JP5658466B2 - 固体撮像装置の製造方法 - Google Patents

固体撮像装置の製造方法 Download PDF

Info

Publication number
JP5658466B2
JP5658466B2 JP2010024823A JP2010024823A JP5658466B2 JP 5658466 B2 JP5658466 B2 JP 5658466B2 JP 2010024823 A JP2010024823 A JP 2010024823A JP 2010024823 A JP2010024823 A JP 2010024823A JP 5658466 B2 JP5658466 B2 JP 5658466B2
Authority
JP
Japan
Prior art keywords
solid
state imaging
imaging device
adhesive
cover member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2010024823A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011165774A (ja
JP2011165774A5 (enExample
Inventor
幸司 都築
幸司 都築
久種 小森
久種 小森
智 ▲濱▼▲崎▼
智 ▲濱▼▲崎▼
康浩 松木
康浩 松木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2010024823A priority Critical patent/JP5658466B2/ja
Publication of JP2011165774A publication Critical patent/JP2011165774A/ja
Publication of JP2011165774A5 publication Critical patent/JP2011165774A5/ja
Application granted granted Critical
Publication of JP5658466B2 publication Critical patent/JP5658466B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222—Sequential connecting processes
    • H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
JP2010024823A 2010-02-05 2010-02-05 固体撮像装置の製造方法 Expired - Fee Related JP5658466B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010024823A JP5658466B2 (ja) 2010-02-05 2010-02-05 固体撮像装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010024823A JP5658466B2 (ja) 2010-02-05 2010-02-05 固体撮像装置の製造方法

Publications (3)

Publication Number Publication Date
JP2011165774A JP2011165774A (ja) 2011-08-25
JP2011165774A5 JP2011165774A5 (enExample) 2013-03-21
JP5658466B2 true JP5658466B2 (ja) 2015-01-28

Family

ID=44596128

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010024823A Expired - Fee Related JP5658466B2 (ja) 2010-02-05 2010-02-05 固体撮像装置の製造方法

Country Status (1)

Country Link
JP (1) JP5658466B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107742630A (zh) * 2013-07-08 2018-02-27 胜丽国际股份有限公司 影像感测器封装结构

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5746919B2 (ja) * 2011-06-10 2015-07-08 新光電気工業株式会社 半導体パッケージ
CN107516651B (zh) * 2016-06-16 2023-08-08 宁波舜宇光电信息有限公司 感光组件和摄像模组及其制造方法
KR102452688B1 (ko) * 2017-09-25 2022-10-11 현대자동차주식회사 이미지 센서 패키지 및 그것의 제조 방법
WO2019196584A1 (zh) * 2018-04-09 2019-10-17 宁波舜宇光电信息有限公司 感光组件、摄像模组及其制作方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4838501B2 (ja) * 2004-06-15 2011-12-14 富士通セミコンダクター株式会社 撮像装置及びその製造方法
JP2006245118A (ja) * 2005-03-01 2006-09-14 Konica Minolta Opto Inc 撮像装置及び撮像装置の製造方法
JP2007110594A (ja) * 2005-10-17 2007-04-26 Hitachi Maxell Ltd カメラモジュール
WO2008032404A1 (en) * 2006-09-15 2008-03-20 Fujitsu Microelectronics Limited Semiconductor device and method for manufacturing same
JP2008193441A (ja) * 2007-02-06 2008-08-21 Matsushita Electric Ind Co Ltd 光学デバイス及びその製造方法
DE102007029620A1 (de) * 2007-06-26 2009-01-08 Richter Chemie- Technik Gmbh Stopfbuchspackung
US20100182483A1 (en) * 2007-07-09 2010-07-22 Masanao Majima Manufacturing Method Of Imaging Device, Imaging Device, and Mobile Terminal
US7964945B2 (en) * 2007-09-28 2011-06-21 Samsung Electro-Mechanics Co., Ltd. Glass cap molding package, manufacturing method thereof and camera module
JP2009152481A (ja) * 2007-12-21 2009-07-09 Shinko Electric Ind Co Ltd 撮像用半導体装置および撮像用半導体装置の製造方法
JP2009188191A (ja) * 2008-02-06 2009-08-20 Fujitsu Microelectronics Ltd 半導体装置及び半導体装置の製造方法
JP5489543B2 (ja) * 2009-06-09 2014-05-14 キヤノン株式会社 固体撮像装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107742630A (zh) * 2013-07-08 2018-02-27 胜丽国际股份有限公司 影像感测器封装结构

Also Published As

Publication number Publication date
JP2011165774A (ja) 2011-08-25

Similar Documents

Publication Publication Date Title
JP5489543B2 (ja) 固体撮像装置
JP4673721B2 (ja) 撮像装置及びその製造方法
CN102738189A (zh) 固体摄像装置及其制造方法和电子系统
CN100490162C (zh) 固体摄像装置及其制造方法
CN102646647B (zh) 固态成像装置、其制造方法和照相机
US7521790B2 (en) Semiconductor device module and manufacturing method of semiconductor device module
CN101159279A (zh) 半导体摄像元件及其制法、半导体摄像元件模块及装置
US8241951B2 (en) Method of manufacturing solid-state image pickup device and solid-state image pickup device
JP6067262B2 (ja) 半導体装置およびその製造方法、ならびにカメラ
US20070210246A1 (en) Stacked image sensor optical module and fabrication method
JP5342838B2 (ja) カメラモジュール及びその製造方法
JP2005317745A (ja) 固体撮像装置およびその製造方法
JP5658466B2 (ja) 固体撮像装置の製造方法
JP5694670B2 (ja) 固体撮像装置およびその製造方法
JP2014053512A (ja) 固体撮像装置及びその製造方法
KR101204901B1 (ko) 카메라 모듈과, 이의 제조 방법
JP4466552B2 (ja) 固体撮像装置の製造方法
JP4839084B2 (ja) 固体撮像装置
JP2009044494A (ja) 撮像デバイス
JP2006269841A (ja) 固体撮像装置
JP2006294720A (ja) カメラモジュール
JP4806970B2 (ja) 固体撮像装置
CN118763090B (zh) 感光组件及其制备方法、摄像模组和电子设备
KR101210023B1 (ko) 카메라 모듈 및 그 제조 방법
JP2006269784A (ja) 撮像装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130205

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20130205

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20131226

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20140106

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140305

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20141031

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20141128

R151 Written notification of patent or utility model registration

Ref document number: 5658466

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151

LAPS Cancellation because of no payment of annual fees