JP2012104627A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2012104627A5 JP2012104627A5 JP2010251463A JP2010251463A JP2012104627A5 JP 2012104627 A5 JP2012104627 A5 JP 2012104627A5 JP 2010251463 A JP2010251463 A JP 2010251463A JP 2010251463 A JP2010251463 A JP 2010251463A JP 2012104627 A5 JP2012104627 A5 JP 2012104627A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- circuit board
- printed circuit
- board according
- interposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 8
- 229910000679 solder Inorganic materials 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010251463A JP2012104627A (ja) | 2010-11-10 | 2010-11-10 | プリント基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010251463A JP2012104627A (ja) | 2010-11-10 | 2010-11-10 | プリント基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2012104627A JP2012104627A (ja) | 2012-05-31 |
| JP2012104627A5 true JP2012104627A5 (enExample) | 2013-12-05 |
Family
ID=46394692
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010251463A Pending JP2012104627A (ja) | 2010-11-10 | 2010-11-10 | プリント基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2012104627A (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016025220A (ja) * | 2014-07-22 | 2016-02-08 | 株式会社日立製作所 | 挿入部品の実装構造体及び回路基板及び電子回路装置の製造方法 |
| JP6092928B2 (ja) | 2015-04-28 | 2017-03-08 | ファナック株式会社 | ブローホールの発生を抑制するリードを有する電子部品の実装構造 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH098434A (ja) * | 1995-06-19 | 1997-01-10 | Nippondenso Co Ltd | 電子回路ユニット及びその製造方法 |
| JPH09148705A (ja) * | 1995-11-17 | 1997-06-06 | Sony Corp | 電子部品を搭載した回路基板 |
| JP2005302929A (ja) * | 2004-04-09 | 2005-10-27 | Matsushita Electric Ind Co Ltd | ガス抜きプリント基板 |
-
2010
- 2010-11-10 JP JP2010251463A patent/JP2012104627A/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2012129443A5 (enExample) | ||
| EP2757863A3 (en) | Printed circuit board stack | |
| JP2014082276A5 (enExample) | ||
| WO2010059977A3 (en) | Solderless electronic component or capacitor mount assembly | |
| JP2006294974A5 (enExample) | ||
| JP2015122608A5 (enExample) | ||
| WO2006114267A3 (en) | Electronic component and electronic configuration | |
| JP2017112794A5 (enExample) | ||
| JP2015035531A5 (enExample) | ||
| JP2012104627A5 (enExample) | ||
| WO2009031586A1 (ja) | 回路基板及び回路基板の製造方法 | |
| US9538656B2 (en) | Electric and/or electronic circuit including a printed circuit board, a separate circuit board and a power connector | |
| JP2017535055A5 (enExample) | ||
| JP2016025113A (ja) | 配線基板 | |
| JP2015012170A5 (ja) | 積層型半導体装置、プリント回路板、電子機器及び積層型半導体装置の製造方法 | |
| JP2014067741A5 (enExample) | ||
| JP2014143379A5 (enExample) | ||
| JP2013162295A5 (enExample) | ||
| JP2012099751A5 (enExample) | ||
| CN102969292B (zh) | 集成电源模块 | |
| WO2008084774A1 (ja) | 電装品ユニット | |
| JP2010044975A5 (enExample) | ||
| CN101668391B (zh) | 电路板组件及其制造方法 | |
| JP2009147976A5 (enExample) | ||
| JP2012104627A (ja) | プリント基板 |