WO2018145644A1 - 摄像模组及其模塑感光组件和制造方法以及电子设备 - Google Patents

摄像模组及其模塑感光组件和制造方法以及电子设备 Download PDF

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Publication number
WO2018145644A1
WO2018145644A1 PCT/CN2018/075797 CN2018075797W WO2018145644A1 WO 2018145644 A1 WO2018145644 A1 WO 2018145644A1 CN 2018075797 W CN2018075797 W CN 2018075797W WO 2018145644 A1 WO2018145644 A1 WO 2018145644A1
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WO
WIPO (PCT)
Prior art keywords
lens
photosensitive
photosensitive member
molded
camera module
Prior art date
Application number
PCT/CN2018/075797
Other languages
English (en)
French (fr)
Inventor
王明珠
栾仲禹
陈烈烽
程端良
赵波杰
田中武彦
黄桢
Original Assignee
宁波舜宇光电信息有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 宁波舜宇光电信息有限公司 filed Critical 宁波舜宇光电信息有限公司
Priority to KR1020197025012A priority Critical patent/KR102405359B1/ko
Priority to JP2019542701A priority patent/JP7061130B2/ja
Priority to EP18751879.0A priority patent/EP3582484A4/en
Priority to CN201880005173.9A priority patent/CN110089101B/zh
Priority to US16/484,292 priority patent/US10979610B2/en
Publication of WO2018145644A1 publication Critical patent/WO2018145644A1/zh
Priority to US17/204,197 priority patent/US20210203818A1/en

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/02—Bodies
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/02—Bodies
    • G03B17/12—Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Definitions

  • the present invention relates to the field of optical imaging, and in particular to a camera module, a molded photosensitive member thereof, a manufacturing method, and an electronic device.
  • camera modules for acquiring images have become more and more commonly used in applications such as personal electronic products, automotive fields, medical fields, etc.
  • camera modules have become the standard for portable electronic devices such as smart phones and tablet computers.
  • the camera module used in portable electronic devices not only captures images, but also enables portable electronic devices to implement functions such as instant video calls.
  • more stringent requirements are imposed on the overall size of the camera module and the imaging capabilities of the camera module. That is to say, the development trend of portable electronic devices requires the camera module to further improve and enhance the imaging capability on the basis of reducing the size.
  • the improvement of the imaging capability of the camera module is based on the configuration of a photosensitive element with a larger imaging area and more passive electronic components such as driving resistors and capacitors for the camera module, precisely because the camera module needs Photosensitive components and more passive electronic components configured with a larger imaging area require the camera module to reduce the size of the camera module only by improving the packaging process.
  • the commonly used camera module packaging process is a COB (Chip On Board) packaging process, that is, a circuit board, a photosensitive element, a bracket, and the like of the camera module are respectively fabricated, and then passive electronic components, photosensitive elements, and brackets are sequentially disposed.
  • COB Chip On Board
  • An object of the present invention is to provide a camera module, a molded photosensitive member thereof, a manufacturing method thereof, and an electronic device, which can reduce stain sensitivity and shorten a lens plane above the lens light passage hole to The distance from the photosensitive plane of the photosensitive element.
  • Another object of the present invention is to provide a camera module, a molded photosensitive member thereof, a manufacturing method thereof, and an electronic device, the camera module and the molded photosensitive member including at least one molded base and at least one lens, At least one molded body of the molded base is molded and coated on at least one lens periphery of the lens in a molding process, thereby being capable of reducing stain sensitivity and shortening a lens plane above the lens light passage to the photosensitive member The distance from the photosensitive plane.
  • Another object of the present invention is to provide a camera module, a molded photosensitive member thereof, a manufacturing method thereof, and an electronic device, wherein the lens module and the lens of the molded photosensitive member are subjected to a heat hardening process and can be molded.
  • the mold temperature of the high temperature is tolerated during the process.
  • Another object of the present invention is to provide a camera module, a molded photosensitive member thereof, a manufacturing method thereof, and an electronic device, the camera module and the lens and at least one photosensitive member or at least one circuit board of the molded photosensitive member At least one enclosed space is formed such that the molding material forming the molded base in the molding process does not contaminate the photosensitive member in a fluid state, reducing stain sensitivity.
  • Another object of the present invention is to provide a camera module, a molded photosensitive member thereof, a manufacturing method thereof, and an electronic device, the camera module and the molded photosensitive member further comprising at least one supporting member, the supporting member being capable of effectively
  • the product yield of the camera module is improved, and the imaging quality of the camera module is improved.
  • Another object of the present invention is to provide a camera module, a molded photosensitive member thereof, a manufacturing method thereof, and an electronic device, the camera module and the lens, the supporting member and the photosensitive member of the molded photosensitive member Or the wiring board forms at least one confined space such that the molding material forming the molding base in the molding process does not contaminate the photosensitive member, reducing stain sensitivity.
  • Another object of the present invention is to provide a camera module, a molded photosensitive member thereof, a manufacturing method thereof, and an electronic device, the molding body covering at least a portion of the periphery of the lens of the lens, the circuit board At least a portion and the outer side surface of the support body to prevent the photosensitive region of the photosensitive member from being damaged or contaminated.
  • Another object of the present invention is to provide a camera module, a molded photosensitive member thereof, a manufacturing method thereof, and an electronic device, the molded body further covering part or all of a top surface of the periphery of the lens to enhance the The stability of the lens.
  • the present invention provides a molded photosensitive member for use in a camera module comprising:
  • An annular support member wherein the molded base is formed into a unitary structure with the lens, the support member, and the wiring board by a molding process.
  • the present invention also provides a camera module having a molded photosensitive member comprising the above-described molded photosensitive member and a lens, wherein light is condensed by the lens and the lens to be concentrated to the photosensitive member.
  • an electronic device comprising one or more of said camera module images with molded photosensitive components.
  • the electronic device is selected from the group consisting of a cell phone, a computer, a television, an intelligent loadable device, a vehicle, a camera, and a monitoring device.
  • FIG. 1 is a schematic view of a photosensitive member of a molded photosensitive member of a camera module connected to a circuit board through a set of leads according to a preferred embodiment of the present invention.
  • FIG. 2 is a schematic view of the molded photosensitive member of the image pickup module according to the above preferred embodiment of the present invention.
  • Figure 3 is a schematic illustration of the molded photosensitive member of the camera module in accordance with the above-described preferred embodiment of the present invention.
  • FIG. 4 is a schematic view showing the molding photosensitive member of the image pickup module according to the above preferred embodiment of the present invention when a molding process is performed by a molding die.
  • Fig. 5 is a schematic view showing the molding photosensitive member of the image pickup module according to the above preferred embodiment of the present invention when the molding process is performed by the molding die.
  • Figure 6 is a schematic illustration of the molded photosensitive member of the camera module in accordance with the above-described preferred embodiment of the present invention.
  • FIG. 7 is a schematic illustration of the camera module in accordance with the above-described preferred embodiment of the present invention.
  • FIG. 8A is a schematic diagram of another modified embodiment of the camera module based on the above preferred embodiment of the present invention.
  • FIG. 8B is a schematic diagram of another modified embodiment of the camera module based on the above preferred embodiment of the present invention.
  • FIG. 9 is a schematic diagram of another modified embodiment of the camera module based on the above preferred embodiment of the present invention.
  • FIG. 10 is a schematic diagram of another modified embodiment of the camera module based on the above preferred embodiment of the present invention.
  • FIG. 11 is a block diagram showing an electronic device with the above camera module of the present invention.
  • FIG. 12 is a schematic diagram of the camera module based on the above embodiment of the present invention applied to a mobile device.
  • FIG. 13 is a schematic diagram of the camera module implemented as a dual camera module according to the above embodiment of the present invention.
  • FIG. 14 is a schematic diagram of an array camera module based on the above embodiment of the present invention.
  • Figure 15 is a schematic diagram of another modified embodiment of the camera module based on the above preferred embodiment of the present invention.
  • Figure 16 is a schematic diagram of another modified embodiment of the camera module based on the above preferred embodiment of the present invention.
  • Figure 17 is a schematic diagram of another modified embodiment of the camera module based on the above preferred embodiment of the present invention.
  • Figure 18 is a schematic diagram of another modified embodiment of the camera module based on the above preferred embodiment of the present invention.
  • Figure 19 is a schematic diagram of another modified embodiment of the camera module based on the above preferred embodiment of the present invention.
  • Figure 20 is a schematic diagram of another modified embodiment of the camera module based on the above preferred embodiment of the present invention.
  • Figure 21 is a schematic diagram of another modified embodiment of the camera module based on the above preferred embodiment of the present invention.
  • Figure 22 is a schematic view showing another modified embodiment of the camera module based on the above preferred embodiment of the present invention.
  • Figure 23 is a schematic view showing another modified embodiment of the camera module based on the above preferred embodiment of the present invention.
  • Figure 24 is a schematic diagram of another modified embodiment of the camera module based on the above preferred embodiment of the present invention.
  • Figure 25 is a schematic diagram of another modified embodiment of the camera module based on the above preferred embodiment of the present invention.
  • Figure 26 is a schematic diagram of another modified embodiment of the camera module based on the above preferred embodiment of the present invention.
  • Figure 27 is a schematic diagram of another modified embodiment of the camera module based on the above preferred embodiment of the present invention.
  • Figure 28 is a schematic diagram of another modified embodiment of the camera module based on the above preferred embodiment of the present invention.
  • Figure 29 is a schematic diagram of another modified embodiment of the camera module based on the above preferred embodiment of the present invention.
  • Figure 30 is a schematic diagram of another modified embodiment of the camera module based on the above preferred embodiment of the present invention.
  • Figure 31 is a schematic view showing another modified embodiment of the camera module based on the above preferred embodiment of the present invention.
  • FIG. 32 is a schematic diagram of another modified embodiment of the camera module based on the above preferred embodiment of the present invention.
  • Figure 33 is a schematic view showing another modified embodiment of the camera module based on the above preferred embodiment of the present invention.
  • Figure 34 is a schematic diagram of another modified embodiment of the camera module based on the above preferred embodiment of the present invention.
  • Figure 35 is a schematic view showing another modified embodiment of the camera module based on the above preferred embodiment of the present invention.
  • Figure 36 is a schematic diagram of another modified embodiment of the camera module based on the above preferred embodiment of the present invention.
  • FIG. 37 is a schematic diagram of another modified embodiment of the camera module based on the above preferred embodiment of the present invention.
  • FIG. 38 is a schematic diagram of another modified embodiment of the camera module based on the above preferred embodiment of the present invention.
  • Figure 39 is a schematic diagram of another modified embodiment of the camera module based on the above preferred embodiment of the present invention.
  • Figure 40 is a schematic diagram of another modified embodiment of the camera module based on the above preferred embodiment of the present invention.
  • Figure 41 is a schematic view showing another modified embodiment of the camera module based on the above preferred embodiment of the present invention.
  • Figure 42 is a schematic diagram of another modified embodiment of the camera module based on the above preferred embodiment of the present invention.
  • Figure 43 is a schematic diagram of another modified embodiment of the camera module based on the above preferred embodiment of the present invention.
  • Figure 44 is a schematic diagram of another modified embodiment of the camera module based on the above preferred embodiment of the present invention.
  • Figure 45 is a schematic diagram of another modified embodiment of the camera module based on the above preferred embodiment of the present invention.
  • Figure 46 is a schematic diagram of another modified embodiment of the camera module based on the above preferred embodiment of the present invention.
  • Figure 47 is a schematic diagram of another modified embodiment of the camera module based on the above preferred embodiment of the present invention.
  • Figure 48 is a schematic diagram of another modified embodiment of the camera module based on the above preferred embodiment of the present invention.
  • Figure 49 is a schematic diagram of another modified embodiment of the camera module based on the above preferred embodiment of the present invention.
  • Figure 50 is a schematic diagram of another modified embodiment of the camera module based on the above preferred embodiment of the present invention.
  • Figure 51 is a schematic illustration of a photosensitive element of a molded photosensitive module of an array camera module coupled to a circuit board through a set of leads, in accordance with a preferred embodiment of the present invention.
  • Figure 52 is a schematic illustration of the molded photosensitive member of the array camera module in accordance with the above-described preferred embodiment of the present invention.
  • Figure 53 is a schematic illustration of the array camera module in accordance with the above-described preferred embodiment of the present invention.
  • Figure 54 is a schematic view showing the molding photosensitive member of the array camera module according to the above preferred embodiment of the present invention when a molding process is performed by a molding die.
  • Figure 55 is a schematic view showing the molding photosensitive member of the array camera module according to the above preferred embodiment of the present invention when the molding process is performed by the molding die.
  • Figure 56 is a schematic view showing the molding photosensitive member of the array camera module according to the above preferred embodiment of the present invention when the molding process is performed by the molding die.
  • Figure 57 is a schematic illustration of the molded photosensitive member of the array camera module in accordance with the above-described preferred embodiment of the present invention.
  • Figure 58A is a schematic diagram of another modified embodiment of the array camera module based on the above preferred embodiment of the present invention.
  • Figure 58B is a schematic view showing another modified embodiment of the array camera module based on the above preferred embodiment of the present invention.
  • Figure 59 is a schematic diagram of another modified embodiment of the array camera module based on the above preferred embodiment of the present invention.
  • Figure 60 is a schematic diagram of another modified embodiment of the array camera module based on the above preferred embodiment of the present invention.
  • Figure 61 is a block diagram showing an electronic device with the array camera module of the above embodiments of the present invention.
  • Figure 62 is a schematic diagram of the array camera module according to the above embodiments of the present invention applied to a mobile device.
  • FIG. 63 is a schematic diagram of the array camera module according to the above embodiments of the present invention implemented as a dual camera module.
  • Figure 64 is a schematic view of the array camera module according to the above embodiments of the present invention after molding in a molding process.
  • Figure 65 is a diagram showing another modified embodiment of the array camera module based on the above preferred embodiment of the present invention.
  • Figure 66 is a schematic diagram of another modified embodiment of the array camera module based on the above preferred embodiment of the present invention.
  • Figure 67 is a schematic diagram of another modified embodiment of the array camera module based on the above preferred embodiment of the present invention.
  • Figure 68 is a schematic diagram of another modified embodiment of the array camera module based on the above preferred embodiment of the present invention.
  • Figure 69 is a schematic diagram of another modified embodiment of the array camera module based on the above preferred embodiment of the present invention.
  • Figure 70 is a schematic diagram of another modified embodiment of the array camera module based on the above preferred embodiment of the present invention.
  • Figure 71 is a schematic diagram of another modified embodiment of the array camera module based on the above preferred embodiment of the present invention.
  • Figure 72 is a schematic diagram of another modified embodiment of the array camera module based on the above preferred embodiment of the present invention.
  • Figure 73 is a diagram showing another modified embodiment of the array camera module based on the above preferred embodiment of the present invention.
  • Figure 74 is a diagram showing another modified embodiment of the array camera module based on the above preferred embodiment of the present invention.
  • Figure 75 is a schematic diagram of another modified embodiment of the array camera module based on the above preferred embodiment of the present invention.
  • Figure 76 is a diagram showing another modified embodiment of the array camera module based on the above preferred embodiment of the present invention.
  • 77 is a schematic diagram of another modified embodiment of the array camera module according to the above preferred embodiment of the present invention.
  • Figure 78 is a diagram showing another modified embodiment of the array camera module based on the above preferred embodiment of the present invention.
  • Figure 79 is a schematic diagram of another modified embodiment of the array camera module based on the above preferred embodiment of the present invention.
  • Figure 80 is a schematic diagram of another modified embodiment of the array camera module based on the above preferred embodiment of the present invention.
  • Figure 81 is a schematic diagram of another modified embodiment of the array camera module based on the above preferred embodiment of the present invention.
  • Figure 82 is a schematic view showing another modified embodiment of the array camera module based on the above preferred embodiment of the present invention.
  • Figure 83 is a schematic diagram of another modified embodiment of the array camera module based on the above preferred embodiment of the present invention.
  • Figure 84 is a diagram showing another modified embodiment of the array camera module based on the above preferred embodiment of the present invention.
  • Figure 85 is a diagram showing another modified embodiment of the array camera module based on the above preferred embodiment of the present invention.
  • 86 is a schematic diagram of another modified embodiment of the array camera module according to the above preferred embodiment of the present invention.
  • Figure 87 is a schematic diagram of another modified embodiment of the array camera module based on the above preferred embodiment of the present invention.
  • Figure 88 is a diagram showing another modified embodiment of the array camera module based on the above preferred embodiment of the present invention.
  • Figure 89 is a schematic diagram of another modified embodiment of the array camera module based on the above preferred embodiment of the present invention.
  • Figure 90 is a schematic diagram of another modified embodiment of the array camera module based on the above preferred embodiment of the present invention.
  • Figure 91 is a schematic diagram of another modified embodiment of the array camera module based on the above preferred embodiment of the present invention.
  • Figure 92 is a schematic diagram of another modified embodiment of the array camera module based on the above preferred embodiment of the present invention.
  • Figure 93 is a schematic diagram of another modified embodiment of the array camera module based on the above preferred embodiment of the present invention.
  • Figure 94 is a diagram showing another modified embodiment of the array camera module based on the above preferred embodiment of the present invention.
  • Figure 95 is a diagram showing another modified embodiment of the array camera module based on the above preferred embodiment of the present invention.
  • Figure 96 is a diagram showing another modified embodiment of the array camera module based on the above preferred embodiment of the present invention.
  • Figure 97 is a diagram showing another modified embodiment of the array camera module based on the above preferred embodiment of the present invention.
  • Figure 98 is a schematic diagram of another modified embodiment of the array camera module based on the above preferred embodiment of the present invention.
  • Figure 99 is a perspective view showing another modified embodiment of the array camera module according to the above preferred embodiment of the present invention.
  • Figure 100 is a perspective view showing another modified embodiment of the array camera module according to the above preferred embodiment of the present invention.
  • FIG. 101 is a perspective view of the array camera module according to the above embodiment of the present invention.
  • Figure 102 is a perspective view of the array camera module according to the above embodiment of the present invention.
  • FIG. 103 is a perspective view of the array camera module according to the above embodiment of the present invention.
  • the term “a” is understood to mean “at least one” or “one or more”, that is, in one embodiment, the number of one element may be one, and in other embodiments, the element The number can be multiple, and the term “a” cannot be construed as limiting the quantity.
  • FIG. 1 to FIG. 7 show a camera module 100 according to a preferred embodiment of the present invention.
  • the camera module 100 includes a lens 10 and a molded photosensitive component 20.
  • the molded photosensitive member 20 further includes a photosensitive member 21, a wiring board 22, a molding base 23, a set of leads 24, a supporting member 25, a plurality of electronic components 26, and a lens 27.
  • the two ends of the lead wires 24 respectively extend to be connected to a non-photosensitive area 213 of the photosensitive element 21 and the circuit board 22, and the molding base 23 is integrally formed on the circuit board 22,
  • the molded base 23, the wiring board 22, and the lens 27 are formed in a unitary structure.
  • Each of the electronic components 26 may be mounted on the wiring board 22 by a process such as an SMT (Surface Mount Technology).
  • the lens 10 and the lens 27 are disposed on a photosensitive path of the photosensitive member 21 of the molded photosensitive member 20. Light reflected by the object enters the inside of the camera module 100 from the lens 10 and the lens 27 to be subsequently received and photoelectrically converted by the photosensitive element 21, thereby obtaining an image associated with the object.
  • the molding process in which the molded base 23 is molded in the thermo-hardened film 27 is defined as a MOL (molding on lens) molding process, and a conventional COB (chip on board). The molding process is different.
  • the arrangement of the lens 27 can reduce the optical TTL (the distance from the lens plane above the lens aperture to the photosensitive plane of the chip), thereby further reducing the size of the camera module 100 without affecting optical performance. It satisfies the demand for electronic equipment to mount a small-sized camera module 100.
  • the arrangement of the lens 27 can also reduce stain sensitivity. For example, in one embodiment, stain sensitivity of 50% can be reduced. That is, preferably, the lens 10 includes a plurality of lens elements, the lens element of the lens 10 and the lens 27 form an optical system, and light rays passing through the optical system are concentrated to the photosensitive element 21.
  • the conventional lens is implemented in the present invention in two parts, one part is the lens 10, the other part is the lens 27, the lens 27 is a lens having refractive power, the lens 10 and the lens Together, 27 acts to refract light, thereby concentrating light to the photosensitive element 21, which can effectively reduce the TTL of the entire optical system.
  • the lens 10 and the lens 27 form a lens assembly, one of the lenses of the lens assembly becomes an external lens, that is, the lens 27, and the lens 27 is The molded base 23 is integrally packaged, so that the size of the camera module can be reduced.
  • the lens 27 is embodied as a lens of thermosetting properties, i.e. the lens is embodied as a thermally hardened lens such that the lens 27 is capable of undergoing a molding process Withstand the ambient temperature in the molding process. For example, it is capable of withstanding a molding ambient temperature of 175 ° C in the molding process of an embodiment.
  • the high temperature resistant and thermally hardened lens 27 is attached to the support member 25 and placed together with the wiring board 22 and the photosensitive member 21
  • a solidified molding material of the fluid is molded integrally around the support member 25 and the outer surface of the lens 27 to integrally mold the molding base 23, so that the molding base 23 can be integrally molded into the
  • the wiring board 22, that is, the molded base 23, the wiring board 22, and the lens 27 are formed in a unitary structure.
  • the lens 27 of the present invention may be not only a heat-hardened lens but also a lens of other nature, and the present invention is not limited thereto.
  • the lens 27 includes a lens body 271 and a lens periphery 272 disposed around the lens body 271. Since the lens 27 is a precision optical element, the edge of the lens body 271 is thin.
  • the lens periphery 272 disposed at the edge of the lens body 271 and integrally connected is a thickened bracket design capable of carrying the lens body 271 so as not to affect the optical performance of the lens body 271 while enabling
  • the lens body 27 is integrally molded to the molding base 23 in a mold.
  • the lens periphery 272 of the lens 27 is disposed in the non-photosensitive region 213 of the photosensitive member 21 before the molding base 23 is formed, the lens of the lens 27 a main body 271 is disposed on a photosensitive path of the photosensitive member 21 of the molded photosensitive member 20; after the molding base 23 is molded, the molding base 23 covers the wiring board 22, The non-photosensitive region 213 of the photosensitive member 21, a portion of the support member 25, and the lens periphery 272 of the lens 27 to form the molded photosensitive member 20.
  • the supporting component 25 can effectively improve the product yield of the camera module 100 and improve the imaging quality of the camera module 100.
  • the support member 25 includes an annular support body 251 and has a through hole 252, wherein the support body 251 is disposed on the non-photosensitive region 213 of the photosensitive member 21 such that the photosensitive member 21 A photosensitive region 212 corresponds to the through hole 252 of the support member 25 and the lens body 271 of the lens 27, so that the support body 251 and the lens 27 can be protected during the molding process.
  • the photosensitive region 212 of the photosensitive element 21 is an annular support body 251 and has a through hole 252, wherein the support body 251 is disposed on the non-photosensitive region 213 of the photosensitive member 21 such that the photosensitive member 21 A photosensitive region 212 corresponds to the through hole 252 of the support member 25 and the lens body 271 of the lens 27, so that the support body 251 and the lens 27 can be protected during the molding process.
  • the photosensitive region 212 of the photosensitive element 21 is
  • the supporting member 25 has a top surface 2501, an inner side surface 2502 and an outer side surface 2503, wherein the two sides of the top surface 2501 are respectively connected to the inner side surface 2502 and the outer side surface 2503.
  • the side of the support member 25 facing the photosensitive member 21 is defined as the inner side 2502 of the support member 25
  • the side of the support member 25 facing the wiring board 22 is defined as The outer side 2503 of the support member 25.
  • An inner side 2502 of the support member 25 is used to form the through hole 252 of the support member 25.
  • the lens periphery 272 has a top surface 2721, a bottom surface 2722 and an outer peripheral surface 2723.
  • the two sides of the outer peripheral surface 2733 of the lens periphery 272 are respectively connected to the top surface 2721 and the bottom surface 2722 of the lens periphery 272. That is, the side of the lens perimeter 272 that faces the circuit board 22 is defined as the outer peripheral surface 2723 of the lens perimeter 272.
  • the lens body 271 has an outer lens surface 2711 and a lens inner surface 2712. That is, the side of the lens body 271 facing the photosensitive element 21 is defined as the inner surface 2712 of the lens body 271, and the side connected to the top surface 2721 of the lens periphery 272. It is defined as the outer surface 2711 of the lens body 271.
  • the lens 27 is attached to the support body 251, it is placed in a mold together with the wiring board 22 and the photosensitive member 21 to perform a molding process.
  • the heat-curable molding material of the fluid is thermally cured to form the molded base 23, and the molded base 23 covers the outer side 2503 of the support body 251 and the peripheral edge 271 of the lens after molding.
  • the outer peripheral surface 2723 is also covers all or a portion of the top surface 2721 of the lens perimeter 271 after molding.
  • the photosensitive member 21 includes the photosensitive region 212 and the non-sensitive region 213, wherein the photosensitive region 212 and the non-sensitive region 213 of the photosensitive member 21 are integrally molded, and the photosensitive member A region 212 is located in the middle of the photosensitive element 21, the non-photosensitive region 213 is located outside the photosensitive element 21, and the non-photosensitive region 213 surrounds the photosensitive region 212 one week. After the light reflected by the object enters the inside of the camera module 100 from the lens 10, it can be received and photoelectrically converted by the photosensitive region 212 of the photosensitive element 21 to obtain an image associated with the object.
  • the photosensitive element 21 has a set of chip connectors 211
  • the circuit board 22 has a set of circuit board connectors 221, wherein two ends of each of the leads 24 can be respectively connected to the photosensitive elements
  • Each of the chip connector 211 of the 21 and each of the circuit board connectors 221 of the wiring board 22 is connected in such a manner that the photosensitive element 21 and the wiring board 22 are connected.
  • each of the chip connector 211 of the photosensitive member 21 and each of the circuit board connectors 221 of the circuit board 22 may be a land, that is, the photosensitive member
  • Each of the chip connector 211 of the 21 and each of the circuit board connectors 221 of the circuit board 22 may be respectively in a disk shape for connecting both ends of each of the leads 24 to the Each of the chip connector 211 of the photosensitive member 21 and each of the circuit board connectors 221 of the wiring board 22.
  • each of the chip connector 211 of the photosensitive element 21 and each of the circuit board connectors 221 of the circuit board 22 may be spherical, such as solder paste or the like.
  • a solder material is spotted on the photosensitive member 21 and the wiring board 22 to form the chip connector 211 of the photosensitive member 21 and the wiring board connector 221 of the wiring board 22, respectively. Nevertheless, the shape of the chip connector 211 of the photosensitive member 21 and the circuit board connector 221 of the wiring board 22 does not limit the content and scope of the present invention.
  • each of the chip connectors 211 of the photosensitive member 21 is disposed in the non-photosensitive region 213 of the photosensitive member 21.
  • the non-photosensitive region 213 of the photosensitive element 21 has a chip inner portion 2131, a chip connecting portion 2132, and a chip outer portion 2133, wherein the chip inner portion 2131 surrounds the photosensitive region 212, the Both sides of the chip connecting portion 2132 extend and are connected to the chip inner side portion 2131 and the chip outer side portion 2132, respectively.
  • an area of the non-photosensitive region 213 from a position where the chip connector 211 is disposed to a position of an edge of the photosensitive region 212 is defined as the chip inner portion 2131, and the non-photosensitive region is to be
  • An area of the 213 where the chip connector 211 is disposed is defined as the chip connection portion 2132, and the position of the non-photosensitive area 213 from the position where the chip connector 211 is disposed to the outer edge of the photosensitive member 21
  • the area of the position is defined as the chip outer portion 2132.
  • the photosensitive element 21 is, in order from the outside to the inside, the chip outer portion 2133, the chip connecting portion 2132, the chip inner portion 2131, and the photosensitive region. 212.
  • the circuit board 22 includes a flat chip mounting area 222 and an edge area 223, wherein the edge area 223 is integrally formed with the chip mounting area 222, and the edge area 223 is located on the chip The periphery of the mounting area 222.
  • the die attach area 222 is used to mount the photosensitive element 21, and the circuit board connector 221 is disposed in the edge region 223.
  • the edge region 223 of the circuit board 22 has a circuit board inner portion 2231, a circuit board connecting portion 2232, and a circuit board outer portion 2233.
  • the circuit board inner portion 2231 surrounds the chip mounting area 222.
  • the two sides of the circuit board connecting portion 2232 respectively extend and are connected to the circuit board inner side portion 2231 and the circuit board outer side portion 2233.
  • an area of the edge region 223 from a position where the board connector 221 is disposed to a position of an edge of the chip mounting region 222 is defined as the board inner portion 2231, which will be described
  • the area of the edge region 223 where the circuit board connector 221 is disposed is defined as the circuit board connection portion 2232, and the position of the edge region 223 from the position where the circuit board connector 221 is disposed to the edge region 223
  • the area of the outer edge is defined as the outer side portion 2233 of the board.
  • the circuit board 22 is, in order from the inside of the circuit board 22, the circuit board outer portion 2233, the circuit board connecting portion 2232, the circuit board inner portion 2231, and the chassis.
  • the chip mounting area 222 is described.
  • the lead 24 is not limited in the camera module 100 of the present invention.
  • the lead 24 can be implemented as a gold wire, that is, by means of a gold wire.
  • the photosensitive element 21 and the wiring board 22 are connected together, so that the electrical signal can be further transmitted to the circuit board 22 through the lead 24 after the optical signal 21 is converted into an electrical signal.
  • the lead wires 24 can also be implemented as silver wires, copper wires, or the like, which can realize the electrical signals in the photosensitive element 21 Made of material that is transferred between the circuit board 22.
  • each of the electronic components 26 is mounted on the edge region 223 of the circuit board 22.
  • each of the electronic components 26 is attached to the wiring board outer portion 2233 of the edge region 223.
  • the photosensitive element 21 and each of the electronic components 26 may be mounted on the same side or opposite sides of the circuit board 22, such as in a specific embodiment, the photosensitive element 21 and each of the electronic elements
  • the device 26 is mounted on the same side of the circuit board 22, and the photosensitive element 21 is mounted on the chip mounting area 222 of the circuit board 22, and each of the electronic components 26 is mounted.
  • the molding base 23 covers each of the electronic components 26 to isolate adjacent ones by the molding base 23.
  • the electronic component 26 and the electronic component 26 and the photosensitive element 21 are isolated, so that in the camera module 100 of the present invention, even when the distance between the adjacent electronic components 26 is relatively close
  • the molded base 23 can also prevent adjacent electronic components 26 from contacting or interfering with each other, and the manner in which the molded base 23 covers the electronic component 26 can also be avoided from being generated in the electronic Contaminants on the surface of the component 26 contaminate the photosensitive region 212 of the photosensitive element 21, thereby reducing the volume of the camera module 100 and improving the imaging quality of the camera module 100. That is, the camera module 100 of the present invention covers the electronic component 26 by the molding base 23, so that the circuit board 22 of a small area can be mounted more.
  • Electronic component 26 It is worth mentioning that the types of electronic components 26 include, but are not limited to, resistors, capacitors, drivers, and the like.
  • the camera module 100 further includes at least one filter element 40.
  • the filter element 40 is disposed at the bottom of the lens 10. That is, the filter element 40 is assembled to the lens 10. The optical lenses inside the lens 10 are sequentially arranged, and the filter element 40 is located in the optical path of the lens 10. After the molded photosensitive member 20 is molded and integrally packaged, the filter element 40 and the lens 10 are attached to the molded photosensitive member 20 to be assembled to form the camera module 100. The filter element 40 is located in the photosensitive path of the photosensitive element 21.
  • the light reflected by the object is filtered from the optical lenses of the lens 10 and filtered by the filter element 40 into the interior of the camera module 100, and can be received and photoelectrically converted by the photosensitive element 21. That is, the filter element 40 can filter stray light, such as an infrared portion, from the light reflected by the object in each of the optical lenses of the lens 10, and in this manner, the camera module 100 can be changed. Imaging quality.
  • the filter elements 40 can be implemented in different types, for example, the filter elements 40 can be implemented as infrared cut filters.
  • a light sheet, a full transmissive spectral filter, and other filters or a combination of a plurality of filters, for example, the filter element 40 can be implemented as a combination of an infrared cut filter and a full transmissive filter. That is, the infrared cut filter and the full transmissive spectral filter can be switched to be selectively located on the photosensitive path of the photosensitive element 21, for example, in an environment where light is sufficient during daytime.
  • the infrared cut filter can be switched to the photosensitive path of the photosensitive element 21 to filter infrared rays entering the light reflected by the object of the camera module 100 through the infrared cut filter.
  • the full transmissive spectrum filter can be switched to the photosensitive path of the photosensitive element 21 to allow access to the camera module 100. Infrared part of the light reflected from the object is transmitted.
  • the mounting position of the filter element 40 has various variant embodiments in different embodiments.
  • the filter element 40 described in FIG. 7 is disposed at the bottom of the lens 10.
  • the filter element 40 is disposed on top of the molded base 23. Both of these arrangements are performed by mounting the filter element 40 after the molded photosensitive member 20 is molded integrally.
  • the filter element 40 and the molded photosensitive component 20 are assembled together in a mold. That is, in other embodiments, the peripheral edge of the filter element 40 may be covered by the support member 25 and secured between the photosensitive element 21 and the lens 27.
  • the filter member 40 is mounted on the photosensitive member 21 and located between the lens 27 and the photosensitive member 21.
  • the latter two arrangements are in that the filter element 40 and the photosensitive element 21, the circuit board 22, the support element 25, and the lens 27 are placed together in a mold, after being molded by the MOL process.
  • the molding base 23 is formed so as to be assembled after the lens 10 is mounted or a driver 30 of the lens 10 is driven.
  • Various variations in position of the filter element 40 will be disclosed in detail in subsequent embodiments.
  • the lens 27 can be a convex lens and has the function of concentrating light. Since the filter element 40 does not cause refraction of light, the lens 27 implemented as a convex lens makes imaging smaller. The particles (stains) on the filter element 40 tend to cause the photosensitive element 21 to form a large stain point on the image, and the closer to the photosensitive element 21, the larger the imaged stain point. Therefore, in the MOL process of the present invention, the lens 27 is disposed at a lower portion of the lens 10, and the filter element 40 is disposed at a bottom portion of the lens 10. That is, the MOL process of the present invention can move the filter element away from the photosensitive element 21 without affecting the convergence of the light of the lens 27 implemented as a convex lens, thereby making the image of the stained spot smaller. .
  • the lens periphery 272 of the lens 27 has a square step shape.
  • the support body 251 also has various modified embodiments.
  • the support body 251 covers all of the lead wires 24, the circuit board outer side portion 2233 of the edge region 223, the circuit board connecting portion 2232, and the inner side of the circuit board.
  • the supporting body 251 covers a portion of the lead 24, The chip outer portion 2133, the chip connecting portion 2132, and the chip inner portion 2131 of the non-photosensitive region 213; and in another embodiment, the supporting body 251 covers a portion of the lead 24, The chip inner portion 2231 of the edge region 223, the chip outer portion 2133 of the non-photosensitive region 213, the chip connecting portion 2132, and the chip inner portion 2131; and, for example, in an embodiment, The support body 251 covers the portion of the lead 24, the circuit board outer portion 2233 of the edge region 223, the circuit board connecting portion 2232, and the circuit board inner portion 2231; for example, in an embodiment The support body 251 a portion covering the lead wire 24, the circuit board outer side portion 2233 of the edge region 223, the circuit board connecting portion 2232, the circuit board inner portion 2231, and the non-photosensitive region 213 The outer side portion 2133;
  • the camera module 100 can be implemented as a fixed focus camera module, wherein the camera module 100 passes through a module assembled to the molding base 23 The plastic body 232 causes the lens 10 to be held in the photosensitive path of the photosensitive member 21. It is to be noted that, in an embodiment, the camera module 100 can be implemented as a zoom camera module, wherein the camera module 100 changes the distance between the lens 10 and the photosensitive element 21 Adjust the focal length of the camera module.
  • the camera module 100 is implemented as a zoom camera module as shown in FIG.
  • the camera module 100 further includes the driver 30, wherein the lenses 10 are respectively disposed correspondingly to the driver 30, the drivers 30 are respectively assembled to the molding base 23, and the driver 30 is electrically connected to the circuit board 22, respectively, to enable the driver 30 to drive the lens 10 along the photosensitive element 21 after the circuit board 22 transmits power and control signals to the driver 30
  • the photosensitive path moves back and forth to adjust the focal length of the camera module 100. That is, the lens 10 is drivably disposed to the driver 30.
  • the type of the driver 30 is not limited in the camera module 100 of the present invention.
  • the driver 30 can be implemented as any capable device such as a voice coil motor.
  • the molding body 232 is deformed to be a lens holder for assembling the lens 10, and the lens 10 is molded in the lens 10 After the photosensitive member 20 is integrally molded, it is directly mounted on the molding main body 232 which is implemented as a lens holder, thereby simplifying the assembly process of the camera module 100. Variations of this aspect of the invention will be disclosed in detail in the following embodiments.
  • the molded photosensitive member 20 is integrally molded by the MOL molding process and assembled to form the camera module 100 in detail from the respective embodiments.
  • the bottom surface 2722 of the lens 27 is attached to the top surface 2501 of the 25, and the support body 251 Covering all of the lead wires 24, the circuit board outer side portion 2233 of the edge region 223, the circuit board connecting portion 2232, the circuit board inner portion 2231, and the non-photosensitive region 213 outside the chip
  • the portion 2133, the chip connecting portion 2132, and the chip connecting portion 2132, the filter element 40 is disposed at a bottom portion of the lens 10.
  • the lens 10 is mounted after integrally molding the molded photosensitive member 20.
  • the manufacturing steps of the camera module 100 and the manufacturing steps of the molded photosensitive member 20 will be described.
  • the photosensitive member 21 is attached to the chip mounting region 222 of the wiring board 22, and the chip connector 211 of the non-photosensitive region 213 of the photosensitive member 21 is The edge region 223 of the circuit board 22 is connected by a set of the leads 24.
  • the electronic component 26 is attached to the outer side of the circuit board outside the circuit board outer portion 2233 of the edge region 223 of the wiring board 22.
  • each of the lead wires 24 protrudes arcually from the upper surface of the photosensitive member 21
  • the curved curvature of the lead 24 is maintained in a rounded state, which is advantageous for ensuring the ability of the lead 24 to transmit the electrical signal between the photosensitive element 21 and the wiring board 22.
  • each of the leads 24 is arranged between the photosensitive element 21 and the wiring board 22, for example, each of the leads 24 may be equally spaced. It can be understood by those skilled in the art that in other embodiments, a plurality of the photosensitive elements 21 may also be mounted on different positions of one of the circuit boards 22 to subsequently fabricate a dual lens camera module or array.
  • the camera module for example, in the embodiment shown in FIG. 14, a plurality of the circuit boards 22 are spliced together to form a circuit board panel 2200, and then each of the photosensitive elements 21 is respectively attached to the line.
  • the board 22 of the corresponding position of the board is spliced to separate the board board 2200 in the subsequent stage, but the invention is not limited in this respect.
  • the support body 251 can prevent the connection position of the lead 24 and the chip connector 211 from coming into contact with the thermosetting material for forming the molded base 23.
  • the heat-curing material of the fluid is prevented from causing deformation of the end of the lead 24 for connecting the chip connector 211 or the lead 24 is detached from the chip connector 211.
  • the support body 251 and the lens periphery 272 of the lens 27 are coupled together to isolate the connection position of the lead 24 and the chip connector 211 from the thermosetting material.
  • the support body 251 and the lens periphery 272 of the lens 27 are coupled together, the inner side surface 2502 of the support member 25 and the lens inner surface 2712 of the lens body 271 form a hermetic seal.
  • the space 2700 is such that when the MOL molding process is performed, the heat-curing material of the fluid is prevented from entering the sealed space 2700, thereby avoiding affecting the light-passing path and also reducing the stain sensitivity.
  • the support body 251 may be formed by disposing glue on the non-photosensitive region 213 of the photosensitive member 21 and after the glue is initially cured, and after preliminary curing, the lens 27 is further cured and finally cured. The support body 251 is formed.
  • the inner side surface 2502 of the support body 251 forms the through hole 252, and the photosensitive region 212 of the photosensitive element 21 corresponds to the through hole 252 and the heat.
  • the lens body 271 of the lens 27 is hardened.
  • the support body 251 formed of glue may also have a viscosity for subsequently adhering contaminants such as dust, thereby preventing the contaminants from contaminating the photosensitive region 212 of the photosensitive member 21 to cause the A staining point occurs in the photosensitive region 212 of the photosensitive member 21 to further ensure the image quality of the image pickup module.
  • the 272 of the lens 27 is attached to the support body 251 of the support member 25 after the support member 25 is fully cured, and the present invention is not limited thereto.
  • the molding material of the thermosetting material which is implemented in a fluid state is formed into a mold which is at least integrally molded on the wiring board 22 after curing by a molding die 900.
  • the size of the camera module 100 and the assembly error of the camera module can be reduced, thereby making the structure of the camera module 100 more compact and improving the camera module. 100 image quality.
  • the lens 27 is disposed on the photosensitive element 21 through the supporting member 25, the optical TTL is reduced, and the structure of the camera module 100 is further compacted, and the electronic device is satisfied with the camera module. The size of the 100 is required.
  • the molding die 900 includes an upper die 901 and a lower die 902, wherein at least one of the upper die 901 and the lower die 902 can be moved to cause the upper die 901 and the
  • the lower mold 902 can be subjected to a mold clamping operation, and at least one molding space 903 is formed between the upper mold 901 and the lower mold 902, wherein the molding base 23 is added to the molding by the molding material. Space 903 is formed and formed after curing.
  • the photosensitive element 21 and the wiring board 22 are connected by a set of the lead wires 24 formed on the non-photosensitive region 213 of the photosensitive element 21 to cover all of the leads 24,
  • the circuit board outer portion 2233 of the edge region 223, the circuit board connecting portion 2232, the circuit board inner portion 2231, the chip outer portion 2133 of the non-photosensitive region 213, and the chip connecting portion 2132 And the chip connecting portion 2132, the lens 27 is disposed on the supporting body 251, so that the semi-finished product of the molded photosensitive member 20, the semi-finished product of the molded photosensitive member 20 is placed on the molding die 900
  • the lower mold 902, the upper mold 901 and/or the lower mold 901 of the molding die 900 are operated to mold the upper mold 901 and the lower mold 902, so that the upper mold 901 is
  • the molding space 903 is formed with the lower mold 902, wherein the pressing surface 9011 of the upper mold 901 is in contact with the lens inner surface 2712 of the lens body 271 of the lens 27, and the support
  • the exterior of the circuit board 22, the non-photosensitive area 213 of the photosensitive element 21, a portion of the support member 25, and the outer peripheral surface 2723 of the 272 of the lens 27 Located in the molding space 903 of the molding die 900, so that when the molding base 23 is molded in the molding space 903, the molding base 23 covers the outside of the wiring board 22, A non-photosensitive region 213 of the photosensitive element 21, a portion of the support member 25, and the outer peripheral surface 2723 of the lens body 272.
  • the molded photosensitive member 20 formed as shown in FIG.
  • the molded base 23 formed also covers a portion of the top surface 2721 of the 272.
  • the molding space 903 of the molding die 900 may be an annular space to form a ring shape after the molding material is added to the molding space 903 and cured.
  • the molded base 23 is.
  • the molding material in fluid form according to the present invention may be a liquid material or a solid particulate material or a mixed material of liquid and solid particles, it being understood that whether the molding material is implemented as a liquid material or It is implemented as a solid particulate material or as a liquid and solid particulate mixed material which, after being added to the molding space 903 of the molding die 900, can be cured to form the molded base 23.
  • the fluid-like molding material is embodied as a thermosetting material such as a liquid, wherein the molding material is cured after being added to the molding space 903 of the molding die 900 to form The molded base 23 is molded. It is worth mentioning that, when the fluid-like molding material is added to the molding space 903 of the molding die 900, the curing manner of the fluid-shaped molding material does not limit the content and scope of the present invention.
  • the medium forming the support 25 and the medium forming the molded base 23 are of different materials.
  • the support body 25 can be formed by an elastic medium, so that the formed support body 25 has a certain elasticity, and the support body 25 can also be formed by a rigid medium, and the invention is not limited thereto.
  • the support body 251 is disposed along the non-photosensitive area 213 of the photosensitive element 21, and the lens periphery 272 of the lens 27 closely fits the support body 251.
  • the sealed space 2700 is formed such that the support body 251 and the lens body 271 of the lens 27 can block the molding material after the molding material is added to the molding space 903 of the molding die 900.
  • the holder 23 further forms a molding hole 231 to correspond to the photosensitive region 212 of the photosensitive member 21, so that, in the subsequent, the molding hole 231 of the molding base 23 allows light to pass through
  • the photosensitive region 212 of the photosensitive member 21 receives and performs photoelectric conversion. That is, since the molding material does not enter the closed space 2700, after the drafting, the outer surface 2711 of the lens body 271 of the lens 27 and the pressing surface 9011 are formed.
  • the hole 231 is molded.
  • the molding base 23 includes the molding main body 232 and has the molding hole 231, which provides a light path for the optical lens 10 and the photosensitive element 21. Therefore, after the light reflected by the object enters the inside of the camera module from the optical lens 10, the light passes through the molding hole 231 of the molding base 23 to be the photosensitive region 212 of the photosensitive member 21. Receive and perform photoelectric conversion.
  • the photosensitive member 21 is first attached to the wiring board 22, and then the supporting member 25 is formed, and further, the lens 27 is disposed on the supporting member 25, The wiring board 22, the photosensitive member 21, and the lens 27 are molded to form the molded base 23, thereby molding the molded photosensitive member 20.
  • the sealed space 2700 is formed between the lens 27 and the photosensitive member 21, damage of the molded mold to the photosensitive member 21 can be prevented, and since the lens 27 and the The distance of the photosensitive element 21 is reduced, so that the back focal length of the camera module 100 assembled by the camera module 100 can be reduced, thereby reducing the height of the camera module 100.
  • the lens is not required 27 provides additional support members, thus also to some extent further reducing the thickness of the camera module 100.
  • the driver 30 and the lens 10 are assembled on the molded base 23 to assemble the camera module 100.
  • the filter element 40 is disposed at the bottom of the lens 10. It will be understood by those skilled in the art that, in other modified embodiments based on the preferred embodiment, after molding the molded photosensitive member 20, the lens 10 or support is directly assembled on the molded base 23.
  • the lens holder of the lens 10, that is, the driver 30 may not be provided. The above is by way of example only, and the invention is not limited thereto.
  • FIG. 8B illustrates a modified embodiment of the preferred embodiment of the present invention, illustrating that the molded photosensitive member 20 and the filter element 40 are assembled to form a camera module 108, in this modified embodiment.
  • the camera module 108 is similar in structure to the camera module 100 in the preferred embodiment, except that the filter elements 40 of the camera module 108 in FIG. 8B are disposed at different positions.
  • the filter element 40 is not disposed at the bottom of the lens 10 of the camera module 108, but the filter element 40 is assembled on the top of the molded base 23.
  • the top surface of the molded base 23 forms an inner side surface 233 and an outer side surface 234, and in the embodiment shown in Fig. 8B, the inner side surface 233 of the molded base 23 is located.
  • the plane may be lower than the plane in which the outer side surface 234 is located, so that the top surface of the molded base 23 forms a stepped surface, that is, the plane of the inner side surface 233 of the molded base 23 is low.
  • the driver 30 is assembled to the outer side surface 234 of the molded base 23 to enable the optics assembled to the driver 30
  • the lens 10 is further held in the photosensitive path of the photosensitive member 21, thereby producing the camera module 108.
  • the inner side surface 233 and the outer side surface 234 of the molded base 23 are in the same plane to allow the molded base
  • the top surface of the 23 forms a flat plane, wherein the filter element 40 is assembled to the inner side surface 233 of the molding base 23, and the driver 30 or the lens 10 is assembled to the molding
  • the outer side surface 234 of the base 23, or the lens 10, is assembled directly to the outer side surface 234 of the molded base 23.
  • the above structure of the molded base 23 of the present invention is merely an example, and the present invention is not limited thereto.
  • the photosensitive member 21 is first attached to the wiring board 22, and then the supporting member 25 is formed, and further, the lens 27 is disposed on the supporting member 25, Further, the wiring board 22, the photosensitive member 21, and the lens 27 are molded in a mold to form the molded base 23, thereby forming the molded photosensitive member 20. Further, the driver 30 and the lens 10 are assembled after the filter element 40 is assembled to the top surface of the molding base 23, thereby assembling and forming the camera module 108.
  • a camera module 109 according to another modified embodiment of the preferred embodiment of the present invention, the camera module 109 in the modified embodiment, and the camera module 100 in the preferred embodiment
  • the structure is similar, except that the arrangement position and assembly order of the filter elements 40 of the camera module 109 in FIG. 9 are different.
  • the molded photosensitive member 20 is molded first, and then the filter member 40 disposed at the bottom of the lens and the lens 10 are assembled together in the molding.
  • the camera module 109 of the modified embodiment shown in FIG. 9 puts the filter element 40 together with the lens 27, the support member 25, the photosensitive element 21, and the circuit board 22 together.
  • the molded base 23 is formed in a mold, and then the driver 30 and the lens 10 are mounted on the molded base 23.
  • the filter element 40 is laminated on the photosensitive element 21.
  • a surface mount process can be used here.
  • the edge of the filter element 40 is fixedly connected by the support element 25 and conforms to the photosensitive element 21, thereby The filter element 40 is fixed between the support element 25 and the photosensitive element 21.
  • the outer side surface 2503 of the support body 251, the outer peripheral surface 2723 of the lens peripheral edge 272 are molded to the molding base 23, the support member 25, the photosensitive member 21, and the lens 27.
  • the circuit board 22 and the electronic component 26 are molded by the molding body 232 of the molding base 23.
  • the filter element 40 covers the photosensitive element 21, and the photosensitive element 21 is isolated from the sealed space 2700 and the external environment, thereby avoiding the sensitization.
  • the element 21 is damaged and dust entering the confined space 2700 is prevented from contacting the photosensitive element 21, reducing stain sensitivity.
  • the photosensitive member 21 is attached to the wiring board 22, and the filter member 40 is attached to the photosensitive member 21, and then the support is formed.
  • An element 25, and the support member 25 is connected to both ends of the filter element 40.
  • the lens 27 is disposed on the support member 25, the circuit board 22, the photosensitive element 21, and the The lens 27 is molded to form the molded base 23.
  • the back focus of the camera module 109 assembled by the camera module can be reduced, thereby reducing the height of the camera module 109.
  • the thickness of the camera module 109 is further reduced to some extent, since it is not necessary to provide additional support members for the filter element 40.
  • FIG. 10 shows a camera module 110 based on another modified embodiment of the preferred embodiment shown in FIG. Different from the camera module 100 in the embodiment described in FIG. 7, in FIG. 10, the structure of the molded body 232 of the molded base 23 is different.
  • the molding base 23 of the camera module 110 includes the molding body 232 and a lens mounting section 236, the molding body 232 and the lens mounting section 236.
  • the connections are integrally molded in sequence.
  • the lens mounting section 236 is for mounting the lens 10 (the lens 10 is not shown in FIG. 10), that is, when the molded photosensitive component 20 is used to assemble the camera module 110.
  • the lens 10 is mounted inside the lens mounting section 236 to provide a stable mounting position for the lens 10.
  • the lens mounting section 236 extends integrally upwardly to provide a support fixed position for the lens 10 so that no additional components need to be provided to mount the lens 10.
  • the molding base 23 integrally extends upwardly and is internally stepped to mold the lens 27, the support member 25, the wiring board 22, and the electronic component electronic component, respectively.
  • the inner side surface of the lens mounting section 236 is flat, so as to be suitable for mounting the unthreaded lens 10 to form a fixed focus module.
  • the lens 10 can be fixed to the lens mounting section 236 by adhesive bonding.
  • the lens 10 is mounted on the lens mounting section 236 such that the molded base 23 functions as a bracket or a lens barrel in a conventional camera module, and the lens 10 is provided. Support, fixed position, but assembly is different from the traditional COB process.
  • the bracket of the camera module of the conventional COB process is fixed to the circuit board in a pasting manner, and the molding base 23 is fixed to the circuit board 22, the supporting member 25, and the lens 27 by an MOL molding process.
  • the molding method has better connection stability with respect to the pasting fixing and the controllability of the process, so that the thickness of the camera module is reduced, and further, the molded base 23 replaces the conventional one.
  • the bracket is provided with the mounting position of the lens 10, which avoids the tilt error caused by the bracket during the assembly and assembly, and reduces the cumulative tolerance of the assembly of the camera module.
  • the filter element 40 may be disposed in the camera module 100 as described in FIG. 7 .
  • the bottom portion of the lens 10 may also be the camera module 108 as described in FIG. 8B, and the filter element 40 is directly mounted on the inner side surface of the molding body 232 of the molding base 23.
  • 233 which may be attached to the surface of the photosensitive member 21 by the support member 25 before molding the molded base 23 as shown in FIG.
  • the invention is not limited by this.
  • FIG. 15 shows a camera module 115 according to another modified embodiment of the preferred embodiment of the present invention, which is different from the camera module 100 in the preferred embodiment described in FIG.
  • the support body 251 of the molded photosensitive member 20 of the camera module 115 covers a portion of the lead 24, the chip outer portion 2133 of the non-photosensitive region 213, the chip connecting portion 2132, and The chip inner portion 2131.
  • the molding body 232 integrally molds the electronic component 26, the edge region 223 of the circuit board 22, the outer side 2503 of the support member 25, and the lens perimeter 272 The outer peripheral surface 2723, thereby forming the molded photosensitive member 20. It will be appreciated that the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27.
  • FIG. 16 shows a camera module 116 based on another modified embodiment of the embodiment of FIG. 8B, which is different from the camera module 108 in the embodiment of FIG. 8B, and the camera module of the present invention.
  • the support body 251 of the molded photosensitive member 20 of the group 116 covers a portion of the lead 24, the chip outer portion 2133 of the non-photosensitive region 213, the chip connecting portion 2132, and the inside of the chip Department 2131.
  • the molding body 232 integrally molds the electronic component 26, the edge region 223 of the circuit board 22, the outer side 2503 of the support member 25, and the lens perimeter 272 The outer peripheral surface 2723, thereby forming the molded photosensitive member 20. It will be appreciated that the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27.
  • FIG. 17 is a camera module 117 based on another modified embodiment of the embodiment of FIG. 9 , which is different from the camera module 109 in the embodiment of FIG. 9 .
  • the support body 251 of the molded photosensitive member 20 of the group 117 covers a portion of the lead 24, the chip outer portion 2133 of the non-photosensitive region 213, the chip connecting portion 2132, and the chip inner side. Department 2131.
  • the molding body 232 integrally molds the electronic component 26, the edge region 223 of the circuit board 22, the outer side 2503 of the support member 25, and the lens perimeter 272 The outer peripheral surface 2723, thereby forming the molded photosensitive member 20. It will be appreciated that the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27.
  • FIG. 18 is a camera module 118 based on another modified embodiment of the embodiment of FIG. 10, which is different from the camera module 110 in the embodiment of FIG. 10, and the camera module of the present invention.
  • the support body 251 of the molded photosensitive member 20 of 116 covers a portion of the lead 24, the chip outer portion 2133 of the non-photosensitive region 213, the chip connecting portion 2132, and the chip inner portion 2131.
  • the molding body 232 integrally molds the electronic component 26, the edge region 223 of the circuit board 22, the outer side 2503 of the support member 25, and the lens perimeter 272 The outer peripheral surface 2723, thereby forming the molded photosensitive member 20. It will be appreciated that the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27.
  • FIG. 19 shows a camera module 119 according to another modified embodiment of the preferred embodiment of the present invention, which is different from the camera module 100 of the preferred embodiment described in FIG.
  • the body 251 covers a portion of the lead 24, the wiring board inner portion 2231 of the edge region 223, the chip outer portion 2133 of the non-photosensitive region 213, the chip connecting portion 2132, and the chip inner side a portion 2131, the molding body 232 integrally molds the electronic component 26, the edge region 223 of the 22, the outer side 2503 of the support member 25, and the periphery of the lens 272
  • the outer peripheral surface 2723 is described to thereby form the molded photosensitive member 20.
  • the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27.
  • FIG. 20 shows a camera module 120 according to another modified embodiment of the preferred embodiment of the present invention.
  • the support body 251 is covered. a portion of the lead 24, the inner side portion 2231 of the edge region 223, the chip outer portion 2133 of the non-photosensitive region 213, the chip connecting portion 2132, and the chip inner portion 2131.
  • the molding body 232 integrally molds the electronic component 26, the edge region 223 of the wiring board 22, the outer side surface 2503 of the support member 25, and the outer circumference of the lens periphery 272 Face 2723, thereby forming the molded photosensitive member 20. It will be appreciated that the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27.
  • FIG. 21 is a camera module 121 according to another modified embodiment of the preferred embodiment of the present invention. Unlike the camera module 109 in the embodiment of FIG. 9, the support body 251 is covered. a portion of the lead 24, the inner side portion 2231 of the edge region 223, the chip outer portion 2133 of the non-photosensitive region 213, the chip connecting portion 2132, and the chip inner portion 2131.
  • the molding body 232 integrally molds the electronic component 26, the edge region 223 of the wiring board 22, the outer side surface 2503 of the support member 25, and the outer circumference of the lens periphery 272 Face 2723, thereby forming the molded photosensitive member 20. It will be appreciated that the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27.
  • FIG. 22 shows a camera module 122 according to another modified embodiment of the preferred embodiment of the present invention.
  • the camera module 122 is different from the camera module 110 of the embodiment shown in FIG. a portion covering the lead 24, the inner side portion 2231 of the edge region 223, the chip outer portion 2133 of the non-photosensitive region 213, the chip connecting portion 2132, and the chip inner portion 2131
  • the molding body 232 integrally molds the electronic component 26, the edge region 223 of the circuit board 22, the outer side surface 2503 of the support member 25, and the periphery of the lens periphery 272
  • the outer peripheral surface 2723 is described to thereby form the molded photosensitive member 20. It will be appreciated that the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27.
  • FIG. 23 shows a camera module 123 according to another modified embodiment of the preferred embodiment of the present invention, which is different from the camera module 100 in the preferred embodiment described in FIG.
  • the main body 251 covers a portion of the lead wire 24, the circuit board outer side portion 2233 of the edge region 223, the circuit board connecting portion 2232, and the wiring board inner portion 2231.
  • the molding body 232 integrally molds the electronic component 26, the wiring board outer portion 2233 of the edge region 223 of the circuit board 22, and the supporting member 25
  • the outer side surface 2503 and the outer peripheral surface 2723 of the lens periphery 272 thereby form the molded photosensitive member 20.
  • the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27.
  • a camera module 124 is different from the camera module 108 of the embodiment shown in FIG. 8B in that the support body is 251 covers a portion of the lead 24, the wiring board outer portion 2233 of the edge region 223, the wiring board connecting portion 2232, and the wiring board inner portion 2231.
  • the molding body 232 integrally molds the electronic component 26, the wiring board outer portion 2233 of the edge region 223 of the circuit board 22, and the supporting member 25
  • the outer side surface 2503 and the outer peripheral surface 2723 of the lens periphery 272 thereby form the molded photosensitive member 20.
  • the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27.
  • FIG. 25 shows a camera module 125 according to another modified embodiment of the preferred embodiment of the present invention.
  • the support body is 251 covers a portion of the lead 24, the wiring board outer portion 2233 of the edge region 223, the wiring board connecting portion 2232, and the wiring board inner portion 2231.
  • the molding body 232 integrally molds the electronic component 26, the wiring board outer portion 2233 of the edge region 223 of the circuit board 22, and the supporting member 25
  • the outer side surface 2503 and the outer peripheral surface 2723 of the lens periphery 272 thereby form the molded photosensitive member 20.
  • the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27.
  • the structure of the camera module 125 and the camera module 109 in the embodiment shown in FIG. 9 is different in that the filter element 40 is not attached to the photosensitive element 21. That is, since the support body 251 does not cover the non-photosensitive region 213, the edge of the filter element 40 is wrapped around the upper end of the support body 251 near the top surface 2501 to avoid contact.
  • the lead 24, and thus the filter element 40 and the photosensitive element 21, are gapped. It can be understood by those skilled in the art that in other modified embodiments of the embodiment shown in FIG. 25, the edge of the filter element 40 may not be fixed by being covered by the support body 251, but The filter element 40 is directly attached to the photosensitive region 212 of the photosensitive member 21, but the present invention is not limited in this respect.
  • FIG. 26 shows a camera module 126 according to another modified embodiment of the preferred embodiment of the present invention, which is different from the camera module 110 in the embodiment shown in FIG. 10 by MOL molding.
  • the molding body 232 integrally molds the electronic component 26, the circuit board outer portion 2233 of the edge region 223 of the circuit board 22, and the outer portion of the support member 25
  • the side surface 2503 and the outer peripheral surface 2723 of the lens periphery 272 thereby form the molded photosensitive member 20.
  • the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27.
  • FIG. 27 shows a camera module 127 according to another modified embodiment of the preferred embodiment of the present invention, which is different from the camera module 100 in the preferred embodiment described in FIG.
  • the main body 251 covers the portion of the lead wire 24, the circuit board outer side portion 2233 of the edge region 223, the circuit board connecting portion 2232, the circuit board inner portion 2231, and the non-photosensitive region 213 Chip outer portion 2133.
  • the molding body 232 integrally molds the electronic component 26, the wiring board outer portion 2233 of the edge region 223 of the circuit board 22, and the supporting member 25
  • the outer side surface 2503 and the outer peripheral surface 2723 of the lens periphery 272 thereby form the molded photosensitive member 20.
  • the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27.
  • FIG. 28 shows a camera module 128 according to another modified embodiment of the preferred embodiment of the present invention. Unlike the camera module 108 of the embodiment shown in FIG. 8B, the molding is performed.
  • the main body 232 integrally molds the electronic component 26, the circuit board outer side portion 2233 of the edge region 223 of the circuit board 22, the outer side surface 2503 of the support member 25, and the lens periphery The outer peripheral surface 2723 of 272, thereby forming the molded photosensitive member 20.
  • the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27.
  • FIG. 29 shows a camera module 129 according to another modified embodiment of the preferred embodiment of the present invention.
  • the main body 232 integrally molds the electronic component 26, the circuit board outer side portion 2233 of the edge region 223 of the circuit board 22, the outer side surface 2503 of the support member 25, and the lens periphery The outer peripheral surface 2723 of 272, thereby forming the molded photosensitive member 20.
  • the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27.
  • the camera module 129 is different from the camera module 109 in the embodiment shown in FIG.
  • the filter element 40 is not attached to the photosensitive element 21. That is, since the support body 251 does not cover the chip connection portion 2132 and the chip inner portion 2131 of the non-photosensitive region 213, the edge of the filter element 40 is coated on the support body. The upper end of the 251 is close to the position of the top surface 2501 to avoid contact with the lead 24, so that there is a gap between the filter element 40 and the photosensitive element 21. It can be understood by those skilled in the art that in other modified embodiments of the embodiment shown in FIG. 30, the edge of the filter element 40 may not be fixed by being covered by the support body 251, but The filter element 40 is directly attached to the photosensitive region 212 of the photosensitive member 21, but the present invention is not limited in this respect.
  • FIG. 30 shows a camera module 130 according to another modified embodiment of the preferred embodiment of the present invention.
  • the main body 232 integrally molds the electronic component 26, the circuit board outer side portion 2233 of the edge region 223 of the circuit board 22, the outer side surface 2503 of the support member 25, and the lens periphery The outer peripheral surface 2723 of 272, thereby forming the molded photosensitive member 20.
  • the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27.
  • FIG. 31 shows a camera module 131 according to another modified embodiment of the preferred embodiment of the present invention, which is different from the camera module 100 in the preferred embodiment described in FIG.
  • the main body 251 covers the wiring board inner portion 2231 of the edge region 223 and the chip outer portion 2133 of the non-photosensitive region 213.
  • the molding body 232 integrally molds the electronic component 26, the circuit board outer portion 2233 of the edge region 223, the circuit board connecting portion 2223, and the support
  • the outer side surface 2503 of the element 25 and the outer peripheral surface 2723 of the lens periphery 272 thereby form the molded photosensitive member 20.
  • the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27.
  • a camera module 132 according to another modified embodiment of the preferred embodiment of the present invention is different from the camera module 108 of the embodiment shown in FIG. 8B in that the support body 251 is The wiring board inner portion 2231 of the edge region 223 and the chip outer portion 2133 of the non-light sensing region 213 are covered.
  • the molding body 232 integrally molds the electronic component 26, the circuit board outer portion 2233 of the edge region 223, the circuit board connecting portion 2223, and the support The outer side surface 2503 of the element 25 and the outer peripheral surface 2723 of the lens periphery 272 thereby form the molded photosensitive member 20.
  • the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27.
  • FIG. 33 is a camera module 133 according to another modified embodiment of the preferred embodiment of the present invention.
  • the camera module 133 is different from the camera module 109 in the embodiment shown in FIG.
  • the wiring board inner portion 2231 of the edge region 223 and the chip outer portion 2133 of the non-light sensing region 213 are covered.
  • the molding body 232 integrally molds the electronic component 26, the circuit board outer portion 2233 of the edge region 223, the circuit board connecting portion 2223, and the support The outer side surface 2503 of the element 25 and the outer peripheral surface 2723 of the lens periphery 272 thereby form the molded photosensitive member 20.
  • the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27.
  • the camera module 133 is different from the camera module 109 in the embodiment shown in FIG. 9 in that the filter element 40 is not attached to the photosensitive element 21. That is, since the support body 251 does not cover the chip connection portion 2132 and the chip inner portion 2131 of the non-photosensitive region 213, the edge of the filter element 40 is coated on the support body. The upper end of the 251 is close to the position of the top surface 2501 to avoid contact with the lead 24, so that there is a gap between the filter element 40 and the photosensitive element 21.
  • the edge of the filter element 40 may not be fixed by being covered by the support body 251, but The filter element 40 is directly attached to the photosensitive region 212 of the photosensitive member 21, but the present invention is not limited in this respect.
  • a camera module 134 is different from the camera module 110 of the embodiment shown in FIG. 10 in that the support body 251 is The wiring board inner portion 2231 of the edge region 223 and the chip outer portion 2133 of the non-light sensing region 213 are covered.
  • the molding body 232 integrally molds the electronic component 26, the circuit board outer portion 2233 of the edge region 223, the circuit board connecting portion 2223, and the support The outer side surface 2503 of the element 25 and the outer peripheral surface 2723 of the lens periphery 272 thereby form the molded photosensitive member 20.
  • the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27.
  • FIG. 35 shows a camera module 135 according to another modified embodiment of the preferred embodiment of the present invention, which is different from the camera module 100 in the preferred embodiment described in FIG.
  • the main body 251 is formed only on the chip inner side portion 2131 of the non-photosensitive area 213, that is, the support main body 251 supports the lens 27 in this embodiment.
  • the lead 24 and each of the two connecting ends are molded and fixed by the molded base 23.
  • the molding body 232 integrally molds the electronic component 26, the lead 24, the edge region 223 of the wiring board 22, and the non-photosensitive region 213
  • the chip outer portion 2133, the chip connecting portion 2132, the outer side surface 2503 of the support member 25, and the outer peripheral surface 2723 of the lens peripheral edge 272 are formed, thereby forming the molded photosensitive member 20.
  • the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27.
  • a camera module 136 is different from the camera module 108 of the embodiment shown in FIG. 8B in that the support body 251 is Only the chip inner portion 2131 of the non-photosensitive region 213 is formed, that is, the support body 251 supports the lens 27 in this embodiment.
  • the lead 24 and each of the two connecting ends are molded and fixed by the molded base 23.
  • the molding body 232 integrally molds the electronic component 26, the lead 24, the edge region 223 of the wiring board 22, and the non-photosensitive region 213
  • the chip outer portion 2133, the chip connecting portion 2132, the outer side surface 2503 of the support member 25, and the outer peripheral surface 2723 of the lens peripheral edge 272 are formed, thereby forming the molded photosensitive member 20.
  • the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27.
  • a camera module 137 according to another modified embodiment of the preferred embodiment of the present invention is different from the camera module 109 in the embodiment shown in FIG. 9 in that the support body 251 is Only the chip inner portion 2131 of the 213 is formed, that is, the support body 251 supports the lens 27 in this embodiment.
  • the lead 24 and each of the two connecting ends are molded and fixed by the molded base 23.
  • the molding body 232 integrally molds the electronic component 26, the lead 24, the edge region 223 of the circuit board 22, and the outside of the chip of the 213 The portion 2133, the chip connecting portion 2132, the outer side surface 2503 of the support member 25, and the outer peripheral surface 2723 of the lens peripheral edge 272, thereby forming the molded photosensitive member 20. It will be appreciated that the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27.
  • a camera module 138 is different from the camera module 110 of the embodiment shown in FIG. 10 in that the support body 251 is Only the chip inner portion 2131 of the non-photosensitive region 213 is formed, that is, the support body 251 supports the lens 27 in this embodiment.
  • the lead 24 and each of the two connecting ends are molded and fixed by the molded base 23.
  • the molding body 232 integrally molds the electronic component 26, the lead 24, the edge region 223 of the wiring board 22, and the non-photosensitive region 213
  • the chip outer portion 2133, the chip connecting portion 2132, the outer side surface 2503 of the support member 25, and the outer peripheral surface 2723 of the lens peripheral edge 272 are formed, thereby forming the molded photosensitive member 20.
  • the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27.
  • FIG. 39 shows a camera module 139 according to another modified embodiment of the preferred embodiment of the present invention, which is different from the camera module 100 in the preferred embodiment described in FIG.
  • the body 251 is formed only on the wiring board outer portion 2233 of the edge region 223. That is, the support body 251 supports the lens 27 in this embodiment and does not cover the lead 24.
  • the molding body 232 integrally molds the electronic component 26, the circuit board outer portion 2233 of the edge region 223, and the outer side surface 2503 of the support member 25. And the outer peripheral surface 2723 of the lens periphery 272, thereby forming the molded photosensitive member 20.
  • the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27. Since the lead 24 is disposed in the sealed space 2700, the lead 24 is not damaged when the 23 is molded, and after the 23 is formed, the lead 24 can be protected. Not affected by the external environment.
  • a camera module 140 according to another modified embodiment of the preferred embodiment of the present invention is different from the camera module 108 of the embodiment shown in FIG. 8B in that the support body 251 is Only the outer side portion 2233 of the wiring board 223 is formed. That is, the support body 251 supports the lens 27 in this embodiment and does not cover the lead 24.
  • the molding body 232 integrally molds the electronic component 26, the circuit board outer portion 2233 of the edge region 223, and the outer side surface 2503 of the support member 25. And the outer peripheral surface 2723 of the lens periphery 272, thereby forming the molded photosensitive member 20.
  • the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27.
  • FIG. 41 shows a camera module 141 according to another modified embodiment of the preferred embodiment of the present invention.
  • the support body 251 is Only the outer side portion 2233 of the wiring board 223 is formed. That is, the support body 251 supports the lens 27 in this embodiment and does not cover the lead 24.
  • the molding body 232 integrally molds the electronic component 26, the circuit board outer portion 2233 of the edge region 223, and the outer side surface 2503 of the support member 25. And the outer peripheral surface 2723 of the lens periphery 272, thereby forming the molded photosensitive member 20.
  • the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27.
  • the camera module 144 is different from the camera module 109 in the embodiment shown in FIG. 9 in that the filter element 40 is not attached to the photosensitive element 21. That is, since the support main body 251 does not cover the wiring board inner side portion 2231 and the circuit board connecting portion 2232 of the non-photosensitive area 213 and the edge area 223, the edge of the filter element 40 The upper end of the support body 251 is wrapped near the top surface 2501 to avoid contact with the lead wires 24, so that there is a gap between the filter element 40 and the photosensitive element 21.
  • the edge of the filter element 40 may not be fixed by being covered by the support body 251, but The filter element 40 is directly attached to the photosensitive region 212 of the photosensitive member 21, but the present invention is not limited in this respect.
  • FIG. 42 shows a camera module 142 according to another modified embodiment of the preferred embodiment of the present invention.
  • the camera module 142 is different from the camera module 110 of the embodiment shown in FIG. Only the outer side portion 2233 of the wiring board 223 is formed. That is, the support body 251 supports the lens 27 in this embodiment and does not cover the lead 24.
  • the molding body 232 integrally molds the electronic component 26, the circuit board outer portion 2233 of the edge region 223, and the outer side surface 2503 of the support member 25. And the outer peripheral surface 2723 of the lens periphery 272, thereby forming the molded photosensitive member 20.
  • the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27.
  • FIG. 43 shows a camera module 143 according to another modified embodiment of the preferred embodiment of the present invention, which is different from the camera module 100 in the preferred embodiment described in FIG.
  • the support body 251, the lens periphery 272 of the lens 27 is directly attached to the non-photosensitive region 213 of the photosensitive element 21.
  • the molding main body 232 integrally molds the electronic component 26, the edge region 223 of the wiring board 22, and the chip outer portion 2133 of the non-photosensitive region 213. And the chip connecting portion 2132, the outer peripheral surface 2723 of the lens peripheral edge 272, thereby forming the molded photosensitive member 20.
  • the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27.
  • the lens 27 and the photosensitive element 21 may be connected by integral molding of the molding body 232, or may be joined together by a surface mounting process in other embodiments, but the present invention is Aspects are not subject to this limitation.
  • FIG. 44 shows a camera module 144 according to another modified embodiment of the preferred embodiment of the present invention, which is different from the camera module 108 in the embodiment shown in FIG. 8B.
  • the lens body 272 of the lens 27 is directly attached to the non-photosensitive region 213 of the photosensitive member 21.
  • the molding main body 232 integrally molds the electronic component 26, the edge region 223 of the wiring board 22, and the chip outer portion 2133 of the non-photosensitive region 213. And the chip connecting portion 2132, the outer peripheral surface 2723 of the lens peripheral edge 272, thereby forming the molded photosensitive member 20.
  • the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27.
  • a camera module 145 is different from the camera module 109 in the embodiment shown in FIG.
  • the lens body 272 of the lens 27 is directly attached to the non-photosensitive region 213 of the photosensitive member 21.
  • the molding main body 232 integrally molds the electronic component 26, the edge region 223 of the wiring board 22, and the chip outer portion 2133 of the non-photosensitive region 213.
  • the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27.
  • the lens 27, the filter element 40, and the photosensitive element 21 may be connected by integral molding of the molding body 232, or may be connected together by a surface mount process in other embodiments. However, the invention is not limited in this respect.
  • FIGS. 7 to 10 and FIGS. 15 to 46 the lens 10 and the driver 30 are not shown in the drawings, and the present invention is not limited thereto. limit.
  • a camera module 146 is different from the camera module 110 in the embodiment shown in FIG.
  • the lens body 272 of the lens 27 is directly attached to the non-photosensitive region 213 of the photosensitive member 21.
  • the molding main body 232 integrally molds the electronic component 26, the edge region 223 of the wiring board 22, and the chip outer portion 2133 of the non-photosensitive region 213.
  • the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27.
  • FIG. 47 shows a camera module 147 according to another modified embodiment of the preferred embodiment of the present invention, which is different from the camera module 100 in the preferred embodiment described in FIG.
  • the arrangement of the element 21 in the circuit board 22 is a sunken type. That is, the wiring board 22 has a photosensitive member recess 224, and the photosensitive member 21 is disposed in the photosensitive member recess 224.
  • the upper surface of the photosensitive member 21 is parallel or lower than the upper surface of the wiring board 22, that is, the chip mounting region 222 of the 22 is lower than the manner in which the edge region 223 is disposed. It is defined as a sinking type. Since the photosensitive element 21 is set to a sunken type, the overall thickness of the camera module 147 assembled is further reduced, which satisfies the demand for an electronic device for a thin and light size camera module.
  • FIG. 48 shows a camera module 148 according to another modified embodiment of the embodiment shown in FIG. 47, which is different from the camera module 147 of the embodiment shown in FIG. 47.
  • the chip mounting area of the wiring board 22 has a photosensitive member accommodating hole 225.
  • the photosensitive member accommodating hole 225 is a through hole, and the photosensitive member 21 is disposed in the photosensitive member accommodating hole 225.
  • the photosensitive member 21 is held in the photosensitive member accommodating hole 225, and further, the supporting member 25 also reinforces the connection between the photosensitive member 21 and the wiring board 22, which can avoid the The photosensitive member 21 is detached from the photosensitive member accommodating hole 225 of the wiring board 22.
  • FIG. 49 shows a camera module 149 according to another modified embodiment of the preferred embodiment of the present invention.
  • the lens 27 is The lens periphery 272 is not provided, and the lens body 271 of the lens 27 is directly supported by the support body 251, and the bottom of the support body 251 is directly attached to the non-photosensitive region 213 of the photosensitive member 21.
  • the molding main body 232 integrally molds the electronic component 26, the edge region 223 of the wiring board 22, and the chip outer portion 2133 of the non-photosensitive region 213. And the chip connecting portion 2132, the outer edge of the lens body 271, thereby forming the molded photosensitive member 20.
  • the outer edge of the lens body 271 is supported by the support body 251, and may be covered by the molding body 232 as shown in FIG. 49, and may be in other embodiments.
  • the present invention is only wrapped by the support body 251, and the present invention is not limited in this respect.
  • FIG. 50 shows a camera module 150 according to another modified embodiment of the preferred embodiment of the present invention, which is different from the camera module 108 in the embodiment shown in FIG. 8B.
  • the body 251 is supported and the bottom of the lens periphery 272 of the lens 27 extends downwardly to form a lens support leg 2720.
  • the lens support leg 2720 is supported by the circuit board outer portion 2233 of the edge region 223. That is, the lens support foot 2720 supports the lens 27 in this embodiment and does not cover the lead 24.
  • the molding body 232 integrally molds the electronic component 26, the circuit board outer portion 2233 of the edge region 223, and the outer side surface 2503 of the support member 25.
  • the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27.
  • the support body 251 and the lens body 271 can prevent the respective portions of the photosensitive element 21 and the wiring board 22 from being subjected to the MOL molding process.
  • the displacement is uneven, and the molding material can be prevented from entering between the photosensitive member 21 and the lens 27 to ensure the flatness of the photosensitive member 21.
  • the present invention mainly describes the features and advantages of the camera module of the present invention by taking a single camera module as an example, but those skilled in the art can understand that in other embodiments, For example, as shown in FIG. 13 and FIG. 14 , the camera module 100 may also be a dual-lens camera module or an array camera module 1000 . Therefore, the single camera module does not constitute a limitation on the content and scope of the present invention.
  • the present invention further provides a method of manufacturing a molded photosensitive member 20, wherein the manufacturing method comprises the following steps:
  • the molding base 23 includes a molding body 232 and has a molding hole 231, wherein the molding body 232 covers at least a portion of the edge region 223 of the wiring board 22, at least a portion of the support member 25. And at least a portion of the lens 27.
  • the present invention further provides a method of manufacturing a molded photosensitive member 20, wherein the manufacturing method comprises the following steps:
  • the molding base 23 includes a molding body 232 and has a molding hole 231 that covers an edge region 223 of the wiring board 22, at least a portion of the support member 25, and the lens. At least a portion of the photosensitive member 212 of the photosensitive member 21 corresponds to the molding hole 231.
  • the present invention further provides a method of manufacturing a molded photosensitive member, wherein the manufacturing method comprises the steps of:
  • the molding base 23 includes a molding body 232 and has a molding hole 231 that covers an edge region 223 of the wiring board 22, at least a portion of the support member 25, and at least a portion of the lens 27, and a photosensitive region 212 of the photosensitive member 21. Corresponding to the molding hole 231.
  • the present invention further provides a method of manufacturing a molded photosensitive member, wherein the manufacturing method comprises the steps of:
  • the present invention further provides an electronic device 200, wherein the electronic device 200 includes at least one camera module 100, wherein each of the camera modules 100 is configured to acquire graphics, wherein each of the camera modules
  • the set 200 further includes at least one lens 10 and at least one molded photosensitive member 20, the molded photosensitive member 20 including a lens 27, a supporting member 25, a photosensitive member 21, a wiring board 22, a set of leads 24, and a molded base 23, wherein both ends of each of the leads 24 are respectively connected to the chip connector 211 of the photosensitive member 21 and the circuit board connector 221 of the circuit board 22, and the lens 27 further includes A lens body 271 and a lens perimeter 272 extend integrally with the lens body 271.
  • the molding base 23 includes a molding body 232 and has a molding hole 231 in which the lens 27 is molded when a molding process is performed through a molding die 900 to mold the molding body 232.
  • the lens body 271 forms the molding hole 231 at the time of demolding, a lens periphery 272 of the lens 27 is attached to the support member 25, wherein the photosensitive region 212 of the photosensitive member 21 corresponds to the mold
  • the plastic hole 231, wherein the lens 10, the lens main body 271 of the lens 27 is disposed in a photosensitive path of the photosensitive member 21 of each of the molded photosensitive members 20.
  • FIG. 51 to FIG. 57 are an array camera module 100 according to a preferred embodiment of the present invention, wherein the array camera module 100 includes at least two lenses 10 and a photosensitive component, and the photosensitive component includes at least two molding photosensitivity. Component 20.
  • the array camera module 100 can be applied to various electronic devices to assist a user to capture an image of an object or a person through the array camera module 100.
  • the array camera module 100 can be used to capture an object.
  • image data such as images or videos of people.
  • the array camera module 100 can be applied to a mobile electronic device, for example, the mobile electronic device can be, but not limited to, a mobile phone or a tablet device.
  • Each of the molded photosensitive members 20 further includes a photosensitive member 21, a wiring board 22, a molding base 23, a set of leads 24, a supporting member 25, a plurality of electronic components 26, and a lens 27.
  • the two ends of each of the leads 24 extend to be connected to a non-photosensitive area 213 of the photosensitive element 21 and the circuit board 22.
  • Each of the molding bases 23 is integrally formed on each of the wiring boards 22 such that each of the molding bases 23, each of the wiring boards 22, and each of the lenses 27 form an integral structure.
  • Each of the electronic components 26 may be mounted on a corresponding one of the circuit boards 22 by a process such as an SMT (Surface Mount Technology).
  • the lens 10 and the lens 27 are disposed on a photosensitive path of the photosensitive member 21 of the molded photosensitive member 20. Light reflected by the object enters the inside of the array camera module 100 from the lens 10 and the lens 27 to be subsequently received and photoelectrically converted by the photosensitive element 21, thereby obtaining an image associated with the object.
  • the molding process in which the molded base 23 is molded in the thermo-hardened film 27 is defined as a MOL (molding on lens) molding process, and a conventional COB (chip on board). The molding process is different.
  • the arrangement of the lens 27 can reduce the optical TTL (the distance from the lens plane above the lens aperture to the photosensitive plane of the chip), thereby further reducing the size of the array camera module 100 without affecting optical performance. Small, meeting the needs of electronic devices for mounting small-sized array camera modules 100.
  • the arrangement of the lens 27 can also reduce stain sensitivity. For example, in one embodiment, stain sensitivity of 50% can be reduced. That is, preferably, the lens 10 includes a plurality of lens elements, and the lens and the lens 27 form an optical system, and light rays passing through the optical system are concentrated to the photosensitive element 21.
  • the conventional lens is implemented in the present invention in two parts, one part is the lens 10, the other part is the lens 27, the lens 27 is a lens having refractive power, the lens 10 and the lens Together, 27 acts to refract light, thereby concentrating light to the photosensitive element 21, which can effectively reduce the TTL of the entire optical system.
  • the lens 10 and the lens 27 form a lens assembly, one of the lenses of the lens assembly becomes an external lens, that is, the lens 27, and the lens 27 is The molded base 23 is integrally packaged, so that the size of the camera module can be reduced.
  • a plurality of the circuit boards 22 of the plurality of the molded photosensitive members 20 of the photosensitive member may be integrally formed to form a connected wiring board, or may be separate wiring boards.
  • a plurality of the molded susceptors 23 of the plurality of the molded photosensitive members 20 of the photosensitive member may be integrally molded to form a continuous molded base, as shown in the drawings, or may be independent molds. Plastic base.
  • the lens 27 is embodied as a lens of thermosetting properties, i.e. the lens is embodied as a thermally hardened lens such that the lens 27 is capable of undergoing a molding process Withstand the ambient temperature in the molding process. For example, it is capable of withstanding a molding ambient temperature of 175 ° C in the molding process of an embodiment.
  • the high temperature resistant and thermally hardened lens 27 is attached to the support member 25 and placed together with the wiring board 22 and the photosensitive member 21
  • a solidified molding material of the fluid is molded integrally around the support member 25 and the outer surface of the lens 27 to integrally mold the molding base 23, so that the molding base 23 can be integrally molded into the
  • the wiring board 22, that is, the molded base 23, the wiring board 22, and the lens 27 are formed in a unitary structure.
  • the lens 27 of the present invention may be not only a heat-hardened lens but also a lens of other nature, and the present invention is not limited thereto.
  • the lens 27 includes a lens body 271 and a lens periphery 272 disposed around the lens body 271. Since the lens 27 is a precision optical element, the edge of the lens body 271 is thin.
  • the lens periphery 272 disposed at the edge of the lens body 271 and integrally connected is a thickened bracket design capable of carrying the lens body 271 so as not to affect the optical performance of the lens body 271 while enabling
  • the lens body 27 is integrally molded to the molding base 23 in a mold.
  • the lens periphery 272 of the lens 27 is disposed in the non-photosensitive region 213 of the photosensitive member 21 before the molding base 23 is formed, the lens of the lens 27 a main body 271 is disposed on a photosensitive path of the photosensitive member 21 of the molded photosensitive member 20; after the molding base 23 is molded, the molding base 23 covers the wiring board 22, The non-photosensitive region 213 of the photosensitive member 21, a portion of the support member 25, and the lens periphery 272 of the lens 27 to form the molded photosensitive member 20.
  • the supporting component 25 can effectively improve the product yield of the array camera module 100 and improve the imaging quality of the array camera module 100.
  • the support member 25 includes a frame-shaped support body 251 and has a through hole 252, wherein the support body 251 is disposed on the non-photosensitive region 213 of the photosensitive member 21, so that the photosensitive member A photosensitive region 212 of 21 corresponds to the through hole 252 of the support member 25 and the lens main body 271 of the lens 27, so that the support main body 251 and the lens 27 can be subjected to a molding process.
  • the photosensitive region 212 of the photosensitive member 21 is protected.
  • the supporting member 25 has a top surface 2501, an inner side surface 2502 and an outer side surface 2503, wherein the two sides of the top surface 2501 are respectively connected to the inner side surface 2502 and the outer side surface 2503.
  • the side of the support member 25 facing the photosensitive member 21 is defined as the inner side 2502 of the support member 25
  • the side of the support member 25 facing the wiring board 22 is defined as The outer side 2503 of the support member 25.
  • An inner side 2502 of the support member 25 is used to form the through hole 252 of the support member 25.
  • the lens periphery 272 has a top surface 2721, a bottom surface 2722 and an outer peripheral surface 2723.
  • the two sides of the outer peripheral surface 2733 of the lens periphery 272 are respectively connected to the top surface 2721 and the bottom surface 2722 of the lens periphery 272. That is, the side of the lens perimeter 272 that faces the circuit board 22 is defined as the outer peripheral surface 2723 of the lens perimeter 272.
  • the lens body 271 has an outer lens surface 2711 and a lens inner surface 2712. That is, the side of the lens body 271 facing the photosensitive element 21 is defined as the inner surface 2712 of the lens body 271, and the side connected to the top surface 2721 of the lens periphery 272. It is defined as the outer surface 2711 of the lens body 271.
  • the lens 27 is attached to the support body 251, it is placed in a mold together with the wiring board 22 and the photosensitive member 21 to perform a molding process.
  • the heat-curable molding material of the fluid is thermally cured to form the molded base 23, and the molded base 23 covers the outer side 2503 of the support body 251 and the peripheral edge 271 of the lens after molding.
  • the outer peripheral surface 2723 is also covers all or a portion of the top surface 2721 of the lens perimeter 271 after molding.
  • the photosensitive member 21 includes the photosensitive region 212 and the non-sensitive region 213, wherein the photosensitive region 212 and the non-sensitive region 213 of the photosensitive member 21 are integrally molded, and the photosensitive member A region 212 is located in the middle of the photosensitive element 21, the non-photosensitive region 213 is located outside the photosensitive element 21, and the non-photosensitive region 213 surrounds the photosensitive region 212 one week.
  • the photosensitive element 21 has a set of chip connectors 211
  • the circuit board 22 has a set of circuit board connectors 221, wherein two ends of each of the leads 24 can be respectively connected to the photosensitive elements
  • Each of the chip connector 211 of the 21 and each of the circuit board connectors 221 of the wiring board 22 is connected in such a manner that the photosensitive element 21 and the wiring board 22 are connected.
  • each of the chip connector 211 of the photosensitive member 21 and each of the circuit board connectors 221 of the circuit board 22 may be a land, that is, the photosensitive member
  • Each of the chip connector 211 of the 21 and each of the circuit board connectors 221 of the circuit board 22 may be respectively in a disk shape for connecting both ends of each of the leads 24 to the Each of the chip connector 211 of the photosensitive member 21 and each of the circuit board connectors 221 of the wiring board 22.
  • each of the chip connector 211 of the photosensitive element 21 and each of the circuit board connectors 221 of the circuit board 22 may be spherical, such as solder paste or the like.
  • a solder material is spotted on the photosensitive member 21 and the wiring board 22 to form the chip connector 211 of the photosensitive member 21 and the wiring board connector 221 of the wiring board 22, respectively. Nevertheless, the shape of the chip connector 211 of the photosensitive member 21 and the circuit board connector 221 of the wiring board 22 does not limit the content and scope of the present invention.
  • each of the chip connectors 211 of the photosensitive member 21 is disposed in the non-photosensitive region 213 of the photosensitive member 21.
  • the non-photosensitive region 213 of the photosensitive element 21 has a chip inner portion 2131, a chip connecting portion 2132, and a chip outer portion 2133, wherein the chip inner portion 2131 surrounds the photosensitive region 212, the Both sides of the chip connecting portion 2132 extend and are connected to the chip inner side portion 2131 and the chip outer side portion 2132, respectively.
  • an area of the non-photosensitive region 213 from a position where the chip connector 211 is disposed to a position of an edge of the photosensitive region 212 is defined as the chip inner portion 2131, and the non-photosensitive region is to be
  • An area of the 213 where the chip connector 211 is disposed is defined as the chip connection portion 2132, and the position of the non-photosensitive area 213 from the position where the chip connector 211 is disposed to the outer edge of the photosensitive member 21
  • the area of the position is defined as the chip outer portion 2132.
  • the photosensitive element 21 is, in order from the outside to the inside, the chip outer portion 2133, the chip connecting portion 2132, the chip inner portion 2131, and the photosensitive region. 212.
  • the circuit board 22 includes a flat chip mounting area 222 and an edge area 223, wherein the edge area 223 is integrally formed with the chip mounting area 222, and the edge area 223 is located on the chip The periphery of the mounting area 222.
  • the die attach area 222 is used to mount the photosensitive element 21, and the circuit board connector 221 is disposed in the edge region 223.
  • the edge region 223 of the circuit board 22 has a circuit board inner portion 2231, a circuit board connecting portion 2232, and a circuit board outer portion 2233.
  • the circuit board inner portion 2231 surrounds the chip mounting area 222.
  • the two sides of the circuit board connecting portion 2232 respectively extend and are connected to the circuit board inner side portion 2231 and the circuit board outer side portion 2233.
  • an area of the edge region 223 from a position where the board connector 221 is disposed to a position of an edge of the chip mounting region 222 is defined as the board inner portion 2231, which will be described
  • the area of the edge region 223 where the circuit board connector 221 is disposed is defined as the circuit board connection portion 2232, and the position of the edge region 223 from the position where the circuit board connector 221 is disposed to the edge region 223
  • the area of the outer edge is defined as the outer side portion 2233 of the board.
  • the circuit board 22 is, in order from the inside of the circuit board 22, the circuit board outer portion 2233, the circuit board connecting portion 2232, the circuit board inner portion 2231, and the chassis.
  • the chip mounting area 222 is described.
  • the lead 24 is not limited in the array camera module 100 of the present invention.
  • the lead 24 can be implemented as a gold wire, that is, by means of a gold wire. Connecting the photosensitive element 21 and the wiring board 22 together, so that the photosensitive element 21 can be further transmitted to the circuit board through the lead 24 after converting the optical signal into an electrical signal twenty two. It can be understood by those skilled in the art that in other examples of the array camera module 100, the lead 24 can also be implemented as any silver wire, copper wire, etc. to enable the electrical signal in the photosensitive element. The material is transferred between the 21 and the circuit board 22.
  • each of the electronic components 26 is mounted on the edge region 223 of the circuit board 22.
  • each of the electronic components 26 is attached to the wiring board outer portion 2233 of the edge region 223.
  • the photosensitive element 21 and each of the electronic components 26 may be mounted on the same side or opposite sides of the circuit board 22, such as in a specific embodiment, the photosensitive element 21 and each of the electronic elements
  • the device 26 is mounted on the same side of the circuit board 22, and the photosensitive element 21 is mounted on the chip mounting area 222 of the circuit board 22, and each of the electronic components 26 is mounted.
  • the molding base 23 covers each of the electronic components 26 to isolate adjacent ones by the molding base 23.
  • the electronic component 26 and the electronic component 26 and the photosensitive element 21 are isolated, so that in the array camera module 100 of the present invention, even the adjacent electronic component 26 is closer
  • the molding base 23 can also prevent adjacent electronic components 26 from contacting or interfering with each other, and the manner in which the molding base 23 covers the electronic component 26 can also be avoided. Contaminants on the surface of the electronic component 26 contaminate the photosensitive region 212 of the photosensitive element 21, thereby reducing the volume of the array camera module 100 and improving the imaging quality of the array camera module 100. That is, the array camera module 100 of the present invention covers the electronic component 26 by the molding base 23, so that the circuit board 22 of a small area can be mounted more.
  • the electronic component 26 is described. It is worth mentioning that the types of electronic components 26 include, but are not limited to, resistors, capacitors, drivers, and the like.
  • the array camera module 100 further includes at least two filter elements 40.
  • the filter element 40 is disposed at the bottom of the lens 10. That is, the filter element 40 is assembled to the lens 10. The optical lenses inside the lens 10 are sequentially arranged, and the filter element 40 is located in the optical path of the lens 10. After the molded photosensitive member 20 is molded and integrally packaged, the filter element 40 and the lens 10 are attached to the molded photosensitive member 20 to be assembled to form the array camera module 100. The filter element 40 is located in the photosensitive path of the photosensitive element 21.
  • the light reflected by the object is filtered from the optical lenses of the lens 10 and filtered by the filter element 40 into the array camera module 100, and can be received and photoelectrically converted by the photosensitive element 21. That is, the filter element 40 can filter stray light, such as an infrared portion, from the light reflected by the object in each of the optical lenses of the lens 10, by which the array camera module 100 can be changed. Imaging quality.
  • the filter elements 40 can be implemented in different types, for example, the filter elements 40 can be implemented as infrared cutoffs.
  • a filter, a full transmissive spectral filter, and other filters or a combination of multiple filters, for example, the filter element 40 can be implemented as a combination of an infrared cut filter and a full transmissive filter. That is, the infrared cut filter and the full transmissive spectral filter can be switched to be selectively located on the photosensitive path of the photosensitive element 21, for example, in an environment where light is sufficient during daytime.
  • the infrared cut filter can be switched to the photosensitive path of the photosensitive element 21 to filter the light reflected by the object into the array camera module 100 through the infrared cut filter.
  • the full permeable spectral filter can be switched to the photosensitive path of the photosensitive element 21 to allow entry. Infrared part of the light reflected by the object of said array in the camera module 100 through.
  • the mounting position of the filter element 40 has various variant embodiments in different embodiments.
  • the filter element 40 described in FIG. 57 is disposed at the bottom of the lens 10.
  • the filter element 40 is disposed on top of the molded base 23. Both of these arrangements are performed by mounting the filter element 40 after the molded photosensitive member 20 is molded integrally.
  • the filter element 40 and the molded photosensitive component 20 are assembled together in a mold. That is, in other embodiments, the peripheral edge of the filter element 40 may be covered by the support member 25 and secured between the photosensitive element 21 and the lens 27.
  • the filter element 40 is mounted on the photosensitive element 21 and located between the lens 27 and the photosensitive element 21.
  • the latter two arrangements are in that the filter element 40 and the photosensitive element 21, the circuit board 22, the support element 25, and the lens 27 are placed together in a mold, after being molded by the MOL process.
  • the molding base 23 is formed so as to be assembled after the lens 10 is mounted or a driver 30 of the lens 10 is driven.
  • Various variations in position of the filter element 40 will be disclosed in detail in subsequent embodiments.
  • the filter element 40 may be directly assembled to the top surface of the molding base 23, or the filter element 40 may be assembled to a small lens holder before the small lens holder is assembled.
  • the top surface of the molded base 23 is assembled in such a manner that the size of the filter element 40 can be reduced to reduce the manufacturing cost of the array camera module.
  • the lens 27 can be a convex lens and has the function of concentrating light. Since the filter element 40 does not cause refraction of light, the lens 27 implemented as a convex lens makes imaging smaller. The particles (stains) on the filter element 40 tend to cause the photosensitive element 21 to form a large stain point on the image, and the closer to the photosensitive element 21, the larger the imaged stain point. Therefore, in the MOL process of the present invention, the lens 27 is disposed at a lower portion of the lens 10, and the filter element 40 is disposed at a bottom portion of the lens 10. That is, the MOL process of the present invention can move the filter element away from the photosensitive element 21 without affecting the convergence of the light of the lens 27 implemented as a convex lens, thereby making the image of the stained spot smaller. .
  • the lens periphery 272 of the lens 27 has a square step shape.
  • the support body 251 also has various modified embodiments.
  • the support body 251 covers all of the lead wires 24, the circuit board outer side portion 2233 of the edge region 223, the circuit board connecting portion 2232, and the inner side of the circuit board.
  • the supporting body 251 covers a portion of the lead 24, The chip outer portion 2133, the chip connecting portion 2132, and the chip inner portion 2131 of the non-photosensitive region 213; and in another embodiment, the supporting body 251 covers a portion of the lead 24, The chip inner portion 2231 of the edge region 223, the chip outer portion 2133 of the non-photosensitive region 213, the chip connecting portion 2132, and the chip inner portion 2131; and, for example, in an embodiment, The support body 251 covers the portion of the lead 24, the circuit board outer portion 2233 of the edge region 223, the circuit board connecting portion 2232, and the circuit board inner portion 2231; for example, in an embodiment , the support body 2 a portion covering the lead wire 24, the circuit board outer side portion 2233 of the edge region 223, the circuit board connecting portion 2232, the circuit board inner portion 2231, and the non-photosensitive region 213
  • the outer side portion 2133 covers the lead 24, The chip outer portion 2133, the chip connecting portion 2132, and the chip inner portion 2131 of the non-photosensitive region
  • the array camera module 100 can be implemented as a fixed focus array camera module, wherein the array camera module 100 is assembled to the molded base 23 A molded body 232 causes the lens 10 to be held in the photosensitive path of the photosensitive member 21. It is to be noted that, in an embodiment, the array camera module 100 can be implemented as a zoom camera module, wherein the array camera module 100 changes the lens 10 and the photosensitive element 21 The distance is adjusted to adjust the focal length of the array camera module.
  • the array camera module 100 is implemented as a zoom camera module as described in FIG.
  • the array camera module 100 further includes the driver 30, wherein the lenses 10 are respectively disposed correspondingly to the driver 30, the drivers 30 are respectively assembled to the molding base 23, and the The driver 30 is electrically connected to the circuit board 22, respectively, to drive the lens 10 along the photosensitive element 21 after the circuit board 22 transmits power and control signals to the driver 30.
  • the photosensitive path moves back and forth to adjust the focal length of the array camera module 100. That is, the lens 10 is drivably disposed to the driver 30.
  • the type of the driver 30 is not limited in the array camera module 100 of the present invention.
  • the driver 30 can be implemented as any such as a voice coil motor.
  • the molding body 232 is deformed to be a lens holder for assembling the lens 10, and the lens 10 is in the mode. After the plastic photosensitive member 20 is integrally molded, it is directly mounted on the molding main body 232 implemented as a lens holder, thereby simplifying the assembly process of the array camera module 100. Variations of this aspect of the invention will be disclosed in detail in the following embodiments.
  • Each of the molded photosensitive members 20 integrally formed by the MOL molding process and assembled to form the array camera module 100 are disclosed in detail in the respective embodiments.
  • each of the filter elements 40 is disposed at a bottom portion of each of the lenses 10.
  • each of the lenses 10 is assembled by integrally molding each of the molded photosensitive members 20.
  • a molded photosensitive member panel 2000 is formed by a jigsaw operation, and then each of the molded photosensitive members 20 is cut.
  • a wiring board panel 2200 is formed, and the wiring board panel 2200 includes a plurality of the wiring boards 22 integrally connected.
  • a molded base panel 2300 is integrally formed in the molding process, and the molded base panel 2300 after integral molding includes a plurality of the molded bases 23.
  • each of the photosensitive elements 21 is attached to each of the chip mounting regions 222 of each of the circuit boards 22, wherein a set of the chip connectors 211 of each of the photosensitive elements 21 and The two sets of the board connectors 222 of the circuit board 22 are respectively connected by a set of the leads 24.
  • Each of the electronic components 26 is attached to the edge region 233 of the circuit board 22, respectively.
  • each of the electronic components 26 is attached to the outer side portion 2233 of the edge region 223, respectively. More preferably, each of the electronic components 26 is spaced apart from each other such that each of the electronic components 26 does not interfere with each other after the array camera module is fabricated.
  • the chip connection end 241 and the circuit board connection end 242 of the lead 24 are respectively connected to the photosensitive element 21 After the chip connector 211 and the board connector 221 of the circuit board 22, the lead 24 protrudes upward to raise the upper surface of the photosensitive member 21. It will be understood by those skilled in the art that maintaining each of the leads 24 in an initial state during the manufacturing process of the array camera module and during use is advantageous for ensuring good electrical power of the leads 24. And guarantee the imaging quality of the array camera module.
  • the support body 251 can prevent the connection position of the lead wire 24 and the chip connector 211 from coming into contact with the thermosetting material for forming the molding base 23, The heat-curing material of the fluid is prevented from causing deformation of the end of the lead 24 for connecting the chip connector 211 or the lead 24 is detached from the chip connector 211.
  • the support body 251 and the lens periphery 272 of the lens 27 are coupled together to isolate the connection position of the lead 24 and the chip connector 211 from the thermosetting material.
  • the support body 251 and the lens periphery 272 of the lens 27 are coupled together, the inner side surface 2502 of the support member 25 and the lens inner surface 2712 of the lens body 271 form a hermetic seal.
  • the space 2700 is such that when the MOL molding process is performed, the heat-curing material of the fluid is prevented from entering the sealed space 2700, thereby avoiding affecting the light-passing path and also reducing the stain sensitivity.
  • the support body 251 may be formed by disposing glue on the non-photosensitive region 213 of the photosensitive member 21 and after the glue is initially cured, and after preliminary curing, the lens 27 is further cured and finally cured. The support body 251 is formed.
  • the inner side surface 2502 of the support body 251 forms the through hole 252, and the photosensitive region 212 of the photosensitive element 21 corresponds to the through hole 252 and the heat.
  • the lens body 271 of the lens 27 is hardened.
  • the support body 251 formed of glue may also have a viscosity for subsequently adhering contaminants such as dust, thereby preventing the contaminants from contaminating the photosensitive region 212 of the photosensitive member 21 to cause the A staining point occurs in the photosensitive region 212 of the photosensitive element 21 to further ensure the image quality of the array camera module.
  • the 272 of the lens 27 is attached to the support body 251 of the support member 25 after the support member 25 is fully cured, and the present invention is not limited thereto.
  • the molding material of the thermosetting material which is implemented in a fluid state is formed into a unit integrally formed on the wiring board 22 by curing after a molding die 900.
  • the size of the array camera module 100 and the assembly error of the array camera module can be reduced, thereby making the structure of the array camera module 100 more compact and improved.
  • the imaging quality of the array camera module 100 since the lens 27 is disposed on the photosensitive element 21 through the supporting member 25, the optical TTL is reduced, and the structure of the array camera module 100 is further made compact, and the electronic device is satisfied for the array.
  • the size of the module 100 is required.
  • the molding die 900 includes an upper die 901 and a lower die 902, wherein at least one of the upper die 901 and the lower die 902 can be moved to cause the upper die 901 and the
  • the lower mold 902 can be subjected to a mold clamping operation, and at least one molding space 903 is formed between the upper mold 901 and the lower mold 902, wherein the molding base 23 is added to the molding by the molding material. Space 903 is formed and formed after curing.
  • the photosensitive element 21 and the wiring board 22 are connected by a set of the lead wires 24 formed on the non-photosensitive region 213 of the photosensitive element 21 to cover all of the leads 24,
  • the circuit board outer portion 2233 of the edge region 223, the circuit board connecting portion 2232, the circuit board inner portion 2231, the chip outer portion 2133 of the non-photosensitive region 213, and the chip connecting portion 2132 And the chip connecting portion 2132, the lens 27 is disposed on the supporting body 251, so that the semi-finished product of the molded photosensitive member 20, the semi-finished product of the molded photosensitive member 20 is placed on the molding die 900
  • the lower mold 902, the upper mold 901 and/or the lower mold 901 of the molding die 900 are operated to mold the upper mold 901 and the lower mold 902, so that the upper mold 901 is
  • the molding space 903 is formed with the lower mold 902, wherein the pressing surface 9011 of the upper mold 901 is in contact with the lens inner surface 2712 of the lens body 271 of the lens 27, and the support
  • the exterior of the circuit board 22, the non-photosensitive area 213 of the photosensitive element 21, a portion of the support member 25, and the outer peripheral surface 2723 of the 272 of the lens 27 Located in the molding space 903 of the molding die 900, so that when the molding base 23 is molded in the molding space 903, the molding base 23 covers the outside of the wiring board 22, A non-photosensitive region 213 of the photosensitive element 21, a portion of the support member 25, and the outer peripheral surface 2723 of the lens body 272.
  • the molded photosensitive member 20 formed as shown in FIG.
  • the molded base 23 formed also covers a portion of the top surface 2721 of the 272.
  • the molding space 903 of the molding die 900 may be an annular space to form a ring shape after the molding material is added to the molding space 903 and cured.
  • the molded base 23 is.
  • the supporting member 25, the lens 27, and the wiring board panel 1100 are placed in the molding space 903, and when the molding die 900 is in a mold clamping state,
  • the liquid molding material is fed into and passed through a curing process to form each of the molding bases 23 integrally molded on the respective wiring boards 22 of the wiring board panel 2200 and the photosensitive member 21.
  • the molded base 23 forms an integral molded base panel 2300 such that each of the molded photosensitive members 20 forms a molded photosensitive member panel 2000.
  • the molding die 900 Further provided are a plurality of driver lead slot forming blocks 9012, each of the driver lead slot forming blocks 9012, during the molding process, the liquid shaped material does not fill the corresponding slot of the driver.
  • the position of the block 9012 so that after the curing step, a plurality of the molding holes 231 and the plurality of driver pin slots are formed in the molded base panel 2300 of the molded photosensitive member panel 2000,
  • the molding pedestal 23 of each of the molded photosensitive members 20 of the diced fabrication unit is configured with the driver pin slot, so that when the photographic camera module is fabricated, the driver 30
  • the pins are attached to the wiring board 22 of the molded photosensitive member 20 by soldering or conductive adhesive bonding or the like.
  • the molding material in fluid form according to the present invention may be a liquid material or a solid particulate material or a mixed material of liquid and solid particles, it being understood that whether the molding material is implemented as a liquid material or It is implemented as a solid particulate material or as a liquid and solid particulate mixed material which, after being added to the molding space 903 of the molding die 900, can be cured to form the molded base 23.
  • the fluid-like molding material is embodied as a thermosetting material such as a liquid, wherein the molding material is cured after being added to the molding space 903 of the molding die 900 to form The molded base 23 is molded. It is worth mentioning that, when the fluid-like molding material is added to the molding space 903 of the molding die 900, the curing manner of the fluid-shaped molding material does not limit the content and scope of the present invention.
  • the medium forming the support 25 and the medium forming the molded base 23 are of different materials.
  • the support body 25 can be formed by an elastic medium, so that the formed support body 25 has a certain elasticity, and the support body 25 can also be formed by a rigid medium, and the invention is not limited thereto.
  • the support body 251 is disposed along the non-photosensitive area 213 of the photosensitive element 21, and the lens periphery 272 of the lens 27 closely fits the support body 251.
  • the sealed space 2700 is formed such that the support body 251 and the lens body 271 of the lens 27 can block the molding material after the molding material is added to the molding space 903 of the molding die 900.
  • the holder 23 further forms a molding hole 231 to correspond to the photosensitive region 212 of the photosensitive member 21, so that, in the subsequent, the molding hole 231 of the molding base 23 allows light to pass through
  • the photosensitive region 212 of the photosensitive member 21 receives and performs photoelectric conversion. That is, since the molding material does not enter the closed space 2700, after the drafting, the outer surface 2711 of the lens body 271 of the lens 27 and the pressing surface 9011 are formed.
  • the hole 231 is molded.
  • the molding base 23 includes the molding main body 232 and has the molding hole 231, which provides a light path for the optical lens 10 and the photosensitive element 21. Therefore, after the light reflected by the object enters the inside of the array camera module from the optical lens 10, the light passes through the molding hole 231 of the molding base 23 to be the photosensitive region of the photosensitive element 21. 212 receives and performs photoelectric conversion.
  • the photosensitive member 21 is first attached to the wiring board 22, and then the supporting member 25 is formed, and further, the lens 27 is disposed on the supporting member 25, The wiring board 22, the photosensitive member 21, and the lens 27 are molded to form the molded base 23, thereby molding the molded photosensitive member 20.
  • the sealed space 2700 is formed between the lens 27 and the photosensitive member 21, damage of the molded mold to the photosensitive member 21 can be prevented, and since the lens 27 and the The distance between the photosensitive elements 21 is reduced, so that the back focal length of the array camera module 100 assembled therefrom can be reduced, thereby reducing the height of the array camera module 100, and on the other hand,
  • the lens 27 provides additional support members, and thus the thickness of the array camera module 100 is further reduced to some extent.
  • the driver 30 and the lens 10 are assembled on the molded base 23 to assemble the array camera module 100.
  • the filter element 40 is disposed at the bottom of the lens 10.
  • FIG. 58B illustrates a modified embodiment of the preferred embodiment of the present invention, illustrating that the molded photosensitive member 20 and the filter element 40 are assembled to form an array of camera modules 108, in this modified embodiment.
  • the array camera module 108 is similar in structure to the array camera module 100 in the preferred embodiment, except that the filter elements 40 of the array camera module 108 in FIG. 58B are disposed at different positions.
  • the filter element 40 is not disposed at the bottom of the lens 10 of the array camera module 108, but the filter element 40 is assembled to the molded base 23.
  • the top surface of the molded base 23 forms an inner side surface 233 and an outer side surface 234, and in the embodiment shown in Fig. 58B, the inner side surface 233 of the molded base 23 is located.
  • the plane may be lower than the plane in which the outer side surface 234 is located, so that the top surface of the molded base 23 forms a stepped surface, that is, the plane of the inner side surface 233 of the molded base 23 is low.
  • the driver 30 is assembled to the outer side surface 234 of the molded base 23 to enable the optics assembled to the driver 30
  • the lens 10 is further held in the photosensitive path of the photosensitive element 21, thereby producing the array camera module 108.
  • the inner side surface 233 and the outer side surface 234 of the molded base 23 are in the same plane to allow the molded base
  • the top surface of the 23 forms a flat plane, wherein the filter element 40 is assembled to the inner side surface 233 of the molding base 23, and the driver 30 or the lens 10 is assembled to the molding
  • the outer side surface 234 of the base 23, or the lens 10, is assembled directly to the outer side surface 234 of the molded base 23.
  • the above structure of the molded base 23 of the present invention is merely an example, and the present invention is not limited thereto.
  • the photosensitive member 21 is first attached to the wiring board 22, and then the supporting member 25 is formed, and further, the lens 27 is disposed on the supporting member 25, Further, the wiring board 22, the photosensitive member 21, and the lens 27 are molded in a mold to form the molded base 23, thereby forming the molded photosensitive member 20. Further, the driver 30 and the lens 10 are assembled after the filter element 40 is assembled to the top surface of the molded base 23, thereby assembling and forming the array camera module 108.
  • An array camera module 109 according to another modified embodiment of the preferred embodiment of the present invention, as shown in FIG. 59, the array camera module 109 in the modified embodiment and the array camera module in the preferred embodiment.
  • the structure of the group 100 is similar, except that the arrangement position and assembly order of the filter elements 40 of the array camera module 109 in FIG. 59 are different.
  • the molded photosensitive member 20 is molded first, and then the filter member 40 disposed at the bottom of the lens and the lens 10 are assembled together in the molding.
  • the array camera module 109 of this modified embodiment shown in FIG. 59 is such that the filter element 40 and the lens 27, the support member 25, the photosensitive element 21, and the circuit board 22 are together.
  • the molded base 23 is formed in a mold, and then the driver 30 and the lens 10 are mounted on the molded base 23.
  • the filter element 40 is laminated on the photosensitive element 21.
  • a surface mount process can be used here.
  • the edge of the filter element 40 is fixedly connected by the support element 25 and conforms to the photosensitive element 21, thereby The filter element 40 is fixed between the support element 25 and the photosensitive element 21.
  • the outer side surface 2503 of the support body 251, the outer peripheral surface 2723 of the lens peripheral edge 272 are molded to the molding base 23, the support member 25, the photosensitive member 21, and the lens 27.
  • the circuit board 22 and the electronic component 26 are molded by the molding body 232 of the molding base 23.
  • the filter element 40 covers the photosensitive element 21, and the photosensitive element 21 is isolated from the sealed space 2700 and the external environment, thereby avoiding the sensitization.
  • the element 21 is damaged and dust entering the confined space 2700 is prevented from contacting the photosensitive element 21, reducing stain sensitivity.
  • the photosensitive member 21 is attached to the wiring board 22, and the filter member 40 is attached to the photosensitive member 21, and then the support is formed.
  • An element 25, and the support member 25 is connected to both ends of the filter element 40.
  • the lens 27 is disposed on the support member 25, the circuit board 22, the photosensitive element 21, and the The lens 27 is molded to form the molded base 23.
  • the back focus of the array camera module 109 assembled therefrom can be reduced, thereby reducing the height of the array camera module 109.
  • the thickness of the array camera module 109 is further reduced to some extent because there is no need to provide additional support members for the filter element 40.
  • FIG. 60 An array camera module 110 based on another variant embodiment of the preferred embodiment shown in FIG. 57 is shown in FIG. Unlike the array camera module 100 of the embodiment described in Fig. 57, in Fig. 60, the molded body 232 of the molding base 23 has a different structure. Specifically, as shown in FIG. 60, the molding base 23 of the array camera module 110 includes the molding body 232 and a lens mounting section 236, the molding body 232 and the lens mounting section. 236 is integrally molded in series. The lens mounting section 236 is used to mount the lens 10 (the lens 10 is not shown in FIG. 60), that is, when the molded photosensitive component 20 is used to assemble the array camera module 110. The lens 10 is mounted inside the lens mounting section 236 to provide a stable mounting position for the lens 10.
  • the lens mounting section 236 extends integrally upwardly to provide a support fixed position for the lens 10 so that no additional components need to be provided to mount the lens 10.
  • the molding base 23 integrally extends upwardly and is internally stepped to mold the lens 27, the support member 25, the wiring board 22, and the electronic component electronic component, respectively.
  • the inner side surface of the lens mounting section 236 is flat, so as to be suitable for mounting the unthreaded lens 10 to form a fixed focus module.
  • the lens 10 can be fixed to the lens mounting section 236 by adhesive bonding.
  • the lens 10 is mounted on the lens mounting section 236 such that the molding base 23 functions as a bracket or a lens barrel in a conventional array camera module, and the lens 10 is Provide support, fixed position, but assembly is different from traditional COB process.
  • the holder of the array camera module of the conventional COB process is fixed to the circuit board in a pasting manner, and the molding base 23 is fixed to the circuit board 22, the support member 25, and the lens 27 by an MOL molding process.
  • the molding method has better connection stability with respect to the adhesive fixing and the controllability of the process, so that the thickness of the array camera module is reduced, and further, the molding base 23 is replaced.
  • the conventional bracket provides the mounting position of the lens 10, which avoids the tilt error caused by the bracket during assembly and assembly, and reduces the cumulative tolerance of the assembly of the array camera module.
  • the filter element 40 may be disposed in the array camera module 100 as described in FIG. 57.
  • the bottom of the lens 10 may also be an array camera module 108 as described in FIG. 58B, and the filter element 40 is directly mounted on the molded body 232 of the molding base 23.
  • the inner side surface 233 may also be a surface that is attached to the photosensitive member 21 by the support member 25 before molding the molded base 23 as shown in FIG. The invention is not limited by this.
  • the array camera module of FIGS. 65 to 98 only shows a part of the deformation implementation. The invention is not limited in this respect.
  • An array camera module 115 based on another modified embodiment of the preferred embodiment of the present invention is different from the array camera module 100 of the preferred embodiment described in FIG. 57.
  • the support body 251 of the molded photosensitive module 20 of the array camera module 115 of the present invention covers a portion of the lead 24, the chip outer portion 2133 of the non-photosensitive region 213, and the chip connection The portion 2132 and the chip inner portion 2131.
  • the molding body 232 integrally molds the electronic component 26, the edge region 223 of the circuit board 22, the outer side 2503 of the support member 25, and the lens perimeter 272 The outer peripheral surface 2723, thereby forming the molded photosensitive member 20. It will be appreciated that the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27.
  • the lens 10 implemented as a fixed focus module in the embodiment of FIG. 65 is supported by the lens holder 11, and the inner side of the lens holder 11 is threaded, but it can be understood In other embodiments, the lens holder 11 may be unthreaded inside, and the invention is not limited thereto.
  • FIG. 66 shows an array camera module 116 based on another modified embodiment of the embodiment of FIG. 58B, which is different from the array camera module 108 in the embodiment of FIG.
  • the support body 251 of the molded photosensitive module 20 of the array camera module 116 covers a portion of the lead 24, the chip outer portion 2133 of the non-photosensitive region 213, the chip connecting portion 2132, and the The chip inner portion 2131 is described.
  • the molding body 232 integrally molds the electronic component 26, the edge region 223 of the circuit board 22, the outer side 2503 of the support member 25, and the lens perimeter 272 The outer peripheral surface 2723, thereby forming the molded photosensitive member 20. It will be appreciated that the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27.
  • FIG. 67 shows an array camera module 117 based on another modified embodiment of the embodiment of FIG. 59, which is different from the array camera module 109 in the embodiment of FIG. 59.
  • the support body 251 of the molded photosensitive module 20 of the array camera module 117 covers a portion of the lead 24, the chip outer portion 2133 of the non-photosensitive region 213, the chip connecting portion 2132, and the The chip inner portion 2131 is described.
  • the molding body 232 integrally molds the electronic component 26, the edge region 223 of the circuit board 22, the outer side 2503 of the support member 25, and the lens perimeter 272 The outer peripheral surface 2723, thereby forming the molded photosensitive member 20. It will be appreciated that the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27.
  • An array camera module 118 based on another modified embodiment of the embodiment of FIG. 60 is different from the array camera module 110 of the embodiment of FIG. 60, and the array of the present invention is shown in FIG.
  • the support body 251 of the molded photosensitive member 20 of the camera module 116 covers a portion of the lead 24, the chip outer portion 2133 of the non-photosensitive region 213, the chip connecting portion 2132, and the Chip inner portion 2131.
  • the molding body 232 integrally molds the electronic component 26, the edge region 223 of the circuit board 22, the outer side 2503 of the support member 25, and the lens perimeter 272 The outer peripheral surface 2723, thereby forming the molded photosensitive member 20. It will be appreciated that the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27.
  • FIG. 69 shows an array camera module 119 according to another modified embodiment of the preferred embodiment of the present invention, which is different from the array camera module 100 in the preferred embodiment described in FIG. 57.
  • the outer peripheral surface 2723, thereby forming the molded photosensitive member 20 It will be appreciated that the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27.
  • an array camera module 120 is different from the array camera module 108 in the embodiment of FIG. 58B in that the support body 251 is a portion covering the lead 24, the inner side portion 2231 of the edge region 223, the chip outer portion 2133 of the non-photosensitive region 213, the chip connecting portion 2132, and the chip inner portion 2131
  • the molding body 232 integrally molds the electronic component 26, the edge region 223 of the circuit board 22, the outer side surface 2503 of the support member 25, and the periphery of the lens periphery 272
  • the outer peripheral surface 2723 is described to thereby form the molded photosensitive member 20. It will be appreciated that the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27.
  • An array camera module 121 is different from the array camera module 109 of the embodiment of FIG. 59.
  • the support body 251 is shown in FIG. a portion covering the lead 24, the inner side portion 2231 of the edge region 223, the chip outer portion 2133 of the non-photosensitive region 213, the chip connecting portion 2132, and the chip inner portion 2131
  • the molding body 232 integrally molds the electronic component 26, the edge region 223 of the circuit board 22, the outer side surface 2503 of the support member 25, and the periphery of the lens periphery 272
  • the outer peripheral surface 2723 is described to thereby form the molded photosensitive member 20. It will be appreciated that the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27.
  • An array camera module 122 is different from the array camera module 110 of the embodiment shown in FIG. 60, and the support is shown in FIG.
  • the body 251 covers a portion of the lead 24, the wiring board inner portion 2231 of the edge region 223, the chip outer portion 2133 of the non-photosensitive region 213, the chip connecting portion 2132, and the chip inner side
  • the molding body 232 integrally molds the electronic component 26, the edge region 223 of the circuit board 22, the outer side surface 2503 of the support member 25, and the lens periphery 272 The outer peripheral surface 2723, thereby forming the molded photosensitive member 20. It will be appreciated that the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27.
  • an array camera module 123 is different from the array camera module 100 of the preferred embodiment described in FIG. 57.
  • the support main body 251 covers a portion of the lead wire 24, the circuit board outer side portion 2233 of the edge region 223, the circuit board connecting portion 2232, and the wiring board inner portion 2231.
  • the molding body 232 integrally molds the electronic component 26, the wiring board outer portion 2233 of the edge region 223 of the circuit board 22, and the supporting member 25
  • the outer side surface 2503 and the outer peripheral surface 2723 of the lens periphery 272 thereby form the molded photosensitive member 20.
  • the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27.
  • An array camera module 124 according to another modified embodiment of the preferred embodiment of the present invention is different from the array camera module 108 of the embodiment shown in FIG. 58B, as shown in FIG.
  • the support body 251 covers a portion of the lead 24, the wiring board outer portion 2233 of the edge region 223, the wiring board connecting portion 2232, and the wiring board inner portion 2231.
  • the molding body 232 integrally molds the electronic component 26, the wiring board outer portion 2233 of the edge region 223 of the circuit board 22, and the supporting member 25
  • the outer side surface 2503 and the outer peripheral surface 2723 of the lens periphery 272 thereby form the molded photosensitive member 20.
  • the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27.
  • An array camera module 125 according to another modified embodiment of the preferred embodiment of the present invention is different from the array camera module 109 of the embodiment shown in FIG. 59, as shown in FIG.
  • the support body 251 covers a portion of the lead 24, the wiring board outer portion 2233 of the edge region 223, the wiring board connecting portion 2232, and the wiring board inner portion 2231.
  • the molding body 232 integrally molds the electronic component 26, the wiring board outer portion 2233 of the edge region 223 of the circuit board 22, and the supporting member 25
  • the outer side surface 2503 and the outer peripheral surface 2723 of the lens periphery 272 thereby form the molded photosensitive member 20.
  • the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27.
  • the array camera module 125 and the array camera module 109 in the embodiment shown in FIG. 59 are different in structure, and the filter element 40 is not attached to the photosensitive element 21. That is, since the support body 251 does not cover the non-photosensitive region 213, the edge of the filter element 40 is wrapped around the upper end of the support body 251 near the top surface 2501 to avoid contact.
  • the lead 24, and thus the filter element 40 and the photosensitive element 21, are gapped. It can be understood by those skilled in the art that in other modified embodiments of the embodiment shown in FIG. 75, the edge of the filter element 40 may not be fixed by being covered by the support body 251, but The filter element 40 is directly attached to the photosensitive region 212 of the photosensitive member 21, but the present invention is not limited in this respect.
  • an array camera module 126 is different from the array camera module 110 in the embodiment shown in FIG. 60.
  • the molding body 232 integrally molds the electronic component 26, the wiring board outer portion 2233 of the edge region 223 of the circuit board 22, and the support member 25
  • the outer side surface 2503 and the outer peripheral surface 2723 of the lens periphery 272 are formed, thereby forming the molded photosensitive member 20.
  • the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27.
  • FIG. 77 shows an array camera module 127 according to another modified embodiment of the preferred embodiment of the present invention, which is different from the array camera module 100 in the preferred embodiment described in FIG. 57.
  • a portion of the support body 251 covering the lead wire 24, the circuit board outer side portion 2233 of the edge region 223, the circuit board connecting portion 2232, the circuit board inner portion 2231, and the non-photosensitive region 213 The chip outer portion 2133.
  • the molding body 232 integrally molds the electronic component 26, the wiring board outer portion 2233 of the edge region 223 of the circuit board 22, and the supporting member 25
  • the outer side surface 2503 and the outer peripheral surface 2723 of the lens periphery 272 thereby form the molded photosensitive member 20.
  • the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27.
  • An array camera module 128 according to another modified embodiment of the preferred embodiment of the present invention is different from the array camera module 108 of the embodiment shown in FIG. 58B, as shown in FIG.
  • the molding body 232 integrally molds the electronic component 26, the circuit board outer side portion 2233 of the edge region 223 of the circuit board 22, the outer side surface 2503 of the support member 25, and the The outer peripheral surface 2723 of the peripheral edge 272 of the lens forms the molded photosensitive member 20. It will be appreciated that the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27.
  • An array camera module 129 according to another modified embodiment of the preferred embodiment of the present invention is different from the array camera module 109 of the embodiment shown in FIG. 59.
  • the molding body 232 integrally molds the electronic component 26, the circuit board outer side portion 2233 of the edge region 223 of the circuit board 22, the outer side surface 2503 of the support member 25, and the The outer peripheral surface 2723 of the peripheral edge 272 of the lens forms the molded photosensitive member 20. It will be appreciated that the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27.
  • the array camera module 129 and the array camera module 109 in the embodiment shown in FIG. 59 are different in structure, and the filter element 40 is not attached to the photosensitive element 21.
  • the edge of the filter element 40 is coated on the support body.
  • the upper end of the 251 is close to the position of the top surface 2501 to avoid contact with the lead 24, so that there is a gap between the filter element 40 and the photosensitive element 21.
  • the edge of the filter element 40 may not be fixed by being covered by the support body 251, but The filter element 40 is directly attached to the photosensitive region 212 of the photosensitive member 21, but the present invention is not limited in this respect.
  • An array camera module 130 according to another modified embodiment of the preferred embodiment of the present invention is different from the array camera module 110 of the embodiment shown in FIG. 60.
  • the molding body 232 integrally molds the electronic component 26, the circuit board outer side portion 2233 of the edge region 223 of the circuit board 22, the outer side surface 2503 of the support member 25, and the The outer peripheral surface 2723 of the peripheral edge 272 of the lens forms the molded photosensitive member 20. It will be appreciated that the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27.
  • An array camera module 131 according to another modified embodiment of the preferred embodiment of the present invention is different from the array camera module 100 of the preferred embodiment described in FIG. 57, as shown in FIG.
  • the support body 251 covers the wiring board inner portion 2231 of the edge region 223 and the chip outer portion 2133 of the non-light-sensitive region 213.
  • the molding body 232 integrally molds the electronic component 26, the circuit board outer portion 2233 of the edge region 223, the circuit board connecting portion 2223, and the support
  • the outer side surface 2503 of the element 25 and the outer peripheral surface 2723 of the lens periphery 272 thereby form the molded photosensitive member 20.
  • the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27.
  • the molded body 232 is an array camera module 132 according to another modified embodiment of the preferred embodiment of the present invention, which is different from the array camera module 108 in the embodiment shown in FIG. 58B.
  • the main body 251 covers the wiring board inner portion 2231 of the edge region 223 and the chip outer portion 2133 of the non-photosensitive region 213.
  • the molding body 232 integrally molds the electronic component 26, the circuit board outer portion 2233 of the edge region 223, the circuit board connecting portion 2223, and the support
  • the outer side surface 2503 of the element 25 and the outer peripheral surface 2723 of the lens periphery 272 thereby form the molded photosensitive member 20.
  • the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27.
  • FIG. 83 shows an array camera module 133 according to another modified embodiment of the preferred embodiment of the present invention, which is different from the array camera module 109 in the embodiment shown in FIG. 59.
  • the main body 251 covers the wiring board inner portion 2231 of the edge region 223 and the chip outer portion 2133 of the non-photosensitive region 213.
  • the molding body 232 integrally molds the electronic component 26, the circuit board outer portion 2233 of the edge region 223, the circuit board connecting portion 2223, and the support
  • the outer side surface 2503 of the element 25 and the outer peripheral surface 2723 of the lens periphery 272 thereby form the molded photosensitive member 20.
  • the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27.
  • the structure of the array camera module 133 and the array camera module 109 in the embodiment shown in FIG. 59 is different in that the filter element 40 is not attached to the photosensitive element 21. That is, since the support body 251 does not cover the chip connection portion 2132 and the chip inner portion 2131 of the non-photosensitive region 213, the edge of the filter element 40 is coated on the support body. The upper end of the 251 is close to the position of the top surface 2501 to avoid contact with the lead 24, so that there is a gap between the filter element 40 and the photosensitive element 21.
  • the edge of the filter element 40 may not be fixed by being covered by the support body 251, but The filter element 40 is directly attached to the photosensitive region 212 of the photosensitive member 21, but the present invention is not limited in this respect.
  • an array camera module 134 according to another modified embodiment of the preferred embodiment of the present invention is different from the array camera module 110 of the embodiment shown in FIG.
  • the main body 251 covers the wiring board inner portion 2231 of the edge region 223 and the chip outer portion 2133 of the non-photosensitive region 213.
  • the molding body 232 integrally molds the electronic component 26, the circuit board outer portion 2233 of the edge region 223, the circuit board connecting portion 2223, and the support
  • the outer side surface 2503 of the element 25 and the outer peripheral surface 2723 of the lens periphery 272 thereby form the molded photosensitive member 20.
  • the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27.
  • FIG. 85 shows an array camera module 135 according to another modified embodiment of the preferred embodiment of the present invention, which is different from the array camera module 100 in the preferred embodiment described in FIG. 57.
  • the support body 251 is formed only on the chip inner side portion 2131 of the non-photosensitive area 213, that is, the support body 251 supports the lens 27 in this embodiment.
  • the lead 24 and each of the two connecting ends are molded and fixed by the molded base 23.
  • the molding body 232 integrally molds the electronic component 26, the lead 24, the edge region 223 of the wiring board 22, and the non-photosensitive region 213
  • the chip outer portion 2133, the chip connecting portion 2132, the outer side surface 2503 of the support member 25, and the outer peripheral surface 2723 of the lens peripheral edge 272 are formed, thereby forming the molded photosensitive member 20.
  • the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27.
  • the 86 is an array camera module 136 according to another modified embodiment of the preferred embodiment of the present invention, which is different from the array camera module 108 in the embodiment shown in FIG. 58B.
  • the main body 251 is formed only on the chip inner side portion 2131 of the non-photosensitive area 213, that is, the support main body 251 supports the lens 27 in this embodiment.
  • the lead 24 and each of the two connecting ends are molded and fixed by the molded base 23.
  • the molding body 232 integrally molds the electronic component 26, the lead 24, the edge region 223 of the wiring board 22, and the non-photosensitive region 213
  • the chip outer portion 2133, the chip connecting portion 2132, the outer side surface 2503 of the support member 25, and the outer peripheral surface 2723 of the lens peripheral edge 272 are formed, thereby forming the molded photosensitive member 20.
  • the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27.
  • an array camera module 137 according to another modified embodiment of the preferred embodiment of the present invention is different from the array camera module 109 in the embodiment shown in FIG. 59.
  • the body 251 is formed only on the chip inner side portion 2131 of the 213, that is, the support body 251 supports the lens 27 in this embodiment.
  • the lead 24 and each of the two connecting ends are molded and fixed by the molded base 23.
  • the molding body 232 integrally molds the electronic component 26, the lead 24, the edge region 223 of the circuit board 22, and the outside of the chip of the 213 The portion 2133, the chip connecting portion 2132, the outer side surface 2503 of the support member 25, and the outer peripheral surface 2723 of the lens peripheral edge 272, thereby forming the molded photosensitive member 20. It will be appreciated that the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27.
  • an array camera module 138 according to another modified embodiment of the preferred embodiment of the present invention is different from the array camera module 110 of the embodiment shown in FIG.
  • the main body 251 is formed only on the chip inner side portion 2131 of the non-photosensitive area 213, that is, the support main body 251 supports the lens 27 in this embodiment.
  • the lead 24 and each of the two connecting ends are molded and fixed by the molded base 23.
  • the molding body 232 integrally molds the electronic component 26, the lead 24, the edge region 223 of the wiring board 22, and the non-photosensitive region 213
  • the chip outer portion 2133, the chip connecting portion 2132, the outer side surface 2503 of the support member 25, and the outer peripheral surface 2723 of the lens peripheral edge 272 are formed, thereby forming the molded photosensitive member 20.
  • the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27.
  • an array camera module 139 is different from the array camera module 100 of the preferred embodiment described in FIG. 57.
  • the support body 251 is formed only on the wiring board outer portion 2233 of the edge region 223. That is, the support body 251 supports the lens 27 in this embodiment and does not cover the lead 24.
  • the molding body 232 integrally molds the electronic component 26, the circuit board outer portion 2233 of the edge region 223, and the outer side surface 2503 of the support member 25. And the outer peripheral surface 2723 of the lens periphery 272, thereby forming the molded photosensitive member 20.
  • the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27. Since the lead 24 is disposed in the sealed space 2700, the lead 24 is not damaged when the 23 is molded, and after the 23 is formed, the lead 24 can be protected. Not affected by the external environment.
  • an array camera module 140 is different from the array camera module 108 of the embodiment shown in FIG. 58B in that the support The body 251 is formed only on the wiring board outer portion 2233 of the edge region 223. That is, the support body 251 supports the lens 27 in this embodiment and does not cover the lead 24.
  • the molding body 232 integrally molds the electronic component 26, the circuit board outer portion 2233 of the edge region 223, and the outer side surface 2503 of the support member 25. And the outer peripheral surface 2723 of the lens periphery 272, thereby forming the molded photosensitive member 20.
  • the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27.
  • an array camera module 141 is different from the array camera module 109 of the embodiment shown in FIG. 59 in that the support The body 251 is formed only on the wiring board outer portion 2233 of the edge region 223. That is, the support body 251 supports the lens 27 in this embodiment and does not cover the lead 24.
  • the molding body 232 integrally molds the electronic component 26, the circuit board outer portion 2233 of the edge region 223, and the outer side surface 2503 of the support member 25. And the outer peripheral surface 2723 of the lens periphery 272, thereby forming the molded photosensitive member 20.
  • the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27.
  • the structure of the array camera module 144 and the array camera module 109 in the embodiment shown in FIG. 59 is different in that the filter element 40 is not attached to the photosensitive element 21. That is, since the support main body 251 does not cover the wiring board inner side portion 2231 and the circuit board connecting portion 2232 of the non-photosensitive area 213 and the edge area 223, the edge of the filter element 40 The upper end of the support body 251 is wrapped near the top surface 2501 to avoid contact with the lead wires 24, so that there is a gap between the filter element 40 and the photosensitive element 21.
  • the edge of the filter element 40 may not be fixed by being covered by the support body 251, but The filter element 40 is directly attached to the photosensitive region 212 of the photosensitive member 21, but the present invention is not limited in this respect.
  • an array camera module 142 according to another modified embodiment of the preferred embodiment of the present invention is different from the array camera module 110 of the embodiment shown in FIG.
  • the body 251 is formed only on the wiring board outer portion 2233 of the edge region 223. That is, the support body 251 supports the lens 27 in this embodiment and does not cover the lead 24.
  • the molding body 232 integrally molds the electronic component 26, the circuit board outer portion 2233 of the edge region 223, and the outer side surface 2503 of the support member 25. And the outer peripheral surface 2723 of the lens periphery 272, thereby forming the molded photosensitive member 20.
  • the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27.
  • FIG. 93 shows an array camera module 143 according to another modified embodiment of the preferred embodiment of the present invention, which is different from the array camera module 100 in the preferred embodiment described in FIG. 57, and
  • the support body 251 is not provided, and the lens periphery 272 of the lens 27 is directly attached to the non-photosensitive region 213 of the photosensitive member 21.
  • the molding main body 232 integrally molds the electronic component 26, the edge region 223 of the wiring board 22, and the chip outer portion 2133 of the non-photosensitive region 213. And the chip connecting portion 2132, the outer peripheral surface 2723 of the lens peripheral edge 272, thereby forming the molded photosensitive member 20.
  • the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27.
  • the lens 27 and the photosensitive element 21 may be connected by integral molding of the molding body 232, or may be joined together by a surface mounting process in other embodiments, but the present invention is Aspects are not subject to this limitation.
  • an array camera module 144 according to another modified embodiment of the preferred embodiment of the present invention is different from the array camera module 108 in the embodiment shown in FIG. 58B.
  • the support body 251, the lens periphery 272 of the lens 27 is directly attached to the non-photosensitive region 213 of the photosensitive element 21.
  • the molding main body 232 integrally molds the electronic component 26, the edge region 223 of the wiring board 22, and the chip outer portion 2133 of the non-photosensitive region 213. And the chip connecting portion 2132, the outer peripheral surface 2723 of the lens peripheral edge 272, thereby forming the molded photosensitive member 20.
  • the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27.
  • An array camera module 145 according to another modified embodiment of the preferred embodiment of the present invention is different from the array camera module 109 of the embodiment shown in FIG. 59, and is not provided.
  • the support body 251, the lens periphery 272 of the lens 27 is directly attached to the non-photosensitive region 213 of the photosensitive element 21.
  • the molding main body 232 integrally molds the electronic component 26, the edge region 223 of the wiring board 22, and the chip outer portion 2133 of the non-photosensitive region 213. And the chip connecting portion 2132, the outer peripheral surface 2723 of the lens peripheral edge 272, thereby forming the molded photosensitive member 20.
  • the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27.
  • the lens 27, the filter element 40, and the photosensitive element 21 may be connected by integral molding of the molding body 232, or may be connected together by a surface mount process in other embodiments. However, the invention is not limited in this respect.
  • FIGS. 57 to 60 and FIGS. 65 to 98 the lens 10 and the driver 30 are not shown in the drawings, and the present invention is not limited thereto. limit.
  • An array camera module 146 is different from the array camera module 110 of the embodiment shown in FIG. 60, and is not provided.
  • the support body 251, the lens periphery 272 of the lens 27 is directly attached to the non-photosensitive region 213 of the photosensitive element 21.
  • the molding main body 232 integrally molds the electronic component 26, the edge region 223 of the wiring board 22, and the chip outer portion 2133 of the non-photosensitive region 213. And the chip connecting portion 2132, the outer peripheral surface 2723 of the lens peripheral edge 272, thereby forming the molded photosensitive member 20.
  • the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27.
  • An array camera module 147 according to another modified embodiment of the preferred embodiment of the present invention is different from the array camera module 100 of the preferred embodiment described in FIG. 57, as shown in FIG.
  • the arrangement of the photosensitive element 21 on the wiring board 22 is a sunken type. That is, the wiring board 22 has a photosensitive member recess 224, and the photosensitive member 21 is disposed in the photosensitive member recess 224.
  • the upper surface of the photosensitive member 21 is parallel or lower than the upper surface of the wiring board 22, that is, the chip mounting region 222 of the 22 is lower than the manner in which the edge region 223 is disposed. It is defined as a sinking type. Since the photosensitive element 21 is set to be sunken, the overall thickness of the array camera module 147 assembled is further reduced, which satisfies the demand of the electronic device for a thin and thin array camera module.
  • an array camera module 148 according to another modified embodiment of the embodiment shown in FIG. 97 is different from the array camera module 147 of the embodiment shown in FIG.
  • the chip mounting area of the circuit board 22 has a photosensitive member receiving hole 225.
  • the photosensitive member accommodating hole 225 is a through hole, and the photosensitive member 21 is disposed in the photosensitive member accommodating hole 225.
  • the photosensitive member 21 is held in the photosensitive member accommodating hole 225, and further, the supporting member 25 also reinforces the connection between the photosensitive member 21 and the wiring board 22, which can avoid the The photosensitive member 21 is detached from the photosensitive member accommodating hole 225 of the wiring board 22.
  • FIGS. 58A to 60 and FIGS. 65 to 96 can also be applied to the embodiments shown in FIGS. 97 and 98, in which the present invention is Not limited to this.
  • an array camera module 149 is different from the camera module 108 of the embodiment shown in FIG. 58B in that the lens 27 is The lens periphery 272 is not provided, and the lens body 271 of the lens 27 is directly supported by the support body 251, and the bottom of the support body 251 is directly attached to the non-photosensitive area of the photosensitive element 21. 213.
  • the molding main body 232 integrally molds the electronic component 26, the edge region 223 of the wiring board 22, and the chip outer portion 2133 of the non-photosensitive region 213. And the chip connecting portion 2132, the outer edge of the lens body 271, thereby forming the molded photosensitive member 20.
  • the outer edge of the lens body 271 is supported by the support body 251, and may be covered by the molding body 232 as shown in FIG. 99, and may be in other embodiments.
  • the present invention is only wrapped by the support body 251, and the present invention is not limited in this respect.
  • an array camera module 150 according to another modified embodiment of the preferred embodiment of the present invention is different from the camera module 108 in the embodiment shown in FIG. 58B.
  • the support body 251 is described, and the bottom of the lens periphery 272 of the lens 27 extends downward to form a lens support leg 2720.
  • the lens support leg 2720 is supported by the circuit board outer portion 2233 of the edge region 223. That is, the lens support foot 2720 supports the lens 27 in this embodiment and does not cover the lead 24.
  • the molding body 232 integrally molds the electronic component 26, the circuit board outer portion 2233 of the edge region 223, and the outer side surface 2503 of the support member 25.
  • the molded body 232 may also cover part or all of the top surface 2721 of the lens perimeter 272 to enhance the stability of the lens 27.
  • the support body 251 and the lens body 271 can prevent the respective portions of the photosensitive element 21 and the wiring board 22 from being subjected to the MOL molding process.
  • the displacement is uneven, and the molding material can be prevented from entering between the photosensitive member 21 and the lens 27 to ensure the flatness of the photosensitive member 21.
  • the array camera module 100 can be applied to various electronic devices, such as but not limited to smart phones, wearable devices, computer devices, televisions, vehicles, cameras, monitoring devices, and the like.
  • the array camera module cooperates with the electronic device to realize image acquisition and reproduction of a target object.
  • the array camera module further includes a bracket 50, wherein the bracket 50 has at least two installation spaces 51, and each of the installation spaces 51 is respectively connected to The two sides of the bracket 50, that is, each of the mounting spaces 51, may respectively form one passage.
  • Each of the drivers 30 is mounted to each of the mounting spaces 51 of the bracket 50 to maintain each of the drivers 30 in a stable state by the brackets 50, thereby ensuring that each of the actuators 30 is assembled
  • the coaxiality of each of the lenses 10 of the driver 30 increases the intensity of the array camera module to further improve the imaging quality of the array camera module.
  • the filler filled between the outer casing of each of the drivers 30 and the inner wall of the bracket 50 may be glue.
  • both of them may be zoom modules, or both of them are fixed.
  • a focus module or one is a zoom module, and the other is a fixed focus module; or a zoom module or a fixed focus module camera module including the molded base 23, and another molded base
  • the camera module of the prior art is placed.
  • the present invention further provides an electronic device 200 with an array camera module, wherein the electronic device 200 includes at least one array of camera modules 100, wherein each of the array camera modules 100 is configured to acquire graphics.
  • Each of the array camera modules 100 further includes at least two lenses 10 and at least two molded photosensitive members 20, each of the molded photosensitive members 20 including a lens 27, a supporting member 25, and a photosensitive member 21.
  • the connector 221 further includes a lens body 271 and a lens periphery 272, the lens periphery 272 extending integrally with the lens body 271.
  • the molding base 23 includes a molding body 232 and has a molding hole 231 in which the lens 27 is molded when a molding process is performed through a molding die 900 to mold the molding body 232.
  • the lens body 271 forms the molding hole 231 at the time of demolding, a lens periphery 272 of the lens 27 is attached to the support member 25, wherein the photosensitive region 212 of the photosensitive member 21 corresponds to the mold

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Studio Devices (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Cameras In General (AREA)
  • Blocking Light For Cameras (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Lens Barrels (AREA)

Abstract

本发明提供一摄像模组及其模塑感光组件和制造方法以及带有摄像模组的电子设备，所述模塑感光组件包括一镜片、一感光元件、一线路板、一模塑基座以及一支承元件，其中所述感光元件设置于所述线路板上其中通过模塑工艺使所述模塑基座与所述镜片、所述支承元件和所述感光元件以及所述线路板形成一体结构，所述摄像模组及其模塑感光组件能够降低污点敏感度以及缩短镜头通光孔上面的镜头平面到感光元件的感光平面的距离。

Description

摄像模组及其模塑感光组件和制造方法以及电子设备 技术领域
本发明涉及光学成像领域，特别涉及一摄像模组及其模塑感光组件和制造方法以及电子设备。
背景技术
近年来，用于获取影像的摄像模组越来越普遍地被应用于诸如个人电子产品、汽车领域、医学领域等，例如摄像模组已成为了诸如智能手机、平板电脑等便携式电子设备的标准配件之一。被应用于便携式电子设备的摄像模组不仅能够获取影像，而且还能够帮助便携式电子设备实现即时视频通话等功能。随着便携式电子设备日趋轻薄化的发展趋势和使用者对于摄像模组的成像品质要求越来越高，对摄像模组的整体尺寸和摄像模组的成像能力都提出了更加苛刻的要求。也就是说，便携式电子设备的发展趋势要求摄像模组在减少尺寸的基础上进一步提高和强化成像能力。
众所周知的是，摄像模组的成像能力的提高是建立在为摄像模组配置具有更大成像面积的感光元件和更多驱动电阻、电容等被动电子元器件的基础上，正因为摄像模组需要被配置具有更大成像面积的感光元件和更多被动电子元器件，要求摄像模组只能通过改进封装工艺才能够降低摄像模组的尺寸。现在普遍采用的摄像模组封装工艺是COB(Chip On Board)封装工艺，即，摄像模组的线路板、感光元件、支架等分别被制成，然后依次将被动电子元器件、感光元件和支架封装在线路板上，为了保证摄像模组的成像品质，需要在每两个部件之间填充胶水，例如在支架和线路板之间填充胶水以将支架封装在线路板上，并且通过胶水实现支架和线路板的调平，因此，COB封装工艺导致摄像模组的尺寸无法被有效地减少，而且摄像模组的封装效率比较低。
发明内容
本发明的目的在于提供一种摄像模组及其模塑感光组件和制造方法以及电子设备，所述摄像模组以及模塑感光组件能够降低污点敏感度以及缩短镜头通光孔上面的镜头平面到感光元件的感光平面的距离。
本发明的另一目的在于提供一种摄像模组及其模塑感光组件和制造方法以及电子设备，所述摄像模组以及模塑感光组件包括至少一模塑基座和至少一镜片，所述模塑基座的至少一模塑主体在模塑工艺中被模塑包覆于所述镜片的至少一镜片周缘，从而能够降低污点敏感度以及缩短镜头通光孔上面的镜头平面到感光元件的感光平面的距离。
本发明的另一目的在于提供一种摄像模组及其模塑感光组件和制造方法以及电子设备，所述摄像模组以及模塑感光组件的所述镜片经过了热硬化处理，能够在模塑工艺过程中耐受住高温的模塑环境温度。
本发明的另一目的在于提供一种摄像模组及其模塑感光组件和制造方法以及电子设备，所述摄像模组以及模塑感光组件的所述镜片和至少一感光元件或者至少一线路板形成至少一密闭空间，这样当在模塑工艺中形成所述模塑基座的成型材料在流体态时不会污染所述感光元件，降低污点敏感度。
本发明的另一目的在于提供一种摄像模组及其模塑感光组件和制造方法以及电子设备，所述摄像模组以及模塑感光组件还包括至少一支承元件，所述支承元件能够有效地提高所述摄像模组的产品良率，并改善所述摄像模组的成像品质。
本发明的另一目的在于提供一种摄像模组及其模塑感光组件和制造方法以及电子设备，所述摄像模组以及模塑感光组件的所述镜片、所述支承元件和所述感光元件或者所述线路板 形成至少一密闭空间，这样当在模塑工艺中形成所述模塑基座的成型材料不会污染所述感光元件，降低污点敏感度。
本发明的另一目的在于提供一种摄像模组及其模塑感光组件和制造方法以及电子设备，所述模塑主体包覆所述镜片的所述镜片周缘的至少一部分、所述线路板的至少一部分以及所述支承主体的所述外侧面，从而避免所述感光元件的所述感光区域被损坏或者被污染。
本发明的另一目的在于提供一种摄像模组及其模塑感光组件和制造方法以及电子设备，所述模塑主体还包覆所述镜片周缘的一顶面的部分或全部，以增强所述镜片的稳固性。
为了实现上述至少一个目的，本发明提供了一模塑感光组件，应用于一摄像模组，其包括：
一镜片；
一感光元件；
一线路板，
一模塑基座；以及
一环形的支承元件，其中通过模塑工艺使所述模塑基座与所述镜片、所述支承元件和所述线路板形成一体结构。
本发明还提供一具有模塑感光组件的摄像模组，其包括上述的模塑感光组件和一镜头，其中光线经所述镜头和所述镜片折射后汇聚至所述感光元件。
根据本发明的另一方面，还提供了一电子设备，包括一个或多个所述的带有模塑感光组件的摄像模组像。在一些实施例中，所述电子设备选自手机、电脑、电视机、智能可穿载设备、交通工具、照相机和监控装置。
附图说明
图1是根据本发明的一个优选实施例的一摄像模组的一模塑感光组件的一感光元件通过一组引线连接于一线路板的示意图。
图2是根据本发明的上述优选实施例的所述摄像模组的所述模塑感光组件的示意图。
图3是根据本发明的上述优选实施例的所述摄像模组的所述模塑感光组件的示意图。
图4是根据本发明的上述优选实施例的所述摄像模组的所述模塑感光组件由一成型模具进行模塑工艺时的示意图。
图5是根据本发明的上述优选实施例的所述摄像模组的所述模塑感光组件由所述成型模具进行模塑工艺时的示意图。
图6是根据本发明的上述优选实施例的所述摄像模组的所述模塑感光组件的示意图。
图7是根据本发明的上述优选实施例的所述摄像模组的示意图。
图8A是基于本发明的上述优选实施例的所述摄像模组的另一变形实施例的示意图。
图8B是基于本发明的上述优选实施例的所述摄像模组的另一变形实施例的示意图。
图9是基于本发明的上述优选实施例的所述摄像模组的另一变形实施例的示意图。
图10是基于本发明的上述优选实施例的所述摄像模组的另一变形实施例的示意图。
图11是带有本发明的上述摄像模组的一电子设备的框图示意图。
图12是基于本发明的上述实施例的所述摄像模组被应用于一移动设备上的示意图。
图13是基于本发明的上述实施例的所述摄像模组被实施为一双摄模组的示意图。
图14是基于本发明的上述实施例的一阵列摄像模组的示意图。
图15是基于本发明的上述优选实施例的所述摄像模组的另一变形实施例的示意图。
图16是基于本发明的上述优选实施例的所述摄像模组的另一变形实施例的示意图。
图17是基于本发明的上述优选实施例的所述摄像模组的另一变形实施例的示意图。
图18是基于本发明的上述优选实施例的所述摄像模组的另一变形实施例的示意图。
图19是基于本发明的上述优选实施例的所述摄像模组的另一变形实施例的示意图。
图20是基于本发明的上述优选实施例的所述摄像模组的另一变形实施例的示意图。
图21是基于本发明的上述优选实施例的所述摄像模组的另一变形实施例的示意图。
图22是基于本发明的上述优选实施例的所述摄像模组的另一变形实施例的示意图。
图23是基于本发明的上述优选实施例的所述摄像模组的另一变形实施例的示意图。
图24是基于本发明的上述优选实施例的所述摄像模组的另一变形实施例的示意图。
图25是基于本发明的上述优选实施例的所述摄像模组的另一变形实施例的示意图。
图26是基于本发明的上述优选实施例的所述摄像模组的另一变形实施例的示意图。
图27是基于本发明的上述优选实施例的所述摄像模组的另一变形实施例的示意图。
图28是基于本发明的上述优选实施例的所述摄像模组的另一变形实施例的示意图。
图29是基于本发明的上述优选实施例的所述摄像模组的另一变形实施例的示意图。
图30是基于本发明的上述优选实施例的所述摄像模组的另一变形实施例的示意图。
图31是基于本发明的上述优选实施例的所述摄像模组的另一变形实施例的示意图。
图32是基于本发明的上述优选实施例的所述摄像模组的另一变形实施例的示意图。
图33是基于本发明的上述优选实施例的所述摄像模组的另一变形实施例的示意图。
图34是基于本发明的上述优选实施例的所述摄像模组的另一变形实施例的示意图。
图35是基于本发明的上述优选实施例的所述摄像模组的另一变形实施例的示意图。
图36是基于本发明的上述优选实施例的所述摄像模组的另一变形实施例的示意图。
图37是基于本发明的上述优选实施例的所述摄像模组的另一变形实施例的示意图。
图38是基于本发明的上述优选实施例的所述摄像模组的另一变形实施例的示意图。
图39是基于本发明的上述优选实施例的所述摄像模组的另一变形实施例的示意图。
图40是基于本发明的上述优选实施例的所述摄像模组的另一变形实施例的示意图。
图41是基于本发明的上述优选实施例的所述摄像模组的另一变形实施例的示意图。
图42是基于本发明的上述优选实施例的所述摄像模组的另一变形实施例的示意图。
图43是基于本发明的上述优选实施例的所述摄像模组的另一变形实施例的示意图。
图44是基于本发明的上述优选实施例的所述摄像模组的另一变形实施例的示意图。
图45是基于本发明的上述优选实施例的所述摄像模组的另一变形实施例的示意图。
图46是基于本发明的上述优选实施例的所述摄像模组的另一变形实施例的示意图。
图47是基于本发明的上述优选实施例的所述摄像模组的另一变形实施例的示意图。
图48是基于本发明的上述优选实施例的所述摄像模组的另一变形实施例的示意图。
图49是基于本发明的上述优选实施例的所述摄像模组的另一变形实施例的示意图。
图50是基于本发明的上述优选实施例的所述摄像模组的另一变形实施例的示意图。
图51是根据本发明的一个优选实施例的一阵列摄像模组的一模塑感光组件的一感光元件通过一组引线连接于一线路板的示意图。
图52是根据本发明的上述优选实施例的所述阵列摄像模组的所述模塑感光组件的示意图。
图53是根据本发明的上述优选实施例的所述阵列摄像模组的示意图。
图54是根据本发明的上述优选实施例的所述阵列摄像模组的所述模塑感光组件由一成型模具进行模塑工艺时的示意图。
图55是根据本发明的上述优选实施例的所述阵列摄像模组的所述模塑感光组件由所述成型模具进行模塑工艺时的示意图。
图56是根据本发明的上述优选实施例的所述阵列摄像模组的所述模塑感光组件由所述成型模具进行模塑工艺时的示意图。
图57是根据本发明的上述优选实施例的所述阵列摄像模组的所述模塑感光组件的示意图。
图58A是基于本发明的上述优选实施例的所述阵列摄像模组的另一变形实施例的示意图。
图58B是基于本发明的上述优选实施例的所述阵列摄像模组的另一变形实施例的示意 图。
图59是基于本发明的上述优选实施例的所述阵列摄像模组的另一变形实施例的示意图。
图60是基于本发明的上述优选实施例的所述阵列摄像模组的另一变形实施例的示意图。
图61是带有本发明的上述各实施例中所述阵列摄像模组的一电子设备的框图示意图。
图62是基于本发明的上述各实施例的所述阵列摄像模组被应用于一移动设备上的示意图。
图63是基于本发明的上述各实施例的所述阵列摄像模组被实施为一双摄模组的示意图。
图64是基于本发明的上述各实施例的所述阵列摄像模组在模塑工艺成型后的示意图。
图65是基于本发明的上述优选实施例的所述阵列摄像模组的另一变形实施例的示意图。
图66是基于本发明的上述优选实施例的所述阵列摄像模组的另一变形实施例的示意图。
图67是基于本发明的上述优选实施例的所述阵列摄像模组的另一变形实施例的示意图。
图68是基于本发明的上述优选实施例的所述阵列摄像模组的另一变形实施例的示意图。
图69是基于本发明的上述优选实施例的所述阵列摄像模组的另一变形实施例的示意图。
图70是基于本发明的上述优选实施例的所述阵列摄像模组的另一变形实施例的示意图。
图71是基于本发明的上述优选实施例的所述阵列摄像模组的另一变形实施例的示意图。
图72是基于本发明的上述优选实施例的所述阵列摄像模组的另一变形实施例的示意图。
图73是基于本发明的上述优选实施例的所述阵列摄像模组的另一变形实施例的示意图。
图74是基于本发明的上述优选实施例的所述阵列摄像模组的另一变形实施例的示意图。
图75是基于本发明的上述优选实施例的所述阵列摄像模组的另一变形实施例的示意图。
图76是基于本发明的上述优选实施例的所述阵列摄像模组的另一变形实施例的示意图。
图77是基于本发明的上述优选实施例的所述阵列摄像模组的另一变形实施例的示意图。
图78是基于本发明的上述优选实施例的所述阵列摄像模组的另一变形实施例的示意图。
图79是基于本发明的上述优选实施例的所述阵列摄像模组的另一变形实施例的示意图。
图80是基于本发明的上述优选实施例的所述阵列摄像模组的另一变形实施例的示意图。
图81是基于本发明的上述优选实施例的所述阵列摄像模组的另一变形实施例的示意图。
图82是基于本发明的上述优选实施例的所述阵列摄像模组的另一变形实施例的示意 图。
图83是基于本发明的上述优选实施例的所述阵列摄像模组的另一变形实施例的示意图。
图84是基于本发明的上述优选实施例的所述阵列摄像模组的另一变形实施例的示意图。
图85是基于本发明的上述优选实施例的所述阵列摄像模组的另一变形实施例的示意图。
图86是基于本发明的上述优选实施例的所述阵列摄像模组的另一变形实施例的示意图。
图87是基于本发明的上述优选实施例的所述阵列摄像模组的另一变形实施例的示意图。
图88是基于本发明的上述优选实施例的所述阵列摄像模组的另一变形实施例的示意图。
图89是基于本发明的上述优选实施例的所述阵列摄像模组的另一变形实施例的示意图。
图90是基于本发明的上述优选实施例的所述阵列摄像模组的另一变形实施例的示意图。
图91是基于本发明的上述优选实施例的所述阵列摄像模组的另一变形实施例的示意图。
图92是基于本发明的上述优选实施例的所述阵列摄像模组的另一变形实施例的示意图。
图93是基于本发明的上述优选实施例的所述阵列摄像模组的另一变形实施例的示意图。
图94是基于本发明的上述优选实施例的所述阵列摄像模组的另一变形实施例的示意图。
图95是基于本发明的上述优选实施例的所述阵列摄像模组的另一变形实施例的示意图。
图96是基于本发明的上述优选实施例的所述阵列摄像模组的另一变形实施例的示意图。
图97是基于本发明的上述优选实施例的所述阵列摄像模组的另一变形实施例的示意图。
图98是基于本发明的上述优选实施例的所述阵列摄像模组的另一变形实施例的示意图。
图99是基于本发明的上述优选实施例的所述阵列摄像模组的另一变形实施例的立体示意图。
图100是基于本发明的上述优选实施例的所述阵列摄像模组的另一变形实施例的立体示意图。
图101是根据本发明的上述实施例的所述阵列摄像模组的立体示意图。
图102是根据本发明的上述实施例的所述阵列摄像模组的立体示意图。
图103是根据本发明的上述实施例的所述阵列摄像模组的立体示意图。
具体实施方式
以下描述用于揭露本发明以使本领域技术人员能够实现本发明。以下描述中的优选实施例只作为举例，本领域技术人员可以想到其他显而易见的变型。在以下描述中界定的本发明的基本原理可以应用于其他实施方案、变形方案、改进方案、等同方案以及没有背离本发明的精神和范围的其他技术方案。
本领域技术人员应理解的是，在本发明的揭露中，术语“纵向”、“横向”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”等指示的方位或位置关系是基于附图所示的方位或位置关系，其仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此上述术语不能理解为对本发明的限制。
可以理解的是，术语“一”应理解为“至少一”或“一个或多个”，即在一个实施例中，一个元件的数量可以为一个，而在另外的实施例中，该元件的数量可以为多个，术语“一”不能理解为对数量的限制。
如图1至图7为本发明的一优选实施例的一摄像模组100，其中所述摄像模组100包括一镜头10和一模塑感光组件20。所述模塑感光组件20进一步包括一感光元件21、一线路板22、一模塑基座23、一组引线24、一支承元件25、多个电子元器件26以及一镜片27。其中各所述引线24的两端分别延伸以被连接于所述感光元件21的一非感光区域213和所述线路板22，所述模塑基座23一体地成型于所述线路板22，以使所述模塑基座23、所述线路板22以及所述镜片27形成一体式结构。各所述电子元器件26可以通过诸如SMT(Surface Mount Technology)工艺被贴装于所述线路板22。所述镜头10和所述镜片27被设置于所述模塑感光组件20的所述感光元件21的感光路径。被物体反射的光线自所述镜头10以及所述镜片27进入所述摄像模组100的内部，以在后续被所述感光元件21接收和进行光电转化，从而得到与物体相关联的影像。在本发明中，这种所述模塑基座23被模塑成型在所述热硬化影片27的模塑工艺被定义为MOL(molding on lens)模塑工艺，以和传统COB(chip on board)模塑工艺相区别。所述镜片27的设置能够降低光学的TTL(镜头通光孔上面的镜头平面到芯片的感光平面的距离)，从而在不影响光学性能的前提下使所述摄像模组100的尺寸进一步减小，满足电子设备对搭载小尺寸的摄像模组100的需求。同时，所述镜片27的设置也能够降低污点敏感度。例如在一实施例中，可以降低50％的污点敏感度。即优选地，所述镜头10包括多个镜片元件，所述镜头10的所述镜片元件和所述镜片27形成一光学系统，经过所述光学系统的光线被汇聚至所述感光元件21。也就是说，传统镜头在本发明中被实施为两部分，一部分是所述镜头10，另一部分是所述镜片27，所述镜片27是具有折光能力的镜片，所述镜头10和所述镜片27一起起到将光线折射的作用，从而将光线汇聚至所述感光元件21，这样能够有效降低整个光学系统的TTL。从另外一方面说，本发明中，所述镜头10和所述镜片27形成一镜头组件，所述镜头组件的其中一片镜片成为外置镜片，即所述镜片27，所述镜片27被所述模塑基座23一体地封装，从而能够减小所述摄像模组的尺寸。
在本发明的这个优选实施例中，优选地，所述镜片27被实施为一热硬化性质的镜片，即所述镜片被实施为一热硬化镜片，从而所述镜片27在进行模塑工艺能够承受住模塑工艺中的环境温度。例如，在一实施例的模塑工艺中能够承受175℃的模塑环境温度。也就是说，在模塑工艺之前，耐高温的且经过了热硬化处理的所述镜片27被连接于所述支承元件25，且和所述线路板22以及所述感光元件21一起被放置于模具中，流体的固化模塑材料围绕所述支承元件25以及所述镜片27的外表面模塑一体成型所述模塑基座23，从而所述模塑基座23能够一体地成型于所述线路板22，也就是说，所述模塑基座23、所述线路板22以及所述镜片27形成一体式结构。本领域的技术人员可以理解的是，本发明的所述镜片27不仅仅可以是热硬化镜片，还可以是其他性质的镜片，本发明并不受此限制。
进一步地，所述镜片27包括一镜片主体271和设置在所述镜片主体271周围的一镜片周缘272。由于所述镜片27为精密的光学元件，所述镜片主体271的边缘较薄。而设置于所述镜片主体271边缘的且为一体连接的所述镜片周缘272为增厚式支架设计，能够承载所述镜片主体271，从而不影响所述镜片主体271的光学性能的同时能够使所述镜片主体27在模具中被一体模塑连接于所述模塑基座23。也就是说，在所述模塑基座23被成型之前，所述镜片27的所述镜片周缘272被设置于所述感光元件21的所述非感光区域213，所述镜 片27的所述镜片主体271被设置于所述模塑感光组件20的所述感光元件21的感光路径；在所述模塑基座23成型之后，所述模塑基座23包覆所述线路板22、所述感光元件21的所述非感光区域213、所述支承元件25的一部分以及所述镜片27的所述镜片周缘272，以形成所述模塑感光组件20。
值得一提的是，所述支承元件25能够有效地提高所述摄像模组100的产品良率，并改善所述摄像模组100的成像品质。进一步地，所述支承元件25包括一环形的支承主体251和具有一通孔252，其中所述支承主体251被设置于所述感光元件21的所述非感光区域213，以使所述感光元件21的一感光区域212对应于所述支承元件25的所述通孔252以及所述镜片27的所述镜片主体271，从而在进行模塑工艺时，所述支承主体251以及所述镜片27能够保护所述感光元件21的所述感光区域212。更进一步地，所述支承元件25具有一顶表面2501、一内侧面2502以及一外侧面2503，其中所述顶表面2501的两侧分别连接于所述内侧面2502和所述外侧面2503。所述支承元件25的朝向所述感光元件21的一侧被定义为所述支承元件25的所述内侧面2502，所述支承元件25的朝向所述线路板22的一侧被定义为所述支承元件25的所述外侧面2503。所述支承元件25的一内侧面2502用于形成所述支承元件25的所述通孔252。
值得一提的是，所述镜片周缘272具有一顶面2721、一底面2722以及一外周面2723。其中所述镜片周缘272的所述外周面2733的两侧分别连接于所述镜片周缘272的所述顶面2721和所述底面2722。也就是说，所述镜片周缘272朝向所述线路板22的一侧被定义为所述镜片周缘272的所述外周面2723。值得一提的是，所述镜片主体271具有一镜片外面2711和一镜片内面2712。也就是说说，所述镜片主体271朝向所述感光元件21的一侧被定义为所述镜片主体271的所述镜片内面2712，而和所述镜片周缘272的所述顶面2721连接的一面被定义为所述镜片主体271的所述镜片外面2711。
进一步地，所述镜片27被贴合于所述支承主体251后和所述线路板22以及所述感光元件21一起被放入模具中进行模塑工艺。流体的热固化模塑材料经过热固化后形成所述模塑基座23，所述模塑基座23在成型后包覆所述支承主体251的所述外侧面2503和所述镜片周缘271的所述外周面2723。当然，在其他实施例中，所述模塑基座23在成型后还包覆所述镜片周缘271的所述顶面2721的全部或者一部分。
更进一步地，所述感光元件21包括所述感光区域212和所述非感光区域213，其中所述感光元件21的所述感光区域212和所述非感光区域213一体地成型，并且所述感光区域212位于所述感光元件21的中部，所述非感光区域213位于所述感光元件21的外部，并且所述非感光区域213围绕所述感光区域212一周。被物体反射的光线自所述镜头10进入所述摄像模组100的内部后，能够被所述感光元件21的所述感光区域212接收和进行光电转化，以得到与物体相关联的影像。
更进一步地，所述感光元件21具有一组芯片连接件211，所述线路板22具有一组线路板连接件221，其中每个所述引线24的两端可以分别被连接于所述感光元件21的每个所述芯片连接件211和所述线路板22的每个所述线路板连接件221，通过上述这样的方式使所述感光元件21和所述线路板22被连接。在本发明的一个实施例中，所述感光元件21的每个所述芯片连接件211和所述线路板22的每个所述线路板连接件221可以是连接盘，即，所述感光元件21的每个所述芯片连接件211和所述线路板22的每个所述线路板连接件221可以分别呈盘状，以用于使每个所述引线24的两端分别连接于所述感光元件21的每个所述芯片连接件211和所述线路板22的每个所述线路板连接件221。在本发明的另一个示例中，所述感光元件21的每个所述芯片连接件211和所述线路板22的每个所述线路板连接件221可以是球状，例如将锡膏或者其他的焊接材料点在所述感光元件21和所述线路板22以分别形成所述感光元件21的所述芯片连接件211和所述线路板22的所述线路板连接件221。尽管如此，所述感光元件21的所述芯片连接件211和所述线路板22的所述线路板连接件221的形状并不限制本发明的内容和范围。
本领域的技术人员可以理解的是，所述感光元件21的每个所述芯片连接件211被设置于所述感光元件21的所述非感光区域213。另外，所述感光元件21的所述非感光区域213具有一芯片内侧部2131、一芯片连接部2132以及一芯片外侧部2133，其中所述芯片内侧部2131围绕所述感光区域212一周，所述芯片连接部2132的两侧分别延伸并连接至所述芯片内侧部2131和所述芯片外侧部2132。也就是说，将所述非感光区域213的从被设置所述芯片连接件211的位置到所述感光区域212的边缘的位置的区域定义为所述芯片内侧部2131，将所述非感光区域213的被设置所述芯片连接件211的区域定义为所述芯片连接部2132，将所述非感光区域213的从被设置所述芯片连接件211的位置到所述感光元件21的外边沿的位置的区域定义为所述芯片外侧部2132。换言之，从所述感光元件21的俯视视角来看，所述感光元件21从外到内依次是所述芯片外侧部2133、所述芯片连接部2132、所述芯片内侧部2131和所述感光区域212。
另外，所述线路板22包括一平整的芯片贴装区域222和一边缘区域223，其中所述边缘区域223与所述芯片贴装区域222一体地形成，并且所述边缘区域223位于所述芯片贴装区域222的周围。所述芯片贴装区域222被用于贴装所述感光元件21，所述线路板连接件221被设置于所述边缘区域223。所述线路板22的所述边缘区域223具有一线路板内侧部2231、一线路板连接部2232以及一线路板外侧部2233，其中所述线路板内侧部2231围绕所述芯片贴装区域222一周，所述线路板连接部2232的两侧分别延伸并连接至所述线路板内侧部2231和所述线路板外侧部2233。也就是说，将所述边缘区域223的从被设置所述线路板连接件221的位置到所述芯片贴装区域222的边缘的位置的区域定义为所述线路板内侧部2231，将所述边缘区域223的被设置所述线路板连接件221的区域定义为所述线路板连接部2232，将所述边缘区域223的从被设置所述线路板连接件221的位置到所述边缘区域223的外边沿的位置的区域定义为所述线路板外侧部2233。换言之，从所述线路板22的俯视视角来看，所述线路板22从内到外依次是所述线路板外侧部2233、所述线路板连接部2232、所述线路板内侧部2231和所述芯片贴装区域222。所述引线24的类型在本发明的所述摄像模组100中不受限制，例如在一个具体实施例中，所述引线24可以被实施为金线，即，通过打金线的方式能够将所述感光元件21和所述线路板22连接在一起，从而所述感光元件21在将光信号转化为电信号后，所述电信号能够通过所述引线24被进一步传输至所述线路板22。本领域的技术人员可以理解的是，在所述摄像模组100的其他示例中，所述引线24也可以被实施为银线、铜线等任何能够实现所述电信号在所述感光元件21和所述线路板22之间传输的材料制成。
值得一提的是，各所述电子元器件26被贴装于所述线路板22的所述边缘区域223。优选地，各所述电子元器件26被贴装于所述边缘区域223的所述线路板外侧部2233。所述感光元件21和各所述电子元器件26可以被贴装于所述线路板22的同一侧或者相反侧，例如在一个具体实施例中，所述感光元件21和每个所述电子元器件26被贴装于所述线路板22的同一侧，并且所述感光元件21被贴装于所述线路板22的所述芯片贴装区域222，每个所述电子元器件26被贴装于所述线路板22的所述边缘区域223。在所述模塑基座23一体地成型于所述线路板22后，所述模塑基座23包覆每个所述电子元器件26，以通过所述模塑基座23隔离相邻的所述电子元器件26和隔离所述电子元器件26和所述感光元件21，从而，在本发明的所述摄像模组100中，即便是相邻所述电子元器件26的距离较近时，所述模塑基座23也可以避免相邻所述电子元器件26相互接触或者干扰，并且所述模塑基座23包覆所述电子元器件26的方式也可以避免产生于所述电子元器件26的表面的污染物污染所述感光元件21的所述感光区域212，进而减少所述摄像模组100的体积和提高所述摄像模组100的成像品质。也就是说，本发明的所述摄像模组100通过所述模塑基座23包覆所述电子元器件26的方式，使小面积的所述线路板22能够被贴装更多的所述电子元器件26。值得一提的是，所述电子元器件26的类型包括但不限于电阻、电容、驱动器等。
进一步地，如图7所示，所述摄像模组100进一步包括至少一滤光元件40，在本发明 的这个优选实施例中，所述滤光元件40被设置于所述镜头10的底部，也就是说，所述滤光元件40被组装于所述镜头10。所述镜头10内部的各光学镜片依次排列，所述滤光元件40位于所述镜头10的光学路径。在所述模塑感光组件20被模塑一体封装之后，所述滤光元件40和所述镜头10一起被贴装于所述模塑感光组件20，组装形成所述摄像模组100。其中，所述滤光元件40位于所述感光元件21的感光路径。被物体反射的光线自所述镜头10的各光学镜片，并通过所述滤光元件40过滤后进入所述摄像模组100的内部，能够被所述感光元件21接收和进行光电转化。也就是说，所述滤光元件40能够过滤自所述镜头10的各光学镜片中被物体反射的光线中的杂光，例如红外线部分，通过这样的方式，能够改变所述摄像模组100的成像品质。
本领域的技术人员可以理解的是，在所述摄像模组100的不同示例中，所述滤光元件40能够被实施为不同的类型，例如所述滤光元件40能够被实施为红外截止滤光片、全透光谱滤光片以及其他的滤光片或者多个滤光片的组合，例如所述滤光元件40能够被实施为红外截止滤光片和全透光谱滤光片的组合，即所述红外截止滤光片和所述全透光谱滤光片能够被切换以选择性地位于所述感光元件21的感光路径上，例如在白天等光线较为充足的环境下使用所述摄像模组100时，可以将所述红外截止滤光片切换至所述感光元件21的感光路径，以通过所述红外截止滤光片过滤进入所述摄像模组100的被物体反射的光线中的红外线，当夜晚等光线较暗的环境中使用所述摄像模组100时，可以将所述全透光谱滤光片切换至所述感光元件21的感光路径，以允许进入所述摄像模组100的被物体反射的光线中的红外线部分透过。
值得一提的是，所述滤光元件40的安装位置在不同的实施例中有多种变形实施方式。图7中所述滤光元件40被设置于所述镜头10内的底部。在其他实施例中，所述滤光元件40被设置于所述模塑基座23的顶部。这两种设置的方式都是在所述模塑感光组件20被模塑一体化成型之后安装所述滤光元件40。在其他实施例中，所述滤光元件40和所述模塑感光组件20在模具中被一起模塑组装完成。也就是说，在其他实施例中，所述滤光元件40的周边缘可以是被所述支承元件25包覆，被固定于所述感光元件21和所述镜片27之间。当所述摄像模组100没有设置所述支承元件25时，所述滤光元件40被贴装于所述感光元件21上，且位于所述镜片27和所述感光元件21之间。后两种设置的方式都是所述滤光元件40和所述感光元件21、所述线路板22、所述支承元件25以及所述镜片27一起被放置于模具中，经MOL工艺模塑之后形成所述模塑基座23，从而之后被贴装所述镜头10或驱动所述镜头10的一驱动器30后组装形成所述摄影模组100。所述滤光元件40在位置上的各种变形会在之后的各实施例中详细揭露。
值得一提的是，所述镜片27可以是凸透镜，具有光线汇聚的作用。由于所述滤光元件40不会产生光的折射，但是被实施为凸透镜的所述镜片27会让成像变小。所述滤光元件40上的颗粒(污点)往往会使所述感光元件21成像上形成较大的污坏点，距离所述感光元件21越近，那么成像的污坏点越大。因此，在本发明的MOL工艺中，所述镜片27被设置于所述镜头10的下部，所述滤光元件40被设置于所述镜头10内的底部。也就是说，本发明的MOL工艺可以将所述滤光元件远离所述感光元件21，同时也不影响被实施为凸透镜的所述镜片27的光线汇聚的作用，从而使污坏点成像更小。
值得一提的是，优选地，所述镜片27的所述镜片周缘272为方形台阶状。
值得一提的是，在本发明的MOL模塑工艺中，所述支承主体251也有多种变形实施方式。例如，在一实施例中，所述支承主体251包覆所述引线24的全部、所述边缘区域223的所述线路板外侧部2233、所述线路板连接部2232、所述线路板内侧部2231、所述非感光区域213的所述2133、所述芯片连接部2132以及所述芯片连接部2132；又例如在一实施例中，所述支承主体251包覆所述引线24的部分、所述非感光区域213的所述芯片外侧部2133、所述芯片连接部2132以及所述芯片内侧部2131；又例如在一实施例中，所述支承主体251包覆所述引线24的部分、所述边缘区域223的所述线路板内侧部2231、所述非感光区域213 的所述芯片外侧部2133、所述芯片连接部2132以及所述芯片内侧部2131；又例如在一实施例中，所述支承主体251包覆所述引线24的部分、所述边缘区域223的所述线路板外侧部2233、所述线路板连接部2232以及所述线路板内侧部2231；又例如在一实施例中，所述支承主体251包覆所述引线24的部分、所述边缘区域223的所述线路板外侧部2233、所述线路板连接部2232、所述线路板内侧部2231以及所述非感光区域213的所述芯片外侧部2133；又例如在一实施例中，所述支承主体251包覆所述边缘区域223的所述线路板内侧部2231以及所述非感光区域213的所述芯片外侧部2133；又例如在一实施例中，所述支承主体251仅仅形成于所述非感光区域213的所述芯片内侧部2131；又例如在一实施例中，所述支承主体251仅仅形成于所述边缘区域223的所述线路板外侧部2233。所述支承主体251的各种变形实施方式会在之后的各实施例中详细揭露。
本领域的技术人员可以理解的是，上述举例的所述滤光元件40在位置上的变形实施以及所述支承主体251的各变形实施在本发明中仅仅作为举例，还有其他合理的变形实施方式，本发明在这一方面并不受此限制。
值得一提的是，在一实施例中，所述摄像模组100可以被实施为一个定焦摄像模组，其中所述摄像模组100通过被组装于所述模塑基座23的一模塑主体232使所述镜头10被保持在所述感光元件21的感光路径。值得一提的是，在一实施例中，所述摄像模组100可以被实施为一个变焦摄像模组，其中所述摄像模组100通过改变所述镜头10和所述感光元件21的距离来调整所述摄像模组的焦距。如图7中所述摄像模组100被实施为一变焦摄像模组。所述摄像模组100进一步还包括所述驱动器30，其中所述镜头10分别被对应地设置于所述驱动器30，所述驱动器30分别被组装于所述模塑基座23，并且所述驱动器30分别被电连接于所述线路板22，以在所述线路板22将电能和控制信号传输至所述驱动器30后，所述驱动器30能够驱动所述镜头10沿着所述感光元件21的感光路径来回移动，从而调整所述摄像模组100的焦距。也就是说，所述镜头10被可驱动地设置于所述驱动器30。值得一提的是，所述驱动器30的类型在本发明的所述摄像模组100中不受限制，例如在另一实施例中，所述驱动器30可以被实施为诸如音圈马达等任何能够驱动所述镜头10沿着所述感光元件21的感光路径产生移位的驱动器，其中所述驱动器30能够接收电能和控制信号以处于工作状态。
值得一提的是，所述摄像模组100被实施为一定焦摄像模组时，所述模塑主体232被变形实施为组装所述镜头10的镜头支架，所述镜头10在所述模塑感光组件20一体化成型之后直接安装于实施为镜头支架的所述模塑主体232，从而简化了所述摄像模组100的组装工序。本发明的这一方面的变形会在之后的实施例中详细揭露。
以下从各个实施例中详细揭露通过MOL模塑工艺一体化成型所述模塑感光组件20以及组装形成所述摄像模组100。
如图1至图7所示的本发明的所述摄像模组100的优选实施例中，所述镜片27的所述底面2722贴合所述25的所述顶表面2501，所述支承主体251包覆所述引线24的全部、所述边缘区域223的所述线路板外侧部2233、所述线路板连接部2232、所述线路板内侧部2231、所述非感光区域213的所述芯片外侧部2133、所述芯片连接部2132以及所述芯片连接部2132，所述滤光元件40被设置于所述镜头10内的底部。本发明的这个优选实施例中，是先一体化成型所述模塑感光组件20后贴装所述镜头10。
进一步地，从所述摄像模组100的制造步骤和所述模塑感光组件20的制造步骤方面来说明。如图2所示，将所述感光元件21贴装于所述线路板22的所述芯片贴装区域222，并且所述感光元件21的所述非感光区域213的所述芯片连接件211和所述线路板22的所述边缘区域223所述线路板连接件221通过一组所述引线24被连接。另外，所述电子元器件26被贴装于所述线路板22的所述边缘区域223的所述线路板外侧部线路板外侧部2233。优选地，一组所述引线24的两端分别被连接于所述感光元件21和所述线路板22，其中每个所述引线24均呈上弧状地突出于所述感光元件21的上表面，所述引线24的弯曲的弧度保持 在圆滑的状态，有利于保证所述引线24在所述感光元件21和所述线路板22之间传输所述电信号的能力。其中，每个所述引线24被排列在所述感光元件21和所述线路板22之间，例如每个所述引线24可以是等间距的。本领域的技术人员可以理解的是，在其他实施例中，多个所述感光元件21也可以被贴装于一个所述线路板22的不同位置，以在后续制作双镜头摄像模组或者阵列摄像模组，例如在图14所示的实施例中，多个所述线路板22拼接在一起以形成一个线路板拼板2200，然后将每个所述感光元件21分别贴装于所述线路板拼版的对应位置的所述线路板22，以在后续将所述线路板拼板2200分离，但本发明在这方面不受限制。
如图2和图3所示，一方面，所述支承主体251能够避免所述引线24和所述芯片连接件211的连接位置与用于形成所述模塑基座23的热固化材料接触，以避免流体的所述热固化材料引起所述引线24的用于连接所述芯片连接件211的端部变形或者所述引线24从所述芯片连接件211上脱落。另一方面，所述支承主体251和所述镜片27的所述镜片周缘272连接在一起，能够隔离所述引线24和所述芯片连接件211的连接位置与所述热固化材料。也就是说，由于支承主体251和所述镜片27的所述镜片周缘272连接在一起后，所述支承元件25的所述内侧面2502以及所述镜片主体271的所述镜片内面2712形成一密闭空间2700，从而在进行MOL模塑工艺时，避免流体的所述热固化材料进入所述密闭空间2700，从而避免影响通光路径，也降低了污点敏感度。在一个实施例中，所述支承主体251可以通过将胶水设置在所述感光元件21的所述非感光区域213并且在胶水初步固化后形成，经过初步固化再设置所述镜片27后进一步固化最终形成所述支承主体251。其中在所述支承主体251形成后，所述支承主体251的所述内侧面2502形成所述通孔252，所述感光元件21的所述感光区域212对应于所述通孔252以及所述热硬化镜头27的所述镜片主体271。另外，由胶水形成的所述支承主体251还可以具有粘性，以用于在后续粘附诸如灰尘等污染物，从而防止这些污染物污染所述感光元件21的所述感光区域212而使所述感光元件21的所述感光区域212出现污坏点，以进一步确保所述摄像模组的成像品质。所述镜片27的所述272在其他实施例中，为所述支承元件25完全固化之后贴装于所述支承元件25的所述支承主体251，本发明并不受此限制。
如图4所示，在进行MOL模塑工艺时，通过一成型模具900使被实施为流体态的热固化材料的成型材料在固化后形成至少一体地成型在所述线路板22的所述模塑基座23，通过这样的方式，能够减少所述摄像模组100的尺寸和减少所述摄像模组的组装误差，从而使所述摄像模组100的结构更加紧凑和提高所述摄像模组100的成像品质。又由于所述镜片27通过所述支承元件25设置于所述感光元件21上，降低了光学性的TTL，进一步使所述摄像模组100的结构更加紧凑，满足电子设备对于所述摄像模组100的尺寸上的需求。
具体地说，所述成型模具900包括一上模具901和一下模具902，其中所述上模具901和所述下模具902中的至少一个模具能够被移动，以使所述上模具901和所述下模具902能够被进行合模操作，和在所述上模具901和所述下模具902之间形成至少一成型空间903，其中所述模塑基座23由所述成型材料被加入所述成型空间903并且在固化后形成。
所述感光元件21和所述线路板22通过一组所述引线24被连接，所述支承主体251形成于所述感光元件21的所述非感光区域213以包覆所述引线24的全部、所述边缘区域223的所述线路板外侧部2233、所述线路板连接部2232、所述线路板内侧部2231、所述非感光区域213的所述芯片外侧部2133、所述芯片连接部2132以及所述芯片连接部2132，所述镜片27被设置于所述支承主体251，从而所述模塑感光组件20的半成品，将所述模塑感光组件20的半成品放置于所述成型模具900的所述下模具902，操作所述成型模具900的所述上模具901和/或所述下模具901，以使所述上模具901和所述下模具902合模，从而在所述上模具901和所述下模具902之间形成所述成型空间903，其中所述上模具901的压合面9011与所述镜片27的所述镜片主体271的所述镜片内面2712接触，所述支承主体251向上支撑所述镜片27。在本发明这个优选实施例中，所述线路板22的外部、所述感光元件21的非 感光区域213、所述支承元件25的一部分以及所述镜片27的所述272的所述外周面2723位于所述成型模具900的所述成型空间903，从而当所述模塑基座23在所述成型空间903成型后，所述模塑基座23包覆所述线路板22的外部、所述感光元件21的非感光区域213、所述支承元件25的一部分以及所述镜片主体272的所述外周面2723。优选地，形成的如图2所示的所述模塑感光组件20中，由于在MOL模塑工艺中，所述成型模具900的所述上模具901的压合面9011没有完全覆盖全部所述镜片主体271的所述镜片内面2712，因此，形成的所述模塑基座23还包覆了所述272的所述顶面2721的一部分。
因此，本领域的技术人员可以理解的是，所述成型模具900的所述成型空间903可以是一个环状的空间，以在所述成型材料被加入所述成型空间903和固化后形成环状的所述模塑基座23。
值得一提的是，本发明涉及的流体状的所述成型材料可以是液体材料或者固体颗粒材料或者液体和固体颗粒混合材料，可以理解的是，无论所述成型材料被实施为液体材料还是被实施为固体颗粒材料或者被实施为液体和固体颗粒混合材料，其在被加入所述成型模具900的所述成型空间903后，均能够固化以形成所述模塑基座23。例如在本发明的这个具体示例中，流体状的所述成型材料被实施为诸如液态的热固化材料，其中所述成型材料在被加入所述成型模具900的所述成型空间903后固化以形成所述模塑基座23。值得一提的是，当流体状的所述成型材料被加入所述成型模具900的所述成型空间903后，流体状的所述成型材料的固化方式不限制本发明的内容和范围。
值得一提的是，形成所述支承体25的介质和形成所述模塑基座23的介质为不同材料。所述支承体25可以通过有弹性的介质形成，使成型后的所述支承体25具有一定的弹性，所述支承体25还可以是通过硬性的介质形成，本发明并不受此限制。
如图5和图6所示，所述支承主体251被沿着所述感光元件21的所述非感光区域213设置，所述镜片27的所述镜片周缘272紧密贴合所述支承主体251以形成所述密闭空间2700，从而在所述成型材料被加入所述成型模具900的所述成型空间903后，所述支承主体251以及所述镜片27的所述镜片主体271能够阻止所述成型材料进入所述密闭空间2700内，即避免进入所述感光元件21的所述感光区域212，从而在所述成型材料固化以形成所述模塑基座23且拔模之后，使所述模塑基座23进一步形成一模塑孔231，以对应于所述感光元件21的所述感光区域212，从而在后续，所述模塑基座23的所述模塑孔231允许光线穿过以被所述感光元件21的所述感光区域212接收和进行光电转化。也就是说，由于所述成型材料并不能进入所述密闭空间2700，因此拔模之后，所述镜片27的所述镜片主体271的所述镜片外面2711和所述压合面9011之间形成所述模塑孔231。也就是说，所述模塑基座23包括所述模塑主体232和具有所述模塑孔231，所述模塑孔231给所述光学镜头10和所述感光元件21提供一光线通路，从而被物体反射的光线自所述光学镜头10进入所述摄像模组的内部后，光线通过所述模塑基座23的所述模塑孔231被所述感光元件21的所述感光区域212接收和进行光电转化。
在制造所述模塑感光组件20时，先将所述感光元件21贴附于所述线路板22，之后形成所述支承元件25，进一步，将所述镜片27设置于所述支承元件25，将所述线路板22、所述感光元件21和所述镜片27进行模塑，形成所述模塑基座23，从而模塑形成所述模塑感光组件20。在模塑时，由于所述镜片27和所述感光元件21之间形成有所述密闭空间2700，因此能够防止模塑的模具对于所述感光元件21的伤害，且由于所述镜片27与所述感光元件21的距离减小，因此可以使得由其组装的所述摄像模组100的后焦距缩小，从而减小所述摄像模组100的高度，另一方面，由于不需要为所述镜片27提供额外的支撑部件，因此也在一定程度上使得所述摄像模组100的厚度得以进一步减小。模塑形成所述模塑感光组件20之后，在所述模塑基座23上组装所述驱动器30和所述镜头10，从而组装形成所述摄像模组100。其中，在这个优选实施例中，所述镜头10内的底部设置有所述滤光元件40。本领域的人员可以理解的是，在其他基于优选实施例的变形实施例中，模塑形成所述模塑感光 组件20之后，在所述模塑基座23上直接组装所述镜头10或者支撑所述镜头10的镜座，也就是说，可以不设置所述驱动器30。以上仅仅作为举例，本发明并不受此限制。
如图8B所示为基于本发明优选实施例的一变形实施例，阐释了所述模塑感光组件20、所述滤光元件40组装形成一摄像模组108，在这个变形实施例中的所述摄像模组108和优选实施例中的所述摄像模组100的结构类似，不同的是图8B中的所述摄像模组108的所述滤光元件40的设置位置不同。在这个变形实施例中，所述摄像模组108的所述镜头10内的底部没有设置所述滤光元件40，而是所述滤光元件40被组装于所述模塑基座23的顶表面，以使所述滤光元件40封闭所述模塑基座23的所述模塑孔231，从而在后续自所述光学镜头进入所述摄像模组的内部的光线能够进一步被所述滤光元件40过滤以改善所述摄像模组的成像品质。也就是说，所述模塑基座23的顶表面形成一内侧表面233和一外侧表面234，在图8B所示的实施例中，所述模塑基座23的所述内侧表面233所在的平面可以低于所述外侧表面234所在的平面，从而使所述模塑基座23的顶表面形成一个台阶状的表面，即所述模塑基座23的所述内侧表面233所在的平面低于所述外侧表面234所在的平面以形成所述模塑基座23的一凹槽235，其中被组装于所述模塑基座23的所述内侧表面233的所述滤光元件40被容纳于所述模塑基座23的所述凹槽235内，所述驱动器30被组装于所述模塑基座23的所述外侧表面234，以使被组装于所述驱动器30的所述光学镜头10进一步被保持在所述感光元件21的感光路径，从而制得所述摄像模组108。本领域的技术人员可以理解的是，在其他实施例中，所述模塑基座23的所述内侧表面233和所述外侧表面234是处于同一个平面内，以使所述模塑基座23的顶表面形成一个平整的平面，其中所述滤光元件40被组装于所述模塑基座23的所述内侧表面233，所述驱动器30或者所述镜头10被组装于所述模塑基座23的所述外侧表面234，或者所述镜头10被直接组装于所述模塑基座23的所述外侧表面234。本发明的所述模塑基座23的上述结构仅仅作为举例，本发明并不受此限制。
在制造所述模塑感光组件20时，先将所述感光元件21贴附于所述线路板22，之后形成所述支承元件25，进一步，将所述镜片27设置于所述支承元件25，进而将所述线路板22、所述感光元件21和所述镜片27在模具中进行模塑，形成所述模塑基座23，进而形成所述模塑感光组件20。进一步地，将所述滤光元件40组装于所述模塑基座23的顶表面之后组装所述驱动器30以及所述镜头10，从而组装形成所述摄像模组108。
如图9所示基于本发明优选实施例的另一变形实施例的一摄像模组109，在这个变形实施例中的所述摄像模组109和优选实施例中的所述摄像模组100的结构类似，不同的是图9中的所述摄像模组109的所述滤光元件40的设置位置以及组装顺序不同。图7的优选实施例中，是先模塑形成所述模塑感光组件20，然后将设置于所述镜头内的底部的所述滤光元件40和所述镜头10一起组装在所述模塑基座23上。而图9所示的这个变形实施例的所述摄像模组109是将所述滤光元件40和所述镜片27、所述支承元件25、所述感光元件21以及所述线路板22一起放入模具中形成所述模塑基座23，之后在所述模塑基座23上贴装所述驱动器30和所述镜头10。具体地，在本发明的图9所示的这个变形实施例中，所述滤光元件40被叠层设置于所述感光元件21上。在这里可以采用表面贴装工艺。为了增强所述滤光元件40在所述感光元件21的稳定性，在实施例中，所述滤光元件40的边缘被所述支承元件25固定连接且贴合所述感光元件21，从而所述滤光元件40被固定于所述支承元件25以及所述感光元件21之间。所述支承主体251的所述外侧面2503、所述镜片周缘272的所述外周面2723被模塑于所述模塑基座23，所述支承元件25、所述感光元件21、所述镜片27、所述线路板22以及所述电子元器件26被所述模塑基座23的所述模塑主体232所模塑。值得一提的是，在这个实施例中，所述滤光元件40覆盖于所述感光元件21的上方，将所述感光元件21与所述密闭空间2700以及外部环境隔离，从而避免所述感光元件21受到损伤以及避免进入所述密闭空间2700的灰尘接触所述感光元件21，降低污点敏感度。
在制造所述模塑感光组件20时，先将所述感光元件21贴附于所述线路板22，进而将 所述滤光元件40贴附于所述感光元件21上，之后形成所述支承元件25，且所述支承元件25连接所述滤光元件40的两端，进一步，将所述镜片27设置于所述支承元件25，将所述线路板22、所述感光元件21和所述镜片27进行模塑，形成所述模塑基座23。在模塑时，由于所述镜片27和所述滤光元件40之间形成有所述密闭空间2700，因此能够防止模塑的模具对于所述感光元件21以及所述滤光元件40的伤害，且由于所述滤光元件40与所述感光元件21的距离减小，因此可以使得由其组装的所述摄像模组109的后焦距缩小，从而减小所述摄像模组109的高度，另一方面，由于不需要为所述滤光元件40提供额外的支撑部件，因此也在一定程度上使得所述摄像模组109的厚度得以进一步减小。
如图10所示为基于图7所示的优选实施例的另一个变形实施例的一摄像模组110。和图7中所述的实施例中的所述摄像模组100不同的是，图10中，所述模塑基座23的所述模塑主体232的结构不同。具体地，如图10所示，所述摄像模组110的所述模塑基座23包括所述模塑主体232以及一镜头安装段236，所述模塑主体232和所述镜头安装段236依次一体地模塑连接。所述镜头安装段236用于安装所述镜头10(所述镜头10在图10中未示出)，也就是说，当所述模塑感光组件20被用于组装所述摄像模组110时，所述镜头10被安装于所述镜头安装段236内侧，以便于为所述镜头10提供稳定的安装位置。所述镜头安装段236一体地向上延伸，为所述镜头10提供支撑固定位置，从而不需要提供额外的部件来安装所述镜头10。换句话说，所述模塑基座23一体地向上延伸，且内部形成台阶状，以分别模塑所述镜片27、所述支承元件25、所述线路板22、所述电子元器件电子元器件26以及支撑所述镜头10。值得一提的是，所述镜头安装段236的内侧表面平整，从而适于安装无螺纹的所述镜头10，形成定焦模组。特别地，所述镜头10可以通过粘接的方式固定于所述镜头安装段236。还值得一提的是，所述镜头10被安装于所述镜头安装段236，从而所述模塑基座23相当于传统摄像模组中的支架或镜筒的功能，为所述镜头10提供支撑、固定位置，但是组装却不同于传统COB工艺过程。传统COB工艺的摄像模组的支架以粘贴的方式固定于线路板，而所述模塑基座23通过MOL模塑工艺固定于所述线路板22、所述支承元件25以及所述镜片27，不需要粘贴固定过程，模塑方式相对于粘贴固定具有更好的连接稳定性以及工艺过程的可控性，使得摄像模组的厚度得以减小，此外，所述模塑基座23代替传统的支架，且为所述镜头10提供安装位置，避免了支架在粘贴组装时带来的倾斜误差，减小了摄像模组组装的累积公差。本领域的技术人员可以理解的是，在其他变形实施例中，需要安装所述滤光元件40时，所述滤光元件40可以是如图7中所述摄像模组100中被设置于所述镜头10内的底部，也可以是如图8B中所述摄像模组108，所述滤光元件40直接被安装在所述模塑基座23的所述模塑主体232的所述内侧表面233，还可以是如图9中在模塑形成所述模塑基座23之前被所述支承元件25贴合于所述感光元件21的表面。本发明并不受此限制。
如图15所示为基于本发明优选实施例的另一变形实施例的一摄像模组115，和图7中所述的优选实施例中的所述摄像模组100不同的是，本发明的所述摄像模组115的所述模塑感光组件20的所述支承主体251包覆所述引线24的部分、所述非感光区域213的所述芯片外侧部2133、所述芯片连接部2132以及所述芯片内侧部2131。所述模塑主体232一体模塑包覆所述电子元器件26、所述线路板22的所述边缘区域223、所述支承元件25的所述外侧面2503以及所述镜片周缘272的所述外周面2723，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以增强所述镜片27的稳固性。
如图16所示为基于图8B的实施例的另一变形实施例的一摄像模组116，和图8B中实施例中的所述摄像模组108不同的是，本发明的所述摄像模组116的所述模塑感光组件20的所述支承主体251包覆所述引线24的部分、所述非感光区域213的所述芯片外侧部2133、所述芯片连接部2132以及所述芯片内侧部2131。所述模塑主体232一体模塑包覆所述电子元器件26、所述线路板22的所述边缘区域223、所述支承元件25的所述外侧面2503以及 所述镜片周缘272的所述外周面2723，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以增强所述镜片27的稳固性。
如图17所示为基于图9的实施例的另一变形实施例的一摄像模组117，和图9中实施例中的所述摄像模组109不同的是，本发明的所述摄像模组117的所述模塑感光组件20的所述支承主体251包覆所述引线24的部分、所述非感光区域213的所述芯片外侧部2133、所述芯片连接部2132以及所述芯片内侧部2131。所述模塑主体232一体模塑包覆所述电子元器件26、所述线路板22的所述边缘区域223、所述支承元件25的所述外侧面2503以及所述镜片周缘272的所述外周面2723，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以增强所述镜片27的稳固性。
如图18所示为基于图10实施例的另一变形实施例的一摄像模组118，和图10中实施例中的所述摄像模组110不同的是，本发明的所述摄像模组116的所述模塑感光组件20的所述支承主体251包覆所述引线24的部分、所述非感光区域213的所述芯片外侧部2133、所述芯片连接部2132以及所述芯片内侧部2131。所述模塑主体232一体模塑包覆所述电子元器件26、所述线路板22的所述边缘区域223、所述支承元件25的所述外侧面2503以及所述镜片周缘272的所述外周面2723，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以增强所述镜片27的稳固性。
如图19所示为基于本发明优选实施例的另一变形实施例的一摄像模组119，和图7中所述的优选实施例中的所述摄像模组100不同的是，所述支承主体251包覆所述引线24的部分、所述边缘区域223的所述线路板内侧部2231、所述非感光区域213的所述芯片外侧部2133、所述芯片连接部2132以及所述芯片内侧部2131，所述模塑主体232一体模塑包覆所述电子元器件26、所述22的所述边缘区域223、所述支承元件25的所述外侧面2503以及所述镜片周缘272的所述外周面2723，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以增强所述镜片27的稳固性。
如图20所示为基于本发明优选实施例的另一变形实施例的一摄像模组120，和图8B中实施例中的所述摄像模组108不同的是，所述支承主体251包覆所述引线24的部分、所述边缘区域223的所述线路板内侧部2231、所述非感光区域213的所述芯片外侧部2133、所述芯片连接部2132以及所述芯片内侧部2131，所述模塑主体232一体模塑包覆所述电子元器件26、所述线路板22的所述边缘区域223、所述支承元件25的所述外侧面2503以及所述镜片周缘272的所述外周面2723，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以增强所述镜片27的稳固性。
如图21所示为基于本发明优选实施例的另一变形实施例的一摄像模组121，和图9中实施例中的所述摄像模组109不同的是，所述支承主体251包覆所述引线24的部分、所述边缘区域223的所述线路板内侧部2231、所述非感光区域213的所述芯片外侧部2133、所述芯片连接部2132以及所述芯片内侧部2131，所述模塑主体232一体模塑包覆所述电子元器件26、所述线路板22的所述边缘区域223、所述支承元件25的所述外侧面2503以及所述镜片周缘272的所述外周面2723，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以增强所述镜片27的稳固性。
如图22所示为基于本发明优选实施例的另一变形实施例的一摄像模组122，和图10所示的实施例中的所述摄像模组110不同的是，所述支承主体251包覆所述引线24的部分、所述边缘区域223的所述线路板内侧部2231、所述非感光区域213的所述芯片外侧部2133、 所述芯片连接部2132以及所述芯片内侧部2131，所述模塑主体232一体模塑包覆所述电子元器件26、所述线路板22的所述边缘区域223、所述支承元件25的所述外侧面2503以及所述镜片周缘272的所述外周面2723，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以增强所述镜片27的稳固性。
如图23所示为基于本发明优选实施例的另一变形实施例的一摄像模组123，和图7中所述的优选实施例中的所述摄像模组100不同的是，所述支承主体251包覆所述引线24的部分、所述边缘区域223的所述线路板外侧部2233、所述线路板连接部2232以及所述线路板内侧部2231。经过MOL模塑工艺之后，所述模塑主体232一体模塑包覆所述电子元器件26、所述线路板22的所述边缘区域223的所述线路板外侧部2233、所述支承元件25的所述外侧面2503以及所述镜片周缘272的所述外周面2723，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以增强所述镜片27的稳固性。
如图24所示为基于本发明优选实施例的另一变形实施例的一摄像模组124，和图8B中所示的实施例中的所述摄像模组108不同的是，所述支承主体251包覆所述引线24的部分、所述边缘区域223的所述线路板外侧部2233、所述线路板连接部2232以及所述线路板内侧部2231。经过MOL模塑工艺之后，所述模塑主体232一体模塑包覆所述电子元器件26、所述线路板22的所述边缘区域223的所述线路板外侧部2233、所述支承元件25的所述外侧面2503以及所述镜片周缘272的所述外周面2723，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以增强所述镜片27的稳固性。
如图25所示为基于本发明优选实施例的另一变形实施例的一摄像模组125，和图9中所示的实施例中的所述摄像模组109不同的是，所述支承主体251包覆所述引线24的部分、所述边缘区域223的所述线路板外侧部2233、所述线路板连接部2232以及所述线路板内侧部2231。经过MOL模塑工艺之后，所述模塑主体232一体模塑包覆所述电子元器件26、所述线路板22的所述边缘区域223的所述线路板外侧部2233、所述支承元件25的所述外侧面2503以及所述镜片周缘272的所述外周面2723，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以增强所述镜片27的稳固性。此外，所述摄像模组125和图9中所示的实施例中的所述摄像模组109的结构还不同的是所述滤光元件40并没有贴合于所述感光元件21。也就是说，由于所述支承主体251没有包覆所述非感光区域213，所述滤光元件40的边缘被包覆于所述支承主体251的上端靠近所述顶表面2501的位置以避免接触所述引线24，因此所述滤光元件40和所述感光元件21之间是有空隙的。本领域的技术人员可以理解的是，在图25所示的实施例的其他变形实施方式中，所述滤光元件40的边缘也可以不通过被所述支承主体251包覆而固定，而是所述滤光元件40被直接贴装于所述感光元件21的所述感光区域212，但是，本发明在这一方面并不受此限制。
如图26所示为基于本发明优选实施例的另一变形实施例的一摄像模组126，和图10中所示的实施例中的所述摄像模组110不同的是，经过MOL模塑工艺之后，所述模塑主体232一体模塑包覆所述电子元器件26、所述线路板22的所述边缘区域223的所述线路板外侧部2233、所述支承元件25的所述外侧面2503以及所述镜片周缘272的所述外周面2723，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以增强所述镜片27的稳固性。
如图27所示为基于本发明优选实施例的另一变形实施例的一摄像模组127，和图7中所述的优选实施例中的所述摄像模组100不同的是，所述支承主体251包覆所述引线24的部分、所述边缘区域223的所述线路板外侧部2233、所述线路板连接部2232、所述线路板内侧部2231以及所述非感光区域213的所述芯片外侧部2133。经过MOL模塑工艺之后， 所述模塑主体232一体模塑包覆所述电子元器件26、所述线路板22的所述边缘区域223的所述线路板外侧部2233、所述支承元件25的所述外侧面2503以及所述镜片周缘272的所述外周面2723，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以增强所述镜片27的稳固性。
如图28所示为基于本发明优选实施例的另一变形实施例的一摄像模组128，和图8B中所示的实施例中的所述摄像模组108不同的是，所述模塑主体232一体模塑包覆所述电子元器件26、所述线路板22的所述边缘区域223的所述线路板外侧部2233、所述支承元件25的所述外侧面2503以及所述镜片周缘272的所述外周面2723，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以增强所述镜片27的稳固性。
如图29所示为基于本发明优选实施例的另一变形实施例的一摄像模组129，和图9中所示的实施例中的所述摄像模组109不同的是，所述模塑主体232一体模塑包覆所述电子元器件26、所述线路板22的所述边缘区域223的所述线路板外侧部2233、所述支承元件25的所述外侧面2503以及所述镜片周缘272的所述外周面2723，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以增强所述镜片27的稳固性。此外，所述摄像模组129和图9中所示的实施例中的所述摄像模组109的结构还不同的是所述滤光元件40并没有贴合于所述感光元件21。也就是说，由于所述支承主体251没有包覆所述非感光区域213的所述芯片连接部2132和所述芯片内侧部2131，所述滤光元件40的边缘被包覆于所述支承主体251的上端靠近所述顶表面2501的位置以避免接触所述引线24，因此所述滤光元件40和所述感光元件21之间是有空隙的。本领域的技术人员可以理解的是，在图30所示的实施例的其他变形实施方式中，所述滤光元件40的边缘也可以不通过被所述支承主体251包覆而固定，而是所述滤光元件40被直接贴装于所述感光元件21的所述感光区域212，但是，本发明在这一方面并不受此限制。
如图30所示为基于本发明优选实施例的另一变形实施例的一摄像模组130，和图10中所示的实施例中的所述摄像模组110不同的是，所述模塑主体232一体模塑包覆所述电子元器件26、所述线路板22的所述边缘区域223的所述线路板外侧部2233、所述支承元件25的所述外侧面2503以及所述镜片周缘272的所述外周面2723，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以增强所述镜片27的稳固性。
如图31所示为基于本发明优选实施例的另一变形实施例的一摄像模组131，和图7中所述的优选实施例中的所述摄像模组100不同的是，所述支承主体251包覆所述边缘区域223的所述线路板内侧部2231以及所述非感光区域213的所述芯片外侧部2133。经过MOL模塑工艺之后，所述模塑主体232一体模塑包覆所述电子元器件26、所述边缘区域223的所述线路板外侧部2233、所述线路板连接部2232、所述支承元件25的所述外侧面2503以及所述镜片周缘272的所述外周面2723，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以增强所述镜片27的稳固性。
如图32所示为基于本发明优选实施例的另一变形实施例的一摄像模组132，和图8B所示的实施例中的所述摄像模组108不同的是，所述支承主体251包覆所述边缘区域223的所述线路板内侧部2231以及所述非感光区域213的所述芯片外侧部2133。经过MOL模塑工艺之后，所述模塑主体232一体模塑包覆所述电子元器件26、所述边缘区域223的所述线路板外侧部2233、所述线路板连接部2232、所述支承元件25的所述外侧面2503以及所述镜片周缘272的所述外周面2723，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以增强所述镜片27的稳固性。
如图33所示为基于本发明优选实施例的另一变形实施例的一摄像模组133，和图9所示的实施例中的所述摄像模组109不同的是，所述支承主体251包覆所述边缘区域223的所述线路板内侧部2231以及所述非感光区域213的所述芯片外侧部2133。经过MOL模塑工艺之后，所述模塑主体232一体模塑包覆所述电子元器件26、所述边缘区域223的所述线路板外侧部2233、所述线路板连接部2232、所述支承元件25的所述外侧面2503以及所述镜片周缘272的所述外周面2723，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以增强所述镜片27的稳固性。此外，所述摄像模组133和图9中所示的实施例中的所述摄像模组109的结构还不同的是所述滤光元件40并没有贴合于所述感光元件21。也就是说，由于所述支承主体251没有包覆所述非感光区域213的所述芯片连接部2132和所述芯片内侧部2131，所述滤光元件40的边缘被包覆于所述支承主体251的上端靠近所述顶表面2501的位置以避免接触所述引线24，因此所述滤光元件40和所述感光元件21之间是有空隙的。本领域的技术人员可以理解的是，在图33所示的实施例的其他变形实施方式中，所述滤光元件40的边缘也可以不通过被所述支承主体251包覆而固定，而是所述滤光元件40被直接贴装于所述感光元件21的所述感光区域212，但是，本发明在这一方面并不受此限制。
如图34所示为基于本发明优选实施例的另一变形实施例的一摄像模组134，和图10所示的实施例中的所述摄像模组110不同的是，所述支承主体251包覆所述边缘区域223的所述线路板内侧部2231以及所述非感光区域213的所述芯片外侧部2133。经过MOL模塑工艺之后，所述模塑主体232一体模塑包覆所述电子元器件26、所述边缘区域223的所述线路板外侧部2233、所述线路板连接部2232、所述支承元件25的所述外侧面2503以及所述镜片周缘272的所述外周面2723，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以增强所述镜片27的稳固性。
如图35所示为基于本发明优选实施例的另一变形实施例的一摄像模组135，和图7中所述的优选实施例中的所述摄像模组100不同的是，所述支承主体251仅仅形成于所述非感光区域213的所述芯片内侧部2131，也就是说，所述支承主体251在这个实施例中支撑所述镜片27。所述引线24以及各两个连接端都是被所述模塑基座23所模塑固定的。经过MOL模塑工艺后，所述模塑主体232一体模塑包覆所述电子元器件26、所述引线24、所述线路板22的所述边缘区域223、所述非感光区域213的所述芯片外侧部2133、所述芯片连接部2132、所述支承元件25的所述外侧面2503以及所述镜片周缘272的所述外周面2723，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以增强所述镜片27的稳固性。
如图36所示为基于本发明优选实施例的另一变形实施例的一摄像模组136，和图8B所示的实施例中的所述摄像模组108不同的是，所述支承主体251仅仅形成于所述非感光区域213的所述芯片内侧部2131，也就是说，所述支承主体251在这个实施例中支撑所述镜片27。所述引线24以及各两个连接端都是被所述模塑基座23所模塑固定的。经过MOL模塑工艺后，所述模塑主体232一体模塑包覆所述电子元器件26、所述引线24、所述线路板22的所述边缘区域223、所述非感光区域213的所述芯片外侧部2133、所述芯片连接部2132、所述支承元件25的所述外侧面2503以及所述镜片周缘272的所述外周面2723，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以增强所述镜片27的稳固性。
如图37所示为基于本发明优选实施例的另一变形实施例的一摄像模组137，和图9所示的实施例中的所述摄像模组109不同的是，所述支承主体251仅仅形成于所述213的所述芯片内侧部2131，也就是说，所述支承主体251在这个实施例中支撑所述镜片27。所述引线24以及各两个连接端都是被所述模塑基座23所模塑固定的。经过MOL模塑工艺后，所述模塑主体232一体模塑包覆所述电子元器件26、所述引线24、所述线路板22的所述边缘 区域223、所述213的所述芯片外侧部2133、所述芯片连接部2132、所述支承元件25的所述外侧面2503以及所述镜片周缘272的所述外周面2723，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以增强所述镜片27的稳固性。
如图38所示为基于本发明优选实施例的另一变形实施例的一摄像模组138，和图10所示的实施例中的所述摄像模组110不同的是，所述支承主体251仅仅形成于所述非感光区域213的所述芯片内侧部2131，也就是说，所述支承主体251在这个实施例中支撑所述镜片27。所述引线24以及各两个连接端都是被所述模塑基座23所模塑固定的。经过MOL模塑工艺后，所述模塑主体232一体模塑包覆所述电子元器件26、所述引线24、所述线路板22的所述边缘区域223、所述非感光区域213的所述芯片外侧部2133、所述芯片连接部2132、所述支承元件25的所述外侧面2503以及所述镜片周缘272的所述外周面2723，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以增强所述镜片27的稳固性。
如图39所示为基于本发明优选实施例的另一变形实施例的一摄像模组139，和图7中所述的优选实施例中的所述摄像模组100不同的是，所述支承主体251仅仅形成于所述边缘区域223的所述线路板外侧部2233。也就是说，所述支承主体251在这个实施例中支撑所述镜片27且不包覆所述引线24。经过MOL模塑工艺后，所述模塑主体232一体模塑包覆所述电子元器件26、所述边缘区域223的所述线路板外侧部2233、所述支承元件25的所述外侧面2503以及所述镜片周缘272的所述外周面2723，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以增强所述镜片27的稳固性。由于所述引线24被设置于所述密闭空间2700内，因此在模塑形成所述23的时候，所述引线24不会被损坏，且在所述23形成之后，所述引线24能够被保护不受外界环境的影响。
如图40所示为基于本发明优选实施例的另一变形实施例的一摄像模组140，和图8B所示的实施例中的所述摄像模组108不同的是，所述支承主体251仅仅形成于所述边缘区域223的所述线路板外侧部2233。也就是说，所述支承主体251在这个实施例中支撑所述镜片27且不包覆所述引线24。经过MOL模塑工艺后，所述模塑主体232一体模塑包覆所述电子元器件26、所述边缘区域223的所述线路板外侧部2233、所述支承元件25的所述外侧面2503以及所述镜片周缘272的所述外周面2723，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以增强所述镜片27的稳固性。
如图41所示为基于本发明优选实施例的另一变形实施例的一摄像模组141，和图9所示的实施例中的所述摄像模组109不同的是，所述支承主体251仅仅形成于所述边缘区域223的所述线路板外侧部2233。也就是说，所述支承主体251在这个实施例中支撑所述镜片27且不包覆所述引线24。经过MOL模塑工艺后，所述模塑主体232一体模塑包覆所述电子元器件26、所述边缘区域223的所述线路板外侧部2233、所述支承元件25的所述外侧面2503以及所述镜片周缘272的所述外周面2723，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以增强所述镜片27的稳固性。此外，所述摄像模组144和图9中所示的实施例中的所述摄像模组109的结构还不同的是所述滤光元件40并没有贴合于所述感光元件21。也就是说，由于所述支承主体251没有包覆所述非感光区域213和所述边缘区域223的所述线路板内侧部2231以及所述线路板连接部2232，所述滤光元件40的边缘被包覆于所述支承主体251的上端靠近所述顶表面2501的位置以避免接触所述引线24，因此所述滤光元件40和所述感光元件21之间是有空隙的。本领域的技术人员可以理解的是，在图41所示的实施例的其他变形实施方式中，所述滤光元件40的边缘也可以不通过被所述支承主体251包覆而固定，而是所述滤光元件40被直接贴装于所述感光元件21的所述感光区域212，但是，本发明在这 一方面并不受此限制。
如图42所示为基于本发明优选实施例的另一变形实施例的一摄像模组142，和图10所示的实施例中的所述摄像模组110不同的是，所述支承主体251仅仅形成于所述边缘区域223的所述线路板外侧部2233。也就是说，所述支承主体251在这个实施例中支撑所述镜片27且不包覆所述引线24。经过MOL模塑工艺后，所述模塑主体232一体模塑包覆所述电子元器件26、所述边缘区域223的所述线路板外侧部2233、所述支承元件25的所述外侧面2503以及所述镜片周缘272的所述外周面2723，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以增强所述镜片27的稳固性。
如图43所示为基于本发明优选实施例的另一变形实施例的一摄像模组143，和图7中所述的优选实施例中的所述摄像模组100不同的是，并没有设置所述支承主体251，所述镜片27的所述镜片周缘272被直接贴装于所述感光元件21的所述非感光区域213。经过MOL模塑工艺后，所述模塑主体232一体模塑包覆所述电子元器件26、所述线路板22的所述边缘区域223、所述非感光区域213的所述芯片外侧部2133和所述芯片连接部2132、所述镜片周缘272的所述外周面2723，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以增强所述镜片27的稳固性。所述镜片27和所述感光元件21的连接方式可以通过所述模塑主体232的一体模塑封装，也可以在其他实施例中通过表面贴装工艺连接在一起，但是，本发明在这一方面并不受此限制。
如图44所示为基于本发明优选实施例的另一变形实施例的一摄像模组144，和图8B所示的实施例中的所述摄像模组108不同的是，并没有设置所述支承主体251，所述镜片27的所述镜片周缘272被直接贴装于所述感光元件21的所述非感光区域213。经过MOL模塑工艺后，所述模塑主体232一体模塑包覆所述电子元器件26、所述线路板22的所述边缘区域223、所述非感光区域213的所述芯片外侧部2133和所述芯片连接部2132、所述镜片周缘272的所述外周面2723，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以增强所述镜片27的稳固性。
如图45所示为基于本发明优选实施例的另一变形实施例的一摄像模组145，和图9所示的实施例中的所述摄像模组109不同的是，并没有设置所述支承主体251，所述镜片27的所述镜片周缘272被直接贴装于所述感光元件21的所述非感光区域213。经过MOL模塑工艺后，所述模塑主体232一体模塑包覆所述电子元器件26、所述线路板22的所述边缘区域223、所述非感光区域213的所述芯片外侧部2133和所述芯片连接部2132、所述镜片周缘272的所述外周面2723，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以增强所述镜片27的稳固性。所述镜片27、所述滤光元件40以及所述感光元件21的连接方式可以通过所述模塑主体232的一体模塑封装，也可以在其他实施例中通过表面贴装工艺连接在一起，但是，本发明在这一方面并不受此限制。
值得一提的是，如图7至图10以及图15至图46中部分实施例中为了标号清楚，因此所述镜头10和所述驱动器30未在图中示出，本发明并不受此限制。
如图46所示为基于本发明优选实施例的另一变形实施例的一摄像模组146，和图10所示的实施例中的所述摄像模组110不同的是，并没有设置所述支承主体251，所述镜片27的所述镜片周缘272被直接贴装于所述感光元件21的所述非感光区域213。经过MOL模塑工艺后，所述模塑主体232一体模塑包覆所述电子元器件26、所述线路板22的所述边缘区域223、所述非感光区域213的所述芯片外侧部2133和所述芯片连接部2132、所述镜片周缘272的所述外周面2723，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以增强所述镜片27的稳 固性。
如图47所示为基于本发明优选实施例的另一变形实施例的一摄像模组147，和图7中所述的优选实施例中的所述摄像模组100不同的是，所述感光元件21在所述线路板22的设置方式为下沉式。也就是说，所述线路板22具有一感光元件凹槽224，所述感光元件21被设置于所述感光元件凹槽224内。在本发明中，这种所述感光元件21的上表面平行或者低于所述线路板22的上表面，即所述22的所述芯片贴装区域222低于所述边缘区域223的设置方式被定义为下沉式。由于所述感光元件21被设置为下沉式，被组装形成的所述摄像模组147的整体厚度进一步降低，满足了电子设备对轻薄尺寸的摄像模组的需求。
如图48所示为基于本发明图47所示的实施例的另一变形实施例的一摄像模组148，和图47所示的实施例的所述摄像模组147不同的是，所述线路板22的所述芯片贴装区域具有一感光元件容纳孔225。所述感光元件容纳孔225为一通孔，所述感光元件21被设置于所述感光元件容纳孔225内。优选地，所述感光元件21被固持在所述感光元件容纳孔225内，此外，所述支承元件25也加固了所述感光元件21和所述线路板22之间的连接，能够避免所述感光元件21从所述线路板22的所述感光元件容纳孔225内脱离出来。
值得一提的是，如图8B至图10以及图15至图46中各实施例中的变形实施方式也可以被应用于图47和图48所示的实施例中，本发明在这一方面并不受此限制。
如图49所示为基于本发明优选实施例的另一变形实施例的一摄像模组149，和图8B所示的实施例中的所述摄像模组108不同的是，所述镜片27并没有设置所述镜片周缘272，所述镜片27的所述镜片主体271被所述支承主体251直接支撑，所述支承主体251的底部直接贴装于所述感光元件21的所述非感光区域213。经过MOL模塑工艺后，所述模塑主体232一体模塑包覆所述电子元器件26、所述线路板22的所述边缘区域223、所述非感光区域213的所述芯片外侧部2133和所述芯片连接部2132、所述镜片主体271的外边缘，从而形成所述模塑感光组件20。可以理解的是，所述镜片主体271的外边缘由于被所述支承主体251所支撑，可以像图49所示的同时也被所述所述模塑主体232包覆，也可以在其他实施例中仅仅被所述支承主体251所包裹，本发明在这一方面并不受此限制。
如图50所示为基于本发明优选实施例的另一变形实施例的一摄像模组150，和图8B所示的实施例中的所述摄像模组108不同的是，并没有设置所述支承主体251，且所述镜片27的所述镜片周缘272的底部向下延伸形成一镜片支撑脚2720。所述镜片支撑脚2720支撑于所述边缘区域223的所述线路板外侧部2233。也就是说，所述镜片支撑脚2720在这个实施例中支撑所述镜片27且不包覆所述引线24。经过MOL模塑工艺后，所述模塑主体232一体模塑包覆所述电子元器件26、所述边缘区域223的所述线路板外侧部2233、所述支承元件25的所述外侧面2503以及所述镜片周缘272的所述外周面2723以及所述镜片支撑脚2720的外侧面，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以增强所述镜片27的稳固性。
值得一提的是，在上述各实施例中，在进行MOL模塑工艺时，所述支承主体251以及所述镜片主体271能够阻止所述感光元件21和所述线路板22的各个部位因为受力不均而产生移位，并且能够阻止所述成型材料进入所述感光元件21和所述镜片27之间，以保证所述感光元件21的平整度。
值得一提的是，本发明主要以单体摄像模组为例对本发明的所述摄像模组的特征和优势进行了阐述，但是本领域的技术人员可以理解的是，在其他的实施例中，例如图13和图14所示，所述摄像模组100也可以是双镜头摄像模组或者阵列摄像模组1000，因此，单体摄像模组并不构成对本发明的内容和范围的限制。
根据本发明的另一个方面，本发明进一步提供一模塑感光组件20的制造方法，其中所述制造方法包括如下步骤：
(a)通过一组引线24连接一感光元件21和一线路板22；
(b)将所述感光元件21和所述线路板22放置于一成型模具900的一上模具901或者 一下模具902；
(c)在所述上模具901和所述下模具902合模的过程中，通过一镜片27向上支撑所述上模具901，设置一支承元件25连接于所述镜片27以阻止所述上模具901的压合面9011通过施压于所述镜片27而施压于每组所述引线24；以及
(d)向形成在所述上模具901和所述下模具902之间的一成型空间903内加入流体状的成型材料，以在所述成型材料固化后形成一模塑基座23，其中所述模塑基座23包括一模塑主体232和具有一模塑孔231，其中所述模塑主体232包覆所述线路板22的边缘区域223的至少一部分、所述支承元件25的至少一部分以及所述镜片27的至少一部分。
根据本发明的另一个方面，本发明进一步提供一模塑感光组件20的制造方法，其中所述制造方法包括如下步骤：
(A)通过一组引线24连接一感光元件21和一线路板22；
(B)通过一支承元件25至少部分地包覆所述引线24且支撑一镜片27，以形成一模塑感光组件半成品；
(C)将所述模塑感光组件半成品放置于一成型模具900的一上模具901或者一下模具902，其中在所述上模具901和所述下模具902进行合模；以及
(D)向形成在所述上模具901和所述下模具902之间的一成型空间903内加入流体状的成型材料，以在所述成型材料固化后形成一模塑基座23，其中所述模塑基座23包括一模塑主体232和具有一模塑孔231，所述模塑主体232包覆所述线路板22的边缘区域223、所述支承元件25的至少一部分以及所述镜片27的至少一部分，所述感光元件21的感光区域212对应于所述模塑孔231。
根据本发明的另一个方面，本发明进一步提供一模塑感光组件的制造方法，其中所述制造方法包括如下步骤：
(h)将一感光元件21贴装于一线路板22；
(i)通过一支承元件25预固定所述感光元件21和所述线路板22，且设置一镜片27贴装在所述支承元件25上以制得一模塑感光组件半成品，并且所述支承元件25阻止在所述感光元件21和所述线路板22之间以及所述镜片27和所述感光元件21之间产生缝隙；
(j)将所述模塑感光组件半成品放置于一成型模具900的一上模具901或者一下模具902，以在所述上模具901和所述下模具902合模时，在所述上模具901和所述下模具902之间形成一环状的成型空间903；以及
(k)向所述成型空间903内加入流体状的成型材料，以在所述成型材料固化后形成所述模塑基座23，其中所述模塑基座23包括一模塑主体232和具有一模塑孔231，所述模塑主体23包覆所述线路板22的边缘区域223、所述支承元件25的至少一部分以及所述镜片27的至少一部分，所述感光元件21的感光区域212对应于所述模塑孔231。
根据本发明的另一个方面，本发明进一步提供一模塑感光组件的制造方法，其中所述制造方法包括如下步骤：
(H)通过一组引线24连接于一感光元件21的芯片连接件211和一线路板22的线路板连接件221；
(I)将所述感光元件21和所述线路板22放置于一成型模具900的一上模具901或者一下模具902，以在所述上模具901和所述下模具902合模的时，在所述上模具901和所述下模具902之间形成一环状的成型空间903；
(J)在向所述成型空间903加入流体状的成型材料时，通过位于所述成型空间903的一支承元件25以及贴装在所述支承元件25的一镜片27阻挡所述成型材料的方式减小所述成型材料产生的冲击力对所述引线24造成的影响；以及
(K)在所述成型材料固化后形成一模塑基座23，其中所述模塑基座23包括一模塑主体232和具有一模塑孔231，其中所述模塑主体232包覆所述线路板22的边缘区域223、所述支承元件25、所述镜片27的至少一部分和所述感光元件21的非感光区域213的至少一 部分。
如图11所示，本发明进一步提供一电子设备200，其中所述电子设备200包括至少一摄像模组100，其中每个所述摄像模组100用于获取图形，其中每个所述摄像模组200分别进一步包括至少一镜头10和至少一模塑感光组件20，所述模塑感光组件20包括一镜片27、一支承元件25，一感光元件21，一线路板22，一组引线24和一模塑基座23，其中每个所述引线24的两端分别被连接于所述感光元件21的芯片连接件211和所述线路板22的线路板连接件221，所述镜片27进一步包括一镜片主体271和一镜片周缘272，所述镜片周缘272一体延伸于所述镜片主体271。其中所述模塑基座23包括一模塑主体232和具有一模塑孔231，其中在通过一成型模具900进行模塑工艺以使所述模塑主体232成型时，所述镜片27的所述镜片主体271在脱模时形成所述模塑孔231，所述镜片27的一镜片周缘272被贴装于所述支承元件25，其中所述感光元件21的感光区域212对应于所述模塑孔231，其中所述镜头10、所述镜片27的所述镜片主体271被设置于每个所述模塑感光组件20的所述感光元件21的感光路径。
如图51至图57为本发明的一优选实施例的一阵列摄像模组100，其中所述阵列摄像模组100包括至少两镜头10和一感光组件，所述感光组件包括至少两模塑感光组件20。所述阵列摄像模组100可以被应用于各种电子设备，以辅助使用者可以通过所述阵列摄像模组100拍摄物体或人物的影像，例如所述阵列摄像模组100可以被用于拍摄物体或者人物的图像或者视频等影像资料。优选地，所述阵列摄像模组100可以被应用于一移动电子设备，例如所述移动电子设备可以是但不限于手机或者平板电脑设备。
各所述模塑感光组件20分别进一步包括一感光元件21、一线路板22、一模塑基座23、一组引线24、一支承元件25、多个电子元器件26以及一镜片27。其中各所述引线24的两端分别延伸以被连接于所述感光元件21的一非感光区域213和所述线路板22。各所述模塑基座23一体地成型于各所述线路板22，以使各所述模塑基座23、各所述线路板22以及各所述镜片27形成一体式结构。各所述电子元器件26可以通过诸如SMT(Surface Mount Technology)工艺被贴装于对应的各所述线路板22。所述镜头10和所述镜片27被设置于所述模塑感光组件20的所述感光元件21的感光路径。被物体反射的光线自所述镜头10以及所述镜片27进入所述阵列摄像模组100的内部，以在后续被所述感光元件21接收和进行光电转化，从而得到与物体相关联的影像。在本发明中，这种所述模塑基座23被模塑成型在所述热硬化影片27的模塑工艺被定义为MOL(molding on lens)模塑工艺，以和传统COB(chip on board)模塑工艺相区别。所述镜片27的设置能够降低光学的TTL(镜头通光孔上面的镜头平面到芯片的感光平面的距离)，从而在不影响光学性能的前提下使所述阵列摄像模组100的尺寸进一步减小，满足电子设备对搭载小尺寸的阵列摄像模组100的需求。同时，所述镜片27的设置也能够降低污点敏感度。例如在一实施例中，可以降低50％的污点敏感度。即优选地，所述镜头10包括多个镜片元件，所述镜头和所述镜片27形成一光学系统，经过所述光学系统的光线被汇聚至所述感光元件21。也就是说，传统镜头在本发明中被实施为两部分，一部分是所述镜头10，另一部分是所述镜片27，所述镜片27是具有折光能力的镜片，所述镜头10和所述镜片27一起起到将光线折射的作用，从而将光线汇聚至所述感光元件21，这样能够有效降低整个光学系统的TTL。从另外一方面说，本发明中，所述镜头10和所述镜片27形成一镜头组件，所述镜头组件的其中一片镜片成为外置镜片，即所述镜片27，所述镜片27被所述模塑基座23一体地封装，从而能够减小所述摄像模组的尺寸。
可以理解的是，所述感光组件的多个所述模塑感光组件20的多个所述线路板22可以一体成型从而形成连体线路板，或者可以是各自独立的线路板。所述感光组件的多个所述模塑感光组件20的多个所述模塑基座23可以一体成型从而形成连体模塑基座，如图中所示，或者也可以是各自独立的模塑基座。
在本发明的这个优选实施例中，优选地，所述镜片27被实施为一热硬化性质的镜片，即所述镜片被实施为一热硬化镜片，从而所述镜片27在进行模塑工艺能够承受住模塑工艺中的环境温度。例如，在一实施例的模塑工艺中能够承受175℃的模塑环境温度。也就是说，在模塑工艺之前，耐高温的且经过了热硬化处理的所述镜片27被连接于所述支承元件25，且和所述线路板22以及所述感光元件21一起被放置于模具中，流体的固化模塑材料围绕所述支承元件25以及所述镜片27的外表面模塑一体成型所述模塑基座23，从而所述模塑基座23能够一体地成型于所述线路板22，也就是说，所述模塑基座23、所述线路板22以及所述镜片27形成一体式结构。本领域的技术人员可以理解的是，本发明的所述镜片27不仅仅可以是热硬化镜片，还可以是其他性质的镜片，本发明并不受此限制。
进一步地，所述镜片27包括一镜片主体271和设置在所述镜片主体271周围的一镜片周缘272。由于所述镜片27为精密的光学元件，所述镜片主体271的边缘较薄。而设置于所述镜片主体271边缘的且为一体连接的所述镜片周缘272为增厚式支架设计，能够承载所述镜片主体271，从而不影响所述镜片主体271的光学性能的同时能够使所述镜片主体27在模具中被一体模塑连接于所述模塑基座23。也就是说，在所述模塑基座23被成型之前，所述镜片27的所述镜片周缘272被设置于所述感光元件21的所述非感光区域213，所述镜片27的所述镜片主体271被设置于所述模塑感光组件20的所述感光元件21的感光路径；在所述模塑基座23成型之后，所述模塑基座23包覆所述线路板22、所述感光元件21的所述非感光区域213、所述支承元件25的一部分以及所述镜片27的所述镜片周缘272，以形成所述模塑感光组件20。
值得一提的是，所述支承元件25能够有效地提高所述阵列摄像模组100的产品良率，并改善所述阵列摄像模组100的成像品质。进一步地，所述支承元件25包括一框形的支承主体251和具有一通孔252，其中所述支承主体251被设置于所述感光元件21的所述非感光区域213，以使所述感光元件21的一感光区域212对应于所述支承元件25的所述通孔252以及所述镜片27的所述镜片主体271，从而在进行模塑工艺时，所述支承主体251以及所述镜片27能够保护所述感光元件21的所述感光区域212。更进一步地，所述支承元件25具有一顶表面2501、一内侧面2502以及一外侧面2503，其中所述顶表面2501的两侧分别连接于所述内侧面2502和所述外侧面2503。所述支承元件25的朝向所述感光元件21的一侧被定义为所述支承元件25的所述内侧面2502，所述支承元件25的朝向所述线路板22的一侧被定义为所述支承元件25的所述外侧面2503。所述支承元件25的一内侧面2502用于形成所述支承元件25的所述通孔252。
值得一提的是，所述镜片周缘272具有一顶面2721、一底面2722以及一外周面2723。其中所述镜片周缘272的所述外周面2733的两侧分别连接于所述镜片周缘272的所述顶面2721和所述底面2722。也就是说，所述镜片周缘272朝向所述线路板22的一侧被定义为所述镜片周缘272的所述外周面2723。值得一提的是，所述镜片主体271具有一镜片外面2711和一镜片内面2712。也就是说说，所述镜片主体271朝向所述感光元件21的一侧被定义为所述镜片主体271的所述镜片内面2712，而和所述镜片周缘272的所述顶面2721连接的一面被定义为所述镜片主体271的所述镜片外面2711。
进一步地，所述镜片27被贴合于所述支承主体251后和所述线路板22以及所述感光元件21一起被放入模具中进行模塑工艺。流体的热固化模塑材料经过热固化后形成所述模塑基座23，所述模塑基座23在成型后包覆所述支承主体251的所述外侧面2503和所述镜片周缘271的所述外周面2723。当然，在其他实施例中，所述模塑基座23在成型后还包覆所述镜片周缘271的所述顶面2721的全部或者一部分。
更进一步地，所述感光元件21包括所述感光区域212和所述非感光区域213，其中所述感光元件21的所述感光区域212和所述非感光区域213一体地成型，并且所述感光区域212位于所述感光元件21的中部，所述非感光区域213位于所述感光元件21的外部，并且所述非感光区域213围绕所述感光区域212一周。被物体反射的光线自所述镜头10进入所 述阵列摄像模组100的内部后，能够被所述感光元件21的所述感光区域212接收和进行光电转化，以得到与物体相关联的影像。
更进一步地，所述感光元件21具有一组芯片连接件211，所述线路板22具有一组线路板连接件221，其中每个所述引线24的两端可以分别被连接于所述感光元件21的每个所述芯片连接件211和所述线路板22的每个所述线路板连接件221，通过上述这样的方式使所述感光元件21和所述线路板22被连接。在本发明的一个实施例中，所述感光元件21的每个所述芯片连接件211和所述线路板22的每个所述线路板连接件221可以是连接盘，即，所述感光元件21的每个所述芯片连接件211和所述线路板22的每个所述线路板连接件221可以分别呈盘状，以用于使每个所述引线24的两端分别连接于所述感光元件21的每个所述芯片连接件211和所述线路板22的每个所述线路板连接件221。在本发明的另一个示例中，所述感光元件21的每个所述芯片连接件211和所述线路板22的每个所述线路板连接件221可以是球状，例如将锡膏或者其他的焊接材料点在所述感光元件21和所述线路板22以分别形成所述感光元件21的所述芯片连接件211和所述线路板22的所述线路板连接件221。尽管如此，所述感光元件21的所述芯片连接件211和所述线路板22的所述线路板连接件221的形状并不限制本发明的内容和范围。
本领域的技术人员可以理解的是，所述感光元件21的每个所述芯片连接件211被设置于所述感光元件21的所述非感光区域213。另外，所述感光元件21的所述非感光区域213具有一芯片内侧部2131、一芯片连接部2132以及一芯片外侧部2133，其中所述芯片内侧部2131围绕所述感光区域212一周，所述芯片连接部2132的两侧分别延伸并连接至所述芯片内侧部2131和所述芯片外侧部2132。也就是说，将所述非感光区域213的从被设置所述芯片连接件211的位置到所述感光区域212的边缘的位置的区域定义为所述芯片内侧部2131，将所述非感光区域213的被设置所述芯片连接件211的区域定义为所述芯片连接部2132，将所述非感光区域213的从被设置所述芯片连接件211的位置到所述感光元件21的外边沿的位置的区域定义为所述芯片外侧部2132。换言之，从所述感光元件21的俯视视角来看，所述感光元件21从外到内依次是所述芯片外侧部2133、所述芯片连接部2132、所述芯片内侧部2131和所述感光区域212。
另外，所述线路板22包括一平整的芯片贴装区域222和一边缘区域223，其中所述边缘区域223与所述芯片贴装区域222一体地形成，并且所述边缘区域223位于所述芯片贴装区域222的周围。所述芯片贴装区域222被用于贴装所述感光元件21，所述线路板连接件221被设置于所述边缘区域223。所述线路板22的所述边缘区域223具有一线路板内侧部2231、一线路板连接部2232以及一线路板外侧部2233，其中所述线路板内侧部2231围绕所述芯片贴装区域222一周，所述线路板连接部2232的两侧分别延伸并连接至所述线路板内侧部2231和所述线路板外侧部2233。也就是说，将所述边缘区域223的从被设置所述线路板连接件221的位置到所述芯片贴装区域222的边缘的位置的区域定义为所述线路板内侧部2231，将所述边缘区域223的被设置所述线路板连接件221的区域定义为所述线路板连接部2232，将所述边缘区域223的从被设置所述线路板连接件221的位置到所述边缘区域223的外边沿的位置的区域定义为所述线路板外侧部2233。换言之，从所述线路板22的俯视视角来看，所述线路板22从内到外依次是所述线路板外侧部2233、所述线路板连接部2232、所述线路板内侧部2231和所述芯片贴装区域222。所述引线24的类型在本发明的所述阵列摄像模组100中不受限制，例如在一个具体实施例中，所述引线24可以被实施为金线，即，通过打金线的方式能够将所述感光元件21和所述线路板22连接在一起，从而所述感光元件21在将光信号转化为电信号后，所述电信号能够通过所述引线24被进一步传输至所述线路板22。本领域的技术人员可以理解的是，在所述阵列摄像模组100的其他示例中，所述引线24也可以被实施为银线、铜线等任何能够实现所述电信号在所述感光元件21和所述线路板22之间传输的材料制成。
值得一提的是，各所述电子元器件26被贴装于所述线路板22的所述边缘区域223。优 选地，各所述电子元器件26被贴装于所述边缘区域223的所述线路板外侧部2233。所述感光元件21和各所述电子元器件26可以被贴装于所述线路板22的同一侧或者相反侧，例如在一个具体实施例中，所述感光元件21和每个所述电子元器件26被贴装于所述线路板22的同一侧，并且所述感光元件21被贴装于所述线路板22的所述芯片贴装区域222，每个所述电子元器件26被贴装于所述线路板22的所述边缘区域223。在所述模塑基座23一体地成型于所述线路板22后，所述模塑基座23包覆每个所述电子元器件26，以通过所述模塑基座23隔离相邻的所述电子元器件26和隔离所述电子元器件26和所述感光元件21，从而，在本发明的所述阵列摄像模组100中，即便是相邻所述电子元器件26的距离较近时，所述模塑基座23也可以避免相邻所述电子元器件26相互接触或者干扰，并且所述模塑基座23包覆所述电子元器件26的方式也可以避免产生于所述电子元器件26的表面的污染物污染所述感光元件21的所述感光区域212，进而减少所述阵列摄像模组100的体积和提高所述阵列摄像模组100的成像品质。也就是说，本发明的所述阵列摄像模组100通过所述模塑基座23包覆所述电子元器件26的方式，使小面积的所述线路板22能够被贴装更多的所述电子元器件26。值得一提的是，所述电子元器件26的类型包括但不限于电阻、电容、驱动器等。
进一步地，如图57所示，所述阵列摄像模组100进一步包括至少两滤光元件40，在本发明的这个优选实施例中，所述滤光元件40被设置于所述镜头10的底部，也就是说，所述滤光元件40被组装于所述镜头10。所述镜头10内部的各光学镜片依次排列，所述滤光元件40位于所述镜头10的光学路径。在所述模塑感光组件20被模塑一体封装之后，所述滤光元件40和所述镜头10一起被贴装于所述模塑感光组件20，组装形成所述阵列摄像模组100。其中，所述滤光元件40位于所述感光元件21的感光路径。被物体反射的光线自所述镜头10的各光学镜片，并通过所述滤光元件40过滤后进入所述阵列摄像模组100的内部，能够被所述感光元件21接收和进行光电转化。也就是说，所述滤光元件40能够过滤自所述镜头10的各光学镜片中被物体反射的光线中的杂光，例如红外线部分，通过这样的方式，能够改变所述阵列摄像模组100的成像品质。
本领域的技术人员可以理解的是，在所述阵列摄像模组100的不同示例中，所述滤光元件40能够被实施为不同的类型，例如所述滤光元件40能够被实施为红外截止滤光片、全透光谱滤光片以及其他的滤光片或者多个滤光片的组合，例如所述滤光元件40能够被实施为红外截止滤光片和全透光谱滤光片的组合，即所述红外截止滤光片和所述全透光谱滤光片能够被切换以选择性地位于所述感光元件21的感光路径上，例如在白天等光线较为充足的环境下使用所述阵列摄像模组100时，可以将所述红外截止滤光片切换至所述感光元件21的感光路径，以通过所述红外截止滤光片过滤进入所述阵列摄像模组100的被物体反射的光线中的红外线，当夜晚等光线较暗的环境中使用所述阵列摄像模组100时，可以将所述全透光谱滤光片切换至所述感光元件21的感光路径，以允许进入所述阵列摄像模组100的被物体反射的光线中的红外线部分透过。
值得一提的是，所述滤光元件40的安装位置在不同的实施例中有多种变形实施方式。图57中所述滤光元件40被设置于所述镜头10内的底部。在其他实施例中，所述滤光元件40被设置于所述模塑基座23的顶部。这两种设置的方式都是在所述模塑感光组件20被模塑一体化成型之后安装所述滤光元件40。在其他实施例中，所述滤光元件40和所述模塑感光组件20在模具中被一起模塑组装完成。也就是说，在其他实施例中，所述滤光元件40的周边缘可以是被所述支承元件25包覆，被固定于所述感光元件21和所述镜片27之间。当所述阵列摄像模组100没有设置所述支承元件25时，所述滤光元件40被贴装于所述感光元件21上，且位于所述镜片27和所述感光元件21之间。后两种设置的方式都是所述滤光元件40和所述感光元件21、所述线路板22、所述支承元件25以及所述镜片27一起被放置于模具中，经MOL工艺模塑之后形成所述模塑基座23，从而之后被贴装所述镜头10或驱动所述镜头10的一驱动器30后组装形成所述摄影模组100。所述滤光元件40在位置上的各种变形会在之后的各实施例中详细揭露。
另外，所述滤光元件40可以被直接组装于所述模塑基座23的顶表面，也可以通过先将所述滤光元件40组装于一个小镜座，然后再将所述小镜座组装于所述模塑基座23的顶表面，通过这样的方式，能够减少所述滤光元件40的尺寸，以降低所述阵列摄像模组的制造成本。
值得一提的是，所述镜片27可以是凸透镜，具有光线汇聚的作用。由于所述滤光元件40不会产生光的折射，但是被实施为凸透镜的所述镜片27会让成像变小。所述滤光元件40上的颗粒(污点)往往会使所述感光元件21成像上形成较大的污坏点，距离所述感光元件21越近，那么成像的污坏点越大。因此，在本发明的MOL工艺中，所述镜片27被设置于所述镜头10的下部，所述滤光元件40被设置于所述镜头10内的底部。也就是说，本发明的MOL工艺可以将所述滤光元件远离所述感光元件21，同时也不影响被实施为凸透镜的所述镜片27的光线汇聚的作用，从而使污坏点成像更小。
值得一提的是，优选地，所述镜片27的所述镜片周缘272为方形台阶状。
值得一提的是，在本发明的MOL模塑工艺中，所述支承主体251也有多种变形实施方式。例如，在一实施例中，所述支承主体251包覆所述引线24的全部、所述边缘区域223的所述线路板外侧部2233、所述线路板连接部2232、所述线路板内侧部2231、所述非感光区域213的所述2133、所述芯片连接部2132以及所述芯片连接部2132；又例如在一实施例中，所述支承主体251包覆所述引线24的部分、所述非感光区域213的所述芯片外侧部2133、所述芯片连接部2132以及所述芯片内侧部2131；又例如在一实施例中，所述支承主体251包覆所述引线24的部分、所述边缘区域223的所述线路板内侧部2231、所述非感光区域213的所述芯片外侧部2133、所述芯片连接部2132以及所述芯片内侧部2131；又例如在一实施例中，所述支承主体251包覆所述引线24的部分、所述边缘区域223的所述线路板外侧部2233、所述线路板连接部2232以及所述线路板内侧部2231；又例如在一实施例中，所述支承主体251包覆所述引线24的部分、所述边缘区域223的所述线路板外侧部2233、所述线路板连接部2232、所述线路板内侧部2231以及所述非感光区域213的所述芯片外侧部2133；又例如在一实施例中，所述支承主体251包覆所述边缘区域223的所述线路板内侧部2231以及所述非感光区域213的所述芯片外侧部2133；又例如在一实施例中，所述支承主体251仅仅形成于所述非感光区域213的所述芯片内侧部2131；又例如在一实施例中，所述支承主体251仅仅形成于所述边缘区域223的所述线路板外侧部2233。所述支承主体251的各种变形实施方式会在之后的各实施例中详细揭露。
本领域的技术人员可以理解的是，上述举例的所述滤光元件40在位置上的变形实施以及所述支承主体251的各变形实施在本发明中仅仅作为举例，还有其他合理的变形实施方式，本发明在这一方面并不受此限制。
值得一提的是，在一实施例中，所述阵列摄像模组100可以被实施为一个定焦阵列摄像模组，其中所述阵列摄像模组100通过被组装于所述模塑基座23的一模塑主体232使所述镜头10被保持在所述感光元件21的感光路径。值得一提的是，在一实施例中，所述阵列摄像模组100可以被实施为一个变焦摄像模组，其中所述阵列摄像模组100通过改变所述镜头10和所述感光元件21的距离来调整所述阵列摄像模组的焦距。如图57中所述阵列摄像模组100被实施为一变焦摄像模组。所述阵列摄像模组100进一步还包括所述驱动器30，其中所述镜头10分别被对应地设置于所述驱动器30，所述驱动器30分别被组装于所述模塑基座23，并且所述驱动器30分别被电连接于所述线路板22，以在所述线路板22将电能和控制信号传输至所述驱动器30后，所述驱动器30能够驱动所述镜头10沿着所述感光元件21的感光路径来回移动，从而调整所述阵列摄像模组100的焦距。也就是说，所述镜头10被可驱动地设置于所述驱动器30。值得一提的是，所述驱动器30的类型在本发明的所述阵列摄像模组100中不受限制，例如在另一实施例中，所述驱动器30可以被实施为诸如音圈马达等任何能够驱动所述镜头10沿着所述感光元件21的感光路径产生移位的驱动器，其中所述驱动器30能够接收电能和控制信号以处于工作状态。
值得一提的是，所述阵列摄像模组100被实施为一定焦摄像模组时，所述模塑主体232 被变形实施为组装所述镜头10的镜头支架，所述镜头10在所述模塑感光组件20一体化成型之后直接安装于实施为镜头支架的所述模塑主体232，从而简化了所述阵列摄像模组100的组装工序。本发明的这一方面的变形会在之后的实施例中详细揭露。
以下从各个实施例中详细揭露通过MOL模塑工艺一体化成型各所述模塑感光组件20以及组装形成所述阵列摄像模组100。
如图51至图57所示的本发明的所述阵列摄像模组100的优选实施例中，所述镜片27的所述底面2722贴合所述25的所述顶表面2501，所述支承主体251包覆所述引线24的全部、所述边缘区域223的所述线路板外侧部2233、所述线路板连接部2232、所述线路板内侧部2231、所述非感光区域213的所述芯片外侧部2133、所述芯片连接部2132以及所述芯片连接部2132，各所述滤光元件40被设置于各所述镜头10内的底部。本发明的这个优选实施例中，是先一体化成型各所述模塑感光组件20后组装各所述镜头10。
在一些实施例中，在制作所述阵列模组100的模塑工艺中，通过拼板作业的方式制作一模塑感光组件拼板2000，然后切割得到各所述模塑感光组件20。在模塑工艺制作形成所述模塑感光组件拼板2200之前，先制作一线路板拼板2200，所述线路板拼板2200包括多个一体连接的所述线路板22。此外，在模塑工艺中一体形成一模塑基座拼板2300，一体成型之后的所述模塑基座拼板2300包括多个各所述模塑基座23。
如图A2所示，将各所述感光元件21贴装于各所述线路板22的各所述芯片贴装区域222，其中每个所述感光元件21的一组所述芯片连接件211和所述线路板22的两组所述线路板连接件222分别通过一组所述引线24被连接。将每个所述电子元器件26分别贴装于所述线路板22的所述边缘区域233。优选地，每个所述电子元器件26分别被贴装于所述边缘区域223的所述线路板外侧部2233。更优选地，每个所述电子元器件26是相互间隔的，以在所述阵列摄像模组被制作完成后，每个所述电子元器件26不会出现相互干扰的情况。
受限于所述引线24的打线工艺和所述引线24本身的特性，在所述引线24的所述芯片连接端241和所述线路板连接端242分别被连接于所述感光元件21的所述芯片连接件211和所述线路板22的所述线路板连接件221后，所述引线24向上突起，以高出所述感光元件21的上表面。本领域的技术人员可以理解的是，在所述阵列摄像模组被制造的过程中和被使用的过程中，使每个所述引线24保持在初始状态有利于保证所述引线24的良好电性和保证所述阵列摄像模组的成像品质。
如图53至图56所示，一方面，所述支承主体251能够避免所述引线24和所述芯片连接件211的连接位置与用于形成所述模塑基座23的热固化材料接触，以避免流体的所述热固化材料引起所述引线24的用于连接所述芯片连接件211的端部变形或者所述引线24从所述芯片连接件211上脱落。另一方面，所述支承主体251和所述镜片27的所述镜片周缘272连接在一起，能够隔离所述引线24和所述芯片连接件211的连接位置与所述热固化材料。也就是说，由于支承主体251和所述镜片27的所述镜片周缘272连接在一起后，所述支承元件25的所述内侧面2502以及所述镜片主体271的所述镜片内面2712形成一密闭空间2700，从而在进行MOL模塑工艺时，避免流体的所述热固化材料进入所述密闭空间2700，从而避免影响通光路径，也降低了污点敏感度。在一个实施例中，所述支承主体251可以通过将胶水设置在所述感光元件21的所述非感光区域213并且在胶水初步固化后形成，经过初步固化再设置所述镜片27后进一步固化最终形成所述支承主体251。其中在所述支承主体251形成后，所述支承主体251的所述内侧面2502形成所述通孔252，所述感光元件21的所述感光区域212对应于所述通孔252以及所述热硬化镜头27的所述镜片主体271。另外，由胶水形成的所述支承主体251还可以具有粘性，以用于在后续粘附诸如灰尘等污染物，从而防止这些污染物污染所述感光元件21的所述感光区域212而使所述感光元件21的所述感光区域212出现污坏点，以进一步确保所述阵列摄像模组的成像品质。所述镜片27的所述272在其他实施例中，为所述支承元件25完全固化之后贴装于所述支承元件25的所述支承主体251，本发明并不受此限制。
如图54至图56所示，在进行MOL模塑工艺时，通过一成型模具900使被实施为流体态的热固化材料的成型材料在固化后形成一体地成型在所述线路板22的所述模塑基座23，通过这样的方式，能够减少所述阵列摄像模组100的尺寸和减少所述阵列摄像模组的组装误差，从而使所述阵列摄像模组100的结构更加紧凑和提高所述阵列摄像模组100的成像品质。又由于所述镜片27通过所述支承元件25设置于所述感光元件21上，降低了光学性的TTL，进一步使所述阵列摄像模组100的结构更加紧凑，满足电子设备对于所述阵列摄像模组100的尺寸上的需求。
具体地说，所述成型模具900包括一上模具901和一下模具902，其中所述上模具901和所述下模具902中的至少一个模具能够被移动，以使所述上模具901和所述下模具902能够被进行合模操作，和在所述上模具901和所述下模具902之间形成至少一成型空间903，其中所述模塑基座23由所述成型材料被加入所述成型空间903并且在固化后形成。
所述感光元件21和所述线路板22通过一组所述引线24被连接，所述支承主体251形成于所述感光元件21的所述非感光区域213以包覆所述引线24的全部、所述边缘区域223的所述线路板外侧部2233、所述线路板连接部2232、所述线路板内侧部2231、所述非感光区域213的所述芯片外侧部2133、所述芯片连接部2132以及所述芯片连接部2132，所述镜片27被设置于所述支承主体251，从而所述模塑感光组件20的半成品，将所述模塑感光组件20的半成品放置于所述成型模具900的所述下模具902，操作所述成型模具900的所述上模具901和/或所述下模具901，以使所述上模具901和所述下模具902合模，从而在所述上模具901和所述下模具902之间形成所述成型空间903，其中所述上模具901的压合面9011与所述镜片27的所述镜片主体271的所述镜片内面2712接触，所述支承主体251向上支撑所述镜片27。在本发明这个优选实施例中，所述线路板22的外部、所述感光元件21的非感光区域213、所述支承元件25的一部分以及所述镜片27的所述272的所述外周面2723位于所述成型模具900的所述成型空间903，从而当所述模塑基座23在所述成型空间903成型后，所述模塑基座23包覆所述线路板22的外部、所述感光元件21的非感光区域213、所述支承元件25的一部分以及所述镜片主体272的所述外周面2723。优选地，形成的如图A2所示的所述模塑感光组件20中，由于在MOL模塑工艺中，所述成型模具900的所述上模具901的压合面9011没有完全覆盖全部所述镜片主体271的所述镜片内面2712，因此，形成的所述模塑基座23还包覆了所述272的所述顶面2721的一部分。
因此，本领域的技术人员可以理解的是，所述成型模具900的所述成型空间903可以是一个环状的空间，以在所述成型材料被加入所述成型空间903和固化后形成环状的所述模塑基座23。
当多个所述感光元件21、所述支承元件25、所述镜片27、所述线路板拼板1100被放入所述成型空间903中，并且在所述成型模具900处于合模状态时，液态的成型材料被送入并经过一个固化过程从而形成一体模塑于所述线路板拼板2200的各个所述线路板22和所述感光元件21上的各所述模塑基座23，这些所述模塑基座23形成一整体的所述模塑基座拼板2300，从而各所述模塑感光组件20形成模塑感光组件拼板2000。
值得一提的是，所述模塑感光组件拼板2000经切割制作得到的的各个所述模塑感光组件20用于制作动焦摄像模组即自动对焦摄像模组时，所述成型模具900进一步地提供有多个驱动器引脚槽成型块9012，各个所述驱动器引脚槽成型块9012在模塑成型过程中，液体状的所述成型材料不会填充对应各个所述驱动器引脚槽成型块9012的位置，从而在固化步骤之后，在所述模塑感光组件拼板2000的所述模塑基座拼板2300中形成多个所述模塑孔231以及多个驱动器引脚槽，经切割制作得到的单体的各个所述模塑感光组件20的所述模塑基座23得以配置有所述驱动器引脚槽，从而在制作所述动焦摄像模组时，所述驱动器30的引脚得以通过焊接或导电胶贴附等方式连接于所述模塑感光组件20的所述线路板22。
值得一提的是，本发明涉及的流体状的所述成型材料可以是液体材料或者固体颗粒材料或者液体和固体颗粒混合材料，可以理解的是，无论所述成型材料被实施为液体材料还是被 实施为固体颗粒材料或者被实施为液体和固体颗粒混合材料，其在被加入所述成型模具900的所述成型空间903后，均能够固化以形成所述模塑基座23。例如在本发明的这个具体示例中，流体状的所述成型材料被实施为诸如液态的热固化材料，其中所述成型材料在被加入所述成型模具900的所述成型空间903后固化以形成所述模塑基座23。值得一提的是，当流体状的所述成型材料被加入所述成型模具900的所述成型空间903后，流体状的所述成型材料的固化方式不限制本发明的内容和范围。
值得一提的是，形成所述支承体25的介质和形成所述模塑基座23的介质为不同材料。所述支承体25可以通过有弹性的介质形成，使成型后的所述支承体25具有一定的弹性，所述支承体25还可以是通过硬性的介质形成，本发明并不受此限制。
如图54至图56所示，所述支承主体251被沿着所述感光元件21的所述非感光区域213设置，所述镜片27的所述镜片周缘272紧密贴合所述支承主体251以形成所述密闭空间2700，从而在所述成型材料被加入所述成型模具900的所述成型空间903后，所述支承主体251以及所述镜片27的所述镜片主体271能够阻止所述成型材料进入所述密闭空间2700内，即避免进入所述感光元件21的所述感光区域212，从而在所述成型材料固化以形成所述模塑基座23且拔模之后，使所述模塑基座23进一步形成一模塑孔231，以对应于所述感光元件21的所述感光区域212，从而在后续，所述模塑基座23的所述模塑孔231允许光线穿过以被所述感光元件21的所述感光区域212接收和进行光电转化。也就是说，由于所述成型材料并不能进入所述密闭空间2700，因此拔模之后，所述镜片27的所述镜片主体271的所述镜片外面2711和所述压合面9011之间形成所述模塑孔231。也就是说，所述模塑基座23包括所述模塑主体232和具有所述模塑孔231，所述模塑孔231给所述光学镜头10和所述感光元件21提供一光线通路，从而被物体反射的光线自所述光学镜头10进入所述阵列摄像模组的内部后，光线通过所述模塑基座23的所述模塑孔231被所述感光元件21的所述感光区域212接收和进行光电转化。
在制造所述模塑感光组件20时，先将所述感光元件21贴附于所述线路板22，之后形成所述支承元件25，进一步，将所述镜片27设置于所述支承元件25，将所述线路板22、所述感光元件21和所述镜片27进行模塑，形成所述模塑基座23，从而模塑形成所述模塑感光组件20。在模塑时，由于所述镜片27和所述感光元件21之间形成有所述密闭空间2700，因此能够防止模塑的模具对于所述感光元件21的伤害，且由于所述镜片27与所述感光元件21的距离减小，因此可以使得由其组装的所述阵列摄像模组100的后焦距缩小，从而减小所述阵列摄像模组100的高度，另一方面，由于不需要为所述镜片27提供额外的支撑部件，因此也在一定程度上使得所述阵列摄像模组100的厚度得以进一步减小。模塑形成所述模塑感光组件20之后，在所述模塑基座23上组装所述驱动器30和所述镜头10，从而组装形成所述阵列摄像模组100。其中，在这个优选实施例中，所述镜头10内的底部设置有所述滤光元件40。本领域的人员可以理解的是，在其他基于优选实施例的变形实施例中，例如图65中，模塑形成所述模塑感光组件20之后，在所述模塑基座23上直接组装所述镜头10或者支撑所述镜头10的一镜座11，也就是说，可以不设置所述驱动器30。以上仅仅作为举例，本发明并不受此限制。
如图58B所示为基于本发明优选实施例的一变形实施例，阐释了所述模塑感光组件20、所述滤光元件40组装形成一阵列摄像模组108，在这个变形实施例中的所述阵列摄像模组108和优选实施例中的所述阵列摄像模组100的结构类似，不同的是图58B中的所述阵列摄像模组108的所述滤光元件40的设置位置不同。在这个变形实施例中，所述阵列摄像模组108的所述镜头10内的底部没有设置所述滤光元件40，而是所述滤光元件40被组装于所述模塑基座23的顶表面，以使所述滤光元件40封闭所述模塑基座23的所述模塑孔231，从而在后续自所述光学镜头进入所述阵列摄像模组的内部的光线能够进一步被所述滤光元件40过滤以改善所述阵列摄像模组的成像品质。也就是说，所述模塑基座23的顶表面形成一内侧表面233和一外侧表面234，在图58B所示的实施例中，所述模塑基座23的所述内侧 表面233所在的平面可以低于所述外侧表面234所在的平面，从而使所述模塑基座23的顶表面形成一个台阶状的表面，即所述模塑基座23的所述内侧表面233所在的平面低于所述外侧表面234所在的平面以形成所述模塑基座23的一凹槽235，其中被组装于所述模塑基座23的所述内侧表面233的所述滤光元件40被容纳于所述模塑基座23的所述凹槽235内，所述驱动器30被组装于所述模塑基座23的所述外侧表面234，以使被组装于所述驱动器30的所述光学镜头10进一步被保持在所述感光元件21的感光路径，从而制得所述阵列摄像模组108。本领域的技术人员可以理解的是，在其他实施例中，所述模塑基座23的所述内侧表面233和所述外侧表面234是处于同一个平面内，以使所述模塑基座23的顶表面形成一个平整的平面，其中所述滤光元件40被组装于所述模塑基座23的所述内侧表面233，所述驱动器30或者所述镜头10被组装于所述模塑基座23的所述外侧表面234，或者所述镜头10被直接组装于所述模塑基座23的所述外侧表面234。本发明的所述模塑基座23的上述结构仅仅作为举例，本发明并不受此限制。
在制造所述模塑感光组件20时，先将所述感光元件21贴附于所述线路板22，之后形成所述支承元件25，进一步，将所述镜片27设置于所述支承元件25，进而将所述线路板22、所述感光元件21和所述镜片27在模具中进行模塑，形成所述模塑基座23，进而形成所述模塑感光组件20。进一步地，将所述滤光元件40组装于所述模塑基座23的顶表面之后组装所述驱动器30以及所述镜头10，从而组装形成所述阵列摄像模组108。
如图59所示基于本发明优选实施例的另一变形实施例的一阵列摄像模组109，在这个变形实施例中的所述阵列摄像模组109和优选实施例中的所述阵列摄像模组100的结构类似，不同的是图59中的所述阵列摄像模组109的所述滤光元件40的设置位置以及组装顺序不同。图57的优选实施例中，是先模塑形成所述模塑感光组件20，然后将设置于所述镜头内的底部的所述滤光元件40和所述镜头10一起组装在所述模塑基座23上。而图59所示的这个变形实施例的所述阵列摄像模组109是将所述滤光元件40和所述镜片27、所述支承元件25、所述感光元件21以及所述线路板22一起放入模具中形成所述模塑基座23，之后在所述模塑基座23上贴装所述驱动器30和所述镜头10。具体地，在本发明的图59所示的这个变形实施例中，所述滤光元件40被叠层设置于所述感光元件21上。在这里可以采用表面贴装工艺。为了增强所述滤光元件40在所述感光元件21的稳定性，在实施例中，所述滤光元件40的边缘被所述支承元件25固定连接且贴合所述感光元件21，从而所述滤光元件40被固定于所述支承元件25以及所述感光元件21之间。所述支承主体251的所述外侧面2503、所述镜片周缘272的所述外周面2723被模塑于所述模塑基座23，所述支承元件25、所述感光元件21、所述镜片27、所述线路板22以及所述电子元器件26被所述模塑基座23的所述模塑主体232所模塑。值得一提的是，在这个实施例中，所述滤光元件40覆盖于所述感光元件21的上方，将所述感光元件21与所述密闭空间2700以及外部环境隔离，从而避免所述感光元件21受到损伤以及避免进入所述密闭空间2700的灰尘接触所述感光元件21，降低污点敏感度。
在制造所述模塑感光组件20时，先将所述感光元件21贴附于所述线路板22，进而将所述滤光元件40贴附于所述感光元件21上，之后形成所述支承元件25，且所述支承元件25连接所述滤光元件40的两端，进一步，将所述镜片27设置于所述支承元件25，将所述线路板22、所述感光元件21和所述镜片27进行模塑，形成所述模塑基座23。在模塑时，由于所述镜片27和所述滤光元件40之间形成有所述密闭空间2700，因此能够防止模塑的模具对于所述感光元件21以及所述滤光元件40的伤害，且由于所述滤光元件40与所述感光元件21的距离减小，因此可以使得由其组装的所述阵列摄像模组109的后焦距缩小，从而减小所述阵列摄像模组109的高度，另一方面，由于不需要为所述滤光元件40提供额外的支撑部件，因此也在一定程度上使得所述阵列摄像模组109的厚度得以进一步减小。
如图60所示为基于图57所示的优选实施例的另一个变形实施例的一阵列摄像模组110。和图57中所述的实施例中的所述阵列摄像模组100不同的是，图60中，所述模塑基 座23的所述模塑主体232的结构不同。具体地，如图60所示，所述阵列摄像模组110的所述模塑基座23包括所述模塑主体232以及一镜头安装段236，所述模塑主体232和所述镜头安装段236依次一体地模塑连接。所述镜头安装段236用于安装所述镜头10(所述镜头10在图60中未示出)，也就是说，当所述模塑感光组件20被用于组装所述阵列摄像模组110时，所述镜头10被安装于所述镜头安装段236内侧，以便于为所述镜头10提供稳定的安装位置。所述镜头安装段236一体地向上延伸，为所述镜头10提供支撑固定位置，从而不需要提供额外的部件来安装所述镜头10。换句话说，所述模塑基座23一体地向上延伸，且内部形成台阶状，以分别模塑所述镜片27、所述支承元件25、所述线路板22、所述电子元器件电子元器件26以及支撑所述镜头10。值得一提的是，所述镜头安装段236的内侧表面平整，从而适于安装无螺纹的所述镜头10，形成定焦模组。特别地，所述镜头10可以通过粘接的方式固定于所述镜头安装段236。还值得一提的是，所述镜头10被安装于所述镜头安装段236，从而所述模塑基座23相当于传统阵列摄像模组中的支架或镜筒的功能，为所述镜头10提供支撑、固定位置，但是组装却不同于传统COB工艺过程。传统COB工艺的阵列摄像模组的支架以粘贴的方式固定于线路板，而所述模塑基座23通过MOL模塑工艺固定于所述线路板22、所述支承元件25以及所述镜片27，不需要粘贴固定过程，模塑方式相对于粘贴固定具有更好的连接稳定性以及工艺过程的可控性，使得阵列摄像模组的厚度得以减小，此外，所述模塑基座23代替传统的支架，且为所述镜头10提供安装位置，避免了支架在粘贴组装时带来的倾斜误差，减小了阵列摄像模组组装的累积公差。本领域的技术人员可以理解的是，在其他变形实施例中，需要安装所述滤光元件40时，所述滤光元件40可以是如图57中所述阵列摄像模组100中被设置于所述镜头10内的底部，也可以是如图58B中所述阵列摄像模组108，所述滤光元件40直接被安装在所述模塑基座23的所述模塑主体232的所述内侧表面233，还可以是如图59中在模塑形成所述模塑基座23之前被所述支承元件25贴合于所述感光元件21的表面。本发明并不受此限制。
可以理解的是，为了在附图中更清楚地体现出本发明中所述阵列摄像模组的各变形实施方式，图65至图98中所述阵列摄像模组仅示出了变形实施的部分，本发明在这一方面并不受此限制。
如图65所示为基于本发明优选实施例的另一变形实施例的一阵列摄像模组115，和图57中所述的优选实施例中的所述阵列摄像模组100不同的是，本发明的所述阵列摄像模组115的所述模塑感光组件20的所述支承主体251包覆所述引线24的部分、所述非感光区域213的所述芯片外侧部2133、所述芯片连接部2132以及所述芯片内侧部2131。所述模塑主体232一体模塑包覆所述电子元器件26、所述线路板22的所述边缘区域223、所述支承元件25的所述外侧面2503以及所述镜片周缘272的所述外周面2723，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以增强所述镜片27的稳固性。
值得一提的是，在图65的实施例中被实施为定焦模组的所述镜头10是通过所述镜座11支撑的，所述镜座11的内侧为有螺纹，但是，可以理解的是，在其他实施例里，也可以是内侧无螺纹的所述镜座11，本发明并不受此限制。
如图66所示为基于图58B的实施例的另一变形实施例的一阵列摄像模组116，和图A8中实施例中的所述阵列摄像模组108不同的是，本发明的所述阵列摄像模组116的所述模塑感光组件20的所述支承主体251包覆所述引线24的部分、所述非感光区域213的所述芯片外侧部2133、所述芯片连接部2132以及所述芯片内侧部2131。所述模塑主体232一体模塑包覆所述电子元器件26、所述线路板22的所述边缘区域223、所述支承元件25的所述外侧面2503以及所述镜片周缘272的所述外周面2723，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以增强所述镜片27的稳固性。
如图67所示为基于图59的实施例的另一变形实施例的一阵列摄像模组117，和图59 中实施例中的所述阵列摄像模组109不同的是，本发明的所述阵列摄像模组117的所述模塑感光组件20的所述支承主体251包覆所述引线24的部分、所述非感光区域213的所述芯片外侧部2133、所述芯片连接部2132以及所述芯片内侧部2131。所述模塑主体232一体模塑包覆所述电子元器件26、所述线路板22的所述边缘区域223、所述支承元件25的所述外侧面2503以及所述镜片周缘272的所述外周面2723，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以增强所述镜片27的稳固性。
如图68所示为基于图60实施例的另一变形实施例的一阵列摄像模组118，和图60中实施例中的所述阵列摄像模组110不同的是，本发明的所述阵列摄像模组116的所述模塑感光组件20的所述支承主体251包覆所述引线24的部分、所述非感光区域213的所述芯片外侧部2133、所述芯片连接部2132以及所述芯片内侧部2131。所述模塑主体232一体模塑包覆所述电子元器件26、所述线路板22的所述边缘区域223、所述支承元件25的所述外侧面2503以及所述镜片周缘272的所述外周面2723，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以增强所述镜片27的稳固性。
如图69所示为基于本发明优选实施例的另一变形实施例的一阵列摄像模组119，和图57中所述的优选实施例中的所述阵列摄像模组100不同的是，所述支承主体251包覆所述引线24的部分、所述边缘区域223的所述线路板内侧部2231、所述非感光区域213的所述芯片外侧部2133、所述芯片连接部2132以及所述芯片内侧部2131，所述模塑主体232一体模塑包覆所述电子元器件26、所述22的所述边缘区域223、所述支承元件25的所述外侧面2503以及所述镜片周缘272的所述外周面2723，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以增强所述镜片27的稳固性。
如图70所示为基于本发明优选实施例的另一变形实施例的一阵列摄像模组120，和图58B中实施例中的所述阵列摄像模组108不同的是，所述支承主体251包覆所述引线24的部分、所述边缘区域223的所述线路板内侧部2231、所述非感光区域213的所述芯片外侧部2133、所述芯片连接部2132以及所述芯片内侧部2131，所述模塑主体232一体模塑包覆所述电子元器件26、所述线路板22的所述边缘区域223、所述支承元件25的所述外侧面2503以及所述镜片周缘272的所述外周面2723，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以增强所述镜片27的稳固性。
如图71所示为基于本发明优选实施例的另一变形实施例的一阵列摄像模组121，和图59中实施例中的所述阵列摄像模组109不同的是，所述支承主体251包覆所述引线24的部分、所述边缘区域223的所述线路板内侧部2231、所述非感光区域213的所述芯片外侧部2133、所述芯片连接部2132以及所述芯片内侧部2131，所述模塑主体232一体模塑包覆所述电子元器件26、所述线路板22的所述边缘区域223、所述支承元件25的所述外侧面2503以及所述镜片周缘272的所述外周面2723，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以增强所述镜片27的稳固性。
如图72所示为基于本发明优选实施例的另一变形实施例的一阵列摄像模组122，和图60所示的实施例中的所述阵列摄像模组110不同的是，所述支承主体251包覆所述引线24的部分、所述边缘区域223的所述线路板内侧部2231、所述非感光区域213的所述芯片外侧部2133、所述芯片连接部2132以及所述芯片内侧部2131，所述模塑主体232一体模塑包覆所述电子元器件26、所述线路板22的所述边缘区域223、所述支承元件25的所述外侧面2503以及所述镜片周缘272的所述外周面2723，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以 增强所述镜片27的稳固性。
如图73所示为基于本发明优选实施例的另一变形实施例的一阵列摄像模组123，和图57中所述的优选实施例中的所述阵列摄像模组100不同的是，所述支承主体251包覆所述引线24的部分、所述边缘区域223的所述线路板外侧部2233、所述线路板连接部2232以及所述线路板内侧部2231。经过MOL模塑工艺之后，所述模塑主体232一体模塑包覆所述电子元器件26、所述线路板22的所述边缘区域223的所述线路板外侧部2233、所述支承元件25的所述外侧面2503以及所述镜片周缘272的所述外周面2723，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以增强所述镜片27的稳固性。
如图74所示为基于本发明优选实施例的另一变形实施例的一阵列摄像模组124，和图58B中所示的实施例中的所述阵列摄像模组108不同的是，所述支承主体251包覆所述引线24的部分、所述边缘区域223的所述线路板外侧部2233、所述线路板连接部2232以及所述线路板内侧部2231。经过MOL模塑工艺之后，所述模塑主体232一体模塑包覆所述电子元器件26、所述线路板22的所述边缘区域223的所述线路板外侧部2233、所述支承元件25的所述外侧面2503以及所述镜片周缘272的所述外周面2723，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以增强所述镜片27的稳固性。
如图75所示为基于本发明优选实施例的另一变形实施例的一阵列摄像模组125，和图59中所示的实施例中的所述阵列摄像模组109不同的是，所述支承主体251包覆所述引线24的部分、所述边缘区域223的所述线路板外侧部2233、所述线路板连接部2232以及所述线路板内侧部2231。经过MOL模塑工艺之后，所述模塑主体232一体模塑包覆所述电子元器件26、所述线路板22的所述边缘区域223的所述线路板外侧部2233、所述支承元件25的所述外侧面2503以及所述镜片周缘272的所述外周面2723，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以增强所述镜片27的稳固性。此外，所述阵列摄像模组125和图59中所示的实施例中的所述阵列摄像模组109的结构还不同的是所述滤光元件40并没有贴合于所述感光元件21。也就是说，由于所述支承主体251没有包覆所述非感光区域213，所述滤光元件40的边缘被包覆于所述支承主体251的上端靠近所述顶表面2501的位置以避免接触所述引线24，因此所述滤光元件40和所述感光元件21之间是有空隙的。本领域的技术人员可以理解的是，在图75所示的实施例的其他变形实施方式中，所述滤光元件40的边缘也可以不通过被所述支承主体251包覆而固定，而是所述滤光元件40被直接贴装于所述感光元件21的所述感光区域212，但是，本发明在这一方面并不受此限制。
如图76所示为基于本发明优选实施例的另一变形实施例的一阵列摄像模组126，和图60中所示的实施例中的所述阵列摄像模组110不同的是，经过MOL模塑工艺之后，所述模塑主体232一体模塑包覆所述电子元器件26、所述线路板22的所述边缘区域223的所述线路板外侧部2233、所述支承元件25的所述外侧面2503以及所述镜片周缘272的所述外周面2723，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以增强所述镜片27的稳固性。
如图77所示为基于本发明优选实施例的另一变形实施例的一阵列摄像模组127，和图57中所述的优选实施例中的所述阵列摄像模组100不同的是，所述支承主体251包覆所述引线24的部分、所述边缘区域223的所述线路板外侧部2233、所述线路板连接部2232、所述线路板内侧部2231以及所述非感光区域213的所述芯片外侧部2133。经过MOL模塑工艺之后，所述模塑主体232一体模塑包覆所述电子元器件26、所述线路板22的所述边缘区域223的所述线路板外侧部2233、所述支承元件25的所述外侧面2503以及所述镜片周缘272的所述外周面2723，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以增强所述镜片27的稳固性。
如图78所示为基于本发明优选实施例的另一变形实施例的一阵列摄像模组128，和图58B中所示的实施例中的所述阵列摄像模组108不同的是，所述模塑主体232一体模塑包覆所述电子元器件26、所述线路板22的所述边缘区域223的所述线路板外侧部2233、所述支承元件25的所述外侧面2503以及所述镜片周缘272的所述外周面2723，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以增强所述镜片27的稳固性。
如图79所示为基于本发明优选实施例的另一变形实施例的一阵列摄像模组129，和图59中所示的实施例中的所述阵列摄像模组109不同的是，所述模塑主体232一体模塑包覆所述电子元器件26、所述线路板22的所述边缘区域223的所述线路板外侧部2233、所述支承元件25的所述外侧面2503以及所述镜片周缘272的所述外周面2723，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以增强所述镜片27的稳固性。此外，所述阵列摄像模组129和图59中所示的实施例中的所述阵列摄像模组109的结构还不同的是所述滤光元件40并没有贴合于所述感光元件21。也就是说，由于所述支承主体251没有包覆所述非感光区域213的所述芯片连接部2132和所述芯片内侧部2131，所述滤光元件40的边缘被包覆于所述支承主体251的上端靠近所述顶表面2501的位置以避免接触所述引线24，因此所述滤光元件40和所述感光元件21之间是有空隙的。本领域的技术人员可以理解的是，在图80所示的实施例的其他变形实施方式中，所述滤光元件40的边缘也可以不通过被所述支承主体251包覆而固定，而是所述滤光元件40被直接贴装于所述感光元件21的所述感光区域212，但是，本发明在这一方面并不受此限制。
如图80所示为基于本发明优选实施例的另一变形实施例的一阵列摄像模组130，和图60中所示的实施例中的所述阵列摄像模组110不同的是，所述模塑主体232一体模塑包覆所述电子元器件26、所述线路板22的所述边缘区域223的所述线路板外侧部2233、所述支承元件25的所述外侧面2503以及所述镜片周缘272的所述外周面2723，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以增强所述镜片27的稳固性。
如图81所示为基于本发明优选实施例的另一变形实施例的一阵列摄像模组131，和图57中所述的优选实施例中的所述阵列摄像模组100不同的是，所述支承主体251包覆所述边缘区域223的所述线路板内侧部2231以及所述非感光区域213的所述芯片外侧部2133。经过MOL模塑工艺之后，所述模塑主体232一体模塑包覆所述电子元器件26、所述边缘区域223的所述线路板外侧部2233、所述线路板连接部2232、所述支承元件25的所述外侧面2503以及所述镜片周缘272的所述外周面2723，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以增强所述镜片27的稳固性。
如图82所示为基于本发明优选实施例的另一变形实施例的一阵列摄像模组132，和图58B所示的实施例中的所述阵列摄像模组108不同的是，所述支承主体251包覆所述边缘区域223的所述线路板内侧部2231以及所述非感光区域213的所述芯片外侧部2133。经过MOL模塑工艺之后，所述模塑主体232一体模塑包覆所述电子元器件26、所述边缘区域223的所述线路板外侧部2233、所述线路板连接部2232、所述支承元件25的所述外侧面2503以及所述镜片周缘272的所述外周面2723，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以增强所述镜片27的稳固性。
如图83所示为基于本发明优选实施例的另一变形实施例的一阵列摄像模组133，和图59所示的实施例中的所述阵列摄像模组109不同的是，所述支承主体251包覆所述边缘区域223的所述线路板内侧部2231以及所述非感光区域213的所述芯片外侧部2133。经过MOL模塑工艺之后，所述模塑主体232一体模塑包覆所述电子元器件26、所述边缘区域223 的所述线路板外侧部2233、所述线路板连接部2232、所述支承元件25的所述外侧面2503以及所述镜片周缘272的所述外周面2723，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以增强所述镜片27的稳固性。此外，所述阵列摄像模组133和图59中所示的实施例中的所述阵列摄像模组109的结构还不同的是所述滤光元件40并没有贴合于所述感光元件21。也就是说，由于所述支承主体251没有包覆所述非感光区域213的所述芯片连接部2132和所述芯片内侧部2131，所述滤光元件40的边缘被包覆于所述支承主体251的上端靠近所述顶表面2501的位置以避免接触所述引线24，因此所述滤光元件40和所述感光元件21之间是有空隙的。本领域的技术人员可以理解的是，在图83所示的实施例的其他变形实施方式中，所述滤光元件40的边缘也可以不通过被所述支承主体251包覆而固定，而是所述滤光元件40被直接贴装于所述感光元件21的所述感光区域212，但是，本发明在这一方面并不受此限制。
如图84所示为基于本发明优选实施例的另一变形实施例的一阵列摄像模组134，和图60所示的实施例中的所述阵列摄像模组110不同的是，所述支承主体251包覆所述边缘区域223的所述线路板内侧部2231以及所述非感光区域213的所述芯片外侧部2133。经过MOL模塑工艺之后，所述模塑主体232一体模塑包覆所述电子元器件26、所述边缘区域223的所述线路板外侧部2233、所述线路板连接部2232、所述支承元件25的所述外侧面2503以及所述镜片周缘272的所述外周面2723，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以增强所述镜片27的稳固性。
如图85所示为基于本发明优选实施例的另一变形实施例的一阵列摄像模组135，和图57中所述的优选实施例中的所述阵列摄像模组100不同的是，所述支承主体251仅仅形成于所述非感光区域213的所述芯片内侧部2131，也就是说，所述支承主体251在这个实施例中支撑所述镜片27。所述引线24以及各两个连接端都是被所述模塑基座23所模塑固定的。经过MOL模塑工艺后，所述模塑主体232一体模塑包覆所述电子元器件26、所述引线24、所述线路板22的所述边缘区域223、所述非感光区域213的所述芯片外侧部2133、所述芯片连接部2132、所述支承元件25的所述外侧面2503以及所述镜片周缘272的所述外周面2723，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以增强所述镜片27的稳固性。
如图86所示为基于本发明优选实施例的另一变形实施例的一阵列摄像模组136，和图58B所示的实施例中的所述阵列摄像模组108不同的是，所述支承主体251仅仅形成于所述非感光区域213的所述芯片内侧部2131，也就是说，所述支承主体251在这个实施例中支撑所述镜片27。所述引线24以及各两个连接端都是被所述模塑基座23所模塑固定的。经过MOL模塑工艺后，所述模塑主体232一体模塑包覆所述电子元器件26、所述引线24、所述线路板22的所述边缘区域223、所述非感光区域213的所述芯片外侧部2133、所述芯片连接部2132、所述支承元件25的所述外侧面2503以及所述镜片周缘272的所述外周面2723，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以增强所述镜片27的稳固性。
如图87所示为基于本发明优选实施例的另一变形实施例的一阵列摄像模组137，和图59所示的实施例中的所述阵列摄像模组109不同的是，所述支承主体251仅仅形成于所述213的所述芯片内侧部2131，也就是说，所述支承主体251在这个实施例中支撑所述镜片27。所述引线24以及各两个连接端都是被所述模塑基座23所模塑固定的。经过MOL模塑工艺后，所述模塑主体232一体模塑包覆所述电子元器件26、所述引线24、所述线路板22的所述边缘区域223、所述213的所述芯片外侧部2133、所述芯片连接部2132、所述支承元件25的所述外侧面2503以及所述镜片周缘272的所述外周面2723，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以增强所述镜片27的稳固性。
如图88所示为基于本发明优选实施例的另一变形实施例的一阵列摄像模组138，和图60所示的实施例中的所述阵列摄像模组110不同的是，所述支承主体251仅仅形成于所述非感光区域213的所述芯片内侧部2131，也就是说，所述支承主体251在这个实施例中支撑所述镜片27。所述引线24以及各两个连接端都是被所述模塑基座23所模塑固定的。经过MOL模塑工艺后，所述模塑主体232一体模塑包覆所述电子元器件26、所述引线24、所述线路板22的所述边缘区域223、所述非感光区域213的所述芯片外侧部2133、所述芯片连接部2132、所述支承元件25的所述外侧面2503以及所述镜片周缘272的所述外周面2723，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以增强所述镜片27的稳固性。
如图89所示为基于本发明优选实施例的另一变形实施例的一阵列摄像模组139，和图57中所述的优选实施例中的所述阵列摄像模组100不同的是，所述支承主体251仅仅形成于所述边缘区域223的所述线路板外侧部2233。也就是说，所述支承主体251在这个实施例中支撑所述镜片27且不包覆所述引线24。经过MOL模塑工艺后，所述模塑主体232一体模塑包覆所述电子元器件26、所述边缘区域223的所述线路板外侧部2233、所述支承元件25的所述外侧面2503以及所述镜片周缘272的所述外周面2723，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以增强所述镜片27的稳固性。由于所述引线24被设置于所述密闭空间2700内，因此在模塑形成所述23的时候，所述引线24不会被损坏，且在所述23形成之后，所述引线24能够被保护不受外界环境的影响。
如图90所示为基于本发明优选实施例的另一变形实施例的一阵列摄像模组140，和图58B所示的实施例中的所述阵列摄像模组108不同的是，所述支承主体251仅仅形成于所述边缘区域223的所述线路板外侧部2233。也就是说，所述支承主体251在这个实施例中支撑所述镜片27且不包覆所述引线24。经过MOL模塑工艺后，所述模塑主体232一体模塑包覆所述电子元器件26、所述边缘区域223的所述线路板外侧部2233、所述支承元件25的所述外侧面2503以及所述镜片周缘272的所述外周面2723，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以增强所述镜片27的稳固性。
如图91所示为基于本发明优选实施例的另一变形实施例的一阵列摄像模组141，和图59所示的实施例中的所述阵列摄像模组109不同的是，所述支承主体251仅仅形成于所述边缘区域223的所述线路板外侧部2233。也就是说，所述支承主体251在这个实施例中支撑所述镜片27且不包覆所述引线24。经过MOL模塑工艺后，所述模塑主体232一体模塑包覆所述电子元器件26、所述边缘区域223的所述线路板外侧部2233、所述支承元件25的所述外侧面2503以及所述镜片周缘272的所述外周面2723，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以增强所述镜片27的稳固性。此外，所述阵列摄像模组144和图59中所示的实施例中的所述阵列摄像模组109的结构还不同的是所述滤光元件40并没有贴合于所述感光元件21。也就是说，由于所述支承主体251没有包覆所述非感光区域213和所述边缘区域223的所述线路板内侧部2231以及所述线路板连接部2232，所述滤光元件40的边缘被包覆于所述支承主体251的上端靠近所述顶表面2501的位置以避免接触所述引线24，因此所述滤光元件40和所述感光元件21之间是有空隙的。本领域的技术人员可以理解的是，在图91所示的实施例的其他变形实施方式中，所述滤光元件40的边缘也可以不通过被所述支承主体251包覆而固定，而是所述滤光元件40被直接贴装于所述感光元件21的所述感光区域212，但是，本发明在这一方面并不受此限制。
如图92所示为基于本发明优选实施例的另一变形实施例的一阵列摄像模组142，和图60所示的实施例中的所述阵列摄像模组110不同的是，所述支承主体251仅仅形成于所述边缘区域223的所述线路板外侧部2233。也就是说，所述支承主体251在这个实施例中支 撑所述镜片27且不包覆所述引线24。经过MOL模塑工艺后，所述模塑主体232一体模塑包覆所述电子元器件26、所述边缘区域223的所述线路板外侧部2233、所述支承元件25的所述外侧面2503以及所述镜片周缘272的所述外周面2723，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以增强所述镜片27的稳固性。
如图93所示为基于本发明优选实施例的另一变形实施例的一阵列摄像模组143，和图57中所述的优选实施例中的所述阵列摄像模组100不同的是，并没有设置所述支承主体251，所述镜片27的所述镜片周缘272被直接贴装于所述感光元件21的所述非感光区域213。经过MOL模塑工艺后，所述模塑主体232一体模塑包覆所述电子元器件26、所述线路板22的所述边缘区域223、所述非感光区域213的所述芯片外侧部2133和所述芯片连接部2132、所述镜片周缘272的所述外周面2723，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以增强所述镜片27的稳固性。所述镜片27和所述感光元件21的连接方式可以通过所述模塑主体232的一体模塑封装，也可以在其他实施例中通过表面贴装工艺连接在一起，但是，本发明在这一方面并不受此限制。
如图94所示为基于本发明优选实施例的另一变形实施例的一阵列摄像模组144，和图58B所示的实施例中的所述阵列摄像模组108不同的是，并没有设置所述支承主体251，所述镜片27的所述镜片周缘272被直接贴装于所述感光元件21的所述非感光区域213。经过MOL模塑工艺后，所述模塑主体232一体模塑包覆所述电子元器件26、所述线路板22的所述边缘区域223、所述非感光区域213的所述芯片外侧部2133和所述芯片连接部2132、所述镜片周缘272的所述外周面2723，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以增强所述镜片27的稳固性。
如图95所示为基于本发明优选实施例的另一变形实施例的一阵列摄像模组145，和图59所示的实施例中的所述阵列摄像模组109不同的是，并没有设置所述支承主体251，所述镜片27的所述镜片周缘272被直接贴装于所述感光元件21的所述非感光区域213。经过MOL模塑工艺后，所述模塑主体232一体模塑包覆所述电子元器件26、所述线路板22的所述边缘区域223、所述非感光区域213的所述芯片外侧部2133和所述芯片连接部2132、所述镜片周缘272的所述外周面2723，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以增强所述镜片27的稳固性。所述镜片27、所述滤光元件40以及所述感光元件21的连接方式可以通过所述模塑主体232的一体模塑封装，也可以在其他实施例中通过表面贴装工艺连接在一起，但是，本发明在这一方面并不受此限制。
值得一提的是，如图57至图60以及图65至图98中部分实施例中为了标号清楚，因此所述镜头10和所述驱动器30未在图中示出，本发明并不受此限制。
如图96所示为基于本发明优选实施例的另一变形实施例的一阵列摄像模组146，和图60所示的实施例中的所述阵列摄像模组110不同的是，并没有设置所述支承主体251，所述镜片27的所述镜片周缘272被直接贴装于所述感光元件21的所述非感光区域213。经过MOL模塑工艺后，所述模塑主体232一体模塑包覆所述电子元器件26、所述线路板22的所述边缘区域223、所述非感光区域213的所述芯片外侧部2133和所述芯片连接部2132、所述镜片周缘272的所述外周面2723，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以增强所述镜片27的稳固性。
如图97所示为基于本发明优选实施例的另一变形实施例的一阵列摄像模组147，和图57中所述的优选实施例中的所述阵列摄像模组100不同的是，所述感光元件21在所述线路板22的设置方式为下沉式。也就是说，所述线路板22具有一感光元件凹槽224，所述感光 元件21被设置于所述感光元件凹槽224内。在本发明中，这种所述感光元件21的上表面平行或者低于所述线路板22的上表面，即所述22的所述芯片贴装区域222低于所述边缘区域223的设置方式被定义为下沉式。由于所述感光元件21被设置为下沉式，被组装形成的所述阵列摄像模组147的整体厚度进一步降低，满足了电子设备对轻薄尺寸的阵列摄像模组的需求。
如图98所示为基于本发明图97所示的实施例的另一变形实施例的一阵列摄像模组148，和图98所示的实施例的所述阵列摄像模组147不同的是，所述线路板22的所述芯片贴装区域具有一感光元件容纳孔225。所述感光元件容纳孔225为一通孔，所述感光元件21被设置于所述感光元件容纳孔225内。优选地，所述感光元件21被固持在所述感光元件容纳孔225内，此外，所述支承元件25也加固了所述感光元件21和所述线路板22之间的连接，能够避免所述感光元件21从所述线路板22的所述感光元件容纳孔225内脱离出来。
值得一提的是，如图58A至图60以及图65至图96中各实施例中的变形实施方式也可以被应用于图97和图98所示的实施例中，本发明在这一方面并不受此限制。
如图99所示为基于本发明优选实施例的另一变形实施例的一阵列摄像模组149，和图58B所示的实施例中的所述摄像模组108不同的是，所述镜片27并没有设置所述镜片周缘272，所述镜片27的所述镜片主体271被所述支承主体251直接支撑，所述支承主体251的底部直接贴装于所述感光元件21的所述非感光区域213。经过MOL模塑工艺后，所述模塑主体232一体模塑包覆所述电子元器件26、所述线路板22的所述边缘区域223、所述非感光区域213的所述芯片外侧部2133和所述芯片连接部2132、所述镜片主体271的外边缘，从而形成所述模塑感光组件20。可以理解的是，所述镜片主体271的外边缘由于被所述支承主体251所支撑，可以像图99所示的同时也被所述所述模塑主体232包覆，也可以在其他实施例中仅仅被所述支承主体251所包裹，本发明在这一方面并不受此限制。
如图100所示为基于本发明优选实施例的另一变形实施例的一阵列摄像模组150，和图58B所示的实施例中的所述摄像模组108不同的是，并没有设置所述支承主体251，且所述镜片27的所述镜片周缘272的底部向下延伸形成一镜片支撑脚2720。所述镜片支撑脚2720支撑于所述边缘区域223的所述线路板外侧部2233。也就是说，所述镜片支撑脚2720在这个实施例中支撑所述镜片27且不包覆所述引线24。经过MOL模塑工艺后，所述模塑主体232一体模塑包覆所述电子元器件26、所述边缘区域223的所述线路板外侧部2233、所述支承元件25的所述外侧面2503以及所述镜片周缘272的所述外周面2723以及所述镜片支撑脚2720的外侧面，从而形成所述模塑感光组件20。可以理解的是，所述模塑主体232还可以包覆所述镜片周缘272的所述顶面2721的部分或全部，以增强所述镜片27的稳固性。
值得一提的是，在上述各实施例中，在进行MOL模塑工艺时，所述支承主体251以及所述镜片主体271能够阻止所述感光元件21和所述线路板22的各个部位因为受力不均而产生移位，并且能够阻止所述成型材料进入所述感光元件21和所述镜片27之间，以保证所述感光元件21的平整度。
值得一提的是，所述阵列摄像模组100可以被应用于各种电子设备，举例地但不限于智能手机、可穿戴设备、电脑设备、电视机、交通工具、照相机、监控装置等，所述阵列摄像模组配合所述电子设备实现对目标对象的图像采集和再现。
值得一提的是，如图101至图103所示，所述阵列摄像模组进一步包括一支架50，其中所述支架50具有至少两安装空间51，并且每个所述安装空间51分别连通于所述支架50的两个侧部，即，每个所述安装空间51可以分别形成一个通道。每个所述驱动器30分别被安装于所述支架50的每个所述安装空间51，以通过所述支架50使每个所述驱动器30被保持在稳定的状态，从而保证被组装于每个所述驱动器30的每个所述镜头10的同轴度并提高所述阵列摄像模组的强度，以进一步提高所述阵列摄像模组的成像品质。
优选地，在每个所述驱动器30分别被安装于所述支架50的每个所述安装空间51后，在每个所述驱动器30的外壳所述支架50的内壁之间填充一些填充物，以使每个所述驱动器 30在被安装于所述支架50的每个所述安装空间51后不会出现晃动的情况。更优选地，被填充在每个所述驱动器30的外壳和所述支架50的内壁之间的填充物可以是胶水。
值得一提的是，在上述各实施例的变形实施方式中，所述阵列摄像模组100被实施为双镜头摄像模组时，可以是两个都是变焦模组，或者两个都是定焦模组，或者一个是变焦模组，另一个是定焦模组；或者是一个包括所述模塑基座23的变焦模组或者定焦模组摄像模组，另一个模塑基座上贴装现有技术中的摄像模组。
如图61所示，本发明进一步提供一带有阵列摄像模组的电子设备200，其中所述电子设备200包括至少一阵列摄像模组100，其中每个所述阵列摄像模组100用于获取图形，其中每个所述阵列摄像模组100分别进一步包括至少两镜头10和至少两模塑感光组件20，各所述模塑感光组件20包括一镜片27、一支承元件25，一感光元件21，一线路板22，一组引线24和一模塑基座23，其中每个所述引线24的两端分别被连接于所述感光元件21的芯片连接件211和所述线路板22的线路板连接件221，所述镜片27进一步包括一镜片主体271和一镜片周缘272，所述镜片周缘272一体延伸于所述镜片主体271。其中所述模塑基座23包括一模塑主体232和具有一模塑孔231，其中在通过一成型模具900进行模塑工艺以使所述模塑主体232成型时，所述镜片27的所述镜片主体271在脱模时形成所述模塑孔231，所述镜片27的一镜片周缘272被贴装于所述支承元件25，其中所述感光元件21的感光区域212对应于所述模塑孔231，其中所述镜头10、所述镜片27的所述镜片主体271被设置于每个所述模塑感光组件20的所述感光元件21的感光路径。
本领域的技术人员应理解，上述描述及附图中所示的本发明的实施例只作为举例而并不限制本发明。本发明的目的已经完整并有效地实现。本发明的功能及结构原理已在实施例中展示和说明，在没有背离所述原理下，本发明的实施方式可以有任何变形或修改。

Claims (76)

  1. 一模塑感光组件，应用于一摄像模组，其特征在于，包括：
    一镜片；
    一感光元件；
    一线路板，
    一模塑基座；以及
    一环形的支承元件，其中通过模塑工艺使所述模塑基座与所述镜片、所述支承元件和所述线路板形成一体结构。
  2. 如权利要求1所述的模塑感光组件，其中所述感光元件和所述线路板通过至少一组引线连接，所述支承元件包裹所述引线的全部，所述模塑基座包裹所述支承元件的至少一部分。
  3. 如权利要求2所述的模塑感光组件，其中所述支承元件还包覆所述线路板的一边缘区域以及所述感光元件的一非感光区域，所述感光元件、所述支承元件以及所述镜片之间形成一密闭空间。
  4. 如权利要求1所述的模塑感光组件，其中所述感光元件和所述线路板通过至少一组引线连接，所述支承元件包裹所述引线的至少一部分，所述模塑基座包裹所述支承元件的至少一部分以及所述引线的至少一部分。
  5. 如权利要求4所述的模塑感光组件，其中所述支承元件还包覆所述感光元件的一感光区域的至少一部分，所述感光元件、所述支承元件以及所述镜片之间形成一密闭空间。
  6. 如权利要求4所述的模塑感光组件，其中所述支承元件还包覆所述感光元件的一非感光区域的至少一部分，所述线路板、所述支承元件以及所述镜片之间形成一密闭空间。
  7. 如权利要求4所述的模塑感光组件，其中所述支承元件还包覆所述线路板的 一边缘区域的至少一部分，所述感光元件、所述支承元件以及所述镜片之间形成一密闭空间。
  8. 如权利要求4所述的模塑感光组件，其中所述支承元件还包覆所述线路板的一边缘区域以及所述感光元件的一非感光区域的至少一部分，所述感光元件、所述支承元件以及所述镜片之间形成一密闭空间。
  9. 如权利要求1所述的模塑感光组件，其中所述感光元件和所述线路板通过至少一组引线连接，所述支承元件被设置于所述引线的内侧并支撑所述镜片，所述模塑基座包裹所述支承元件的至少一部分以及所述引线的全部，所述感光元件、所述支承元件以及所述镜片之间形成一密闭空间。
  10. 如权利要求1所述的模塑感光组件，其中所述感光元件和所述线路板通过至少一组引线连接，所述支承元件被设置于所述引线的外侧并支撑所述镜片，所述模塑基座包裹所述支承元件的至少一部分，所述线路板、所述支承元件以及所述镜片之间形成一密闭空间。
  11. 如权利要求1至10中任一所述的模塑感光组件，其中所述支承元件包括一框形的支承主体和具有一通孔，所述感光元件的感光区域对应于所述通孔，所述支承主体具有一顶表面、一内侧面以及一外侧面，所述支承主体的所述顶表面向内和向外分别延伸以连接于所述内侧面和所述外侧面，所述内侧面形成所述通孔，其中所述镜片包括一镜片主体和延伸于所述镜片主体的一镜片周缘，其中所述镜片的所述镜片周缘具有一顶面、一底面和一外周面，所述镜片周缘的所述外周面的两侧分别延伸以连接于所述镜片周缘的所述顶面和所述底面，其中所述镜片周缘的所述底面贴合所述支承主体的所述顶表面，其中所述模塑基座包括一模塑主体和具有一模塑孔，其中所述模塑主体包覆所述镜片的所述镜片周缘的至少一部分、所述线路板的至少一部分以及所述支承主体的所述外侧面，其中所述感光元件的感光区域以及所述镜片的所述镜片主体的位置对应于所述模塑孔。
  12. 如权利要求11所述的模塑感光组件，其中所述模塑基座还包括一镜头安装段，所述镜头安装段和所述模塑主体一体地模塑连接。
  13. 如权利要求11所述的模塑感光组件，其中所述模塑主体还包覆所述镜片周缘的所述顶面的至少一部分。
  14. 如权利要求1至10中任一所述的模塑感光组件，其中所述模塑感光组件还包括一滤光元件，所述滤光元件的位置对应所述感光元件的一感光区域，所述滤光元件被贴装于所述感光元件的所述感光区域。
  15. 如权利要求1至10中任一所述的模塑感光组件，其中所述模塑感光组件还包括多个电子元器件，各所述电子元器件被电连接设置于所述线路板上，所述模塑基座包覆至少一所述电子元器件。
  16. 如权利要求1至10中任一所述的模塑感光组件，其中所述线路板还具有一感光元件容纳孔，所述感光元件被设置于所述感光元件容纳孔内。
  17. 如权利要求1至10中任一所述的模塑感光组件，其中所述线路板还具有一感光元件凹槽，所述感光元件被设置于所述感光元件凹槽内。
  18. 如权利要求1至10中任一所述的模塑感光组件，其中每组所述引线的两端分别被连接于所述感光元件的一芯片连接件和每个所述线路板的一线路板连接件，其中所述感光元件的非感光区域包括一芯片内侧部、一芯片连接部以及一芯片外侧部，其中所述感光元件的所述芯片连接件被设置于所述芯片连接部，所述芯片内侧部和所述芯片外侧部分别位于所述芯片连接部的内侧和外侧，所述线路板包括平整的芯片贴装区域和边缘区域，其中所述边缘区域与所述芯片贴装区域一体地形成，并且所述边缘区域位于所述芯片贴装区域的周围，所述芯片贴装区域被用于贴装所述感光元件，所述线路板连接件被设置于所述边缘区域，所述线路板的所述边缘区域包括一线路板内侧部、一线路板连接部以及一线路板外侧部，其中所述线路板的所述线路板连接件被设置于所述线路板连接部，所述线路板内侧部和所述线路板外侧部分别位于所述线路板连接部的内侧和外侧。
  19. 如权利要求1至10中任一所述的模塑感光组件，其中所述镜片为热硬化镜片。
  20. 如权利要求1至10中任一所述的模塑感光组件，其中所述镜片为能够汇聚光线的凸透镜。
  21. 如权利要求1至10中任一所述的模塑感光组件，其中所述镜片的外侧为方形台阶形状。
  22. 一带有模塑感光组件的摄像模组，其特征在于，包括一如权利要求1至21中任一所述的模塑感光组件和一镜头，其中光线经所述镜头和所述镜片折射后汇聚至所述感光元件。
  23. 如权利要求22所述的带有模塑感光组件的摄像模组，所述镜头进一步包括一滤光元件，所述滤光元件设置于所述镜头内。
  24. 如权利要求22所述的带有模塑感光组件的摄像模组，进一步包括一滤光元件，所述滤光元件被设置于所述镜头和所述模塑感光组件的所述感光元件之间。
  25. 如权利要求22所述的带有模塑感光组件的摄像模组，其中所述模塑感光组件还包括一滤光元件，所述滤光元件的位置对应所述感光元件的一感光区域，所述滤光元件被贴装于所述感光元件的所述感光区域。
  26. 根据权利要求24所述的带有模塑感光组件的摄像模组，其中所述滤光元件被组装于所述模塑感光组件的所述模塑主体的一顶表面。
  27. 一电子设备，其特征在于，包括一个或多个根据权利要求22至26中任一述的带有模塑感光组件的摄像模组，其中每个所述摄像模组被用于获取图像。
  28. 根据权利要求27所述的电子设备，其特征在于，所述电子设备选自手机、电脑、电视机、智能可穿载设备、交通工具、照相机和监控装置。
  29. 一感光组件，应用于至少一阵列摄像模组，其特征在于，包括至少两模塑感光组件，各个所述模塑感光组件包括：
    一镜片；
    一感光元件；
    一线路板；
    一模塑基座；以及
    一环形的支承元件，其中通过模塑工艺使所述模塑基座与所述镜片、所述支承元件和所述线路板形成一体结构。
  30. 如权利要求29所述的感光组件，其中所述支承元件包括一框形的支承主体和具有一通孔，所述感光元件的感光区域对应于所述通孔，所述镜片周缘的一底面贴合所述支承主体的一顶表面，其中所述模塑基座包括一模塑主体和具有至少一模塑孔，其中所述模塑主体包覆所述镜片的所述镜片周缘的至少一部分、所述线路板的至少一部分以及所述支承主体的一外侧面，其中所述感光元件的感光区域以及所述镜片的所述镜片主体的位置对应于所述模塑孔。
  31. 如权利要求30所述的感光组件，其中所述模塑感光组件还包括至少一组引线，其中每组所述引线的两端分别被连接于所述感光元件的至少一芯片连接件和每个所述线路板的至少一线路板连接件，其中所述感光元件的所述非感光区域包括一芯片内侧部、一芯片连接部以及一芯片外侧部，其中所述感光元件的所述芯片连接件被设置于所述芯片连接部，所述芯片内侧部和所述芯片外侧部分别位于所述芯片连接部的内侧和外侧，所述线路板包括平整的一芯片贴装区域和一边缘区域，其中所述边缘区域与所述芯片贴装区域一体地形成，并且所述边缘区域位于所述芯片贴装区域的周围，所述芯片贴装区域被用于贴装所述感光元件，所述线路板连接件被设置于所述边缘区域，所述线路板的所述边缘区域包括一线路板内侧部、一线路板连接部以及一线路板外侧部，其中所述线路板的所述线路板连接件被设置于所述线路板连接部，所述线路板内侧部和所述线路板外侧部分别位于所述线路板连接部的内侧和外侧。
  32. 如权利要求31所述的感光组件，其中所述支承主体包覆所述引线的全部、所述边缘区域的所述线路板外侧部、所述线路板连接部、所述线路板内侧部、所述非感光区域的所述芯片外侧部、所述芯片连接部以及所述芯片连接部，所述模 塑主体进一步包覆所述线路板连接部，所述感光元件、所述支承主体以及所述镜片之间形成一密闭空间。
  33. 如权利要求32所述的感光组件，其中所述模塑感光组件还包括一滤光元件，所述滤光元件的位置对应所述感光元件的所述感光区域，所述滤光元件被贴装于所述感光元件的所述感光区域。
  34. 如权利要求32所述的感光组件，其中所述支承主体包覆所述滤光元件的边缘。
  35. 如权利要求32所述的感光组件，其中所述模塑感光组件还包括一滤光元件，所述滤光元件被所述支承元件支撑于所述镜片和所述感光元件之间，且所述滤光元件的边缘被所述支承元件包覆。
  36. 如权利要求31所述的感光组件，其中所述支承主体包覆所述引线的至少一部分、所述非感光区域的所述芯片外侧部、所述芯片连接部以及所述芯片内侧部，所述模塑主体包覆所述线路板的所述边缘区域，所述感光元件、所述支承主体以及所述镜片之间形成一密闭空间。
  37. 如权利要求36所述的感光组件，其中所述模塑感光组件还包括一滤光元件，所述滤光元件的位置对应所述感光元件的所述感光区域，所述滤光元件被贴装于所述感光元件的所述感光区域。
  38. 如权利要求37所述的感光组件，其中所述支承主体包覆所述滤光元件的边缘。
  39. 如权利要求36所述的感光组件，其中所述模塑感光组件还包括一滤光元件，所述滤光元件被所述支承元件支撑于所述镜片和所述感光元件之间，且所述滤光元件的边缘被所述支承元件包覆。
  40. 如权利要求31所述的感光组件，其中所述支承主体包覆所述引线的至少一部分、所述非感光区域的所述芯片外侧部、所述芯片连接部以及所述芯片内侧部， 所述模塑主体模塑包覆所述线路板的所述边缘区域的所述线路板外侧部，所述线路板、所述支承主体以及所述镜片之间形成一密闭空间。
  41. 如权利要求40所述的感光组件，其中所述模塑感光组件还包括一滤光元件，所述滤光元件的位置对应所述感光元件的所述感光区域，所述滤光元件被贴装于所述感光元件的所述感光区域。
  42. 如权利要求41所述的感光组件，其中所述滤光元件的边缘被所述支承主体包覆。
  43. 如权利要求40所述的感光组件，其中所述模塑感光组件还包括一滤光元件，所述滤光元件被所述支承元件支撑于所述镜片和所述感光元件之间，且所述滤光元件的边缘被所述支承元件包覆。
  44. 如权利要求31所述的感光组件，其中所述支承主体包覆所述引线的至少一部分、所述边缘区域的所述线路板外侧部、所述线路板连接部以及所述线路板内侧部，所述模塑主体一体模塑包覆所述线路板的所述边缘区域的所述线路板外侧部，所述感光元件、所述支承主体以及所述镜片之间形成至少一密闭空间。
  45. 如权利要求44所述的感光组件，其中所述模塑感光组件还包括一滤光元件，所述滤光元件的位置对应所述感光元件的所述感光区域，所述滤光元件被贴装于所述感光元件的所述感光区域。
  46. 如权利要求44所述的感光组件，其中所述模塑感光组件还包括一滤光元件，所述滤光元件被所述支承元件支撑于所述镜片和所述感光元件之间，且所述滤光元件的边缘被所述支承元件包覆。
  47. 如权利要求31所述的感光组件，其中所述支承主体包覆所述引线的至少一部分、所述边缘区域的所述线路板外侧部、所述线路板连接部、所述线路板内侧部以及所述非感光区域的所述芯片外侧部，所述模塑主体一体模塑包覆所述边缘区域的所述线路板外侧部以及所述线路板连接部，所述感光元件、所述支承主体以及所述镜片之间形成至少一密闭空间。
  48. 如权利要求47所述的感光组件，其中所述模塑感光组件还包括一滤光元件，所述滤光元件的边缘被所述支承主体包覆。
  49. 如权利要求47所述的感光组件，其中所述模塑感光组件还包括一滤光元件，所述滤光元件的位置对应所述感光元件的所述感光区域，所述滤光元件被贴装于所述感光元件的所述感光区域。
  50. 如权利要求31所述的感光组件，其中所述支承主体包覆所述边缘区域的所述线路板内侧部以及所述非感光区域的所述芯片外侧部，所述模塑主体一体模塑包覆所述边缘区域的所述线路板外侧部以及所述线路板连接部，所述感光元件、所述支承主体以及所述镜片之间形成一密闭空间。
  51. 如权利要求50所述的感光组件，其中所述模塑感光组件还包括一滤光元件，所述滤光元件的位置对应所述感光元件的所述感光区域，所述滤光元件被贴装于所述感光元件的所述感光区域。
  52. 如权利要求50所述的感光组件，其中所述模塑感光组件还包括一滤光元件，所述滤光元件的边缘被所述支承主体包覆。
  53. 如权利要求31所述的感光组件，其中所述支承主体形成于所述非感光区域的所述芯片内侧部以支撑所述镜片的所述镜片周缘，所述模塑主体一体模塑包覆所述引线的全部、所述线路板的所述边缘区域、所述非感光区域的所述芯片外侧部以及所述芯片连接部，所述感光元件、所述支承主体以及所述镜片之间形成至少一密闭空间。
  54. 如权利要求53所述的感光组件，其中所述模塑感光组件还包括一滤光元件，所述滤光元件的位置对应所述感光元件的所述感光区域，所述滤光元件被贴装于所述感光元件的所述感光区域。
  55. 如权利要求54所述的感光组件，其中所述滤光元件的边缘被所述支承主体包覆。
  56. 如权利要求53所述的感光组件，其中所述模塑感光组件还包括一滤光元件，所述滤光元件被所述支承元件支撑于所述镜片和所述感光元件之间，且所述滤光元件的边缘被所述支承元件包覆。
  57. 如权利要求31所述的感光组件，其中所述支承主体形成于所述边缘区域的所述线路板外侧部以支撑所述镜片的所述镜片周缘，所述模塑主体一体模塑包覆所述边缘区域的所述线路板外侧部，所述线路板、所述支承主体以及所述镜片之间形成至少一密闭空间。
  58. 如权利要求57所述的感光组件，其中所述模塑感光组件还包括一滤光元件，所述滤光元件的位置对应所述感光元件的所述感光区域，所述滤光元件被贴装于所述感光元件的所述感光区域。
  59. 如权利要求57所述的感光组件，其中所述模塑感光组件还包括一滤光元件，所述滤光元件被所述支承元件支撑于所述镜片和所述感光元件之间，且所述滤光元件的边缘被所述支承元件包覆。
  60. 如权利要求30至59中任一所述的感光组件，其中所述模塑基座还包括至少一镜头安装段，所述镜头安装段和所述模塑主体一体地模塑连接。
  61. 如权利要求30至59中任一所述的感光组件，其中所述模塑感光组件还包括多个电子元器件，各所述电子元器件被电连接设置于所述线路板上，所述模塑主体包覆各所述电子元器件。
  62. 如权利要求30至59中任一所述的感光组件，其中所述模塑主体还包覆所述镜片周缘的所述顶面的至少一部分。
  63. 如权利要求29至59中任一所述的感光组件，其中所述线路板还具有一感光元件容纳孔，所述感光元件被设置于所述感光元件容纳孔内。
  64. 如权利要求29至59中任一所述的感光组件，其中所述线路板还具有一感光元件凹槽，所述感光元件被设置于所述感光元件凹槽内。
  65. 如权利要求29至59中任一所述的感光组件，其中所述镜片为热硬化镜片。
  66. 如权利要求29至59中任一所述的感光组件，其中所述镜片为能够汇聚光线的凸透镜。
  67. 如权利要求29至59中任一所述的感光组件，其中所述镜片的外侧为方形台阶形状。
  68. 如权利要求29至59中任一所述的感光组件，其中所述至少两模塑感光组件的多个所述线路板一体成型从而形成一连体线路板；或者所述至少两模塑感光组件的多个所述线路板各自独立。
  69. 如权利要求29至59中任一所述的感光组件，其中所述至少两模塑感光组件的多个所述模塑基座一体成型从而形成一连体模塑基座；或者所述至少两模塑感光组件的多个所述模塑基座各自独立。
  70. 一带有模塑感光组件的阵列摄像模组，其特征在于，包括：至少两个镜头和根据权利要求29至69中任一所述的感光组件，其中光线经过对应的所述镜头和各个所述模塑感光组件的所述镜片折射后汇聚至对应的所述感光元件。
  71. 如权利要求70所述的带有模塑感光组件的阵列摄像模组，进一步包括至少两滤光元件，各个所述滤光元件设置于对应的所述镜头内的底部。
  72. 如权利要求70所述的带有模塑感光组件的阵列摄像模组，进一步包括至少两滤光元件，所述滤光元件被设置于所述镜头和所述模塑感光组件的所述感光元件之间。
  73. 根据权利要求72所述的带有模塑感光组件的阵列摄像模组，其中所述滤光元件被组装于所述模塑感光组件的所述模塑主体的顶表面。
  74. 如权利要求70所述的带有模塑感光组件的阵列摄像模组，进一步包括至少两滤光元件，各所述滤光元件被设置于所述镜头和所述模塑感光组件的所述镜片之间。
  75. 一电子设备，其特征在于，包括一个或多个根据权利要求70至74中任一所述的带有模塑感光组件的阵列摄像模组，其中每个所述阵列摄像模组被用于获取图像。
  76. 根据权利要求75所述的电子设备，其特征在于，所述电子设备选自手机、电脑、电视机、智能可穿载设备、交通工具、照相机和监控装置。
PCT/CN2018/075797 2017-02-08 2018-02-08 摄像模组及其模塑感光组件和制造方法以及电子设备 WO2018145644A1 (zh)

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JP2019542701A JP7061130B2 (ja) 2017-02-08 2018-02-08 撮像モジュールおよびそのモールド感光アセンブリと製造方法、ならびに電子機器
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