JP2014143379A - 実装基板および電子部品の実装方法 - Google Patents

実装基板および電子部品の実装方法 Download PDF

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Publication number
JP2014143379A
JP2014143379A JP2013012391A JP2013012391A JP2014143379A JP 2014143379 A JP2014143379 A JP 2014143379A JP 2013012391 A JP2013012391 A JP 2013012391A JP 2013012391 A JP2013012391 A JP 2013012391A JP 2014143379 A JP2014143379 A JP 2014143379A
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JP
Japan
Prior art keywords
mounting
terminal
electrolytic capacitor
printed wiring
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2013012391A
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English (en)
Japanese (ja)
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JP2014143379A5 (enExample
Inventor
Tatsuya Miyagi
竜也 宮城
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
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Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2013012391A priority Critical patent/JP2014143379A/ja
Publication of JP2014143379A publication Critical patent/JP2014143379A/ja
Publication of JP2014143379A5 publication Critical patent/JP2014143379A5/ja
Pending legal-status Critical Current

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  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP2013012391A 2013-01-25 2013-01-25 実装基板および電子部品の実装方法 Pending JP2014143379A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013012391A JP2014143379A (ja) 2013-01-25 2013-01-25 実装基板および電子部品の実装方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013012391A JP2014143379A (ja) 2013-01-25 2013-01-25 実装基板および電子部品の実装方法

Publications (2)

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JP2014143379A true JP2014143379A (ja) 2014-08-07
JP2014143379A5 JP2014143379A5 (enExample) 2016-03-10

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ID=51424430

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JP2013012391A Pending JP2014143379A (ja) 2013-01-25 2013-01-25 実装基板および電子部品の実装方法

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JP (1) JP2014143379A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020096201A1 (ko) * 2018-11-09 2020-05-14 엘지전자 주식회사 전동식 압축기
WO2022039375A1 (ko) * 2020-08-20 2022-02-24 삼성전자주식회사 커패시터 및 이를 포함하는 전자장치
WO2025165009A1 (ko) * 2024-01-29 2025-08-07 삼성전자주식회사 인쇄회로기판 및 이를 포함하는 전자 장치

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6076058U (ja) * 1983-10-28 1985-05-28 株式会社ケンウッド 電子部品の実装構造
JPS6218928U (enExample) * 1985-07-17 1987-02-04
JPS6365266U (enExample) * 1986-10-20 1988-04-30
JPH01167010U (enExample) * 1988-05-16 1989-11-22
JPH0329389A (ja) * 1989-06-27 1991-02-07 Mitsubishi Electric Corp プリント回路板
JPH04144055A (ja) * 1990-10-05 1992-05-18 Mitsubishi Electric Corp カード用モジユール
JPH0562067U (ja) * 1992-01-23 1993-08-13 日本精機株式会社 回路基板
JPH09219575A (ja) * 1996-02-08 1997-08-19 Nippon Telegr & Teleph Corp <Ntt> 光素子実装構造
JP2005158912A (ja) * 2003-11-25 2005-06-16 Canon Inc 回路基板
JP2008218935A (ja) * 2007-03-08 2008-09-18 Kawasaki Microelectronics Kk 半導体集積回路パッケージが装着された回路基板および半導体集積回路パッケージ

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6076058U (ja) * 1983-10-28 1985-05-28 株式会社ケンウッド 電子部品の実装構造
JPS6218928U (enExample) * 1985-07-17 1987-02-04
JPS6365266U (enExample) * 1986-10-20 1988-04-30
JPH01167010U (enExample) * 1988-05-16 1989-11-22
JPH0329389A (ja) * 1989-06-27 1991-02-07 Mitsubishi Electric Corp プリント回路板
JPH04144055A (ja) * 1990-10-05 1992-05-18 Mitsubishi Electric Corp カード用モジユール
JPH0562067U (ja) * 1992-01-23 1993-08-13 日本精機株式会社 回路基板
JPH09219575A (ja) * 1996-02-08 1997-08-19 Nippon Telegr & Teleph Corp <Ntt> 光素子実装構造
JP2005158912A (ja) * 2003-11-25 2005-06-16 Canon Inc 回路基板
JP2008218935A (ja) * 2007-03-08 2008-09-18 Kawasaki Microelectronics Kk 半導体集積回路パッケージが装着された回路基板および半導体集積回路パッケージ

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020096201A1 (ko) * 2018-11-09 2020-05-14 엘지전자 주식회사 전동식 압축기
WO2022039375A1 (ko) * 2020-08-20 2022-02-24 삼성전자주식회사 커패시터 및 이를 포함하는 전자장치
US12406804B2 (en) 2020-08-20 2025-09-02 Samsung Electronics Co., Ltd. Capacitor and electronic device comprising same
WO2025165009A1 (ko) * 2024-01-29 2025-08-07 삼성전자주식회사 인쇄회로기판 및 이를 포함하는 전자 장치

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