JP2012028408A5 - - Google Patents

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Publication number
JP2012028408A5
JP2012028408A5 JP2010163141A JP2010163141A JP2012028408A5 JP 2012028408 A5 JP2012028408 A5 JP 2012028408A5 JP 2010163141 A JP2010163141 A JP 2010163141A JP 2010163141 A JP2010163141 A JP 2010163141A JP 2012028408 A5 JP2012028408 A5 JP 2012028408A5
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JP
Japan
Prior art keywords
support
connection portion
connection
connection terminal
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2010163141A
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English (en)
Japanese (ja)
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JP2012028408A (ja
JP5713598B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2010163141A priority Critical patent/JP5713598B2/ja
Priority claimed from JP2010163141A external-priority patent/JP5713598B2/ja
Priority to US13/183,975 priority patent/US8419442B2/en
Publication of JP2012028408A publication Critical patent/JP2012028408A/ja
Publication of JP2012028408A5 publication Critical patent/JP2012028408A5/ja
Application granted granted Critical
Publication of JP5713598B2 publication Critical patent/JP5713598B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2010163141A 2010-07-20 2010-07-20 ソケット及びその製造方法 Expired - Fee Related JP5713598B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2010163141A JP5713598B2 (ja) 2010-07-20 2010-07-20 ソケット及びその製造方法
US13/183,975 US8419442B2 (en) 2010-07-20 2011-07-15 Socket and method of fabricating the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010163141A JP5713598B2 (ja) 2010-07-20 2010-07-20 ソケット及びその製造方法

Publications (3)

Publication Number Publication Date
JP2012028408A JP2012028408A (ja) 2012-02-09
JP2012028408A5 true JP2012028408A5 (enExample) 2013-08-22
JP5713598B2 JP5713598B2 (ja) 2015-05-07

Family

ID=45493993

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010163141A Expired - Fee Related JP5713598B2 (ja) 2010-07-20 2010-07-20 ソケット及びその製造方法

Country Status (2)

Country Link
US (1) US8419442B2 (enExample)
JP (1) JP5713598B2 (enExample)

Families Citing this family (28)

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Publication number Priority date Publication date Assignee Title
US8482111B2 (en) 2010-07-19 2013-07-09 Tessera, Inc. Stackable molded microelectronic packages
DE102011005544A1 (de) * 2011-03-15 2012-09-20 Robert Bosch Gmbh Verbesserte Mehrfach-Direktkontaktierung von elektrischen Bauteilen
KR101128063B1 (ko) 2011-05-03 2012-04-23 테세라, 인코포레이티드 캡슐화 층의 표면에 와이어 본드를 구비하는 패키지 적층형 어셈블리
US8404520B1 (en) 2011-10-17 2013-03-26 Invensas Corporation Package-on-package assembly with wire bond vias
US8946757B2 (en) 2012-02-17 2015-02-03 Invensas Corporation Heat spreading substrate with embedded interconnects
US8835228B2 (en) 2012-05-22 2014-09-16 Invensas Corporation Substrate-less stackable package with wire-bond interconnect
US9502390B2 (en) 2012-08-03 2016-11-22 Invensas Corporation BVA interposer
US9167710B2 (en) 2013-08-07 2015-10-20 Invensas Corporation Embedded packaging with preformed vias
US20150076714A1 (en) 2013-09-16 2015-03-19 Invensas Corporation Microelectronic element with bond elements to encapsulation surface
US9379074B2 (en) 2013-11-22 2016-06-28 Invensas Corporation Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects
US9583456B2 (en) 2013-11-22 2017-02-28 Invensas Corporation Multiple bond via arrays of different wire heights on a same substrate
US9583411B2 (en) 2014-01-17 2017-02-28 Invensas Corporation Fine pitch BVA using reconstituted wafer with area array accessible for testing
JP2015173150A (ja) * 2014-03-11 2015-10-01 新光電気工業株式会社 半導体パッケージ
US10381326B2 (en) 2014-05-28 2019-08-13 Invensas Corporation Structure and method for integrated circuits packaging with increased density
US9735084B2 (en) 2014-12-11 2017-08-15 Invensas Corporation Bond via array for thermal conductivity
US9888579B2 (en) 2015-03-05 2018-02-06 Invensas Corporation Pressing of wire bond wire tips to provide bent-over tips
US9502372B1 (en) 2015-04-30 2016-11-22 Invensas Corporation Wafer-level packaging using wire bond wires in place of a redistribution layer
US9761554B2 (en) * 2015-05-07 2017-09-12 Invensas Corporation Ball bonding metal wire bond wires to metal pads
US9490222B1 (en) 2015-10-12 2016-11-08 Invensas Corporation Wire bond wires for interference shielding
US10490528B2 (en) 2015-10-12 2019-11-26 Invensas Corporation Embedded wire bond wires
US10332854B2 (en) 2015-10-23 2019-06-25 Invensas Corporation Anchoring structure of fine pitch bva
US10181457B2 (en) 2015-10-26 2019-01-15 Invensas Corporation Microelectronic package for wafer-level chip scale packaging with fan-out
US10043779B2 (en) 2015-11-17 2018-08-07 Invensas Corporation Packaged microelectronic device for a package-on-package device
US9984992B2 (en) 2015-12-30 2018-05-29 Invensas Corporation Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces
US9935075B2 (en) 2016-07-29 2018-04-03 Invensas Corporation Wire bonding method and apparatus for electromagnetic interference shielding
US10299368B2 (en) 2016-12-21 2019-05-21 Invensas Corporation Surface integrated waveguides and circuit structures therefor
JP7316192B2 (ja) 2019-10-29 2023-07-27 タイコエレクトロニクスジャパン合同会社 ソケット
CN114597712A (zh) * 2020-08-14 2022-06-07 富士康(昆山)电脑接插件有限公司 芯片电连接器

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US5917707A (en) 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
US5476211A (en) 1993-11-16 1995-12-19 Form Factor, Inc. Method of manufacturing electrical contacts, using a sacrificial member
JP2717717B2 (ja) 1989-11-14 1998-02-25 株式会社豊田中央研究所 吸臭性粘土鉱物とその製造方法
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US20070020960A1 (en) 2003-04-11 2007-01-25 Williams John D Contact grid array system
CN100440628C (zh) 2005-10-17 2008-12-03 富士康(昆山)电脑接插件有限公司 电连接器
JP5325440B2 (ja) * 2008-03-26 2013-10-23 株式会社フジクラ 電子部品実装用基板及びその製造方法と、電子回路部品
JP4832479B2 (ja) * 2008-08-01 2011-12-07 株式会社フジクラ コネクタ及び該コネクタを備えた電子部品

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