JP2014143379A5 - - Google Patents

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Publication number
JP2014143379A5
JP2014143379A5 JP2013012391A JP2013012391A JP2014143379A5 JP 2014143379 A5 JP2014143379 A5 JP 2014143379A5 JP 2013012391 A JP2013012391 A JP 2013012391A JP 2013012391 A JP2013012391 A JP 2013012391A JP 2014143379 A5 JP2014143379 A5 JP 2014143379A5
Authority
JP
Japan
Prior art keywords
terminal
mounting
disposed
electronic component
mounting substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2013012391A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014143379A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2013012391A priority Critical patent/JP2014143379A/ja
Priority claimed from JP2013012391A external-priority patent/JP2014143379A/ja
Publication of JP2014143379A publication Critical patent/JP2014143379A/ja
Publication of JP2014143379A5 publication Critical patent/JP2014143379A5/ja
Pending legal-status Critical Current

Links

JP2013012391A 2013-01-25 2013-01-25 実装基板および電子部品の実装方法 Pending JP2014143379A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013012391A JP2014143379A (ja) 2013-01-25 2013-01-25 実装基板および電子部品の実装方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013012391A JP2014143379A (ja) 2013-01-25 2013-01-25 実装基板および電子部品の実装方法

Publications (2)

Publication Number Publication Date
JP2014143379A JP2014143379A (ja) 2014-08-07
JP2014143379A5 true JP2014143379A5 (enExample) 2016-03-10

Family

ID=51424430

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013012391A Pending JP2014143379A (ja) 2013-01-25 2013-01-25 実装基板および電子部品の実装方法

Country Status (1)

Country Link
JP (1) JP2014143379A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200053983A (ko) * 2018-11-09 2020-05-19 엘지전자 주식회사 전동식 압축기
KR102872169B1 (ko) * 2020-08-20 2025-10-16 삼성전자주식회사 커패시터 및 이를 포함하는 전자장치
KR20250118073A (ko) * 2024-01-29 2025-08-05 삼성전자주식회사 인쇄회로기판 및 이를 포함하는 전자 장치

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6076058U (ja) * 1983-10-28 1985-05-28 株式会社ケンウッド 電子部品の実装構造
JPS6218928U (enExample) * 1985-07-17 1987-02-04
JPS6365266U (enExample) * 1986-10-20 1988-04-30
JPH01167010U (enExample) * 1988-05-16 1989-11-22
JPH0329389A (ja) * 1989-06-27 1991-02-07 Mitsubishi Electric Corp プリント回路板
JPH04144055A (ja) * 1990-10-05 1992-05-18 Mitsubishi Electric Corp カード用モジユール
JPH0562067U (ja) * 1992-01-23 1993-08-13 日本精機株式会社 回路基板
JPH09219575A (ja) * 1996-02-08 1997-08-19 Nippon Telegr & Teleph Corp <Ntt> 光素子実装構造
JP2005158912A (ja) * 2003-11-25 2005-06-16 Canon Inc 回路基板
JP2008218935A (ja) * 2007-03-08 2008-09-18 Kawasaki Microelectronics Kk 半導体集積回路パッケージが装着された回路基板および半導体集積回路パッケージ

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