JP2019114672A5 - - Google Patents

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Publication number
JP2019114672A5
JP2019114672A5 JP2017247425A JP2017247425A JP2019114672A5 JP 2019114672 A5 JP2019114672 A5 JP 2019114672A5 JP 2017247425 A JP2017247425 A JP 2017247425A JP 2017247425 A JP2017247425 A JP 2017247425A JP 2019114672 A5 JP2019114672 A5 JP 2019114672A5
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JP
Japan
Prior art keywords
distance
wiring
wiring portion
wirings
shorter
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Application number
JP2017247425A
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English (en)
Japanese (ja)
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JP7061459B2 (ja
JP2019114672A (ja
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Priority to JP2017247425A priority Critical patent/JP7061459B2/ja
Priority claimed from JP2017247425A external-priority patent/JP7061459B2/ja
Priority to US16/174,665 priority patent/US10356893B1/en
Priority to TW107139271A priority patent/TWI693875B/zh
Priority to CN201811389599.7A priority patent/CN109963400B/zh
Publication of JP2019114672A publication Critical patent/JP2019114672A/ja
Publication of JP2019114672A5 publication Critical patent/JP2019114672A5/ja
Application granted granted Critical
Publication of JP7061459B2 publication Critical patent/JP7061459B2/ja
Active legal-status Critical Current
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JP2017247425A 2017-12-25 2017-12-25 回路基板、コネクタ組立体及びケーブルハーネス Active JP7061459B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2017247425A JP7061459B2 (ja) 2017-12-25 2017-12-25 回路基板、コネクタ組立体及びケーブルハーネス
US16/174,665 US10356893B1 (en) 2017-12-25 2018-10-30 Circuit board, connector assembly and cable harness
TW107139271A TWI693875B (zh) 2017-12-25 2018-11-06 電路板、連接器總成以及線束
CN201811389599.7A CN109963400B (zh) 2017-12-25 2018-11-21 电路板、连接器组件和线缆束

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017247425A JP7061459B2 (ja) 2017-12-25 2017-12-25 回路基板、コネクタ組立体及びケーブルハーネス

Publications (3)

Publication Number Publication Date
JP2019114672A JP2019114672A (ja) 2019-07-11
JP2019114672A5 true JP2019114672A5 (enExample) 2020-10-15
JP7061459B2 JP7061459B2 (ja) 2022-04-28

Family

ID=66951673

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017247425A Active JP7061459B2 (ja) 2017-12-25 2017-12-25 回路基板、コネクタ組立体及びケーブルハーネス

Country Status (4)

Country Link
US (1) US10356893B1 (enExample)
JP (1) JP7061459B2 (enExample)
CN (1) CN109963400B (enExample)
TW (1) TWI693875B (enExample)

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* Cited by examiner, † Cited by third party
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WO2020177877A1 (en) * 2019-03-07 2020-09-10 Advantest Corporation Method for providing an electrical connection and printed circuit board
CN115088393B (zh) * 2020-01-17 2025-11-07 安费诺有限公司 印刷电路板上的导电迹线的弯曲部补偿
US11297713B2 (en) 2020-01-23 2022-04-05 Super Micro Computer, Inc. Reference metal layer for setting the impedance of metal contacts of a connector
JP2023107606A (ja) * 2022-01-24 2023-08-03 日本航空電子工業株式会社 コネクタ・ケーブル
CN114126236B (zh) * 2022-01-26 2022-04-22 苏州浪潮智能科技有限公司 一种差分传输线的走线设计方法及电路板
US12137518B2 (en) * 2022-04-21 2024-11-05 Dell Products L.P. Resetting different pair skew of printed circuit board traces
CN115275715B (zh) * 2022-07-15 2025-07-22 番禺得意精密电子工业有限公司 传输板和连接件

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