JP2009027172A5 - - Google Patents

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Publication number
JP2009027172A5
JP2009027172A5 JP2008189059A JP2008189059A JP2009027172A5 JP 2009027172 A5 JP2009027172 A5 JP 2009027172A5 JP 2008189059 A JP2008189059 A JP 2008189059A JP 2008189059 A JP2008189059 A JP 2008189059A JP 2009027172 A5 JP2009027172 A5 JP 2009027172A5
Authority
JP
Japan
Prior art keywords
conductor
external connection
multilayer body
terminal
connection conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008189059A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009027172A (ja
JP4911133B2 (ja
Filing date
Publication date
Priority claimed from US11/313,614 external-priority patent/US7088569B1/en
Priority claimed from US11/474,306 external-priority patent/US7428135B2/en
Application filed filed Critical
Publication of JP2009027172A publication Critical patent/JP2009027172A/ja
Publication of JP2009027172A5 publication Critical patent/JP2009027172A5/ja
Application granted granted Critical
Publication of JP4911133B2 publication Critical patent/JP4911133B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2008189059A 2005-12-22 2008-07-22 積層コンデンサ及びその実装構造 Active JP4911133B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US11/313614 2005-12-22
US11/313,614 US7088569B1 (en) 2005-12-22 2005-12-22 Multilayer capacitor
US11/474306 2006-06-26
US11/474,306 US7428135B2 (en) 2006-06-26 2006-06-26 Multilayer capacitor

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2006344989A Division JP4213744B2 (ja) 2005-12-22 2006-12-21 積層コンデンサ及びその実装構造

Publications (3)

Publication Number Publication Date
JP2009027172A JP2009027172A (ja) 2009-02-05
JP2009027172A5 true JP2009027172A5 (enExample) 2009-08-27
JP4911133B2 JP4911133B2 (ja) 2012-04-04

Family

ID=38299890

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2006344989A Active JP4213744B2 (ja) 2005-12-22 2006-12-21 積層コンデンサ及びその実装構造
JP2008189059A Active JP4911133B2 (ja) 2005-12-22 2008-07-22 積層コンデンサ及びその実装構造

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2006344989A Active JP4213744B2 (ja) 2005-12-22 2006-12-21 積層コンデンサ及びその実装構造

Country Status (3)

Country Link
JP (2) JP4213744B2 (enExample)
KR (1) KR100872006B1 (enExample)
TW (1) TWI336481B (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100887124B1 (ko) * 2007-08-06 2009-03-04 삼성전기주식회사 적층형 칩 커패시터
JP4502006B2 (ja) * 2007-12-28 2010-07-14 Ｔｄｋ株式会社 貫通型積層コンデンサアレイ
JP4502007B2 (ja) * 2007-12-28 2010-07-14 Ｔｄｋ株式会社 貫通型積層コンデンサアレイ
JP4548492B2 (ja) * 2008-02-13 2010-09-22 Ｔｄｋ株式会社 積層コンデンサアレイ
KR100925628B1 (ko) * 2008-03-07 2009-11-06 삼성전기주식회사 적층형 칩 커패시터
JP4957709B2 (ja) 2008-11-26 2012-06-20 株式会社村田製作所 積層コンデンサ
JP5343997B2 (ja) * 2011-04-22 2013-11-13 Ｔｄｋ株式会社 積層コンデンサの実装構造
KR101376925B1 (ko) 2012-12-10 2014-03-20 삼성전기주식회사 적층 세라믹 커패시터 및 그 제조 방법
KR20140038912A (ko) 2013-10-01 2014-03-31 삼성전기주식회사 적층 세라믹 커패시터 및 그 실장 기판
US20180190431A1 (en) * 2015-08-26 2018-07-05 Tdk Corporation Electronic device

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5849430U (ja) * 1981-09-28 1983-04-04 京セラ株式会社 チツプ状複合電子部品
KR100384112B1 (ko) * 2000-08-30 2003-05-14 주식회사 이노칩테크놀로지 병렬형 저항-커패시터 복합 칩 및 그 제조 방법
US7054136B2 (en) 2002-06-06 2006-05-30 Avx Corporation Controlled ESR low inductance multilayer ceramic capacitor
JP4097268B2 (ja) * 2004-02-26 2008-06-11 Ｔｄｋ株式会社 積層コンデンサ
JP4086812B2 (ja) 2004-05-31 2008-05-14 Ｔｄｋ株式会社 積層コンデンサ
JP3832505B2 (ja) * 2004-12-24 2006-10-11 株式会社村田製作所 積層コンデンサおよびその実装構造
JP2007043093A (ja) * 2005-07-05 2007-02-15 Taiyo Yuden Co Ltd 積層コンデンサ

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