JP5564328B2 - ソケット - Google Patents

ソケット Download PDF

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Publication number
JP5564328B2
JP5564328B2 JP2010115532A JP2010115532A JP5564328B2 JP 5564328 B2 JP5564328 B2 JP 5564328B2 JP 2010115532 A JP2010115532 A JP 2010115532A JP 2010115532 A JP2010115532 A JP 2010115532A JP 5564328 B2 JP5564328 B2 JP 5564328B2
Authority
JP
Japan
Prior art keywords
substrate
relay
relay board
board
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2010115532A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011243457A (ja
JP2011243457A5 (enExample
Inventor
義博 井原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2010115532A priority Critical patent/JP5564328B2/ja
Priority to US13/104,078 priority patent/US8083529B2/en
Publication of JP2011243457A publication Critical patent/JP2011243457A/ja
Publication of JP2011243457A5 publication Critical patent/JP2011243457A5/ja
Application granted granted Critical
Publication of JP5564328B2 publication Critical patent/JP5564328B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2435—Contacts for co-operating by abutting resilient; resiliently-mounted with opposite contact points, e.g. C beam
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/28—Clamped connections, spring connections
    • H01R4/50—Clamped connections, spring connections utilising a cam, wedge, cone or ball also combined with a screw
    • H01R4/5066—Clamped connections, spring connections utilising a cam, wedge, cone or ball also combined with a screw mounted in an insulating housing having a cover providing clamping force
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • H05K7/1069—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting with spring contact pieces

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Connecting Device With Holders (AREA)
JP2010115532A 2010-05-19 2010-05-19 ソケット Expired - Fee Related JP5564328B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2010115532A JP5564328B2 (ja) 2010-05-19 2010-05-19 ソケット
US13/104,078 US8083529B2 (en) 2010-05-19 2011-05-10 Socket

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010115532A JP5564328B2 (ja) 2010-05-19 2010-05-19 ソケット

Publications (3)

Publication Number Publication Date
JP2011243457A JP2011243457A (ja) 2011-12-01
JP2011243457A5 JP2011243457A5 (enExample) 2013-03-28
JP5564328B2 true JP5564328B2 (ja) 2014-07-30

Family

ID=44972852

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010115532A Expired - Fee Related JP5564328B2 (ja) 2010-05-19 2010-05-19 ソケット

Country Status (2)

Country Link
US (1) US8083529B2 (enExample)
JP (1) JP5564328B2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011258364A (ja) * 2010-06-08 2011-12-22 Shinko Electric Ind Co Ltd ソケット
JP5582995B2 (ja) * 2010-12-14 2014-09-03 新光電気工業株式会社 ソケット
JP6046392B2 (ja) * 2012-06-22 2016-12-14 新光電気工業株式会社 接続端子構造、インターポーザ、及びソケット
US12413001B2 (en) * 2021-06-18 2025-09-09 Intel Corporation Heterogenous socket contact for electrical and mechanical performance scaling in a microelectronic package

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1912734B2 (de) * 1969-03-13 1971-04-01 Farbenfabriken Bayer AG, 5090 Le verkusen Vorrichtung zum vermischen von schnell miteinander reagie renden komponenten insbesondere fuer die herstellung von schaumstoffen
DE69535629T2 (de) * 1994-11-15 2008-07-31 Formfactor, Inc., Livermore Montage von elektronischen komponenten auf einer leiterplatte
JP2002084624A (ja) * 2000-09-05 2002-03-22 Sumitomo Wiring Syst Ltd 高電圧用電気接続箱
JP2003069187A (ja) * 2001-08-24 2003-03-07 Sony Corp 電子部品実装基板用の基板接続支持具及び基板接続方法
JP4206855B2 (ja) * 2002-09-03 2009-01-14 株式会社アドヴィックス 電子制御ユニットの筐体
TWM297068U (en) 2005-12-29 2006-09-01 Hon Hai Prec Ind Co Ltd Electrical contact
CN100440628C (zh) 2005-10-17 2008-12-03 富士康(昆山)电脑接插件有限公司 电连接器
JP4065898B2 (ja) * 2006-01-30 2008-03-26 アルプス電気株式会社 接続ボード
CN101836513B (zh) * 2007-10-24 2013-01-23 富士通株式会社 印刷电路板单元和插座
JP5643476B2 (ja) * 2008-04-16 2014-12-17 日本電子材料株式会社 二重弾性機構プローブカード

Also Published As

Publication number Publication date
JP2011243457A (ja) 2011-12-01
US8083529B2 (en) 2011-12-27
US20110287671A1 (en) 2011-11-24

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