KR100872006B1 - 적층 커패시터 - Google Patents
적층 커패시터 Download PDFInfo
- Publication number
- KR100872006B1 KR100872006B1 KR1020060133173A KR20060133173A KR100872006B1 KR 100872006 B1 KR100872006 B1 KR 100872006B1 KR 1020060133173 A KR1020060133173 A KR 1020060133173A KR 20060133173 A KR20060133173 A KR 20060133173A KR 100872006 B1 KR100872006 B1 KR 100872006B1
- Authority
- KR
- South Korea
- Prior art keywords
- conductor
- conductors
- terminal
- laminate
- multilayer capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/313,614 US7088569B1 (en) | 2005-12-22 | 2005-12-22 | Multilayer capacitor |
| US11/313614 | 2005-12-22 | ||
| US11/474306 | 2006-06-26 | ||
| US11/474,306 US7428135B2 (en) | 2006-06-26 | 2006-06-26 | Multilayer capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20070066996A KR20070066996A (ko) | 2007-06-27 |
| KR100872006B1 true KR100872006B1 (ko) | 2008-12-05 |
Family
ID=38299890
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020060133173A Active KR100872006B1 (ko) | 2005-12-22 | 2006-12-22 | 적층 커패시터 |
Country Status (3)
| Country | Link |
|---|---|
| JP (2) | JP4213744B2 (enExample) |
| KR (1) | KR100872006B1 (enExample) |
| TW (1) | TWI336481B (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100887124B1 (ko) * | 2007-08-06 | 2009-03-04 | 삼성전기주식회사 | 적층형 칩 커패시터 |
| JP4502007B2 (ja) * | 2007-12-28 | 2010-07-14 | Tdk株式会社 | 貫通型積層コンデンサアレイ |
| JP4502006B2 (ja) * | 2007-12-28 | 2010-07-14 | Tdk株式会社 | 貫通型積層コンデンサアレイ |
| JP4548492B2 (ja) * | 2008-02-13 | 2010-09-22 | Tdk株式会社 | 積層コンデンサアレイ |
| KR100925628B1 (ko) * | 2008-03-07 | 2009-11-06 | 삼성전기주식회사 | 적층형 칩 커패시터 |
| JP4957709B2 (ja) | 2008-11-26 | 2012-06-20 | 株式会社村田製作所 | 積層コンデンサ |
| JP5343997B2 (ja) * | 2011-04-22 | 2013-11-13 | Tdk株式会社 | 積層コンデンサの実装構造 |
| KR101376925B1 (ko) | 2012-12-10 | 2014-03-20 | 삼성전기주식회사 | 적층 세라믹 커패시터 및 그 제조 방법 |
| KR20140038912A (ko) | 2013-10-01 | 2014-03-31 | 삼성전기주식회사 | 적층 세라믹 커패시터 및 그 실장 기판 |
| WO2017033949A1 (ja) * | 2015-08-26 | 2017-03-02 | Tdk株式会社 | 電子デバイス |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5849430U (ja) * | 1981-09-28 | 1983-04-04 | 京セラ株式会社 | チツプ状複合電子部品 |
| KR20000072338A (ko) * | 2000-08-30 | 2000-12-05 | 엄우식 | 병렬형 저항-커패시터 복합 칩 및 그 제조 방법 |
| JP2004047983A (ja) | 2002-06-06 | 2004-02-12 | Avx Corp | 多層セラミックコンデンサ |
| JP2005347314A (ja) | 2004-05-31 | 2005-12-15 | Tdk Corp | 積層コンデンサ |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4097268B2 (ja) * | 2004-02-26 | 2008-06-11 | Tdk株式会社 | 積層コンデンサ |
| JP3832505B2 (ja) * | 2004-12-24 | 2006-10-11 | 株式会社村田製作所 | 積層コンデンサおよびその実装構造 |
| JP2007043093A (ja) * | 2005-07-05 | 2007-02-15 | Taiyo Yuden Co Ltd | 積層コンデンサ |
-
2006
- 2006-12-21 JP JP2006344989A patent/JP4213744B2/ja active Active
- 2006-12-22 KR KR1020060133173A patent/KR100872006B1/ko active Active
- 2006-12-22 TW TW095148488A patent/TWI336481B/zh active
-
2008
- 2008-07-22 JP JP2008189059A patent/JP4911133B2/ja active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5849430U (ja) * | 1981-09-28 | 1983-04-04 | 京セラ株式会社 | チツプ状複合電子部品 |
| KR20000072338A (ko) * | 2000-08-30 | 2000-12-05 | 엄우식 | 병렬형 저항-커패시터 복합 칩 및 그 제조 방법 |
| JP2004047983A (ja) | 2002-06-06 | 2004-02-12 | Avx Corp | 多層セラミックコンデンサ |
| JP2005347314A (ja) | 2004-05-31 | 2005-12-15 | Tdk Corp | 積層コンデンサ |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2009027172A (ja) | 2009-02-05 |
| KR20070066996A (ko) | 2007-06-27 |
| JP2007173838A (ja) | 2007-07-05 |
| TWI336481B (en) | 2011-01-21 |
| JP4911133B2 (ja) | 2012-04-04 |
| TW200739625A (en) | 2007-10-16 |
| JP4213744B2 (ja) | 2009-01-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4911133B2 (ja) | 積層コンデンサ及びその実装構造 | |
| CN1988081B (zh) | 多层电容器 | |
| JP4400622B2 (ja) | 積層コンデンサ | |
| US6542352B1 (en) | Ceramic chip capacitor of conventional volume and external form having increased capacitance from use of closely spaced interior conductive planes reliably connecting to positionally tolerant exterior pads through multiple redundant vias | |
| KR100925603B1 (ko) | 적층형 캐패시터 | |
| US20130319742A1 (en) | Laminated chip electronic component, board for mounting the same, and packing unit thereof | |
| US10036765B2 (en) | Reducing hysteresis effects in an accelerometer | |
| JP2005050962A (ja) | コンデンサ実装構造,コンデンサ実装基板及びコンデンサ実装用配線基板 | |
| US8497567B2 (en) | Thin-film capacitor, multilayer wiring board and semiconductor device | |
| JP2006286930A (ja) | 積層コンデンサ | |
| US20170142838A1 (en) | Laminated thin film capacitor | |
| CN1661741B (zh) | 层叠电容器 | |
| JP4475274B2 (ja) | 積層コンデンサ | |
| US6751087B2 (en) | Layered polymer on aluminum stacked capacitor | |
| JP2007242801A (ja) | 積層コンデンサ及びその実装構造 | |
| JP2008512724A (ja) | 適応型ミラーシステム | |
| JP2009164244A (ja) | 積層コンデンサ | |
| JP2004342846A (ja) | 積層セラミックコンデンサ | |
| US8884717B2 (en) | Diplexer | |
| CN110752772A (zh) | 基于压电叠堆的多自由度压电作动器及工作方法 | |
| CN113777775B (zh) | 一种高可靠性压电指向调节机构及其实现方法 | |
| JP2007115759A (ja) | 積層コンデンサ、複合コンデンサおよびコンデンサモジュール、ならびにコンデンサの配置方法 | |
| JPS59111868A (ja) | 静電記録ヘツド | |
| US20250125276A1 (en) | Package substrate, semiconductor device, and method for forming package substrate | |
| JP7652305B2 (ja) | 電子部品の製造方法、および、電子部品の製造装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 20061222 |
|
| PA0201 | Request for examination | ||
| PG1501 | Laying open of application | ||
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20081030 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20081128 Patent event code: PR07011E01D |
|
| PR1002 | Payment of registration fee |
Payment date: 20081201 End annual number: 3 Start annual number: 1 |
|
| PG1601 | Publication of registration | ||
| PR1001 | Payment of annual fee |
Payment date: 20111028 Start annual number: 4 End annual number: 4 |
|
| FPAY | Annual fee payment |
Payment date: 20121114 Year of fee payment: 5 |
|
| PR1001 | Payment of annual fee |
Payment date: 20121114 Start annual number: 5 End annual number: 5 |
|
| FPAY | Annual fee payment |
Payment date: 20131031 Year of fee payment: 6 |
|
| PR1001 | Payment of annual fee |
Payment date: 20131031 Start annual number: 6 End annual number: 6 |
|
| FPAY | Annual fee payment |
Payment date: 20141103 Year of fee payment: 7 |
|
| PR1001 | Payment of annual fee |
Payment date: 20141103 Start annual number: 7 End annual number: 7 |
|
| FPAY | Annual fee payment |
Payment date: 20151102 Year of fee payment: 8 |
|
| PR1001 | Payment of annual fee |
Payment date: 20151102 Start annual number: 8 End annual number: 8 |
|
| FPAY | Annual fee payment |
Payment date: 20161028 Year of fee payment: 9 |
|
| PR1001 | Payment of annual fee |
Payment date: 20161028 Start annual number: 9 End annual number: 9 |
|
| FPAY | Annual fee payment |
Payment date: 20171030 Year of fee payment: 10 |
|
| PR1001 | Payment of annual fee |
Payment date: 20171030 Start annual number: 10 End annual number: 10 |
|
| FPAY | Annual fee payment |
Payment date: 20181119 Year of fee payment: 11 |
|
| PR1001 | Payment of annual fee |
Payment date: 20181119 Start annual number: 11 End annual number: 11 |
|
| FPAY | Annual fee payment |
Payment date: 20191118 Year of fee payment: 12 |
|
| PR1001 | Payment of annual fee |
Payment date: 20191118 Start annual number: 12 End annual number: 12 |
|
| PR1001 | Payment of annual fee |
Payment date: 20201119 Start annual number: 13 End annual number: 13 |
|
| PR1001 | Payment of annual fee |
Payment date: 20211118 Start annual number: 14 End annual number: 14 |
|
| PR1001 | Payment of annual fee |
Payment date: 20221102 Start annual number: 15 End annual number: 15 |
|
| PR1001 | Payment of annual fee |
Payment date: 20231101 Start annual number: 16 End annual number: 16 |
|
| PR1001 | Payment of annual fee |
Payment date: 20241017 Start annual number: 17 End annual number: 17 |