KR100872006B1 - 적층 커패시터 - Google Patents

적층 커패시터 Download PDF

Info

Publication number
KR100872006B1
KR100872006B1 KR1020060133173A KR20060133173A KR100872006B1 KR 100872006 B1 KR100872006 B1 KR 100872006B1 KR 1020060133173 A KR1020060133173 A KR 1020060133173A KR 20060133173 A KR20060133173 A KR 20060133173A KR 100872006 B1 KR100872006 B1 KR 100872006B1
Authority
KR
South Korea
Prior art keywords
conductor
conductors
terminal
laminate
multilayer capacitor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020060133173A
Other languages
English (en)
Korean (ko)
Other versions
KR20070066996A (ko
Inventor
마사아키 토가시
크리스 티. 버켓
다카시 아오키
다케루 요시다
Original Assignee
티디케이가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/313,614 external-priority patent/US7088569B1/en
Priority claimed from US11/474,306 external-priority patent/US7428135B2/en
Application filed by 티디케이가부시기가이샤 filed Critical 티디케이가부시기가이샤
Publication of KR20070066996A publication Critical patent/KR20070066996A/ko
Application granted granted Critical
Publication of KR100872006B1 publication Critical patent/KR100872006B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/30Stacked capacitors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/228Terminals
    • H01G4/232Terminals electrically connecting two or more layers of a stacked or rolled capacitor

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
KR1020060133173A 2005-12-22 2006-12-22 적층 커패시터 Active KR100872006B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US11/313,614 US7088569B1 (en) 2005-12-22 2005-12-22 Multilayer capacitor
US11/313614 2005-12-22
US11/474306 2006-06-26
US11/474,306 US7428135B2 (en) 2006-06-26 2006-06-26 Multilayer capacitor

Publications (2)

Publication Number Publication Date
KR20070066996A KR20070066996A (ko) 2007-06-27
KR100872006B1 true KR100872006B1 (ko) 2008-12-05

Family

ID=38299890

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020060133173A Active KR100872006B1 (ko) 2005-12-22 2006-12-22 적층 커패시터

Country Status (3)

Country Link
JP (2) JP4213744B2 (enExample)
KR (1) KR100872006B1 (enExample)
TW (1) TWI336481B (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100887124B1 (ko) * 2007-08-06 2009-03-04 삼성전기주식회사 적층형 칩 커패시터
JP4502007B2 (ja) * 2007-12-28 2010-07-14 Tdk株式会社 貫通型積層コンデンサアレイ
JP4502006B2 (ja) * 2007-12-28 2010-07-14 Tdk株式会社 貫通型積層コンデンサアレイ
JP4548492B2 (ja) * 2008-02-13 2010-09-22 Tdk株式会社 積層コンデンサアレイ
KR100925628B1 (ko) * 2008-03-07 2009-11-06 삼성전기주식회사 적층형 칩 커패시터
JP4957709B2 (ja) 2008-11-26 2012-06-20 株式会社村田製作所 積層コンデンサ
JP5343997B2 (ja) * 2011-04-22 2013-11-13 Tdk株式会社 積層コンデンサの実装構造
KR101376925B1 (ko) 2012-12-10 2014-03-20 삼성전기주식회사 적층 세라믹 커패시터 및 그 제조 방법
KR20140038912A (ko) 2013-10-01 2014-03-31 삼성전기주식회사 적층 세라믹 커패시터 및 그 실장 기판
WO2017033949A1 (ja) * 2015-08-26 2017-03-02 Tdk株式会社 電子デバイス

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5849430U (ja) * 1981-09-28 1983-04-04 京セラ株式会社 チツプ状複合電子部品
KR20000072338A (ko) * 2000-08-30 2000-12-05 엄우식 병렬형 저항-커패시터 복합 칩 및 그 제조 방법
JP2004047983A (ja) 2002-06-06 2004-02-12 Avx Corp 多層セラミックコンデンサ
JP2005347314A (ja) 2004-05-31 2005-12-15 Tdk Corp 積層コンデンサ

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4097268B2 (ja) * 2004-02-26 2008-06-11 Tdk株式会社 積層コンデンサ
JP3832505B2 (ja) * 2004-12-24 2006-10-11 株式会社村田製作所 積層コンデンサおよびその実装構造
JP2007043093A (ja) * 2005-07-05 2007-02-15 Taiyo Yuden Co Ltd 積層コンデンサ

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5849430U (ja) * 1981-09-28 1983-04-04 京セラ株式会社 チツプ状複合電子部品
KR20000072338A (ko) * 2000-08-30 2000-12-05 엄우식 병렬형 저항-커패시터 복합 칩 및 그 제조 방법
JP2004047983A (ja) 2002-06-06 2004-02-12 Avx Corp 多層セラミックコンデンサ
JP2005347314A (ja) 2004-05-31 2005-12-15 Tdk Corp 積層コンデンサ

Also Published As

Publication number Publication date
JP2009027172A (ja) 2009-02-05
KR20070066996A (ko) 2007-06-27
JP2007173838A (ja) 2007-07-05
TWI336481B (en) 2011-01-21
JP4911133B2 (ja) 2012-04-04
TW200739625A (en) 2007-10-16
JP4213744B2 (ja) 2009-01-21

Similar Documents

Publication Publication Date Title
JP4911133B2 (ja) 積層コンデンサ及びその実装構造
CN1988081B (zh) 多层电容器
JP4400622B2 (ja) 積層コンデンサ
US6542352B1 (en) Ceramic chip capacitor of conventional volume and external form having increased capacitance from use of closely spaced interior conductive planes reliably connecting to positionally tolerant exterior pads through multiple redundant vias
KR100925603B1 (ko) 적층형 캐패시터
US20130319742A1 (en) Laminated chip electronic component, board for mounting the same, and packing unit thereof
US10036765B2 (en) Reducing hysteresis effects in an accelerometer
JP2005050962A (ja) コンデンサ実装構造,コンデンサ実装基板及びコンデンサ実装用配線基板
US8497567B2 (en) Thin-film capacitor, multilayer wiring board and semiconductor device
JP2006286930A (ja) 積層コンデンサ
US20170142838A1 (en) Laminated thin film capacitor
CN1661741B (zh) 层叠电容器
JP4475274B2 (ja) 積層コンデンサ
US6751087B2 (en) Layered polymer on aluminum stacked capacitor
JP2007242801A (ja) 積層コンデンサ及びその実装構造
JP2008512724A (ja) 適応型ミラーシステム
JP2009164244A (ja) 積層コンデンサ
JP2004342846A (ja) 積層セラミックコンデンサ
US8884717B2 (en) Diplexer
CN110752772A (zh) 基于压电叠堆的多自由度压电作动器及工作方法
CN113777775B (zh) 一种高可靠性压电指向调节机构及其实现方法
JP2007115759A (ja) 積層コンデンサ、複合コンデンサおよびコンデンサモジュール、ならびにコンデンサの配置方法
JPS59111868A (ja) 静電記録ヘツド
US20250125276A1 (en) Package substrate, semiconductor device, and method for forming package substrate
JP7652305B2 (ja) 電子部品の製造方法、および、電子部品の製造装置

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 20061222

PA0201 Request for examination
PG1501 Laying open of application
E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 20081030

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20081128

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20081201

End annual number: 3

Start annual number: 1

PG1601 Publication of registration
PR1001 Payment of annual fee

Payment date: 20111028

Start annual number: 4

End annual number: 4

FPAY Annual fee payment

Payment date: 20121114

Year of fee payment: 5

PR1001 Payment of annual fee

Payment date: 20121114

Start annual number: 5

End annual number: 5

FPAY Annual fee payment

Payment date: 20131031

Year of fee payment: 6

PR1001 Payment of annual fee

Payment date: 20131031

Start annual number: 6

End annual number: 6

FPAY Annual fee payment

Payment date: 20141103

Year of fee payment: 7

PR1001 Payment of annual fee

Payment date: 20141103

Start annual number: 7

End annual number: 7

FPAY Annual fee payment

Payment date: 20151102

Year of fee payment: 8

PR1001 Payment of annual fee

Payment date: 20151102

Start annual number: 8

End annual number: 8

FPAY Annual fee payment

Payment date: 20161028

Year of fee payment: 9

PR1001 Payment of annual fee

Payment date: 20161028

Start annual number: 9

End annual number: 9

FPAY Annual fee payment

Payment date: 20171030

Year of fee payment: 10

PR1001 Payment of annual fee

Payment date: 20171030

Start annual number: 10

End annual number: 10

FPAY Annual fee payment

Payment date: 20181119

Year of fee payment: 11

PR1001 Payment of annual fee

Payment date: 20181119

Start annual number: 11

End annual number: 11

FPAY Annual fee payment

Payment date: 20191118

Year of fee payment: 12

PR1001 Payment of annual fee

Payment date: 20191118

Start annual number: 12

End annual number: 12

PR1001 Payment of annual fee

Payment date: 20201119

Start annual number: 13

End annual number: 13

PR1001 Payment of annual fee

Payment date: 20211118

Start annual number: 14

End annual number: 14

PR1001 Payment of annual fee

Payment date: 20221102

Start annual number: 15

End annual number: 15

PR1001 Payment of annual fee

Payment date: 20231101

Start annual number: 16

End annual number: 16

PR1001 Payment of annual fee

Payment date: 20241017

Start annual number: 17

End annual number: 17