JP2014165210A (ja) 2013-02-21 2013-02-21 モジュール基板

Publications (2)

Publication Number Publication Date
JP2014165210A JP2014165210A (ja) 2014-09-08
JP2014165210A5 true JP2014165210A5 (enExample) 2016-04-07

Family

ID=51350999

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013032450A Pending JP2014165210A (ja) 2013-02-21 2013-02-21 モジュール基板

Country Status (2)

Country Link
US (1) US9468104B2 (enExample)
JP (1) JP2014165210A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9363892B2 (en) * 2013-07-19 2016-06-07 Google Technology Holdings LLC Circuit assembly and corresponding methods
DE102015220676A1 (de) * 2015-10-22 2017-04-27 Zf Friedrichshafen Ag Leiterplatte und Anordnung mit einer Leiterplatte
KR20190124280A (ko) * 2017-03-09 2019-11-04 후아웨이 테크놀러지 컴퍼니 리미티드 소비자 전자 제품용 메인보드 및 단말기
DE102017206099A1 (de) * 2017-04-10 2018-10-11 BSH Hausgeräte GmbH Leiterplatten-Anordnung sowie Verfahren zur Herstellung einer Leiterplatten-Anordnung
US11553616B2 (en) * 2018-12-07 2023-01-10 Delta Electronics, Inc. Module with power device

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06111869A (ja) * 1992-09-29 1994-04-22 Fujitsu Ltd 表面実装用端子
EP0732107A3 (en) * 1995-03-16 1997-05-07 Toshiba Kk Shielding device for a circuit substrate
US6525414B2 (en) * 1997-09-16 2003-02-25 Matsushita Electric Industrial Co., Ltd. Semiconductor device including a wiring board and semiconductor elements mounted thereon
US6137164A (en) * 1998-03-16 2000-10-24 Texas Instruments Incorporated Thin stacked integrated circuit device
SG77652A1 (en) * 1998-03-18 2001-01-16 Hitachi Cable Semiconductor device lead-patterning substrate and electronics device and method for fabricating same
JP2001167969A (ja) * 1999-12-06 2001-06-22 Tdk Corp 三次元搭載用多端子積層セラミックコンデンサ
US6528870B2 (en) * 2000-01-28 2003-03-04 Kabushiki Kaisha Toshiba Semiconductor device having a plurality of stacked wiring boards
JP3967133B2 (ja) * 2000-03-21 2007-08-29 三菱電機株式会社 半導体装置及び電子機器の製造方法
US6528408B2 (en) * 2001-05-21 2003-03-04 Micron Technology, Inc. Method for bumped die and wire bonded board-on-chip package
US7087988B2 (en) * 2002-07-30 2006-08-08 Kabushiki Kaisha Toshiba Semiconductor packaging apparatus
JP2004303944A (ja) 2003-03-31 2004-10-28 Matsushita Electric Ind Co Ltd モジュール基板及びその製造方法
PL200759B1 (pl) * 2003-04-25 2009-02-27 Adb Polska Sp Zestaw płytek z obwodami drukowanymi
JP2005277355A (ja) * 2004-03-26 2005-10-06 Sanyo Electric Co Ltd 回路装置
JP2005286057A (ja) * 2004-03-29 2005-10-13 Sanyo Electric Co Ltd 回路装置およびその製造方法
JP4421436B2 (ja) * 2004-09-30 2010-02-24 太陽誘電株式会社 面実装コイル部品
JP2007066936A (ja) * 2005-08-29 2007-03-15 Matsushita Electric Ind Co Ltd 高周波モジュールとその製造方法
JP4864419B2 (ja) * 2005-10-28 2012-02-01 株式会社東芝 プリント回路板および電子機器
JP4740765B2 (ja) * 2006-02-24 2011-08-03 エルピーダメモリ株式会社 半導体装置及びその製造方法
JP2007281276A (ja) * 2006-04-10 2007-10-25 Nec Electronics Corp 半導体装置
US20070241441A1 (en) * 2006-04-17 2007-10-18 Stats Chippac Ltd. Multichip package system
JP2007294560A (ja) * 2006-04-24 2007-11-08 Nec Electronics Corp 半導体装置およびその製造方法
JP5154262B2 (ja) * 2008-02-26 2013-02-27 太陽誘電株式会社 電子部品
TWI362732B (en) * 2008-04-07 2012-04-21 Nanya Technology Corp Multi-chip stack package
KR20100046760A (ko) * 2008-10-28 2010-05-07 삼성전자주식회사 반도체 패키지
JP5240293B2 (ja) * 2009-04-02 2013-07-17 株式会社村田製作所 回路基板
JP5234521B2 (ja) * 2009-08-21 2013-07-10 Ｔｄｋ株式会社 電子部品及びその製造方法
JP2011171427A (ja) * 2010-02-17 2011-09-01 Canon Inc 積層型半導体装置
US8847376B2 (en) * 2010-07-23 2014-09-30 Tessera, Inc. Microelectronic elements with post-assembly planarization
JP2012079876A (ja) * 2010-09-30 2012-04-19 Fujitsu Ltd 電子装置の製造方法及び電子装置
JP2012104790A (ja) * 2010-10-12 2012-05-31 Elpida Memory Inc 半導体装置
JP5788166B2 (ja) * 2010-11-02 2015-09-30 新光電気工業株式会社 接続端子構造及びその製造方法、並びにソケット
JP5360158B2 (ja) * 2011-08-05 2013-12-04 株式会社村田製作所 チップ部品構造体
WO2013052372A2 (en) * 2011-10-03 2013-04-11 Invensas Corporation Stub minimization for multi-die wirebond assemblies with parallel windows
US8436457B2 (en) * 2011-10-03 2013-05-07 Invensas Corporation Stub minimization for multi-die wirebond assemblies with parallel windows
US9462732B2 (en) * 2013-03-13 2016-10-04 Laird Technologies, Inc. Electromagnetic interference shielding (EMI) apparatus including a frame with drawn latching features
JP6336714B2 (ja) * 2013-05-27 2018-06-06 富士通コンポーネント株式会社 電子装置
JP2015195263A (ja) * 2014-03-31 2015-11-05 マイクロン テクノロジー， インク． 半導体装置及びその製造方法

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