US20180302979A1 - Flying tail type rigid-flexible printed circuit board - Google Patents
Flying tail type rigid-flexible printed circuit board Download PDFInfo
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- US20180302979A1 US20180302979A1 US16/018,430 US201816018430A US2018302979A1 US 20180302979 A1 US20180302979 A1 US 20180302979A1 US 201816018430 A US201816018430 A US 201816018430A US 2018302979 A1 US2018302979 A1 US 2018302979A1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
Definitions
- the present invention relates to a method of manufacturing a flying tail type rigid-flexible printed circuit board and a flying tail type rigid-flexible printed circuit board manufactured by the same, and more particularly, to a method of manufacturing a flying tail type rigid-flexible printed circuit board using a flexible insulator and a flying tail type rigid-flexible printed circuit board manufactured by the same.
- the degree of integration of semiconductor elements is gradually increasing, the number of pads provided on the semiconductor elements to connect the semiconductor elements to external circuits is increasing and mounting density is also on an increasing trend.
- a minimum processing dimension of the semiconductor element made of silicon is about 0.2 ⁇ m, it is required to provide about 1000 pads on the semiconductor element with a size of about 10 mm.
- miniaturization and thinning are needed to improve the mounting density, and particularly, in order to respond to portable information devices such as notebook personal computers (PCs), PDAs, and mobile phones, miniaturization and thinning of the semiconductor packages are needed.
- This flying tail type rigid-flexible printed circuit board which consists of a rigid domain (hereinafter, R) having mechanical strength due to an embedded insulating layer and a flexible domain (hereinafter, F) that connects the rigid domains R to each other and has elasticity, is mainly used in small terminals, such as mobile phones, requiring high integration by removing an unnecessary space due to use of a connector in response to demands for high integration and fine pitches of mounted components according to high functionality of mobile devices.
- a first inner circuit pattern layer is formed on one or both surfaces of a base substrate, and a coverlay is attached to the inner layer circuit pattern layer of a flexible domain F (step S 1 ).
- a first insulating layer is laminated on a rigid domain R, and a first metal layer is laminated on the first insulating layer including the flexible domain F (step 82 ).
- the first insulating layer is made of a cured insulator so that the first insulating layer is not laminated on the flexible domain F. Since the first metal layer is laminated on the first insulating layer and the first insulating layer is not laminated on the flexible domain F, the first metal layer is formed not to be in contact with the coverlay.
- a first window is processed by removing the first metal layer in a blind via-hole forming domain, which is to be formed in the rigid domain R (step 83 ).
- a blind via-hole is processed by processing the first insulating layer, which is exposed by the first window, with CO2 laser (step 84 ).
- a through-hole which penetrates the entire first insulating layer and base substrate, is processed using a CNC drill (step 85 ).
- a first plating layer is formed on the first metal layer including inner walls of the blind via-hole and the through-hole (step 86 ).
- a first circuit pattern layer is formed by patterning the first metal layer and the first plating layer (step 87 ). At this time, the first metal layer and the first plating layer formed in the flexible domain F are removed.
- a second insulating layer is laminated on the rigid domain R, and a second metal layer is laminated on the second insulating layer including the flexible domain F (step 88 ).
- the first insulating layer is made of a cured insulator so that the first insulating layer is not laminated on the flexible domain F.
- a via-hole is processed (step 89 ).
- the via-hole is formed by processing the second insulating layer, which is exposed by a second window, with CO2 laser after processing the second window by removing the second metal layer in a domain in which the via-hole is to be processed.
- a second plating layer is formed on the second metal layer including the via-hole (step 810 ).
- a second circuit pattern layer is formed by patterning the second metal layer and the second plating layer (step 811 ). At this time, like the step 87 , the second metal layer and the second plating layer formed in the flexible domain F are removed.
- a third insulating layer is laminated on the rigid domain R, a third metal layer is laminated on the third insulating layer including the flexible domain F, and a third circuit pattern layer is formed (step 812 ). That is, since this step, a step of forming a third build-up layer, is equal to a method of forming a first build-up layer or a second build-up layer, repeated description will be omitted.
- the insulating layer is made of a cured insulator so that the second insulating layer is not laminated on the flexible domain F whenever forming a build-up layer.
- a cured insulator there are problems such as deterioration of filling property and an additional increase in manufacturing costs due to a curing process.
- the present invention has been invented in order to overcome the above-described problems and it is, therefore, an object of the present invention to provide a method of manufacturing a flying tail type rigid-flexible printed circuit board using a flexible insulator and a flying tail type rigid-flexible printed circuit board manufactured by the same.
- a method of manufacturing a flying tail type rigid-flexible printed circuit board including the steps of: providing a base substrate having a first inner circuit pattern layer on one or both surfaces; laminating a first insulating layer on a rigid domain R of the base substrate; laminating at least one circuit layer, which extends over the entire domain of the base substrate, on the first insulating layer; and removing a portion of the circuit layer, which corresponds to a flexible domain F, wherein the circuit layer includes a second insulating layer.
- the first insulating layer is made of a rigid insulator
- the second insulating layer is made of a flexible insulator.
- the method of manufacturing a flying tail type rigid-flexible printed circuit board further includes, after the step of providing the base substrate having the first inner circuit pattern layer on one or both surfaces, the step of attaching a coverlay to the first inner circuit pattern layer formed in the flexible domain F of the base substrate.
- the step of removing the portion of the circuit layer, which corresponds to the flexible domain F is performed through the steps of processing a cavity on an edge of the flexible domain F adjacent to the rigid domain R; and removing a circuit layer pile remaining after processing the cavity.
- the step of processing the cavity on the edge of the flexible domain F adjacent to the rigid domain R is performed by a laser method or a routing method.
- the step of laminating the at least one circuit layer, which extends over the entire domain of the base substrate, on the first insulating layer is performed through the steps of laminating a metal layer which extends over the entire domain of the base substrate; forming a plating layer on the metal layer; forming a second inner circuit pattern layer by etching the metal layer and the plating layer along a circuit pattern; and laminating a second insulating layer, which extends over the entire domain of the base substrate, on the second inner circuit pattern layer.
- the method of manufacturing a flying tail type rigid-flexible printed circuit board further includes, after the step of laminating the metal layer which extends over the entire domain of the base substrate, the step of forming a via-hole by window-etching a portion of the metal layer to form a via-hole opening and irradiating laser to the via-hole opening.
- the method of manufacturing a flying tail type rigid-flexible printed circuit board further includes, after the step of laminating the metal layer which extends over the entire domain of the base substrate, the step of processing a through-hole which penetrates the entire first insulating layer and base substrate.
- the step of providing the base substrate having the first inner circuit pattern layer on one or both surfaces is performed through the steps of providing a flexible film having a metal layer on one or both surfaces; and forming the first inner circuit pattern layer by etching the metal layer.
- the method of manufacturing a flying tail type rigid-flexible printed circuit board further includes, after the step of laminating the at least one circuit layer, which extends over the entire domain of the base substrate, on the first insulating layer, the step of forming an outer circuit pattern layer on the outermost top surface of the circuit layer.
- a flying tail type rigid-flexible printed circuit board including: a base substrate having a first inner circuit pattern layer on one or both surfaces; a first insulating layer laminated on a rigid domain R of the base substrate; and at least one circuit layer formed on the first insulating layer and including a second insulating layer.
- the first insulating layer is made of a rigid insulator
- the second insulating layer is made of a flexible insulator.
- the flying tail type rigid-flexible printed circuit board further includes a coverlay attached to the first inner circuit pattern layer formed in a flexible domain F of the base substrate.
- the circuit layer consists of a lower second inner circuit pattern layer; and the second insulating layer which covers the second inner circuit pattern layer.
- the flying tail type rigid-flexible printed circuit board further includes an outer circuit pattern layer formed on the outermost top surface of the circuit layer.
- FIGS. 1 to 21 are process diagrams showing a method of manufacturing a flying tail type rigid-flexible printed circuit board in accordance with the present invention.
- FIG. 22 is a cross-sectional view of a flying tail type rigid-flexible printed circuit board manufactured by the method of manufacturing a flying tail type rigid-flexible printed circuit board in accordance with the present invention.
- FIG. 23 is another cross-sectional view of a flying tail type rigid-flexible printed circuit board in accordance with the present invention.
- FIGS. 1 to 21 are process diagrams showing a method of manufacturing a flying tail type rigid-flexible printed circuit board in accordance with the present invention.
- a method of manufacturing a flying tail type rigid-flexible printed circuit board in accordance with the present invention performs the step of providing a base substrate having a first inner circuit pattern layer on one or both surfaces.
- the base substrate 10 may be provided by performing the step of providing a flexible film 10 b having a metal layer 10 a on one or both surfaces as shown in FIG. 1 and the step of forming the first inner circuit pattern layer 10 a ′ by etching the metal layer 10 a as shown in FIG. 2 .
- the flexible film 10 b may be made of polyimide resins, polyurethane resins, acrylate resins, and so on.
- the first inner circuit pattern layer 10 a ′ may be implemented by one of photolithography, E-beam lithography, focused ion beam lithography, dry etching, wet etching, and nano-imprinting.
- the method of manufacturing a flying tail type rigid-flexible printed circuit board in accordance with the present invention may additionally perform, after the step of providing the base substrate 10 having the first inner circuit pattern layer 10 ′ on one or both surfaces, as shown in FIG. 3 , the step of attaching a coverlay 11 to the first inner circuit pattern layer 10 a ′ formed in a flexible domain F of the base substrate 10 .
- the coverlay 11 plays a role of protecting the first inner circuit pattern layer 10 a ′ formed in the flexible domain F of the base substrate 10 from external environment.
- this coverlay 11 may be attached to the first inner circuit pattern layer 10 a ′ by being pressed with a press after being temporarily bonded by hand using a soldering iron in a state of being preliminarily attached to the first inner circuit pattern layer 10 a ′ using an adhesive layer 15 ( FIG. 23 ).
- a material of the coverlay 11 may be a polyimide film.
- a first insulating layer 12 is laminated on a rigid domain R of the base substrate 10 .
- the first insulating layer 12 may be made of a rigid insulator, and specifically, the rigid insulator may be cured no flow prepreg.
- the first insulating layer 12 is laminated only on the rigid domain R of the base substrate 10 using no flow prepreg so as not to be laminated on the flexible domain F.
- the step of laminating at least one circuit layer, which extends over the entire domain of the base substrate 10 , on the first insulating layer 12 is performed.
- a method of laminating the at least one circuit layer, which extends over the entire domain of the base substrate 10 , on the first insulating layer 12 , as shown in FIG. 5 performs the step of laminating a metal layer 21 which extends over the entire domain of the base substrate 10 (step S′ 1 ).
- the metal layer 21 is laminated on the first insulating layer 12 while not being in contact with the first inner circuit pattern layer 10 a ′ formed in the flexible domain F of the base substrate 10 .
- the method of manufacturing a flying tail type rigid-flexible printed circuit board in accordance with the present invention may perform the step of processing a through-hole 22 which penetrates the entire first insulating layer 12 and base substrate 10 .
- the through-hole 22 may be processed using a computer numerical control (CNC) drill.
- CNC computer numerical control
- step S′ 2 the step of forming a plating layer 23 on the metal layer 21 including an inner wall of the through-hole 22 .
- This plating layer 23 may be formed by one or a combination of electroless plating, electroplating, screen plating, sputtering, evaporation, ink-jetting, and dispensing using one of Cu, Ag, Sn, Au, Ni, and Pd.
- step S′ 3 the step of forming a second inner circuit pattern layer 23 ′ by etching the metal layer 21 and the plating layer 23 along a circuit pattern.
- the second inner circuit pattern layer 23 ′ may be implemented by one of photolithography, E-beam lithography, focused ion beam lithography, dry etching, wet etching, and nano-imprinting.
- a first circuit layer 20 is formed by performing the step (step S′ 4 ) of laminating a second insulating layer 24 , which extends over the entire domain of the base substrate 10 , on the second inner circuit pattern layer 23 ′, and the circuit layer may be formed in a plurality of layers by repeatedly performing the steps S′ 1 to S′ 4 .
- the second insulating layer 24 may be made of a flexible insulator. That is, unlike the first insulating layer 12 laminated on the rigid domain R of the base substrate 10 , the second insulating layer 24 is laminated over the entire domain of the base substrate 10 using uncured typical prepreg, thus removing additional manufacturing costs due to curing and implementing a flying tail type rigid-flexible printed circuit board with improved filling property. Further, in terms of productivity, the step of laminating the second insulating layer 24 has an advantage of utilizing an existing production line as it is.
- the step of forming a via-hole 33 by laminating a metal layer 31 which extends over the entire domain of the base substrate as shown in FIG. 10 , window-etching a portion of the metal layer 31 to form a via-hole opening 32 as shown in FIG. 11 , and irradiating laser to the via-hole opening 32 as shown in FIG. 12 may be additionally performed.
- a second circuit layer 30 is formed by forming a plating layer 34 on the metal layer 31 including the via-hole 33 as shown in FIG. 13 , etching the metal layer 31 and the plating layer 34 along a circuit pattern to form a second inner circuit pattern layer 34 ′ as shown in FIG. 14 , and laminating a second insulating layer 35 as shown in FIG. 15 .
- the step of forming an outer circuit pattern layer on the outermost top surface of the circuit layer 20 and 30 is performed, and the step of removing a portion of the circuit layer 20 and 30 , which corresponds to the flexible domain F.
- a metal layer 41 which extends over the entire domain of the base substrate, is laminated on the outermost top surface of the circuit layer.
- a via-hole opening 42 is formed by window-etching a portion of the metal layer 41 .
- a via-hole 44 is formed by irradiating laser to the via-hole opening 42 .
- the cavity 45 is processed on the edge of the flexible domain F adjacent to the rigid domain R.
- the cavity 45 may be processed by drilling such as a CNC drill and a CO2 or Yag laser drill by using the metal layer 21 and the plating layer 23 of the flexible domain F as a stopper.
- the cavity 45 may be processed by routing including a CNC router machine or a router bit or may be formed by being primarily processed with a router and secondarily processed with laser.
- the step of forming a plating layer 46 on the metal layer 41 including inner walls of the via-hole 44 and the cavity 45 is performed, and as shown in FIG. 21 , an outer circuit pattern layer 46 ′ is formed by etching the metal layer 41 and the plating layer 46 along a circuit pattern. At this time, the plating layer on the inner wall of the cavity 45 is also removed by etching.
- a flying tail type rigid-flexible printed circuit board in accordance with the present invention is finally completed by removing a circuit layer pile A remaining after processing the cavity 45 .
- a flying tail type rigid-flexible printed circuit board when manufacturing a flying tail type rigid-flexible printed circuit board according to the method of manufacturing a flying tail type rigid-flexible printed circuit board in accordance with the present invention, unlike a conventional method of manufacturing a flying tail type rigid-flexible printed circuit board, since there is no need for an etching process for removing the metal layer and the plating layer corresponding to the flexible domain F, additional manufacturing costs due to an etching process are not required.
- FIG. 22 is a cross-sectional view of a flying tail type rigid-flexible printed circuit board manufactured by the method of manufacturing a flying tail type rigid-flexible printed circuit board in accordance with the present invention.
- a flying tail type rigid-flexible printed circuit board manufactured by the method of manufacturing a flying tail type rigid-flexible printed circuit board in accordance with the present invention includes a base substrate 10 , a first insulating layer 12 laminated on a rigid domain R of the base substrate 10 , and at least one circuit layer 20 and 30 formed on the first insulating layer 12 and including a second insulating layer 24 and 35 .
- the flying tail type rigid-flexible printed circuit board may further include a coverlay 11 attached to a first inner circuit pattern layer formed in a flexible domain F of the base substrate 10 .
- a first inner circuit pattern layer 10 a ′ is formed on one or both surfaces of a flexible film 10 b.
- the circuit layer may consist of a lower second inner circuit pattern layer 23 ′ and 34 ′ and the second insulating layer 24 and 35 which covers the second inner circuit pattern layer 23 ′ and 34 ′.
- the second inner circuit pattern layer 23 ′ and 34 ′ consists of a metal layer 21 and 31 and a plating layer.
- the first insulating layer 12 is made of a rigid insulator, that is, cured no flow prepreg
- the second insulating layer 24 and 35 is made of a flexible insulator, that is, uncured typical prepreg.
- the flying tail type rig id-flexible printed circuit board may additionally include an outer circuit pattern layer 46 ′ formed on the outermost top surface of the circuit layer.
- the flying tail type rigid-flexible printed circuit board and the method of manufacturing a flying tail type rigid-flexible printed circuit board manufactured by the same unlike the conventional method of manufacturing a flying tail type rigid-flexible printed circuit board, since there is no need for an etching process for removing the metal layer and the plating layer corresponding to the flexible domain F, additional manufacturing costs due to an etching process are not required.
- the flying tail type rigid-flexible printed circuit board and the method of manufacturing a flying tail type rigid-flexible printed circuit board manufactured by the same when laminating the insulating layer, unlike the conventional method of manufacturing a flying tail type rigid-flexible printed circuit board, since it is not required to cure an insulator, additional manufacturing costs due to a curing process are not required, and it is possible to implement a flying tail type rigid-flexible printed circuit board with improved filling property by laminating the insulating layer using an uncured insulator.
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- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The present invention relates to a method of manufacturing a flying tail type rigid-flexible printed circuit board and a flying tail type rigid-flexible printed circuit board manufactured by the same and implement a flying tail type rigid-flexible printed circuit board with improved filling property by providing a method of manufacturing a flying tail type rigid-flexible printed circuit board including: providing a base substrate having a first inner circuit pattern layer on both surfaces; laminating a first insulating layer on a rigid domain R of the base substrate; laminating at least one circuit layer, which extends over the entire domain of the base substrate, on the first insulating layer; and removing a portion of the circuit layer, which corresponds to a flexible domain F, wherein the circuit layer includes a second insulating layer and a flying tail type rigid-flexible printed circuit board manufactured by the same.
Description
- This application is a continuation of U.S. patent application Ser. No. 15/285,390 filed on Oct. 4, 2016, which was a continuation of U.S. patent application Ser. No. 13/771,830 filed on Feb. 20, 2013, which claims the benefit under 35 U.S.C. § 119(a) of Korean Patent Application No. 10-2012-0017509 filed on Feb. 21, 2012, in the Korean Intellectual Property Office, the entire disclosures of each of which are incorporated herein by reference for all purposes.
- The present invention relates to a method of manufacturing a flying tail type rigid-flexible printed circuit board and a flying tail type rigid-flexible printed circuit board manufactured by the same, and more particularly, to a method of manufacturing a flying tail type rigid-flexible printed circuit board using a flexible insulator and a flying tail type rigid-flexible printed circuit board manufactured by the same.
- In recent times, as the degree of integration of semiconductor elements is gradually increasing, the number of pads provided on the semiconductor elements to connect the semiconductor elements to external circuits is increasing and mounting density is also on an increasing trend. For example, when a minimum processing dimension of the semiconductor element made of silicon is about 0.2 μm, it is required to provide about 1000 pads on the semiconductor element with a size of about 10 mm.
- Further, in semiconductor devices such as semiconductor packages, on which the semiconductor elements are mounted, miniaturization and thinning are needed to improve the mounting density, and particularly, in order to respond to portable information devices such as notebook personal computers (PCs), PDAs, and mobile phones, miniaturization and thinning of the semiconductor packages are needed.
- In order to package the semiconductor element, it is required to connect the pad of the semiconductor element to a pad of a wiring substrate as well as mounting the semiconductor element on the wiring substrate. However, when about 1000 pads are provided around the semiconductor element with a size of about 10 mm, they are provided with a very fine pitch of about 40 μm. In order to connect the pads provided with a fine pitch to the pad provided on the wiring substrate, since very high accuracy is required for wiring on the wiring substrate or positioning upon connection, it is very difficult to apply a conventional wire bonding or tape automated bonding (TAB) technique.
- Accordingly, recently, various multilayer printed circuit boards, which can mount electronic components on surfaces thereof, have been developed according to miniaturization and integration of the electronic components, and particularly, active researches on a flying tail type rigid-flexible printed circuit board, which can minimize a space occupied by a printed circuit board and be three-dimensionally and spatially transformed, are in progress.
- This flying tail type rigid-flexible printed circuit board, which consists of a rigid domain (hereinafter, R) having mechanical strength due to an embedded insulating layer and a flexible domain (hereinafter, F) that connects the rigid domains R to each other and has elasticity, is mainly used in small terminals, such as mobile phones, requiring high integration by removing an unnecessary space due to use of a connector in response to demands for high integration and fine pitches of mounted components according to high functionality of mobile devices.
- When looking into a conventional method of manufacturing a flying tail type rigid-flexible printed circuit board, first, a first inner circuit pattern layer is formed on one or both surfaces of a base substrate, and a coverlay is attached to the inner layer circuit pattern layer of a flexible domain F (step S1).
- Next, a first insulating layer is laminated on a rigid domain R, and a first metal layer is laminated on the first insulating layer including the flexible domain F (step 82).
- At this time, it is preferred that the first insulating layer is made of a cured insulator so that the first insulating layer is not laminated on the flexible domain F. Since the first metal layer is laminated on the first insulating layer and the first insulating layer is not laminated on the flexible domain F, the first metal layer is formed not to be in contact with the coverlay.
- Next, a first window is processed by removing the first metal layer in a blind via-hole forming domain, which is to be formed in the rigid domain R (step 83).
- Next, a blind via-hole is processed by processing the first insulating layer, which is exposed by the first window, with CO2 laser (step 84).
- Next, a through-hole, which penetrates the entire first insulating layer and base substrate, is processed using a CNC drill (step 85).
- Next, a first plating layer is formed on the first metal layer including inner walls of the blind via-hole and the through-hole (step 86).
- Next, a first circuit pattern layer is formed by patterning the first metal layer and the first plating layer (step 87). At this time, the first metal layer and the first plating layer formed in the flexible domain F are removed.
- Next, a second insulating layer is laminated on the rigid domain R, and a second metal layer is laminated on the second insulating layer including the flexible domain F (step 88). At this time, like the above step 82, it is preferred that the first insulating layer is made of a cured insulator so that the first insulating layer is not laminated on the flexible domain F.
- Next, a via-hole is processed (step 89). At this time, the via-hole is formed by processing the second insulating layer, which is exposed by a second window, with CO2 laser after processing the second window by removing the second metal layer in a domain in which the via-hole is to be processed.
- Next, a second plating layer is formed on the second metal layer including the via-hole (step 810).
- Next, a second circuit pattern layer is formed by patterning the second metal layer and the second plating layer (step 811). At this time, like the step 87, the second metal layer and the second plating layer formed in the flexible domain F are removed.
- Finally, a third insulating layer is laminated on the rigid domain R, a third metal layer is laminated on the third insulating layer including the flexible domain F, and a third circuit pattern layer is formed (step 812). That is, since this step, a step of forming a third build-up layer, is equal to a method of forming a first build-up layer or a second build-up layer, repeated description will be omitted.
- Like this, in the conventional method of manufacturing a flying tail type rigid-flexible printed circuit board, like the steps S7 and S11, an etching process for removing the metal layer and the plating layer formed in the flexible domain F is performed whenever forming a build-up layer. Accordingly, there is a problem of an additional increase in manufacturing costs.
- Further, like the steps S2 and SS, the insulating layer is made of a cured insulator so that the second insulating layer is not laminated on the flexible domain F whenever forming a build-up layer. In case of a cured insulator, there are problems such as deterioration of filling property and an additional increase in manufacturing costs due to a curing process.
- The present invention has been invented in order to overcome the above-described problems and it is, therefore, an object of the present invention to provide a method of manufacturing a flying tail type rigid-flexible printed circuit board using a flexible insulator and a flying tail type rigid-flexible printed circuit board manufactured by the same.
- In accordance with one aspect of the present invention to achieve the object, there is provided a method of manufacturing a flying tail type rigid-flexible printed circuit board including the steps of: providing a base substrate having a first inner circuit pattern layer on one or both surfaces; laminating a first insulating layer on a rigid domain R of the base substrate; laminating at least one circuit layer, which extends over the entire domain of the base substrate, on the first insulating layer; and removing a portion of the circuit layer, which corresponds to a flexible domain F, wherein the circuit layer includes a second insulating layer.
- At this time, the first insulating layer is made of a rigid insulator, and the second insulating layer is made of a flexible insulator.
- And, the rigid insulator is cured no flow prepreg.
- Further, the method of manufacturing a flying tail type rigid-flexible printed circuit board further includes, after the step of providing the base substrate having the first inner circuit pattern layer on one or both surfaces, the step of attaching a coverlay to the first inner circuit pattern layer formed in the flexible domain F of the base substrate.
- Further, the step of removing the portion of the circuit layer, which corresponds to the flexible domain F, is performed through the steps of processing a cavity on an edge of the flexible domain F adjacent to the rigid domain R; and removing a circuit layer pile remaining after processing the cavity.
- Further, the step of processing the cavity on the edge of the flexible domain F adjacent to the rigid domain R is performed by a laser method or a routing method.
- Further, the step of laminating the at least one circuit layer, which extends over the entire domain of the base substrate, on the first insulating layer is performed through the steps of laminating a metal layer which extends over the entire domain of the base substrate; forming a plating layer on the metal layer; forming a second inner circuit pattern layer by etching the metal layer and the plating layer along a circuit pattern; and laminating a second insulating layer, which extends over the entire domain of the base substrate, on the second inner circuit pattern layer.
- Further, the method of manufacturing a flying tail type rigid-flexible printed circuit board further includes, after the step of laminating the metal layer which extends over the entire domain of the base substrate, the step of forming a via-hole by window-etching a portion of the metal layer to form a via-hole opening and irradiating laser to the via-hole opening.
- Further, the method of manufacturing a flying tail type rigid-flexible printed circuit board further includes, after the step of laminating the metal layer which extends over the entire domain of the base substrate, the step of processing a through-hole which penetrates the entire first insulating layer and base substrate.
- Further, the step of providing the base substrate having the first inner circuit pattern layer on one or both surfaces is performed through the steps of providing a flexible film having a metal layer on one or both surfaces; and forming the first inner circuit pattern layer by etching the metal layer.
- Further, the method of manufacturing a flying tail type rigid-flexible printed circuit board further includes, after the step of laminating the at least one circuit layer, which extends over the entire domain of the base substrate, on the first insulating layer, the step of forming an outer circuit pattern layer on the outermost top surface of the circuit layer.
- And, in accordance with another aspect of the present invention to achieve the object, there is provided a flying tail type rigid-flexible printed circuit board including: a base substrate having a first inner circuit pattern layer on one or both surfaces; a first insulating layer laminated on a rigid domain R of the base substrate; and at least one circuit layer formed on the first insulating layer and including a second insulating layer.
- At this time, the first insulating layer is made of a rigid insulator, and the second insulating layer is made of a flexible insulator.
- And, the rigid insulator is cured no flow prepreg.
- Further, the flying tail type rigid-flexible printed circuit board further includes a coverlay attached to the first inner circuit pattern layer formed in a flexible domain F of the base substrate.
- Further, the circuit layer consists of a lower second inner circuit pattern layer; and the second insulating layer which covers the second inner circuit pattern layer.
- Further, the flying tail type rigid-flexible printed circuit board further includes an outer circuit pattern layer formed on the outermost top surface of the circuit layer.
- These and/or other aspects and advantages of the present general inventive concept will become apparent and more readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
-
FIGS. 1 to 21 are process diagrams showing a method of manufacturing a flying tail type rigid-flexible printed circuit board in accordance with the present invention; and -
FIG. 22 is a cross-sectional view of a flying tail type rigid-flexible printed circuit board manufactured by the method of manufacturing a flying tail type rigid-flexible printed circuit board in accordance with the present invention. -
FIG. 23 is another cross-sectional view of a flying tail type rigid-flexible printed circuit board in accordance with the present invention. - Advantages and features of the present invention and methods of accomplishing the same will be apparent by referring to embodiments described below in detail in connection with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below and may be implemented in various different forms. The exemplary embodiments are provided only for completing the disclosure of the present invention and for fully representing the scope of the present invention to those skilled in the art. Like reference numerals refer to like elements throughout the specification.
- Terms used herein are provided to explain embodiments, not limiting the present invention. Throughout this specification, the singular form includes the plural form unless the context clearly indicates otherwise. When terms “comprises” and/or “comprising” used herein do not preclude existence and addition of another component, step, operation and/or device, in addition to the above-mentioned component, step, operation and/or device.
- Hereinafter, configuration and operational effect of the present invention will be described in detail with reference to the accompanying drawings.
-
FIGS. 1 to 21 are process diagrams showing a method of manufacturing a flying tail type rigid-flexible printed circuit board in accordance with the present invention. - First, a method of manufacturing a flying tail type rigid-flexible printed circuit board in accordance with the present invention performs the step of providing a base substrate having a first inner circuit pattern layer on one or both surfaces.
- The
base substrate 10 may be provided by performing the step of providing aflexible film 10 b having ametal layer 10 a on one or both surfaces as shown inFIG. 1 and the step of forming the first innercircuit pattern layer 10 a′ by etching themetal layer 10 a as shown inFIG. 2 . - Here, for example, the
flexible film 10 b may be made of polyimide resins, polyurethane resins, acrylate resins, and so on. - And, the first inner
circuit pattern layer 10 a′ may be implemented by one of photolithography, E-beam lithography, focused ion beam lithography, dry etching, wet etching, and nano-imprinting. - In addition, the method of manufacturing a flying tail type rigid-flexible printed circuit board in accordance with the present invention may additionally perform, after the step of providing the
base substrate 10 having the first innercircuit pattern layer 10′ on one or both surfaces, as shown inFIG. 3 , the step of attaching acoverlay 11 to the first innercircuit pattern layer 10 a′ formed in a flexible domain F of thebase substrate 10. - The
coverlay 11 plays a role of protecting the first innercircuit pattern layer 10 a′ formed in the flexible domain F of thebase substrate 10 from external environment. For example, thiscoverlay 11 may be attached to the first innercircuit pattern layer 10 a′ by being pressed with a press after being temporarily bonded by hand using a soldering iron in a state of being preliminarily attached to the first innercircuit pattern layer 10 a′ using an adhesive layer 15 (FIG. 23 ). A material of thecoverlay 11 may be a polyimide film. - Next, as shown in
FIG. 4 , a first insulatinglayer 12 is laminated on a rigid domain R of thebase substrate 10. - Here, the first insulating
layer 12 may be made of a rigid insulator, and specifically, the rigid insulator may be cured no flow prepreg. - That is, the first insulating
layer 12 is laminated only on the rigid domain R of thebase substrate 10 using no flow prepreg so as not to be laminated on the flexible domain F. - Next, the step of laminating at least one circuit layer, which extends over the entire domain of the
base substrate 10, on the first insulatinglayer 12 is performed. - Specifically, first, a method of laminating the at least one circuit layer, which extends over the entire domain of the
base substrate 10, on the first insulatinglayer 12, as shown inFIG. 5 , performs the step of laminating ametal layer 21 which extends over the entire domain of the base substrate 10 (step S′1). - Since the first insulating
layer 12 is laminated only on the rigid domain R of thebase substrate 10, themetal layer 21 is laminated on the first insulatinglayer 12 while not being in contact with the first innercircuit pattern layer 10 a′ formed in the flexible domain F of thebase substrate 10. - Additionally, the method of manufacturing a flying tail type rigid-flexible printed circuit board in accordance with the present invention, as shown in
FIG. 6 , may perform the step of processing a through-hole 22 which penetrates the entire first insulatinglayer 12 andbase substrate 10. At this time, for example, the through-hole 22 may be processed using a computer numerical control (CNC) drill. - Next, as shown in
FIG. 7 , the step of forming aplating layer 23 on themetal layer 21 including an inner wall of the through-hole 22 (step S′2). - This
plating layer 23 may be formed by one or a combination of electroless plating, electroplating, screen plating, sputtering, evaporation, ink-jetting, and dispensing using one of Cu, Ag, Sn, Au, Ni, and Pd. - Next, as shown in
FIG. 8 , the step of forming a second innercircuit pattern layer 23′ by etching themetal layer 21 and theplating layer 23 along a circuit pattern (step S′3). - At this time, the second inner
circuit pattern layer 23′, like the first innercircuit pattern layer 10 a′, may be implemented by one of photolithography, E-beam lithography, focused ion beam lithography, dry etching, wet etching, and nano-imprinting. - Next, as shown in
FIG. 9 , afirst circuit layer 20 is formed by performing the step (step S′4) of laminating a second insulatinglayer 24, which extends over the entire domain of thebase substrate 10, on the second innercircuit pattern layer 23′, and the circuit layer may be formed in a plurality of layers by repeatedly performing the steps S′1 to S′4. - Here, the second insulating
layer 24 may be made of a flexible insulator. That is, unlike the first insulatinglayer 12 laminated on the rigid domain R of thebase substrate 10, the second insulatinglayer 24 is laminated over the entire domain of thebase substrate 10 using uncured typical prepreg, thus removing additional manufacturing costs due to curing and implementing a flying tail type rigid-flexible printed circuit board with improved filling property. Further, in terms of productivity, the step of laminating the second insulatinglayer 24 has an advantage of utilizing an existing production line as it is. - Meanwhile, in a process of laminating the circuit layer, the step of forming a via-
hole 33 by laminating ametal layer 31, which extends over the entire domain of the base substrate as shown inFIG. 10 , window-etching a portion of themetal layer 31 to form a via-hole opening 32 as shown inFIG. 11 , and irradiating laser to the via-hole opening 32 as shown inFIG. 12 may be additionally performed. - Next, a
second circuit layer 30 is formed by forming aplating layer 34 on themetal layer 31 including the via-hole 33 as shown inFIG. 13 , etching themetal layer 31 and theplating layer 34 along a circuit pattern to form a second innercircuit pattern layer 34′ as shown inFIG. 14 , and laminating a second insulatinglayer 35 as shown inFIG. 15 . - At this time, when forming the second inner
circuit pattern layer 34′, in order to process acavity 45 ofFIG. 19 in the circuit layer along an edge of the flexible domain F, it is preferred to form acavity window 36 ofFIG. 14 by etching both of themetal layer 31 and theplating layer 34 in the edge portion of the flexible domain F. - Next, the step of forming an outer circuit pattern layer on the outermost top surface of the
circuit layer circuit layer - When specifically looking into this, as shown in
FIG. 16 , ametal layer 41, which extends over the entire domain of the base substrate, is laminated on the outermost top surface of the circuit layer. - Next, as shown in
FIG. 17 , a via-hole opening 42 is formed by window-etching a portion of themetal layer 41. At this time, it is preferred to form acavity opening 43 at the same time by window-etching themetal layer 41 on the edge of the flexible domain F. This is to perform the step of forming thecavity 45 ofFIG. 19 , which will be performed later. - Next, as shown in
FIG. 18 , a via-hole 44 is formed by irradiating laser to the via-hole opening 42. - Next, as shown in
FIG. 19 , thecavity 45 is processed on the edge of the flexible domain F adjacent to the rigid domain R. At this time, thecavity 45 may be processed by drilling such as a CNC drill and a CO2 or Yag laser drill by using themetal layer 21 and theplating layer 23 of the flexible domain F as a stopper. Or, thecavity 45 may be processed by routing including a CNC router machine or a router bit or may be formed by being primarily processed with a router and secondarily processed with laser. - Next, as shown in
FIG. 20 , the step of forming aplating layer 46 on themetal layer 41 including inner walls of the via-hole 44 and thecavity 45 is performed, and as shown inFIG. 21 , an outercircuit pattern layer 46′ is formed by etching themetal layer 41 and theplating layer 46 along a circuit pattern. At this time, the plating layer on the inner wall of thecavity 45 is also removed by etching. - Finally, a flying tail type rigid-flexible printed circuit board in accordance with the present invention is finally completed by removing a circuit layer pile A remaining after processing the
cavity 45. - Like this, when manufacturing a flying tail type rigid-flexible printed circuit board according to the method of manufacturing a flying tail type rigid-flexible printed circuit board in accordance with the present invention, unlike a conventional method of manufacturing a flying tail type rigid-flexible printed circuit board, since there is no need for an etching process for removing the metal layer and the plating layer corresponding to the flexible domain F, additional manufacturing costs due to an etching process are not required.
- Further, when laminating the insulating layer, unlike the conventional method of manufacturing a flying tail type rigid-flexible printed circuit board, since it is not required to cure an insulator, additional costs due to a curing process are not required, and it is possible to implement a flying tail type rigid-flexible printed circuit board with improved filling property by laminating the insulating layer using an uncured insulator.
- Now, a structure of a flying tail type rigid-flexible printed circuit board manufactured by the method of manufacturing a flying tail type rigid-flexible printed circuit board in accordance with the present invention will be specifically described.
-
FIG. 22 is a cross-sectional view of a flying tail type rigid-flexible printed circuit board manufactured by the method of manufacturing a flying tail type rigid-flexible printed circuit board in accordance with the present invention. - Referring to
FIG. 22 , a flying tail type rigid-flexible printed circuit board manufactured by the method of manufacturing a flying tail type rigid-flexible printed circuit board in accordance with the present invention includes abase substrate 10, a first insulatinglayer 12 laminated on a rigid domain R of thebase substrate 10, and at least onecircuit layer layer 12 and including a second insulatinglayer - In addition, the flying tail type rigid-flexible printed circuit board may further include a
coverlay 11 attached to a first inner circuit pattern layer formed in a flexible domain F of thebase substrate 10. - In the
base substrate 10, a first innercircuit pattern layer 10 a′ is formed on one or both surfaces of aflexible film 10 b. - Specifically, the circuit layer may consist of a lower second inner
circuit pattern layer 23′ and 34′ and the second insulatinglayer circuit pattern layer 23′ and 34′. The second innercircuit pattern layer 23′ and 34′ consists of ametal layer - Here, while the first insulating
layer 12 is made of a rigid insulator, that is, cured no flow prepreg, the second insulatinglayer - Meanwhile, the flying tail type rig id-flexible printed circuit board may additionally include an outer
circuit pattern layer 46′ formed on the outermost top surface of the circuit layer. - According to the flying tail type rigid-flexible printed circuit board and the method of manufacturing a flying tail type rigid-flexible printed circuit board manufactured by the same, unlike the conventional method of manufacturing a flying tail type rigid-flexible printed circuit board, since there is no need for an etching process for removing the metal layer and the plating layer corresponding to the flexible domain F, additional manufacturing costs due to an etching process are not required.
- Further, according to the flying tail type rigid-flexible printed circuit board and the method of manufacturing a flying tail type rigid-flexible printed circuit board manufactured by the same, when laminating the insulating layer, unlike the conventional method of manufacturing a flying tail type rigid-flexible printed circuit board, since it is not required to cure an insulator, additional manufacturing costs due to a curing process are not required, and it is possible to implement a flying tail type rigid-flexible printed circuit board with improved filling property by laminating the insulating layer using an uncured insulator.
- Further, in terms of productivity, there is an advantage of utilizing an existing production line as it is.
- The foregoing description illustrates the present invention. Additionally, the foregoing description shows and explains only the preferred embodiments of the present invention, but it is to be understood that the present invention is capable of use in various other combinations, modifications, and environments and is capable of changes and modifications within the scope of the inventive concept as expressed herein, commensurate with the above teachings and/or the skill or knowledge of the related art. The embodiments described hereinabove are further intended to explain best modes known of practicing the invention and to enable others skilled in the art to utilize the invention in such, or other, embodiments and with the various modifications required by the particular applications or uses of the invention. Accordingly, the description is not intended to limit the invention to the form disclosed herein. Also, it is intended that the appended claims be construed to include alternative embodiments.
Claims (15)
1. A rigid-flexible printed circuit board having a rigid portion and a flexible portion, the rigid-flexible printed circuit board comprising:
a flexible film having a first circuit pattern layer on one or both surfaces;
a first insulating layer disposed on the flexible film of the rigid portion to expose the first circuit pattern layer on the flexible film of the flexible portion and covering the first circuit pattern layer on the flexible film of the rigid portion;
a residual metal pattern disposed on the first insulating layer to be positioned on the rigid portion, which is adjacent to the flexible portion to be exposed facing the flexible portion;
a second circuit pattern layer disposed on the first insulating layer;
a second insulating layer covering the second circuit pattern layer and the residual metal pattern;
a third circuit pattern layer disposed on the second insulating layer;
a third insulating layer covering the third circuit pattern layer; and
a coverlay attached to the first circuit pattern layer on the flexible film of the flexible portion by applying an adhesive layer between the coverlay and the first circuit pattern layer,
wherein the coverlay has an exposed surface on the flexible portion and a portion extending between the first insulating layer and the first circuit pattern layer on the flexible film of the rigid portion.
2. The rigid-flexible printed circuit board according to claim 1 , wherein the residual metal pattern has an exposed surface facing the flexible portion and the exposed surface is an etched surface.
3. The rigid-flexible printed circuit board according to claim 1 , wherein the second insulating layer and third insulating layer have exposed surfaces that are facing the flexible portion and are substantially coplanar with each other,
4. The rigid-flexible printed circuit board according to claim 1 , further comprising:
a plurality of conductive vias connecting to either one or both of the first and second circuit pattern layers
5. The rigid-flexible printed circuit board according to claim 4 , wherein the flexible film of the flexible portion is not covered by the residual metal pattern, and the plurality of conductive vias are not directly connected to the residual metal pattern.
6. The rigid-flexible printed circuit board according to claim 1 , further comprising:
an outer circuit pattern layer disposed on the outermost top surface of the third insulating layer.
7. A rigid-flexible printed circuit board having a rigid portion and a flexible portion, the rigid-flexible printed circuit board comprising:
a flexible film having a first circuit pattern layer on one or both surfaces;
a first insulating layer disposed on the flexible film of the rigid portion to expose the first circuit pattern layer on the flexible film of the flexible portion and covering the first circuit pattern layer on the flexible film of the rigid portion;
a second circuit pattern layer disposed on the first insulating layer;
a second insulating layer disposed on the first insulating layer to cover the second circuit pattern layer;
a residual metal pattern disposed between the first and the second insulating layers to be exposed on side surfaces of the first and the second insulating layers facing the flexible portion; and
a coverlay attached to the first circuit pattern layer on the flexible film of the flexible portion by applying an adhesive layer between the coverlay and the first circuit pattern layer,
wherein the coverlay has an exposed surface on the flexible portion and a portion extending between the first insulating layer and the first circuit pattern layer on the flexible film of the rigid portion.
8. The rigid-flexible printed circuit board according to claim 7 , further comprising a third circuit pattern layer disposed on the second insulating layer and a third insulating layer disposed on the second insulating layer to cover the second circuit pattern layer.
9. The rigid-flexible printed circuit board according to claim 8 , wherein the third circuit pattern layer is electrically connected to at least one of the first and the second circuit pattern layers through a hole penetrating at least the second insulating layer.
10. The rigid-flexible printed circuit board according to claim 7 , wherein the residual metal pattern having a same material as that of the second circuit pattern layer.
11. The rigid-flexible printed circuit board according to claim 7 , wherein the second circuit pattern layer is electrically connected to the first circuit pattern layer through a hole penetrating at least the first insulating layer.
12. The rigid-flexible printed circuit board according to claim 7 , further comprising:
a plurality of conductive vias connecting to either one or both of the first and second circuit pattern layers
13. The rigid-flexible printed circuit board according to claim 12 , wherein the flexible film of the flexible portion is not covered by the residual metal pattern, and the plurality of conductive vias are not directly connected to the residual metal pattern.
14. A rigid-flexible printed circuit board having a rigid portion and a flexible portion, the rigid-flexible printed circuit board comprising:
a flexible film having a first circuit pattern layer on one or both surfaces;
a first insulating layer disposed on the flexible film of the rigid portion to expose the first circuit pattern layer on the flexible film of the flexible portion and covering the first circuit pattern layer on the flexible film of the rigid portion;
a second circuit pattern layer disposed on the first insulating layer;
a second insulating layer disposed on the first insulating layer to cover the second circuit pattern layer;
a residual metal pattern disposed between the first and the second insulating layers to be exposed on side surfaces of the first and the second insulating layers facing the flexible portion; and
a coverlay attached to the first circuit pattern layer on the flexible film of the flexible portion by applying an adhesive layer between the coverlay and the first circuit pattern layer;
a plurality of conductive vias connecting to either one or both of the first and second circuit pattern layers;
wherein the flexible film of the flexible portion is not covered by the residual metal pattern, and the plurality of conductive vias are not directly connected to the residual metal pattern,
wherein the coverlay has an exposed surface on the flexible portion and a portion extending between the first insulating layer and the first circuit pattern layer on the flexible film of the rigid portion.
15. The rigid-flexible printed circuit board according to claim 1 , wherein the residual metal pattern has an exposed surface facing the flexible portion and the exposed surface is an etched surface.
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US16/018,430 US20180302979A1 (en) | 2012-02-21 | 2018-06-26 | Flying tail type rigid-flexible printed circuit board |
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KR1020120017509A KR101387313B1 (en) | 2012-02-21 | 2012-02-21 | Method of manufacturing flying tail type rigid-flexible printed circuit board and flying tail type rigid-flexible printed circuit board manufactured by the same |
US13/771,830 US20130213695A1 (en) | 2012-02-21 | 2013-02-20 | Method of manufacturing flying tail type rigid-flexible printed circuit board and flying tail type rigid-flexible printed circuit board manufactured by the same |
US15/285,390 US10034368B2 (en) | 2012-02-21 | 2016-10-04 | Flying tail type rigid-flexible printed circuit board |
US16/018,430 US20180302979A1 (en) | 2012-02-21 | 2018-06-26 | Flying tail type rigid-flexible printed circuit board |
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US15/285,390 Active US10034368B2 (en) | 2012-02-21 | 2016-10-04 | Flying tail type rigid-flexible printed circuit board |
US16/018,430 Abandoned US20180302979A1 (en) | 2012-02-21 | 2018-06-26 | Flying tail type rigid-flexible printed circuit board |
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US15/285,390 Active US10034368B2 (en) | 2012-02-21 | 2016-10-04 | Flying tail type rigid-flexible printed circuit board |
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2016
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
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US11006532B2 (en) * | 2018-10-30 | 2021-05-11 | Taiwan Semiconductor Manufacturing Company, Ltd. | Circuit carrier and manifacturing method thereof |
US20210267068A1 (en) * | 2018-10-30 | 2021-08-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Electronic assembly having circuit carrier and manufacturing method thereof |
US11665834B2 (en) * | 2018-10-30 | 2023-05-30 | Taiwan Semiconductor Manufacturing Company, Ltd. | Electronic assembly having circuit carrier and manufacturing method thereof |
CN111970811A (en) * | 2020-07-21 | 2020-11-20 | 武汉电信器件有限公司 | Circuit board |
Also Published As
Publication number | Publication date |
---|---|
CN105813405B (en) | 2019-06-28 |
KR101387313B1 (en) | 2014-04-18 |
US20170027055A1 (en) | 2017-01-26 |
CN103260356B (en) | 2016-03-16 |
CN105813405A (en) | 2016-07-27 |
US20130213695A1 (en) | 2013-08-22 |
KR20130096025A (en) | 2013-08-29 |
CN103260356A (en) | 2013-08-21 |
US10034368B2 (en) | 2018-07-24 |
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