JP2014082276A5 - - Google Patents

Download PDF

Info

Publication number
JP2014082276A5
JP2014082276A5 JP2012228210A JP2012228210A JP2014082276A5 JP 2014082276 A5 JP2014082276 A5 JP 2014082276A5 JP 2012228210 A JP2012228210 A JP 2012228210A JP 2012228210 A JP2012228210 A JP 2012228210A JP 2014082276 A5 JP2014082276 A5 JP 2014082276A5
Authority
JP
Japan
Prior art keywords
electronic component
hole
body portion
insulating layer
main body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012228210A
Other languages
English (en)
Japanese (ja)
Other versions
JP5968753B2 (ja
JP2014082276A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2012228210A priority Critical patent/JP5968753B2/ja
Priority claimed from JP2012228210A external-priority patent/JP5968753B2/ja
Priority to KR1020130118347A priority patent/KR20140048042A/ko
Priority to US14/050,505 priority patent/US8804361B2/en
Publication of JP2014082276A publication Critical patent/JP2014082276A/ja
Publication of JP2014082276A5 publication Critical patent/JP2014082276A5/ja
Application granted granted Critical
Publication of JP5968753B2 publication Critical patent/JP5968753B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2012228210A 2012-10-15 2012-10-15 配線基板 Active JP5968753B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2012228210A JP5968753B2 (ja) 2012-10-15 2012-10-15 配線基板
KR1020130118347A KR20140048042A (ko) 2012-10-15 2013-10-04 배선 기판
US14/050,505 US8804361B2 (en) 2012-10-15 2013-10-10 Wiring substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012228210A JP5968753B2 (ja) 2012-10-15 2012-10-15 配線基板

Publications (3)

Publication Number Publication Date
JP2014082276A JP2014082276A (ja) 2014-05-08
JP2014082276A5 true JP2014082276A5 (enExample) 2015-11-05
JP5968753B2 JP5968753B2 (ja) 2016-08-10

Family

ID=50475136

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012228210A Active JP5968753B2 (ja) 2012-10-15 2012-10-15 配線基板

Country Status (3)

Country Link
US (1) US8804361B2 (enExample)
JP (1) JP5968753B2 (enExample)
KR (1) KR20140048042A (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102105403B1 (ko) * 2013-11-28 2020-04-28 삼성전기주식회사 전자소자 내장 기판 및 그 제조 방법
JP6384118B2 (ja) * 2014-05-13 2018-09-05 日立化成株式会社 半導体装置の製造方法、半導体装置及び半導体装置製造用部材
KR101591752B1 (ko) 2014-08-13 2016-02-12 주식회사 뉴마이크로 칼라 샤프심
KR101591751B1 (ko) 2014-08-13 2016-02-05 주식회사 뉴마이크로 컬러 샤프심 제조용 가공 수지, 및 이의 제조방법
KR101591749B1 (ko) 2014-08-13 2016-02-05 주식회사 뉴마이크로 칼라 샤프심 제조용 식물성 가소제 및 이의 제조방법
KR101591750B1 (ko) 2014-08-13 2016-02-11 주식회사 뉴마이크로 칼라 샤프심의 제조방법
KR101609264B1 (ko) 2014-12-09 2016-04-05 삼성전기주식회사 전자소자 내장 기판 및 그 제조 방법
JP6639934B2 (ja) * 2016-02-08 2020-02-05 新光電気工業株式会社 配線基板、半導体装置及び配線基板の製造方法
US9743526B1 (en) 2016-02-10 2017-08-22 International Business Machines Corporation Wiring board with stacked embedded capacitors and method of making
JP6678090B2 (ja) * 2016-10-04 2020-04-08 新光電気工業株式会社 電子部品内蔵基板及びその製造方法と電子部品装置
US11445596B2 (en) 2018-12-27 2022-09-13 Unimicron Technology Corp. Circuit board having heat-dissipation block and method of manufacturing the same
TWI694756B (zh) * 2018-12-27 2020-05-21 欣興電子股份有限公司 一種具有散熱塊的電路板及其製造方法
US20200279814A1 (en) * 2019-02-28 2020-09-03 Advanced Semiconductor Engineering, Inc. Wiring structure and method for manufacturing the same
US10790241B2 (en) 2019-02-28 2020-09-29 Advanced Semiconductor Engineering, Inc. Wiring structure and method for manufacturing the same
KR20220001634A (ko) * 2020-06-30 2022-01-06 삼성전기주식회사 인쇄회로기판
US20250070001A1 (en) * 2023-08-24 2025-02-27 Qualcomm Incorporated Device including substrate with passive electronic component embedded therein

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6239485B1 (en) * 1998-11-13 2001-05-29 Fujitsu Limited Reduced cross-talk noise high density signal interposer with power and ground wrap
CN100381027C (zh) * 1999-09-02 2008-04-09 伊比登株式会社 印刷布线板及其制造方法
JP2005116943A (ja) * 2003-10-10 2005-04-28 Seiko Epson Corp プリント配線基板、実装基板モジュール、プリント配線基板の製造方法、およびそれを用いた電気光学装置、電子機器
JP2006073763A (ja) * 2004-09-01 2006-03-16 Denso Corp 多層基板の製造方法
JP4882880B2 (ja) 2007-06-12 2012-02-22 株式会社デンソー プリント基板の製造方法およびプリント基板
JP2012079994A (ja) * 2010-10-05 2012-04-19 Yamaichi Electronics Co Ltd 部品内蔵プリント配線板およびその製造方法

Similar Documents

Publication Publication Date Title
JP2014082276A5 (enExample)
JP2016192568A5 (enExample)
JP2015233164A5 (enExample)
WO2013032670A3 (en) Laminated flex circuit layers for electronic device components
JP2011217547A5 (enExample)
JP2014072205A5 (enExample)
EP2728981A3 (en) Connecting structure between circuit boards and battery pack having the same
MX379589B (es) Estructura de capas multiples y metodo de fabricacion relacionado para componentes electronicos.
JP2012129443A5 (enExample)
JP2013232486A5 (enExample)
JP2015122608A5 (enExample)
JP2014206814A5 (enExample)
WO2011112409A3 (en) Wiring substrate with customization layers
JP2017038046A5 (enExample)
JP2015050384A5 (enExample)
JP2014067741A5 (enExample)
JP2013168517A5 (enExample)
JP2015035531A5 (enExample)
JP2010045067A5 (enExample)
JP2014165210A5 (enExample)
JP2015106663A5 (enExample)
JP2011103931A5 (enExample)
JP2015115342A5 (enExample)
JP2015076463A5 (enExample)
JP2012104627A5 (enExample)