CN104716115A - 传感器封装及其制造方法 - Google Patents

传感器封装及其制造方法 Download PDF

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Publication number
CN104716115A
CN104716115A CN201410662747.3A CN201410662747A CN104716115A CN 104716115 A CN104716115 A CN 104716115A CN 201410662747 A CN201410662747 A CN 201410662747A CN 104716115 A CN104716115 A CN 104716115A
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Prior art keywords
intermediate carrier
chip
sensor
integrated circuit
opening
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亨德里克·博曼
罗埃尔·达门
西恩拉德·科内利斯·塔克
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Ams International AG
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NXP BV
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Priority to CN201910757601.XA priority Critical patent/CN110459520A/zh
Publication of CN104716115A publication Critical patent/CN104716115A/zh
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Abstract

本申请涉及传感器封装，包括接合到中间载体的传感器芯片，并且传感器元件在载体中的开口上。封装用于焊接到板，在这期间中间载体保护传感器芯片的传感器部分。

Description

传感器封装及其制造方法
技术领域
本申请涉及传感器芯片封装。
背景技术
方型扁平式封装是表面安装集成电路封装的一个例子，其中欧翼从封装的四个面中的每一个延伸。一种为了改善小型化和用于传感器封装的修改是所谓的带散热片、薄四方扁平无引线封装(HVQFN)。这种封装没有元件从封装延伸，和其中封装包括集成的散热部分。这种封装是和其它表面安装器件一起，用于通过焊接被安装在印刷电路板(PCB)上。
图1(a)示出了用于焊接到PCB上的HVQFN封装。传感器芯片10具有在顶表面的外区周围的焊盘11。在一个例子中，这些焊盘连接到接合线14，接合线14向下延伸到载体12，载体12例如是引线框架，这提供了扩散(fan out)功能。接合线植入在封装中。接合线通过引线键合连接。这通常是“冷焊”工艺，连接的材料没有(如真正的焊缝和焊接工艺那样)成为液态。当IC要用于引线键合时，在接合焊盘上存在金属化，并且这通常是铝或金。
引线框架12具有焊接到下面的PCB13的外接触，和在芯片10的下方的中心管芯焊盘区域。中心管芯焊盘区域也被焊接到PCB，以及该焊接区域执行散热功能。
替代引线框架，载体可以例如是层压基板。
芯片10载有一个或多个传感器元件16。HVQFN腔体封装允许在芯片上的传感器通过具有开口的封装以具有到环境的开放接口，通过所述开口传感器区域被暴露。
图1(b)示出了位于焊盘11上的具有焊料凸块18的传感器芯片，焊盘11可以用于使能芯片直接安装到PCB上。图1(a)的封装的优点是与管芯尺寸相比，封装尺寸相对大，如由箭头20所示。
很显然芯片尺寸封装(CSP)从尺寸和成本的角度来看是优选的，例如通过直接焊接芯片到PCB。
然而，这种用于传感器的方法的缺点是来自CSP工艺的污染风险，特别是当焊料凸块在晶圆级被附接时当焊料凸块回流焊接时的焊料飞溅的风险，而且在板焊接工艺期间在客户方面可能污染传感器区域，并且影响它的功能。
图2和3被用于解释直接将芯片焊接到PCB上的问题。
图2示出了传感器元件16在当准备焊接到PCB上，特别是当形成焊球18时如何被CSP工艺污染。该工艺从晶圆开始，在晶圆上形成焊盘11，接着是凸块底层金属层。通过回流工艺形成焊球，这将引起如22所示的污染。
产生的封装然后在客户方(即电子电路的制造者而不是各个元件)被焊接到PCB13。芯片的设计者不知道在这个阶段可以使用什么水平的清洁，也不知道使用的焊料和其它材料的质量。
图3示出了当封装被设置在客户电路板13上时如何通过焊锡回流污染传感器元件16。污染物如26所示。
因此需要一种保护传感器元件的传感器封装，但比图1(a)的引线键合封装使用更少的空间。
发明内容
本发明由权利要求限定。
根据一个实施例，提供一种传感器封装，包括：
集成电路芯片，所述集成电路芯片在第一表面上具有至少一个传感器元件；
具有第一表面的中间载体，通过粘合剂将集成电路芯片的第一表面接合到中间载体的第一表面，其中中间载体具有传感器元件下方的开口；和
焊料接合焊盘，位于与中间载体的第一表面相对的第二表面上；
当形成封装时，粘合剂避免受到与焊接有关的工艺的污染。中间载体为芯片上的传感器元件提供防护。
封装可以形成为“近CSP”(芯片尺寸封装)，其中中间载体不需要明显大于芯片。封装使用中间载体，和粘合剂将芯片和中间载体互连。
例如，由中间载体的外边缘限定的外部的形状可以在芯片形状的外边缘的0.5mm范围内，更优选地在0.4mm范围内，以及更优选地在0.3mm范围内。
这是可能的，因为不需要例如用于接合线的空间。尽管封装尺寸小，但是例如当将封装焊接到客户PCB上时，具有传感器开口的中间载体提供用于传感器的防护。
集成电路芯片可以包括金凸块或镍金凸块(即具有很少金防护层以避免氧化的化学镀镍凸块)，该凸块通过粘合剂被接合到中间载体的第一表面。这是在封装制造中避免使用焊料的一种方法。
粘合剂可以包括各向异性导电胶或非导电胶。
开口的面积可以比传感器元件的传感器面积小很多。这样，中间载体作为屏障以保护传感器，和只需要用于正确传感器操作的足够大的开口。
包胶模可以可选地提供在集成电路芯片上以改善封装的鲁棒性。
传感器装置可以包括电路板和传感器封装，通过将焊料接合焊盘焊接到电路板上的迹线来固定到电路板上。
一个实施例还提供了一种传感器封装的制造方法，包括：
提供集成电路芯片，所述集成电路芯片在第一表面上具有至少一个传感器元件；和
通过粘合剂将集成电路芯片的第一表面接合到中间载体的第一表面，其中中间载体具有传感器元件下方的开口，
其中中间载体包括焊料接合焊盘，焊料接合焊盘位于与中间载体的第一表面相对的第二表面上。
附图说明
通过根据以下附图描述本发明实施例，其中：
图1示出了已知的HVQFN传感器封装以及基本的芯片封装以使能尺寸比较；
图2示出了当传感器直接附着到PCB上时可能产生的第一污染问题；
图3示出了当传感器直接附着到PCB上时可能产生的第二污染问题；
图4示出了一种封装和用于形成封装的方法的例子；和
图5示出了图4的封装附着到电路板。
具体实施方式
本申请涉及传感器封装，通过该传感器封装将传感器芯片接合到中间载体，并且传感器元件在载体中的一个开口或一组开口上。
封装用于焊接到板，在这期间中间载体保护传感器芯片的传感器部分。
图4示出了传感器封装的制造方法。
该方法始于集成电路芯片40，该集成电路芯片40在第一表面41上具有至少一个传感器元件42。第一表面还具有例如金或镍金或铜的金属凸块44。这些中的每一个都形成在金属焊盘的上方，金属焊盘限定了芯片的最终输入或输出端，并且凸块底层金属层是位于金属焊盘和金属凸块之间。
通过使用粘合剂将集成电路芯片40的第一表面41接合到中间载体48的第一表面，该粘合剂例如是各向异性导电粘合剂(ACA)或非导电粘合剂(NCA)。可以用带或膏的形式施加粘合剂。中间载体48具有在传感器元件42下方的开口50或一组开口。
注意通常不需要传感器元件传感器表面与开口一致。例如，传感器可能是压力传感器，对于压力传感器不需要校准。类似地，化学传感器也不需要直接校准。
中间载体48包括焊料接合焊盘52，焊料接合焊盘52位于与第一表面相对的中间载体的第二表面上。这样提供从而整个封装可以如表面安装器件设置在印刷电路板上，同时和其它表面安装元件一起设置。
集成电路芯片的面积可以例如占由中间载体48的外边缘所限定的形状的面积的60％，从而制造接近芯片尺寸封装。该面积可以至少占载体面积的70％或甚至80％。
类似地，由中间载体的外边缘限定的外部的形状可以在芯片形状的外边缘的0.5mm范围内，更优选地在0.4mm范围内，以及更优选地在0.3mm范围内。再一次，这意味着封装尺寸可以接近芯片尺寸从而有助于小型化和减少成本。
开口50或一组开口可以具有比传感器元件42的传感器面积更小的面积，和中间载体作为遮蔽保护传感器元件。开口50在允许传感器功能的同时可以尽可能小。
然后芯片可以使用树脂54包胶模以限定封装。
中间载体可以包括片状结构，以及它在传感器芯片末端和接合焊盘52之间提供所需要的电连接。
图5示出了通过焊接连接62将传感器封装焊接到客户板60上。在客户焊接操作期间，中问载体48保护传感器元件。特别地，它提供由客户执行的清洁或其它工艺步骤的品质公差，从而传感器芯片到客户PCB的连接更可靠和易于执行。
本实施例因此提供了近-CSP封装，它使用中间载体，中间载体可以是片状结构，以及本实施例使用非焊料凸块作为芯片和中间载体之间的连接。特别地，为了避免手CSP工艺的污染，由金属凸块(例如金，镍金，铜或其它金属)代替焊料以及使用粘合剂制造芯片和中间载体之间的连接。
这些实施例可以被用于传感器，传感器被配置为检测环境参数中的各种不同，环境参数例如是光，湿度，气体或液体浓度或压力。
芯片和封装通常是正方形或长方形。
以上作为示例给出了金凸块，镍金凸块和铜凸块。与粘合剂相结合，用于这种类型的连接的最常用的例子是金凸块。可以使用铜，但是有氧化风险。也可以考虑化学镀镍或镍金凸块。
中间载体实质上可以包含印刷电路板结构，称为合板结构。材料可能与传统的PCB不同。例如可以使用BT(双马来酰亚胺三嗪树脂)板，使用玻璃纤维材料的芯。可以通过钻孔在板之间形成垂直连接。
可以使用陶瓷制造相同材料的结构，例如多层陶瓷(使用氧化铝或玻璃陶瓷堆一起烧结)。
一个芯片可能具有单个传感器，虽然常见的是一个以上的传感器。传感器装置可能甚至包含一批个别的传感器电极。
封装尺寸通常在1mm2到10mm2。因此，典型的尺寸在1mm*1mm到3mm*3mm。
包胶模混合物可以是基于环氧的模塑料。也可以使用基于硅的模塑料。
在载体中的开口可以比传感器电极面积小很多。例如，它可以具有小于200μm的线性尺寸，例如大约100μm。
传感器封装可以是传感器系统的一部分，例如分析设备。它也可能被提供为另一个产品的附加功能如移动电话。例如，已知压力传感器被用作为移动电话内的气压计，从而提供高度信息以获得较快的GPS坐标定位。麦克风本质上也是压力传感器。因此，当传感器被包括进小型产品时，其所占的空间量需要尽可能小，并且因此所感兴趣的是所占面积的减小。
所披露实施例的其他变化可以通过本领域技术人员在实施所提出的发明、研究附图、披露和附加的权利要求后理解和影响。在权利要求中，术语”包括”不排除其他的元件或者步骤，以及不定冠词“一种”不排除那些元件的复数。事实上，在彼此不同的从属权利要求中记载的一些手段并不表示这些手段的结合不能被用于优化。在权利要求中的附图标记将不被理解为对范围的限制。

Claims (15)

1.一种传感器封装，其特征在于，包括：
集成电路芯片(40)，所述集成电路芯片(40)在其第一表面上具有至少一个传感器元件(42)；
具有第一表面的中间载体(48)，通过粘合剂将集成电路芯片的第一表面接合到中间载体(48)的第一表面，其中中间载体(48)具有位于传感器元件(42)下方的开口(50)；和
焊料接合焊盘(52)，位于与中间载体(48)的第一表面相对的中间载体(48)的第二表面上。
2.根据权利要求1所述的封装，其特征在于，由中间载体的外边缘限定的外部形状在芯片形状的外边缘的0.5mm范围内，更优选地在0.4mm范围内，甚至更优选地在0.3mm范围内。
3.根据前述任一权利要求所述的封装，其特征在于，集成电路芯片(40)包括金，镍或镍金凸块(44)，所述凸块(44)通过粘合剂被接合到中间载体的第一表面。
4.根据前述任一权利要求所述的封装，其特征在于，粘合剂包括各向异性导电胶或非导电胶。
5.根据前述任一权利要求所述的封装，其特征在于，中间载体具有位于传感器元件(42)下方的一组开口(50)。
6.根据前述任一权利要求所述的封装，其特征在于，开口(50)或一组开口具有比传感器元件的传感器面积更小的面积。
7.根据前述任一权利要求所述的封装，其特征在于，包括位于集成电路芯片上方的包胶模(54)。
8.一种传感器装置，其特征在于，包括：
电路板(60)；和
根据前述任一权利要求所述的传感器封装，通过将焊料接合焊盘(52)焊接到电路板(60)上的迹线以将所述传感器封装固定到电路板上。
9.一种传感器封装的制造方法，其特征在于，包括：
提供集成电路芯片(40)，所述集成电路芯片(40)在其第一表面上具有至少一个传感器元件(42)；和
通过粘合剂将集成电路芯片的第一表面接合到中间载体(48)的第一表面，其中中间载体(48)具有位于传感器元件(42)下方的开口(50)，
其中中间载体(48)包括焊料接合焊盘(52)，焊料接合焊盘(52)位于与中间载体的第一表面相对的中间载体的第二表面上。
10.根据权利要求9所述的方法，其特征在于，由中间载体的外边缘限定的外部形状在芯片形状的外边缘的0.5mm范围内，更优选地在0.4mm范围内，甚至更优选地在0.3mm范围内。
11.根据权利要求9或10所述的方法，其特征在于，集成电路芯片(40)包括金，镍或镍金凸块(44)，所述接合包括将凸块(44)接合到中间载体的第一表面。
12.根据权利要求9至11任一项所述的方法，其特征在于，中间载体具有位于传感器元件(42)下方的一组开口(50)。
13.根据权利要求9至12任一项所述的方法，其特征在于，开口(50)或一组开口具有比传感器元件的传感器面积更小的面积。
14.根据权利要求9至13任一项所述的方法，其特征在于，还包括位于集成电路芯片上方的包胶模。
15.根据权利要求9至14任一项所述的方法，其特征在于，还还包括将焊料接合焊盘焊接到电路板的迹线。
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