KR20140048042A - 배선 기판 - Google Patents

배선 기판 Download PDF

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Publication number
KR20140048042A
KR20140048042A KR1020130118347A KR20130118347A KR20140048042A KR 20140048042 A KR20140048042 A KR 20140048042A KR 1020130118347 A KR1020130118347 A KR 1020130118347A KR 20130118347 A KR20130118347 A KR 20130118347A KR 20140048042 A KR20140048042 A KR 20140048042A
Authority
KR
South Korea
Prior art keywords
protrusions
wiring board
electronic component
protrusion
core substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020130118347A
Other languages
English (en)
Korean (ko)
Inventor
다케미 마치다
다이스케 다키자와
Original Assignee
신꼬오덴기 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 신꼬오덴기 고교 가부시키가이샤 filed Critical 신꼬오덴기 고교 가부시키가이샤
Publication of KR20140048042A publication Critical patent/KR20140048042A/ko
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49822—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09854—Hole or via having special cross-section, e.g. elliptical
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
KR1020130118347A 2012-10-15 2013-10-04 배선 기판 Ceased KR20140048042A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012228210A JP5968753B2 (ja) 2012-10-15 2012-10-15 配線基板
JPJP-P-2012-228210 2012-10-15

Publications (1)

Publication Number Publication Date
KR20140048042A true KR20140048042A (ko) 2014-04-23

Family

ID=50475136

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130118347A Ceased KR20140048042A (ko) 2012-10-15 2013-10-04 배선 기판

Country Status (3)

Country Link
US (1) US8804361B2 (enExample)
JP (1) JP5968753B2 (enExample)
KR (1) KR20140048042A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9743525B2 (en) 2014-12-09 2017-08-22 Samsung Electro-Mechanics Co., Ltd. Electronic device embedded substrate and manufacturing method thereof

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102105403B1 (ko) * 2013-11-28 2020-04-28 삼성전기주식회사 전자소자 내장 기판 및 그 제조 방법
JP6384118B2 (ja) * 2014-05-13 2018-09-05 日立化成株式会社 半導体装置の製造方法、半導体装置及び半導体装置製造用部材
KR101591749B1 (ko) 2014-08-13 2016-02-05 주식회사 뉴마이크로 칼라 샤프심 제조용 식물성 가소제 및 이의 제조방법
KR101591750B1 (ko) 2014-08-13 2016-02-11 주식회사 뉴마이크로 칼라 샤프심의 제조방법
KR101591751B1 (ko) 2014-08-13 2016-02-05 주식회사 뉴마이크로 컬러 샤프심 제조용 가공 수지, 및 이의 제조방법
KR101591752B1 (ko) 2014-08-13 2016-02-12 주식회사 뉴마이크로 칼라 샤프심
JP6639934B2 (ja) * 2016-02-08 2020-02-05 新光電気工業株式会社 配線基板、半導体装置及び配線基板の製造方法
US9743526B1 (en) 2016-02-10 2017-08-22 International Business Machines Corporation Wiring board with stacked embedded capacitors and method of making
JP6678090B2 (ja) * 2016-10-04 2020-04-08 新光電気工業株式会社 電子部品内蔵基板及びその製造方法と電子部品装置
TWI694756B (zh) * 2018-12-27 2020-05-21 欣興電子股份有限公司 一種具有散熱塊的電路板及其製造方法
US11445596B2 (en) 2018-12-27 2022-09-13 Unimicron Technology Corp. Circuit board having heat-dissipation block and method of manufacturing the same
US20200279814A1 (en) * 2019-02-28 2020-09-03 Advanced Semiconductor Engineering, Inc. Wiring structure and method for manufacturing the same
US10790241B2 (en) 2019-02-28 2020-09-29 Advanced Semiconductor Engineering, Inc. Wiring structure and method for manufacturing the same
KR20220001634A (ko) * 2020-06-30 2022-01-06 삼성전기주식회사 인쇄회로기판
US20250070001A1 (en) * 2023-08-24 2025-02-27 Qualcomm Incorporated Device including substrate with passive electronic component embedded therein

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6239485B1 (en) * 1998-11-13 2001-05-29 Fujitsu Limited Reduced cross-talk noise high density signal interposer with power and ground wrap
EP1771050B1 (en) * 1999-09-02 2011-06-15 Ibiden Co., Ltd. Printed circuit board and method of manufacturing printed circuit board
JP2005116943A (ja) * 2003-10-10 2005-04-28 Seiko Epson Corp プリント配線基板、実装基板モジュール、プリント配線基板の製造方法、およびそれを用いた電気光学装置、電子機器
JP2006073763A (ja) * 2004-09-01 2006-03-16 Denso Corp 多層基板の製造方法
JP4882880B2 (ja) 2007-06-12 2012-02-22 株式会社デンソー プリント基板の製造方法およびプリント基板
JP2012079994A (ja) * 2010-10-05 2012-04-19 Yamaichi Electronics Co Ltd 部品内蔵プリント配線板およびその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9743525B2 (en) 2014-12-09 2017-08-22 Samsung Electro-Mechanics Co., Ltd. Electronic device embedded substrate and manufacturing method thereof

Also Published As

Publication number Publication date
JP2014082276A (ja) 2014-05-08
US8804361B2 (en) 2014-08-12
US20140104797A1 (en) 2014-04-17
JP5968753B2 (ja) 2016-08-10

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