KR102100209B1 - 배선 기판 - Google Patents

배선 기판 Download PDF

Info

Publication number
KR102100209B1
KR102100209B1 KR1020130110887A KR20130110887A KR102100209B1 KR 102100209 B1 KR102100209 B1 KR 102100209B1 KR 1020130110887 A KR1020130110887 A KR 1020130110887A KR 20130110887 A KR20130110887 A KR 20130110887A KR 102100209 B1 KR102100209 B1 KR 102100209B1
Authority
KR
South Korea
Prior art keywords
hole
resin
electronic component
protrusions
core substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020130110887A
Other languages
English (en)
Korean (ko)
Other versions
KR20140041345A (ko
Inventor
다이스케 다키자와
Original Assignee
신꼬오덴기 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 신꼬오덴기 고교 가부시키가이샤 filed Critical 신꼬오덴기 고교 가부시키가이샤
Publication of KR20140041345A publication Critical patent/KR20140041345A/ko
Application granted granted Critical
Publication of KR102100209B1 publication Critical patent/KR102100209B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/184—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components inserted in holes through the PCBs and wherein terminals of the components are connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/185—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H10W70/687—Shapes or dispositions thereof comprising multiple insulating layers characterized by the outer layers being for protection, e.g. solder masks, or for protection against chemical or mechanical damage
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09854—Hole or via having special cross-section, e.g. elliptical
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
KR1020130110887A 2012-09-27 2013-09-16 배선 기판 Active KR102100209B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2012-214437 2012-09-27
JP2012214437A JP6007044B2 (ja) 2012-09-27 2012-09-27 配線基板

Publications (2)

Publication Number Publication Date
KR20140041345A KR20140041345A (ko) 2014-04-04
KR102100209B1 true KR102100209B1 (ko) 2020-04-13

Family

ID=50338641

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130110887A Active KR102100209B1 (ko) 2012-09-27 2013-09-16 배선 기판

Country Status (3)

Country Link
US (1) US9049799B2 (enExample)
JP (1) JP6007044B2 (enExample)
KR (1) KR102100209B1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102473405B1 (ko) * 2015-10-30 2022-12-02 삼성전기주식회사 인쇄회로기판 및 그 제조방법
US9743526B1 (en) 2016-02-10 2017-08-22 International Business Machines Corporation Wiring board with stacked embedded capacitors and method of making
US11637057B2 (en) * 2019-01-07 2023-04-25 Qualcomm Incorporated Uniform via pad structure having covered traces between partially covered pads
JP7293360B2 (ja) 2019-03-07 2023-06-19 アブソリックス インコーポレイテッド パッケージング基板及びこれを含む半導体装置
JP7433318B2 (ja) 2019-03-07 2024-02-19 アブソリックス インコーポレイテッド パッケージング基板及びこれを含む半導体装置
JP7228697B2 (ja) * 2019-03-12 2023-02-24 アブソリックス インコーポレイテッド パッケージング基板及びこれを含む半導体装置
CN113261093B (zh) 2019-03-12 2024-04-16 爱玻索立克公司 半导体封装用基板及其制备方法以及半导体装置
CN113424304B (zh) 2019-03-12 2024-04-12 爱玻索立克公司 装载盒及对象基板的装载方法
WO2020185021A1 (ko) 2019-03-12 2020-09-17 에스케이씨 주식회사 패키징 기판 및 이를 포함하는 반도체 장치
ES3041275T3 (en) 2019-03-29 2025-11-11 Absolics Inc Packaging glass substrate for semiconductor, packaging substrate for semiconductor, and semiconductor device
KR20220089715A (ko) 2019-08-23 2022-06-28 앱솔릭스 인코포레이티드 패키징 기판 및 이를 포함하는 반도체 장치

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007116155A (ja) * 2005-10-17 2007-05-10 Samsung Electro-Mechanics Co Ltd 受動素子を内蔵した基板及びその製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3878663B2 (ja) * 1999-06-18 2007-02-07 日本特殊陶業株式会社 配線基板の製造方法及び配線基板
JP4298559B2 (ja) * 2004-03-29 2009-07-22 新光電気工業株式会社 電子部品実装構造及びその製造方法
JP2006073763A (ja) * 2004-09-01 2006-03-16 Denso Corp 多層基板の製造方法
JP4648230B2 (ja) 2006-03-24 2011-03-09 日本特殊陶業株式会社 配線基板の製造方法
JP4862641B2 (ja) * 2006-12-06 2012-01-25 株式会社デンソー 多層基板及び多層基板の製造方法
KR20110045098A (ko) * 2008-09-30 2011-05-03 이비덴 가부시키가이샤 전자 부품 내장 배선판 및 그의 제조 방법
US8400782B2 (en) * 2009-07-24 2013-03-19 Ibiden Co., Ltd. Wiring board and method for manufacturing the same

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007116155A (ja) * 2005-10-17 2007-05-10 Samsung Electro-Mechanics Co Ltd 受動素子を内蔵した基板及びその製造方法

Also Published As

Publication number Publication date
US20140085847A1 (en) 2014-03-27
KR20140041345A (ko) 2014-04-04
JP6007044B2 (ja) 2016-10-12
JP2014072205A (ja) 2014-04-21
US9049799B2 (en) 2015-06-02

Similar Documents

Publication Publication Date Title
KR102100209B1 (ko) 배선 기판
JP6373574B2 (ja) 回路基板及びその製造方法
JP5968753B2 (ja) 配線基板
US9723729B2 (en) Printed wiring board
JP5989814B2 (ja) 埋め込み基板、印刷回路基板及びその製造方法
US9295159B2 (en) Method for fabricating packaging substrate with embedded semiconductor component
US9899235B2 (en) Fabrication method of packaging substrate
US9917025B2 (en) Printed wiring board and method for manufacturing printed wiring board
JP2015106615A (ja) プリント配線板、プリント配線板の製造方法
JP6334962B2 (ja) 配線基板、及び、配線基板の製造方法
KR101766476B1 (ko) 캐비티 인쇄회로기판 제조 방법
TW201519714A (zh) 印刷電路板及其製造方法
JP6373605B2 (ja) 配線基板、及び、配線基板の製造方法
KR102306719B1 (ko) 인쇄회로기판, 그 제조방법, 및 전자부품 모듈
US20150156882A1 (en) Printed circuit board, manufacturing method thereof, and semiconductor package
KR20140039993A (ko) 배선 기판
CN113496983A (zh) 半导体封装载板及其制法与半导体封装制程
KR101501902B1 (ko) 금속 포스트를 구비한 인쇄회로기판 및 이의 제조 방법
KR102023729B1 (ko) 인쇄회로기판 및 그 제조 방법
KR20150059086A (ko) 칩 내장 기판 및 그 제조 방법
KR102436220B1 (ko) 패키지 기판 및 그 제조방법
KR20190000007A (ko) 리지드 플렉시블 회로기판 제조방법
JP2025063819A (ja) 回路基板と電子素子パッケージ
KR20250070474A (ko) 회로 기판 및 회로 기판의 제조방법
JP2006339276A (ja) 接続用基板及びその製造方法

Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 20130916

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20180827

Comment text: Request for Examination of Application

Patent event code: PA02011R01I

Patent event date: 20130916

Comment text: Patent Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20190920

Patent event code: PE09021S01D

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 20200303

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20200407

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20200408

End annual number: 3

Start annual number: 1

PG1601 Publication of registration
PR1001 Payment of annual fee

Payment date: 20240319

Start annual number: 5

End annual number: 5

PR1001 Payment of annual fee

Payment date: 20250317

Start annual number: 6

End annual number: 6