JP6007044B2 - 配線基板 - Google Patents

配線基板 Download PDF

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Publication number
JP6007044B2
JP6007044B2 JP2012214437A JP2012214437A JP6007044B2 JP 6007044 B2 JP6007044 B2 JP 6007044B2 JP 2012214437 A JP2012214437 A JP 2012214437A JP 2012214437 A JP2012214437 A JP 2012214437A JP 6007044 B2 JP6007044 B2 JP 6007044B2
Authority
JP
Japan
Prior art keywords
hole
coating resin
chip capacitor
core substrate
capacitor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2012214437A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014072205A5 (enExample
JP2014072205A (ja
Inventor
大介 滝澤
大介 滝澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2012214437A priority Critical patent/JP6007044B2/ja
Priority to US14/021,189 priority patent/US9049799B2/en
Priority to KR1020130110887A priority patent/KR102100209B1/ko
Publication of JP2014072205A publication Critical patent/JP2014072205A/ja
Publication of JP2014072205A5 publication Critical patent/JP2014072205A5/ja
Application granted granted Critical
Publication of JP6007044B2 publication Critical patent/JP6007044B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/184—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components inserted in holes through the PCBs and wherein terminals of the components are connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/185—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H10W70/687—Shapes or dispositions thereof comprising multiple insulating layers characterized by the outer layers being for protection, e.g. solder masks, or for protection against chemical or mechanical damage
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09854—Hole or via having special cross-section, e.g. elliptical
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP2012214437A 2012-09-27 2012-09-27 配線基板 Active JP6007044B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2012214437A JP6007044B2 (ja) 2012-09-27 2012-09-27 配線基板
US14/021,189 US9049799B2 (en) 2012-09-27 2013-09-09 Wiring substrate
KR1020130110887A KR102100209B1 (ko) 2012-09-27 2013-09-16 배선 기판

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012214437A JP6007044B2 (ja) 2012-09-27 2012-09-27 配線基板

Publications (3)

Publication Number Publication Date
JP2014072205A JP2014072205A (ja) 2014-04-21
JP2014072205A5 JP2014072205A5 (enExample) 2015-10-08
JP6007044B2 true JP6007044B2 (ja) 2016-10-12

Family

ID=50338641

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012214437A Active JP6007044B2 (ja) 2012-09-27 2012-09-27 配線基板

Country Status (3)

Country Link
US (1) US9049799B2 (enExample)
JP (1) JP6007044B2 (enExample)
KR (1) KR102100209B1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102473405B1 (ko) * 2015-10-30 2022-12-02 삼성전기주식회사 인쇄회로기판 및 그 제조방법
US9743526B1 (en) 2016-02-10 2017-08-22 International Business Machines Corporation Wiring board with stacked embedded capacitors and method of making
US11637057B2 (en) * 2019-01-07 2023-04-25 Qualcomm Incorporated Uniform via pad structure having covered traces between partially covered pads
JP7293360B2 (ja) 2019-03-07 2023-06-19 アブソリックス インコーポレイテッド パッケージング基板及びこれを含む半導体装置
JP7433318B2 (ja) 2019-03-07 2024-02-19 アブソリックス インコーポレイテッド パッケージング基板及びこれを含む半導体装置
JP7228697B2 (ja) * 2019-03-12 2023-02-24 アブソリックス インコーポレイテッド パッケージング基板及びこれを含む半導体装置
CN113261093B (zh) 2019-03-12 2024-04-16 爱玻索立克公司 半导体封装用基板及其制备方法以及半导体装置
CN113424304B (zh) 2019-03-12 2024-04-12 爱玻索立克公司 装载盒及对象基板的装载方法
WO2020185021A1 (ko) 2019-03-12 2020-09-17 에스케이씨 주식회사 패키징 기판 및 이를 포함하는 반도체 장치
ES3041275T3 (en) 2019-03-29 2025-11-11 Absolics Inc Packaging glass substrate for semiconductor, packaging substrate for semiconductor, and semiconductor device
KR20220089715A (ko) 2019-08-23 2022-06-28 앱솔릭스 인코포레이티드 패키징 기판 및 이를 포함하는 반도체 장치

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3878663B2 (ja) * 1999-06-18 2007-02-07 日本特殊陶業株式会社 配線基板の製造方法及び配線基板
JP4298559B2 (ja) * 2004-03-29 2009-07-22 新光電気工業株式会社 電子部品実装構造及びその製造方法
JP2006073763A (ja) * 2004-09-01 2006-03-16 Denso Corp 多層基板の製造方法
KR100700922B1 (ko) * 2005-10-17 2007-03-28 삼성전기주식회사 수동 소자를 내장한 기판 및 그 제조 방법
JP4648230B2 (ja) 2006-03-24 2011-03-09 日本特殊陶業株式会社 配線基板の製造方法
JP4862641B2 (ja) * 2006-12-06 2012-01-25 株式会社デンソー 多層基板及び多層基板の製造方法
KR20110045098A (ko) * 2008-09-30 2011-05-03 이비덴 가부시키가이샤 전자 부품 내장 배선판 및 그의 제조 방법
US8400782B2 (en) * 2009-07-24 2013-03-19 Ibiden Co., Ltd. Wiring board and method for manufacturing the same

Also Published As

Publication number Publication date
US20140085847A1 (en) 2014-03-27
KR20140041345A (ko) 2014-04-04
KR102100209B1 (ko) 2020-04-13
JP2014072205A (ja) 2014-04-21
US9049799B2 (en) 2015-06-02

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