JP2011243457A5 - - Google Patents

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Publication number
JP2011243457A5
JP2011243457A5 JP2010115532A JP2010115532A JP2011243457A5 JP 2011243457 A5 JP2011243457 A5 JP 2011243457A5 JP 2010115532 A JP2010115532 A JP 2010115532A JP 2010115532 A JP2010115532 A JP 2010115532A JP 2011243457 A5 JP2011243457 A5 JP 2011243457A5
Authority
JP
Japan
Prior art keywords
relay
relay board
substrate
conductor layer
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2010115532A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011243457A (ja
JP5564328B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2010115532A priority Critical patent/JP5564328B2/ja
Priority claimed from JP2010115532A external-priority patent/JP5564328B2/ja
Priority to US13/104,078 priority patent/US8083529B2/en
Publication of JP2011243457A publication Critical patent/JP2011243457A/ja
Publication of JP2011243457A5 publication Critical patent/JP2011243457A5/ja
Application granted granted Critical
Publication of JP5564328B2 publication Critical patent/JP5564328B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2010115532A 2010-05-19 2010-05-19 ソケット Expired - Fee Related JP5564328B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2010115532A JP5564328B2 (ja) 2010-05-19 2010-05-19 ソケット
US13/104,078 US8083529B2 (en) 2010-05-19 2011-05-10 Socket

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010115532A JP5564328B2 (ja) 2010-05-19 2010-05-19 ソケット

Publications (3)

Publication Number Publication Date
JP2011243457A JP2011243457A (ja) 2011-12-01
JP2011243457A5 true JP2011243457A5 (enExample) 2013-03-28
JP5564328B2 JP5564328B2 (ja) 2014-07-30

Family

ID=44972852

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010115532A Expired - Fee Related JP5564328B2 (ja) 2010-05-19 2010-05-19 ソケット

Country Status (2)

Country Link
US (1) US8083529B2 (enExample)
JP (1) JP5564328B2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011258364A (ja) * 2010-06-08 2011-12-22 Shinko Electric Ind Co Ltd ソケット
JP5582995B2 (ja) * 2010-12-14 2014-09-03 新光電気工業株式会社 ソケット
JP6046392B2 (ja) * 2012-06-22 2016-12-14 新光電気工業株式会社 接続端子構造、インターポーザ、及びソケット
US12413001B2 (en) * 2021-06-18 2025-09-09 Intel Corporation Heterogenous socket contact for electrical and mechanical performance scaling in a microelectronic package

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1912734B2 (de) * 1969-03-13 1971-04-01 Farbenfabriken Bayer AG, 5090 Le verkusen Vorrichtung zum vermischen von schnell miteinander reagie renden komponenten insbesondere fuer die herstellung von schaumstoffen
WO1996016440A1 (en) * 1994-11-15 1996-05-30 Formfactor, Inc. Interconnection elements for microelectronic components
JP2002084624A (ja) * 2000-09-05 2002-03-22 Sumitomo Wiring Syst Ltd 高電圧用電気接続箱
JP2003069187A (ja) * 2001-08-24 2003-03-07 Sony Corp 電子部品実装基板用の基板接続支持具及び基板接続方法
JP4206855B2 (ja) * 2002-09-03 2009-01-14 株式会社アドヴィックス 電子制御ユニットの筐体
TWM297068U (en) 2005-12-29 2006-09-01 Hon Hai Prec Ind Co Ltd Electrical contact
CN100440628C (zh) 2005-10-17 2008-12-03 富士康(昆山)电脑接插件有限公司 电连接器
JP4065898B2 (ja) * 2006-01-30 2008-03-26 アルプス電気株式会社 接続ボード
TWI349397B (en) * 2007-10-24 2011-09-21 Fujitsu Ltd Printed circuit board unit and socket
JP5643476B2 (ja) * 2008-04-16 2014-12-17 日本電子材料株式会社 二重弾性機構プローブカード

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