JP2012099751A5 - - Google Patents
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- Publication number
- JP2012099751A5 JP2012099751A5 JP2010248188A JP2010248188A JP2012099751A5 JP 2012099751 A5 JP2012099751 A5 JP 2012099751A5 JP 2010248188 A JP2010248188 A JP 2010248188A JP 2010248188 A JP2010248188 A JP 2010248188A JP 2012099751 A5 JP2012099751 A5 JP 2012099751A5
- Authority
- JP
- Japan
- Prior art keywords
- hole
- circuit board
- printed circuit
- corner
- terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010248188A JP5783706B2 (ja) | 2010-11-05 | 2010-11-05 | プリント回路板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010248188A JP5783706B2 (ja) | 2010-11-05 | 2010-11-05 | プリント回路板 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012099751A JP2012099751A (ja) | 2012-05-24 |
| JP2012099751A5 true JP2012099751A5 (enExample) | 2013-12-19 |
| JP5783706B2 JP5783706B2 (ja) | 2015-09-24 |
Family
ID=46391299
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010248188A Expired - Fee Related JP5783706B2 (ja) | 2010-11-05 | 2010-11-05 | プリント回路板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5783706B2 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102837100B1 (ko) | 2020-01-14 | 2025-07-22 | 주식회사 엘지에너지솔루션 | Bmu 부품 손상 방지 구조를 포함하는 배터리 팩 |
| CN115996513B (zh) * | 2021-10-19 | 2025-06-20 | 礼鼎半导体科技秦皇岛有限公司 | 封装芯片、封装结构、电路板及其制造方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11111771A (ja) * | 1997-10-07 | 1999-04-23 | Matsushita Electric Ind Co Ltd | 配線基板の接続方法、キャリア基板および配線基板 |
| JPH11111772A (ja) * | 1997-10-07 | 1999-04-23 | Matsushita Electric Ind Co Ltd | キャリア基板の実装位置決め方法、キャリア基板および配線基板 |
| JP2001119107A (ja) * | 1999-10-19 | 2001-04-27 | Nec Saitama Ltd | プリント配線板 |
| JP2001144116A (ja) * | 1999-11-11 | 2001-05-25 | Hitachi Kokusai Electric Inc | 電子部品の実装方法及び構造、並びに回路基板 |
| JP4273598B2 (ja) * | 1999-11-22 | 2009-06-03 | パナソニック株式会社 | Bga型パッケージを搭載する回路基板 |
| JP5017991B2 (ja) * | 2006-09-28 | 2012-09-05 | 富士通株式会社 | プリント配線板、電子装置 |
| JP2009130048A (ja) * | 2007-11-21 | 2009-06-11 | Elpida Memory Inc | 半導体装置及び電子装置 |
| JP2010010428A (ja) * | 2008-06-27 | 2010-01-14 | Fujitsu Ltd | プリント基板及び電子機器 |
-
2010
- 2010-11-05 JP JP2010248188A patent/JP5783706B2/ja not_active Expired - Fee Related
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