JP2013162295A5 - - Google Patents

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Publication number
JP2013162295A5
JP2013162295A5 JP2012022061A JP2012022061A JP2013162295A5 JP 2013162295 A5 JP2013162295 A5 JP 2013162295A5 JP 2012022061 A JP2012022061 A JP 2012022061A JP 2012022061 A JP2012022061 A JP 2012022061A JP 2013162295 A5 JP2013162295 A5 JP 2013162295A5
Authority
JP
Japan
Prior art keywords
mounting surface
base substrate
electrode
hole
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2012022061A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013162295A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2012022061A priority Critical patent/JP2013162295A/ja
Priority claimed from JP2012022061A external-priority patent/JP2013162295A/ja
Publication of JP2013162295A publication Critical patent/JP2013162295A/ja
Publication of JP2013162295A5 publication Critical patent/JP2013162295A5/ja
Withdrawn legal-status Critical Current

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JP2012022061A 2012-02-03 2012-02-03 ベース基板、電子デバイス、ベース基板の製造方法、及び電子デバイスの製造方法 Withdrawn JP2013162295A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012022061A JP2013162295A (ja) 2012-02-03 2012-02-03 ベース基板、電子デバイス、ベース基板の製造方法、及び電子デバイスの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012022061A JP2013162295A (ja) 2012-02-03 2012-02-03 ベース基板、電子デバイス、ベース基板の製造方法、及び電子デバイスの製造方法

Publications (2)

Publication Number Publication Date
JP2013162295A JP2013162295A (ja) 2013-08-19
JP2013162295A5 true JP2013162295A5 (enExample) 2015-03-26

Family

ID=49174220

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012022061A Withdrawn JP2013162295A (ja) 2012-02-03 2012-02-03 ベース基板、電子デバイス、ベース基板の製造方法、及び電子デバイスの製造方法

Country Status (1)

Country Link
JP (1) JP2013162295A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6591747B2 (ja) * 2014-12-26 2019-10-16 京セラ株式会社 圧電デバイスの製造方法
JP6852569B2 (ja) * 2017-05-30 2021-03-31 セイコーエプソン株式会社 Ｍｅｍｓ素子、電子機器および移動体
CN113228256B (zh) * 2018-12-27 2024-03-22 株式会社大真空 压电振动器件

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009225218A (ja) * 2008-03-18 2009-10-01 Citizen Holdings Co Ltd 電極構造、電子デバイス、及び電極構造の製造方法
JP5108579B2 (ja) * 2008-03-21 2012-12-26 シチズンファインテックミヨタ株式会社 電子部品パッケージの製造方法および電子部品パッケージ
JP5447379B2 (ja) * 2008-08-05 2014-03-19 株式会社大真空 圧電振動デバイスの封止部材、及びその製造方法
JP2011124752A (ja) * 2009-12-10 2011-06-23 Seiko Epson Corp 圧電デバイスおよびその封止方法

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