JP2014072205A5 - - Google Patents

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Publication number
JP2014072205A5
JP2014072205A5 JP2012214437A JP2012214437A JP2014072205A5 JP 2014072205 A5 JP2014072205 A5 JP 2014072205A5 JP 2012214437 A JP2012214437 A JP 2012214437A JP 2012214437 A JP2012214437 A JP 2012214437A JP 2014072205 A5 JP2014072205 A5 JP 2014072205A5
Authority
JP
Japan
Prior art keywords
coating resin
main surface
wiring board
electronic component
protrusion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012214437A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014072205A (ja
JP6007044B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2012214437A priority Critical patent/JP6007044B2/ja
Priority claimed from JP2012214437A external-priority patent/JP6007044B2/ja
Priority to US14/021,189 priority patent/US9049799B2/en
Priority to KR1020130110887A priority patent/KR102100209B1/ko
Publication of JP2014072205A publication Critical patent/JP2014072205A/ja
Publication of JP2014072205A5 publication Critical patent/JP2014072205A5/ja
Application granted granted Critical
Publication of JP6007044B2 publication Critical patent/JP6007044B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2012214437A 2012-09-27 2012-09-27 配線基板 Active JP6007044B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2012214437A JP6007044B2 (ja) 2012-09-27 2012-09-27 配線基板
US14/021,189 US9049799B2 (en) 2012-09-27 2013-09-09 Wiring substrate
KR1020130110887A KR102100209B1 (ko) 2012-09-27 2013-09-16 배선 기판

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012214437A JP6007044B2 (ja) 2012-09-27 2012-09-27 配線基板

Publications (3)

Publication Number Publication Date
JP2014072205A JP2014072205A (ja) 2014-04-21
JP2014072205A5 true JP2014072205A5 (enExample) 2015-10-08
JP6007044B2 JP6007044B2 (ja) 2016-10-12

Family

ID=50338641

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012214437A Active JP6007044B2 (ja) 2012-09-27 2012-09-27 配線基板

Country Status (3)

Country Link
US (1) US9049799B2 (enExample)
JP (1) JP6007044B2 (enExample)
KR (1) KR102100209B1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102473405B1 (ko) * 2015-10-30 2022-12-02 삼성전기주식회사 인쇄회로기판 및 그 제조방법
US9743526B1 (en) 2016-02-10 2017-08-22 International Business Machines Corporation Wiring board with stacked embedded capacitors and method of making
US11637057B2 (en) * 2019-01-07 2023-04-25 Qualcomm Incorporated Uniform via pad structure having covered traces between partially covered pads
EP3916770A4 (en) 2019-03-07 2022-11-02 Absolics Inc. Packaging substrate and semiconductor apparatus comprising same
JP7293360B2 (ja) 2019-03-07 2023-06-19 アブソリックス インコーポレイテッド パッケージング基板及びこれを含む半導体装置
EP3916772A4 (en) 2019-03-12 2023-04-05 Absolics Inc. PACKAGING SUBSTRATE AND SEMICONDUCTOR DEVICE WITH IT
JP7228697B2 (ja) * 2019-03-12 2023-02-24 アブソリックス インコーポレイテッド パッケージング基板及びこれを含む半導体装置
WO2020185023A1 (ko) 2019-03-12 2020-09-17 에스케이씨 주식회사 패키징 기판 및 이의 제조방법
CN113424304B (zh) 2019-03-12 2024-04-12 爱玻索立克公司 装载盒及对象基板的装载方法
KR102515304B1 (ko) 2019-03-29 2023-03-29 앱솔릭스 인코포레이티드 반도체용 패키징 유리기판, 반도체용 패키징 기판 및 반도체 장치
KR20220089715A (ko) 2019-08-23 2022-06-28 앱솔릭스 인코포레이티드 패키징 기판 및 이를 포함하는 반도체 장치

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3878663B2 (ja) * 1999-06-18 2007-02-07 日本特殊陶業株式会社 配線基板の製造方法及び配線基板
JP4298559B2 (ja) * 2004-03-29 2009-07-22 新光電気工業株式会社 電子部品実装構造及びその製造方法
JP2006073763A (ja) * 2004-09-01 2006-03-16 Denso Corp 多層基板の製造方法
KR100700922B1 (ko) * 2005-10-17 2007-03-28 삼성전기주식회사 수동 소자를 내장한 기판 및 그 제조 방법
JP4648230B2 (ja) 2006-03-24 2011-03-09 日本特殊陶業株式会社 配線基板の製造方法
JP4862641B2 (ja) * 2006-12-06 2012-01-25 株式会社デンソー 多層基板及び多層基板の製造方法
JPWO2010038489A1 (ja) * 2008-09-30 2012-03-01 イビデン株式会社 電子部品内蔵配線板及びその製造方法
US8400782B2 (en) * 2009-07-24 2013-03-19 Ibiden Co., Ltd. Wiring board and method for manufacturing the same

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