JP2014067741A - 配線基板 - Google Patents
配線基板 Download PDFInfo
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- JP2014067741A JP2014067741A JP2012209735A JP2012209735A JP2014067741A JP 2014067741 A JP2014067741 A JP 2014067741A JP 2012209735 A JP2012209735 A JP 2012209735A JP 2012209735 A JP2012209735 A JP 2012209735A JP 2014067741 A JP2014067741 A JP 2014067741A
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- hole
- electronic component
- wiring board
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-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49822—Multilayer substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09072—Hole or recess under component or special relationship between hole and component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09854—Hole or via having special cross-section, e.g. elliptical
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/005—Punching of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
Abstract
【解決手段】コア基板21は、チップキャパシタ50を搭載する貫通孔22を有する。貫通孔22には、チップキャパシタ50の両端面と対向する内面に突起部23,24が形成されている。突起部23,24は、チップキャパシタ50の接続端子52,53に向って突出するように形成されている。そして、突起部23,24の大きさ(先端間の距離)は、チップキャパシタ50の長さよりも短く設定されている。チップキャパシタ50は、貫通孔22の内面に形成された突起部23,24より支持される。
【選択図】図1
Description
なお、添付図面は、特徴を分かりやすくするために便宜上特徴となる部分を拡大して示している場合があり、寸法,比率などは実際と異なる場合がある。また、断面図では、各部材の断面構造を分かりやすくするために、一部のハッチングを省略している。
図4に示すように、コア基板21両主面の金属箔をエッチング等によりパターニングして配線層31,41を形成する。このとき、図1(a)等に示す貫通孔22に応じて配線層31,41に開口31a,41aを形成する。
上記の配線基板20の製造工程において、チップキャパシタ50は、貫通孔22内に形成された突起部23,24により支持される。このため、貫通孔22内にチップキャパシタ50を保持するために仮止め用のテープを必要としない。したがって、コア基板21の両面に粘着材等が残らないため、粘着材等による配線基板20の反りや絶縁層32,42の剥離等の発生が抑制される。
(1)コア基板21は、チップキャパシタ50を搭載する貫通孔22を有する。チップキャパシタ50は、貫通孔22の内面に形成された突起部23,24より支持される。従って、チップキャパシタ50を貫通孔22内に保持するために仮止め用のテープを用いる必要が無いため、コア基板21の両面に粘着材等が残らない。これにより、配線基板20の反りや絶縁層32,42の剥離等の発生を抑制することができ、配線基板20の不良を低減することができる。
・突起部23,24の形状を適宜変更してもよい。例えば、図9(a)に示すように、貫通孔61をテーパ状に形成してもよい。この場合、貫通孔61の内面に形成される突起部62の先端間の距離が、コア基板21の厚さ方向に沿って徐々に短くなる。これにより、貫通孔61内にチップキャパシタ50を挿入し易くなる。つまり、チップキャパシタ50を貫通孔61内に圧入するために必要な押圧力が、デーパを形成しない場合よるも小さくなる。これにより、チップキャパシタ50のキャパシタ本体51に加わる応力等を小さくすることで、キャパシタ本体51の破損を抑制することができる。なお、図9(b)に示すように、側面63の一部が三角形(三角柱状)に突出する形状の突起部64を形成してもよい。
・図1(a)に示すスルーホール35内に絶縁材36を充填したが、導電材(例えば銅)を充填した、所謂フィルドビアスルーホールとしもよい。
・チップキャパシタの接続端子は、直方体状に形成されたキャパシタ本体51の短手方向の両端に形成されてもよい。
22 貫通孔
23,24 突起部
25 絶縁材
50 チップコンデンサ(電子部品)
51 キャパシタ本体
52,53 接続端子
52a,53a 係合溝
Claims (6)
- 第1の主面と第2の主面とを貫通する貫通孔が形成されたコア基板と、
前記貫通孔内に配置された電子部品と、
前記電子部品の接続端子に向って前記貫通孔の内面から突出するように形成された突起部と、
前記貫通孔の内面と前記電子部品との間に充填された絶縁材と、
前記コア基板の第1の主面及び前記電子部品を被覆する第1の絶縁層と、
前記コア基板の第2の主面及び前記電子部品を被覆する第2の絶縁層と
を有し、
前記電子部品は、電子部品本体と、前記電子部品本体の周囲に形成された接続端子を有し、
前記電子部品の接続端子は、前記突起部によって形成され前記電子部品の挿入方向に沿って延びる係合溝を有すること、
を特徴とする配線基板。 - 前記突起部は複数形成され、前記貫通孔において対向する2つの内面にそれぞれ形成された前記突起部の先端間の距離は、前記電子部品の大きさよりも小さく、前記電子部品本体の大きさよりも大きく形成されたことを特徴とする請求項1に記載の配線基板。
- 前記突起部は、前記第1の主面から前記第2の主面に向って連続するように形成されたことを特徴とする請求項1又は2に記載の配線基板。
- 前記突起部は、前記突起部の先端と対向する電子部品の接続端子との間の距離が、前記第1の主面から前記第2の主面に向って徐々に変化するように形成されたことを特徴とする請求項1〜3のうちの何れか一項に記載の配線基板。
- 前記コア基板は、補強材を含むことを特徴とする請求項1〜4のうちの何れか一項に記載の配線基板。
- 前記絶縁材は前記第1の絶縁層及び前記第2の絶縁層と同じ熱硬化性樹脂であり、前記第1の絶縁層及び前記第2の絶縁層を加熱加圧によって形成するときに前記貫通孔の内面と前記電子部品との間に充填されたものであることを特徴とする、請求項1〜5のうちの何れか一項に記載の配線基板。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012209735A JP2014067741A (ja) | 2012-09-24 | 2012-09-24 | 配線基板 |
US14/018,644 US9119301B2 (en) | 2012-09-24 | 2013-09-05 | Wiring substrate |
KR1020130107704A KR20140039993A (ko) | 2012-09-24 | 2013-09-09 | 배선 기판 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012209735A JP2014067741A (ja) | 2012-09-24 | 2012-09-24 | 配線基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014067741A true JP2014067741A (ja) | 2014-04-17 |
JP2014067741A5 JP2014067741A5 (ja) | 2015-09-24 |
Family
ID=50337774
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012209735A Pending JP2014067741A (ja) | 2012-09-24 | 2012-09-24 | 配線基板 |
Country Status (3)
Country | Link |
---|---|
US (1) | US9119301B2 (ja) |
JP (1) | JP2014067741A (ja) |
KR (1) | KR20140039993A (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102139755B1 (ko) | 2015-01-22 | 2020-07-31 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
US11445596B2 (en) | 2018-12-27 | 2022-09-13 | Unimicron Technology Corp. | Circuit board having heat-dissipation block and method of manufacturing the same |
TWI694756B (zh) * | 2018-12-27 | 2020-05-21 | 欣興電子股份有限公司 | 一種具有散熱塊的電路板及其製造方法 |
CN111385959A (zh) * | 2018-12-27 | 2020-07-07 | 欣兴电子股份有限公司 | 一种具有散热块的电路板及其制造方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007129092A (ja) * | 2005-11-04 | 2007-05-24 | Hitachi Ltd | 電子部品実装プリント基板 |
JP2012079994A (ja) * | 2010-10-05 | 2012-04-19 | Yamaichi Electronics Co Ltd | 部品内蔵プリント配線板およびその製造方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4648230B2 (ja) | 2006-03-24 | 2011-03-09 | 日本特殊陶業株式会社 | 配線基板の製造方法 |
JP4862641B2 (ja) * | 2006-12-06 | 2012-01-25 | 株式会社デンソー | 多層基板及び多層基板の製造方法 |
US7876577B2 (en) * | 2007-03-12 | 2011-01-25 | Tyco Electronics Corporation | System for attaching electronic components to molded interconnection devices |
-
2012
- 2012-09-24 JP JP2012209735A patent/JP2014067741A/ja active Pending
-
2013
- 2013-09-05 US US14/018,644 patent/US9119301B2/en active Active
- 2013-09-09 KR KR1020130107704A patent/KR20140039993A/ko not_active Application Discontinuation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007129092A (ja) * | 2005-11-04 | 2007-05-24 | Hitachi Ltd | 電子部品実装プリント基板 |
JP2012079994A (ja) * | 2010-10-05 | 2012-04-19 | Yamaichi Electronics Co Ltd | 部品内蔵プリント配線板およびその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
KR20140039993A (ko) | 2014-04-02 |
US9119301B2 (en) | 2015-08-25 |
US20140083749A1 (en) | 2014-03-27 |
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