CN101512765A - 半导体器件及其制造方法 - Google Patents
半导体器件及其制造方法 Download PDFInfo
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- CN101512765A CN101512765A CNA2006800557894A CN200680055789A CN101512765A CN 101512765 A CN101512765 A CN 101512765A CN A2006800557894 A CNA2006800557894 A CN A2006800557894A CN 200680055789 A CN200680055789 A CN 200680055789A CN 101512765 A CN101512765 A CN 101512765A
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- Engineering & Computer Science (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Studio Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
Claims (18)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2006/318400 WO2008032404A1 (en) | 2006-09-15 | 2006-09-15 | Semiconductor device and method for manufacturing same |
Publications (1)
Publication Number | Publication Date |
---|---|
CN101512765A true CN101512765A (zh) | 2009-08-19 |
Family
ID=39183475
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNA2006800557894A Pending CN101512765A (zh) | 2006-09-15 | 2006-09-15 | 半导体器件及其制造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7939361B2 (zh) |
JP (1) | JP5218058B2 (zh) |
KR (1) | KR101100790B1 (zh) |
CN (1) | CN101512765A (zh) |
WO (1) | WO2008032404A1 (zh) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
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CN102646686A (zh) * | 2011-02-18 | 2012-08-22 | 索尼公司 | 半导体设备,制造设备和制造方法 |
CN102891152A (zh) * | 2011-06-10 | 2013-01-23 | 新光电气工业株式会社 | 半导体封装体 |
CN103456754A (zh) * | 2012-05-31 | 2013-12-18 | 意法半导体有限公司 | 晶片级光学传感器封装和低剖面照相机模块以及制造方法 |
CN104303288A (zh) * | 2012-05-15 | 2015-01-21 | 韩国科泰高科株式会社 | 指纹传感器封装件及其制造方法 |
CN104716115A (zh) * | 2013-12-12 | 2015-06-17 | 恩智浦有限公司 | 传感器封装及其制造方法 |
CN106946215A (zh) * | 2017-04-13 | 2017-07-14 | 华天科技(昆山)电子有限公司 | 带盖板的引线键合型芯片封装结构及其制作方法 |
CN107591374A (zh) * | 2016-07-06 | 2018-01-16 | 胜丽国际股份有限公司 | 感测器封装结构 |
US11177300B2 (en) | 2015-03-24 | 2021-11-16 | Sony Corporation | Solid-state image pickup apparatus, method of manufacturing solid-state image pickup apparatus, and electronic apparatus |
CN114651324A (zh) * | 2019-11-14 | 2022-06-21 | 株式会社T-Able | 图像传感器模块以及图像传感器模块的制造方法 |
Families Citing this family (41)
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KR20100058345A (ko) * | 2008-11-24 | 2010-06-03 | 삼성전자주식회사 | 카메라 모듈 형성방법 |
JP5595066B2 (ja) * | 2009-03-25 | 2014-09-24 | 京セラ株式会社 | 撮像装置および撮像モジュール |
JP5332834B2 (ja) * | 2009-04-06 | 2013-11-06 | 大日本印刷株式会社 | 撮像素子モジュール |
KR101640417B1 (ko) | 2010-01-22 | 2016-07-25 | 삼성전자 주식회사 | 반도체 패키지 및 이의 제조 방법 |
JP5658466B2 (ja) * | 2010-02-05 | 2015-01-28 | キヤノン株式会社 | 固体撮像装置の製造方法 |
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2006
- 2006-09-15 CN CNA2006800557894A patent/CN101512765A/zh active Pending
- 2006-09-15 KR KR1020097004725A patent/KR101100790B1/ko active IP Right Grant
- 2006-09-15 WO PCT/JP2006/318400 patent/WO2008032404A1/ja active Application Filing
- 2006-09-15 JP JP2008534206A patent/JP5218058B2/ja not_active Expired - Fee Related
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JPWO2008032404A1 (ja) | 2010-01-21 |
US7939361B2 (en) | 2011-05-10 |
JP5218058B2 (ja) | 2013-06-26 |
KR101100790B1 (ko) | 2012-01-02 |
US20090166784A1 (en) | 2009-07-02 |
WO2008032404A1 (en) | 2008-03-20 |
KR20090038490A (ko) | 2009-04-20 |
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