JP2011165774A5 - - Google Patents
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- Publication number
- JP2011165774A5 JP2011165774A5 JP2010024823A JP2010024823A JP2011165774A5 JP 2011165774 A5 JP2011165774 A5 JP 2011165774A5 JP 2010024823 A JP2010024823 A JP 2010024823A JP 2010024823 A JP2010024823 A JP 2010024823A JP 2011165774 A5 JP2011165774 A5 JP 2011165774A5
- Authority
- JP
- Japan
- Prior art keywords
- solid
- imaging device
- state imaging
- manufacturing
- cover member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000003384 imaging method Methods 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims 3
- 230000002093 peripheral effect Effects 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010024823A JP5658466B2 (ja) | 2010-02-05 | 2010-02-05 | 固体撮像装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010024823A JP5658466B2 (ja) | 2010-02-05 | 2010-02-05 | 固体撮像装置の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011165774A JP2011165774A (ja) | 2011-08-25 |
| JP2011165774A5 true JP2011165774A5 (enExample) | 2013-03-21 |
| JP5658466B2 JP5658466B2 (ja) | 2015-01-28 |
Family
ID=44596128
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010024823A Expired - Fee Related JP5658466B2 (ja) | 2010-02-05 | 2010-02-05 | 固体撮像装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5658466B2 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5746919B2 (ja) * | 2011-06-10 | 2015-07-08 | 新光電気工業株式会社 | 半導体パッケージ |
| TW201503334A (zh) * | 2013-07-08 | 2015-01-16 | 勝開科技股份有限公司 | 影像感測器二階段封裝方法 |
| CN107516651B (zh) * | 2016-06-16 | 2023-08-08 | 宁波舜宇光电信息有限公司 | 感光组件和摄像模组及其制造方法 |
| KR102452688B1 (ko) * | 2017-09-25 | 2022-10-11 | 현대자동차주식회사 | 이미지 센서 패키지 및 그것의 제조 방법 |
| WO2019196584A1 (zh) * | 2018-04-09 | 2019-10-17 | 宁波舜宇光电信息有限公司 | 感光组件、摄像模组及其制作方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4838501B2 (ja) * | 2004-06-15 | 2011-12-14 | 富士通セミコンダクター株式会社 | 撮像装置及びその製造方法 |
| JP2006245118A (ja) * | 2005-03-01 | 2006-09-14 | Konica Minolta Opto Inc | 撮像装置及び撮像装置の製造方法 |
| JP2007110594A (ja) * | 2005-10-17 | 2007-04-26 | Hitachi Maxell Ltd | カメラモジュール |
| WO2008032404A1 (en) * | 2006-09-15 | 2008-03-20 | Fujitsu Microelectronics Limited | Semiconductor device and method for manufacturing same |
| JP2008193441A (ja) * | 2007-02-06 | 2008-08-21 | Matsushita Electric Ind Co Ltd | 光学デバイス及びその製造方法 |
| DE102007029620A1 (de) * | 2007-06-26 | 2009-01-08 | Richter Chemie- Technik Gmbh | Stopfbuchspackung |
| US20100182483A1 (en) * | 2007-07-09 | 2010-07-22 | Masanao Majima | Manufacturing Method Of Imaging Device, Imaging Device, and Mobile Terminal |
| US7964945B2 (en) * | 2007-09-28 | 2011-06-21 | Samsung Electro-Mechanics Co., Ltd. | Glass cap molding package, manufacturing method thereof and camera module |
| JP2009152481A (ja) * | 2007-12-21 | 2009-07-09 | Shinko Electric Ind Co Ltd | 撮像用半導体装置および撮像用半導体装置の製造方法 |
| JP2009188191A (ja) * | 2008-02-06 | 2009-08-20 | Fujitsu Microelectronics Ltd | 半導体装置及び半導体装置の製造方法 |
| JP5489543B2 (ja) * | 2009-06-09 | 2014-05-14 | キヤノン株式会社 | 固体撮像装置 |
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2010
- 2010-02-05 JP JP2010024823A patent/JP5658466B2/ja not_active Expired - Fee Related