JP2011103931A5 - - Google Patents

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Publication number
JP2011103931A5
JP2011103931A5 JP2009259165A JP2009259165A JP2011103931A5 JP 2011103931 A5 JP2011103931 A5 JP 2011103931A5 JP 2009259165 A JP2009259165 A JP 2009259165A JP 2009259165 A JP2009259165 A JP 2009259165A JP 2011103931 A5 JP2011103931 A5 JP 2011103931A5
Authority
JP
Japan
Prior art keywords
inter
electrode
disposed
end surface
member connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2009259165A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011103931A (ja
JP5424825B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2009259165A priority Critical patent/JP5424825B2/ja
Priority claimed from JP2009259165A external-priority patent/JP5424825B2/ja
Priority to US12/942,236 priority patent/US8437144B2/en
Publication of JP2011103931A publication Critical patent/JP2011103931A/ja
Publication of JP2011103931A5 publication Critical patent/JP2011103931A5/ja
Application granted granted Critical
Publication of JP5424825B2 publication Critical patent/JP5424825B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2009259165A 2009-11-12 2009-11-12 積層実装構造体 Active JP5424825B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009259165A JP5424825B2 (ja) 2009-11-12 2009-11-12 積層実装構造体
US12/942,236 US8437144B2 (en) 2009-11-12 2010-11-09 Laminate mount assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009259165A JP5424825B2 (ja) 2009-11-12 2009-11-12 積層実装構造体

Publications (3)

Publication Number Publication Date
JP2011103931A JP2011103931A (ja) 2011-06-02
JP2011103931A5 true JP2011103931A5 (enExample) 2013-06-20
JP5424825B2 JP5424825B2 (ja) 2014-02-26

Family

ID=44228169

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009259165A Active JP5424825B2 (ja) 2009-11-12 2009-11-12 積層実装構造体

Country Status (2)

Country Link
US (1) US8437144B2 (enExample)
JP (1) JP5424825B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150282317A1 (en) * 2014-03-28 2015-10-01 Lockheed Martin Corporation Edge contacts of circuit boards, and related apparatus and methods
WO2017072847A1 (ja) * 2015-10-27 2017-05-04 オリンパス株式会社 内視鏡
WO2024117017A1 (ja) * 2022-11-28 2024-06-06 京セラ株式会社 電子素子実装用基板、母基板、及び電子装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59205747A (ja) * 1983-05-09 1984-11-21 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
JPS6132785U (ja) * 1984-07-27 1986-02-27 ティーディーケイ株式会社 積層混成集積形ｄｃ／ｄｃコンバ−タ
JP3656861B2 (ja) * 1995-04-05 2005-06-08 ソニー株式会社 半導体集積回路装置及び半導体集積回路装置の製造方法
US5847930A (en) * 1995-10-13 1998-12-08 Hei, Inc. Edge terminals for electronic circuit modules
FI106585B (fi) * 1997-10-22 2001-02-28 Nokia Mobile Phones Ltd Koaksiaalijohto, menetelmä koaksiaalijohdon valmistamiseksi ja langaton viestin
JP3374778B2 (ja) * 1999-02-25 2003-02-10 株式会社村田製作所 チップ型電子部品
JP3664001B2 (ja) * 1999-10-25 2005-06-22 株式会社村田製作所 モジュール基板の製造方法
US6957963B2 (en) * 2000-01-20 2005-10-25 Gryphics, Inc. Compliant interconnect assembly
EP1369002A2 (en) * 2001-01-17 2003-12-10 Honeywell International Inc. Adaptor for plastic-leaded chip carrier (plcc) and other surface mount technology (smt) chip carriers
JP2004303884A (ja) * 2003-03-31 2004-10-28 Seiko Epson Corp 三次元実装モジュールの製造方法とその方法で得られる三次元実装モジュール
EP1523043B1 (en) * 2003-10-06 2011-12-28 Semiconductor Energy Laboratory Co., Ltd. Optical sensor and method for manufacturing the same
JP4918373B2 (ja) * 2006-04-28 2012-04-18 オリンパス株式会社 積層実装構造体
JP2008168042A (ja) 2007-01-15 2008-07-24 Olympus Corp 積層実装構造体
JP5086647B2 (ja) * 2007-01-17 2012-11-28 オリンパス株式会社 積層実装構造体

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