JPS6132785U - 積層混成集積形dc/dcコンバ−タ - Google Patents
積層混成集積形dc/dcコンバ−タInfo
- Publication number
- JPS6132785U JPS6132785U JP1984113453U JP11345384U JPS6132785U JP S6132785 U JPS6132785 U JP S6132785U JP 1984113453 U JP1984113453 U JP 1984113453U JP 11345384 U JP11345384 U JP 11345384U JP S6132785 U JPS6132785 U JP S6132785U
- Authority
- JP
- Japan
- Prior art keywords
- laminated
- transformer
- hybrid integrated
- converter
- electronic components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F30/00—Fixed transformers not covered by group H01F19/00
- H01F30/06—Fixed transformers not covered by group H01F19/00 characterised by the structure
- H01F30/10—Single-phase transformers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/01—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate comprising only passive thin-film or thick-film elements formed on a common insulating substrate
- H01L27/013—Thick-film circuits
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M3/00—Conversion of dc power input into dc power output
- H02M3/22—Conversion of dc power input into dc power output with intermediate conversion into ac
- H02M3/24—Conversion of dc power input into dc power output with intermediate conversion into ac by static converters
- H02M3/28—Conversion of dc power input into dc power output with intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M3/00—Conversion of dc power input into dc power output
- H02M3/22—Conversion of dc power input into dc power output with intermediate conversion into ac
- H02M3/24—Conversion of dc power input into dc power output with intermediate conversion into ac by static converters
- H02M3/28—Conversion of dc power input into dc power output with intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac
- H02M3/325—Conversion of dc power input into dc power output with intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac using devices of a triode or a transistor type requiring continuous application of a control signal
- H02M3/335—Conversion of dc power input into dc power output with intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac using devices of a triode or a transistor type requiring continuous application of a control signal using semiconductor devices only
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/08—Magnetic details
- H05K2201/083—Magnetic materials
- H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Dc-Dc Converters (AREA)
- Regulation Of General Use Transformers (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
【図面の簡単な説明】
第1図ないし第8図は本考案による積層トランスの製造
工程を示す平面図、第9図は同積層トランスの斜視図、
第10図は同積層トランスの回路図、第11図は同積層
トランス上にガラス製アンダーコートまたは積層コンデ
ンサを連続積層した時の斜視図、第12図は同積層トラ
ンス上に必要な電子部品を搭載した時の斜視図、第13
図は完成した積層混成集積形DC/DCコンバータの回
路図である。 図中主な部分の名称は次のとおり。1,4,9,14,
17,20,21:磁性体層、2.6,11,16,1
8:1次巻線用導体、5,10,15,19.21:2
次巻線用導体、p1, p2, s1, S2:引出端
および外部端子、22:ガラス製アンダーコートまたは
積層コンデンサ、23:積層トランス、24:入力端子
、25:トランス巻線引出端子、26:出力端子、27
:抵抗、28,28′:トランジスタ、タイオード、2
9:コンデンサ、30:積層トランス。
工程を示す平面図、第9図は同積層トランスの斜視図、
第10図は同積層トランスの回路図、第11図は同積層
トランス上にガラス製アンダーコートまたは積層コンデ
ンサを連続積層した時の斜視図、第12図は同積層トラ
ンス上に必要な電子部品を搭載した時の斜視図、第13
図は完成した積層混成集積形DC/DCコンバータの回
路図である。 図中主な部分の名称は次のとおり。1,4,9,14,
17,20,21:磁性体層、2.6,11,16,1
8:1次巻線用導体、5,10,15,19.21:2
次巻線用導体、p1, p2, s1, S2:引出端
および外部端子、22:ガラス製アンダーコートまたは
積層コンデンサ、23:積層トランス、24:入力端子
、25:トランス巻線引出端子、26:出力端子、27
:抵抗、28,28′:トランジスタ、タイオード、2
9:コンデンサ、30:積層トランス。
Claims (3)
- (1)積層トランスの表面に配線を施し、電子部品を搭
載した積層混成集積形DC/DCコンバータ。 - (2)積層トランスは、複数の絶縁体層と互に絶縁した
2組の導体層との交互積層体によって構成されており、
前記導体層が前記絶縁体層の層間から層間へと周回する
1次及び2次巻線を形成するように端部で接続されてい
る積層トランスであり、同積層トランスの表面はガラス
製アンダーコートで構成されている実用新案登録請求の
範囲第1項記載の積層混成集積形DC/DCコンバータ
。 - (3) 電子部品の一部は同積層トランスの表面に積
層コンデンサを連続積層したものであり、この複合基板
上に抵抗および半導体を搭載させることにより電子部品
のすべてが構成されている実用新案登録請求の範囲第2
項記載の積層混成集積形DC/DCコンパータ。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1984113453U JPS6132785U (ja) | 1984-07-27 | 1984-07-27 | 積層混成集積形dc/dcコンバ−タ |
US07/040,688 US4730241A (en) | 1984-07-27 | 1987-04-17 | Laminated hybrid integrated DC-DC converter |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1984113453U JPS6132785U (ja) | 1984-07-27 | 1984-07-27 | 積層混成集積形dc/dcコンバ−タ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6132785U true JPS6132785U (ja) | 1986-02-27 |
JPH0210795Y2 JPH0210795Y2 (ja) | 1990-03-16 |
Family
ID=14612615
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1984113453U Granted JPS6132785U (ja) | 1984-07-27 | 1984-07-27 | 積層混成集積形dc/dcコンバ−タ |
Country Status (2)
Country | Link |
---|---|
US (1) | US4730241A (ja) |
JP (1) | JPS6132785U (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6366094U (ja) * | 1986-10-16 | 1988-05-02 | ||
JPS6464240A (en) * | 1987-09-03 | 1989-03-10 | Tdk Corp | Ic package |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2615319B1 (fr) * | 1987-05-15 | 1989-07-07 | Bull Sa | Transformateur a fort couplage adapte a un circuit d'alimentation a decoupage et circuit d'alimentation a decoupage comportant un tel transformateur |
JP2790640B2 (ja) * | 1989-01-14 | 1998-08-27 | ティーディーケイ株式会社 | 混成集積回路部品の構造 |
US4914561A (en) * | 1989-02-03 | 1990-04-03 | Eldec Corporation | Dual transformer device for power converters |
US4980810A (en) * | 1989-05-25 | 1990-12-25 | Hughes Aircraft Company | VHF DC-DC power supply operating at frequencies greater than 50 MHz |
JPH0834709B2 (ja) * | 1990-01-31 | 1996-03-29 | 株式会社日立製作所 | 半導体集積回路及びそれを使つた電動機制御装置 |
EP0481682B1 (en) * | 1990-10-18 | 1996-07-24 | Valor Electronics Inc. | Non-coupled integrated magnetic structure |
US5120572A (en) * | 1990-10-30 | 1992-06-09 | Microelectronics And Computer Technology Corporation | Method of fabricating electrical components in high density substrates |
US5254493A (en) * | 1990-10-30 | 1993-10-19 | Microelectronics And Computer Technology Corporation | Method of fabricating integrated resistors in high density substrates |
US5598327A (en) * | 1990-11-30 | 1997-01-28 | Burr-Brown Corporation | Planar transformer assembly including non-overlapping primary and secondary windings surrounding a common magnetic flux path area |
GB2252208B (en) * | 1991-01-24 | 1995-05-03 | Burr Brown Corp | Hybrid integrated circuit planar transformer |
US5355301A (en) * | 1992-02-28 | 1994-10-11 | Fuji Electric Co., Ltd. | One-chip type switching power supply device |
US5635669A (en) * | 1992-07-27 | 1997-06-03 | Murata Manufacturing Co., Ltd. | Multilayer electronic component |
DE69315907T2 (de) * | 1992-07-27 | 1998-04-16 | Murata Manufacturing Co | Elektronisches Vielschichtbauteil, Verfahren zur dessen Herstellung und Verfahren zur Messung seiner Charakteristiken |
US5521807A (en) * | 1992-12-31 | 1996-05-28 | Interpoint Corporation | DC-To-DC converter with secondary flyback core reset |
US5563780A (en) * | 1993-12-08 | 1996-10-08 | International Power Systems, Inc. | Power conversion array applying small sequentially switched converters in parallel |
US5990776A (en) | 1994-12-08 | 1999-11-23 | Jitaru; Ionel | Low noise full integrated multilayers magnetic for power converters |
DE19517703A1 (de) * | 1995-05-13 | 1996-11-14 | Friwo Geraetebau Gmbh | Hydridschaltkreis mit integrierten elektronischen Bauelementen und einem Keramiksubstrat |
JPH0983104A (ja) * | 1995-09-12 | 1997-03-28 | Murata Mfg Co Ltd | コイル内蔵回路基板 |
US5847951A (en) * | 1996-12-16 | 1998-12-08 | Dell Usa, L.P. | Method and apparatus for voltage regulation within an integrated circuit package |
JP3642012B2 (ja) * | 2000-07-21 | 2005-04-27 | 株式会社日立製作所 | 半導体装置,電力変換装置及び自動車 |
EP1942574B1 (en) * | 2005-10-28 | 2017-09-27 | Hitachi Metals, Ltd. | Dc-dc converter |
TWI320594B (en) * | 2006-05-04 | 2010-02-11 | Cyntec Co Ltd | Package structure |
JP5424825B2 (ja) * | 2009-11-12 | 2014-02-26 | オリンパス株式会社 | 積層実装構造体 |
US8344842B1 (en) | 2010-01-20 | 2013-01-01 | Vlt, Inc. | Vertical PCB surface mount inductors and power converters |
US8824161B2 (en) * | 2012-06-15 | 2014-09-02 | Medtronic, Inc. | Integrated circuit packaging for implantable medical devices |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5947286U (ja) * | 1982-09-21 | 1984-03-29 | 富士電気化学株式会社 | Dc/dcコンバ−タ |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3714530A (en) * | 1971-08-06 | 1973-01-30 | Amp Inc | Voltage multiplying wafer capacitor |
US4342143A (en) * | 1974-02-04 | 1982-08-03 | Jennings Thomas A | Method of making multiple electrical components in integrated microminiature form |
US4080585A (en) * | 1977-04-11 | 1978-03-21 | Cubic Corporation | Flat coil transformer for electronic circuit boards |
GB2045540B (en) * | 1978-12-28 | 1983-08-03 | Tdk Electronics Co Ltd | Electrical inductive device |
JPS5947286B2 (ja) * | 1979-07-23 | 1984-11-17 | 株式会社 保谷レンズ | 斜位眼鏡調製用計算尺 |
US4355277A (en) * | 1980-10-01 | 1982-10-19 | Motorola, Inc. | Dual mode DC/DC converter |
JPS5945985A (ja) * | 1982-09-08 | 1984-03-15 | 矢沢フエロマイト株式会社 | 遮音材 |
DE3341785A1 (de) * | 1983-11-18 | 1985-06-13 | Siemens Ag | Miniatur-schaltnetzteil |
US4622627A (en) * | 1984-02-16 | 1986-11-11 | Theta-J Corporation | Switching electrical power supply utilizing miniature inductors integrally in a PCB |
-
1984
- 1984-07-27 JP JP1984113453U patent/JPS6132785U/ja active Granted
-
1987
- 1987-04-17 US US07/040,688 patent/US4730241A/en not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5947286U (ja) * | 1982-09-21 | 1984-03-29 | 富士電気化学株式会社 | Dc/dcコンバ−タ |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6366094U (ja) * | 1986-10-16 | 1988-05-02 | ||
JPS6464240A (en) * | 1987-09-03 | 1989-03-10 | Tdk Corp | Ic package |
Also Published As
Publication number | Publication date |
---|---|
JPH0210795Y2 (ja) | 1990-03-16 |
US4730241A (en) | 1988-03-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS6132785U (ja) | 積層混成集積形dc/dcコンバ−タ | |
US6353379B1 (en) | Magnetic device employing a winding structure spanning multiple boards and method of manufacture thereof | |
JP3196187B2 (ja) | 電磁気回路の実装構造 | |
JP3057203B2 (ja) | プリントコイル形トランス | |
JP2002299130A (ja) | 電源用複合素子 | |
JPS60244097A (ja) | 混成電子回路 | |
JPH10163039A (ja) | 薄型トランス | |
JPS63102397A (ja) | 多層プリント配線板 | |
US20020163818A1 (en) | Magnetic device and method of manufacture therefor | |
JPH0115160Y2 (ja) | ||
JPH0541532Y2 (ja) | ||
JPS5849430U (ja) | チツプ状複合電子部品 | |
JPH02114697A (ja) | 混成集積回路装置 | |
JPH0632382B2 (ja) | 回路基板 | |
JPS61107611A (ja) | 高静電容量積層母線 | |
JPH0110918Y2 (ja) | ||
JPS5953631U (ja) | 多層構造を有する熱収縮性チユ−ブ | |
JPS6129542U (ja) | 積層混成集積形送・受信装置 | |
JPH0638416Y2 (ja) | 混成集積回路部品 | |
JPH05109556A (ja) | 高周波用薄膜トランスおよび高周波用薄膜インダクタ | |
JPH10199736A (ja) | 複合トランス | |
JPS59107109U (ja) | 積層複合部品 | |
JPS5812973U (ja) | 多層プリント基板 | |
JPS6261530U (ja) | ||
JPS6025135U (ja) | 積層セラミックコンデンサ |