JP5658466B2 - 固体撮像装置の製造方法 - Google Patents
固体撮像装置の製造方法 Download PDFInfo
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- JP5658466B2 JP5658466B2 JP2010024823A JP2010024823A JP5658466B2 JP 5658466 B2 JP5658466 B2 JP 5658466B2 JP 2010024823 A JP2010024823 A JP 2010024823A JP 2010024823 A JP2010024823 A JP 2010024823A JP 5658466 B2 JP5658466 B2 JP 5658466B2
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- JP
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- Prior art keywords
- solid
- state imaging
- imaging device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
- H01L2224/9222—Sequential connecting processes
- H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
- H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Description
まず、図3(a)に示す第1工程では、固体撮像素子2と実装部材4とを準備し、実装部材4上に固体撮像素子2を固定する。固体撮像素子2は、第1面および第2面を有し、第1面に画素領域21と電極パッド24とを有している。固体撮像素子2の第2面は、実装部材4に対して接着剤43によって固定される。
Claims (6)
- 固体撮像装置の製造方法であって、
第1面および第2面を有し、前記第1面に画素領域とその外側に配置された電極パッドとを有する固体撮像素子の前記第2面が、端子を有する実装部材に固定された状態で、前記電極パッドと前記端子とを導電部材によって接続する接続工程と、
前記接続工程の後に、前記固体撮像素子の前記第1面にカバー部材を載置した後、前記カバー部材の外側端に沿って接着剤を塗布し前記接着剤を硬化させることによって、前記固体撮像素子の前記第1面に前記接着剤によって前記カバー部材を固定する固定工程と、
前記固定工程の後に、前記導電部材を封止部材で封止する封止工程と、
を含むことを特徴とする固体撮像装置の製造方法。 - 前記カバー部材は、前記固体撮像素子の前記第1面に載置された状態において前記画素領域に対向しかつ前記画素領域から離隔して配置される平板部と、前記載置された状態において前記平板部の周辺部から前記固体撮像素子の方向に延びる枠部とを含み、前記接着剤は、前記枠部の前記外側端に接触し前記枠部の内側端に接触しないように塗布される、
ことを特徴とする請求項1に記載の固体撮像装置の製造方法。 - 前記封止工程では、前記導電部材を覆うように前記実装部材および前記固体撮像素子に樹脂を塗布し前記樹脂を硬化させることにより前記封止部材を形成する、
ことを特徴とする請求項1又は2に記載の固体撮像装置の製造方法。 - 前記接着剤はUV硬化樹脂であって、前記硬化は前記接着剤にUV光を照射することによりなされる、
ことを特徴とする請求項1乃至3のいずれか1項に記載の固体撮像装置の製造方法。 - 前記封止部材は黒色である、
ことを特徴とする請求項1乃至4のいずれか1項に記載の固体撮像装置の製造方法。 - 前記封止工程では、複数の前記固体撮像素子が前記実装部材に搭載された集合体を形成し、前記封止工程の後に前記集合体を個々の固体撮像装置に分断する、
ことを特徴とする請求項1乃至5のいずれか1項に記載の固体撮像装置の製造方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010024823A JP5658466B2 (ja) | 2010-02-05 | 2010-02-05 | 固体撮像装置の製造方法 |
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JP2010024823A JP5658466B2 (ja) | 2010-02-05 | 2010-02-05 | 固体撮像装置の製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2011165774A JP2011165774A (ja) | 2011-08-25 |
JP2011165774A5 JP2011165774A5 (ja) | 2013-03-21 |
JP5658466B2 true JP5658466B2 (ja) | 2015-01-28 |
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JP2010024823A Expired - Fee Related JP5658466B2 (ja) | 2010-02-05 | 2010-02-05 | 固体撮像装置の製造方法 |
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JP (1) | JP5658466B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107742630A (zh) * | 2013-07-08 | 2018-02-27 | 胜丽国际股份有限公司 | 影像感测器封装结构 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5746919B2 (ja) * | 2011-06-10 | 2015-07-08 | 新光電気工業株式会社 | 半導体パッケージ |
CN107516651B (zh) * | 2016-06-16 | 2023-08-08 | 宁波舜宇光电信息有限公司 | 感光组件和摄像模组及其制造方法 |
KR102452688B1 (ko) * | 2017-09-25 | 2022-10-11 | 현대자동차주식회사 | 이미지 센서 패키지 및 그것의 제조 방법 |
WO2019196584A1 (zh) * | 2018-04-09 | 2019-10-17 | 宁波舜宇光电信息有限公司 | 感光组件、摄像模组及其制作方法 |
Family Cites Families (11)
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JP4838501B2 (ja) * | 2004-06-15 | 2011-12-14 | 富士通セミコンダクター株式会社 | 撮像装置及びその製造方法 |
JP2006245118A (ja) * | 2005-03-01 | 2006-09-14 | Konica Minolta Opto Inc | 撮像装置及び撮像装置の製造方法 |
JP2007110594A (ja) * | 2005-10-17 | 2007-04-26 | Hitachi Maxell Ltd | カメラモジュール |
CN101512765A (zh) * | 2006-09-15 | 2009-08-19 | 富士通微电子株式会社 | 半导体器件及其制造方法 |
JP2008193441A (ja) * | 2007-02-06 | 2008-08-21 | Matsushita Electric Ind Co Ltd | 光学デバイス及びその製造方法 |
DE102007029620A1 (de) * | 2007-06-26 | 2009-01-08 | Richter Chemie- Technik Gmbh | Stopfbuchspackung |
US20100182483A1 (en) * | 2007-07-09 | 2010-07-22 | Masanao Majima | Manufacturing Method Of Imaging Device, Imaging Device, and Mobile Terminal |
US7964945B2 (en) * | 2007-09-28 | 2011-06-21 | Samsung Electro-Mechanics Co., Ltd. | Glass cap molding package, manufacturing method thereof and camera module |
JP2009152481A (ja) * | 2007-12-21 | 2009-07-09 | Shinko Electric Ind Co Ltd | 撮像用半導体装置および撮像用半導体装置の製造方法 |
JP2009188191A (ja) * | 2008-02-06 | 2009-08-20 | Fujitsu Microelectronics Ltd | 半導体装置及び半導体装置の製造方法 |
JP5489543B2 (ja) * | 2009-06-09 | 2014-05-14 | キヤノン株式会社 | 固体撮像装置 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN107742630A (zh) * | 2013-07-08 | 2018-02-27 | 胜丽国际股份有限公司 | 影像感测器封装结构 |
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JP2011165774A (ja) | 2011-08-25 |
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