TW200739625A - Multilayer capacitor - Google Patents

Multilayer capacitor

Info

Publication number
TW200739625A
TW200739625A TW095148488A TW95148488A TW200739625A TW 200739625 A TW200739625 A TW 200739625A TW 095148488 A TW095148488 A TW 095148488A TW 95148488 A TW95148488 A TW 95148488A TW 200739625 A TW200739625 A TW 200739625A
Authority
TW
Taiwan
Prior art keywords
conductors
multilayer body
multilayer capacitor
multilayer
inner connecting
Prior art date
Application number
TW095148488A
Other languages
Chinese (zh)
Other versions
TWI336481B (en
Inventor
Masaaki Togashi
Chris T Burket
Takashi Aoki
Takeru Yoshida
Original Assignee
Tdk Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/313,614 external-priority patent/US7088569B1/en
Priority claimed from US11/474,306 external-priority patent/US7428135B2/en
Application filed by Tdk Corp filed Critical Tdk Corp
Publication of TW200739625A publication Critical patent/TW200739625A/en
Application granted granted Critical
Publication of TWI336481B publication Critical patent/TWI336481B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor

Abstract

A multilayer capacitor comprises a multilayer body in which a plurality of dielectric layers and a plurality of first and second inner electrodes are alternately laminated, and a plurality of outer conductors (first and second terminal conductors, and first and second outer connecting conductors) formed on the multilayer body. Each of the outer conductors is formed on one of two side faces of the multilayer body opposing each other. Each of the first and second inner electrodes is electrically connected to the corresponding outer connecting conductor. At least one first inner connecting conductor and at least one second inner connecting conductor are laminated in the multilayer body. Each of the inner connecting conductors is electrically connected to the corresponding terminal and outer connecting conductors. The equivalent series resistance of the multilayer capacitor is set to a desirable value by adjusting the number or position of inner connecting conductors.
TW095148488A 2005-12-22 2006-12-22 Multilayer capacitor TWI336481B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/313,614 US7088569B1 (en) 2005-12-22 2005-12-22 Multilayer capacitor
US11/474,306 US7428135B2 (en) 2006-06-26 2006-06-26 Multilayer capacitor

Publications (2)

Publication Number Publication Date
TW200739625A true TW200739625A (en) 2007-10-16
TWI336481B TWI336481B (en) 2011-01-21

Family

ID=38299890

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095148488A TWI336481B (en) 2005-12-22 2006-12-22 Multilayer capacitor

Country Status (3)

Country Link
JP (2) JP4213744B2 (en)
KR (1) KR100872006B1 (en)
TW (1) TWI336481B (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100887124B1 (en) * 2007-08-06 2009-03-04 삼성전기주식회사 Multilayer Chip Capacitor
JP4502007B2 (en) * 2007-12-28 2010-07-14 Ｔｄｋ株式会社 Feedthrough multilayer capacitor array
JP4502006B2 (en) * 2007-12-28 2010-07-14 Ｔｄｋ株式会社 Feedthrough multilayer capacitor array
JP4548492B2 (en) * 2008-02-13 2010-09-22 Ｔｄｋ株式会社 Multilayer capacitor array
KR100925628B1 (en) 2008-03-07 2009-11-06 삼성전기주식회사 Multilayer Chip Capacitor
JP4957709B2 (en) 2008-11-26 2012-06-20 株式会社村田製作所 Multilayer capacitor
JP5343997B2 (en) * 2011-04-22 2013-11-13 Ｔｄｋ株式会社 Multilayer capacitor mounting structure
KR101376925B1 (en) 2012-12-10 2014-03-20 삼성전기주식회사 Multi-layered ceramic capacitor and method of manufacturing the same
KR20140038912A (en) 2013-10-01 2014-03-31 삼성전기주식회사 Multi-layered ceramic capacitor and board for mounting the same
WO2017033949A1 (en) * 2015-08-26 2017-03-02 Tdk株式会社 Electronic device

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5849430U (en) * 1981-09-28 1983-04-04 京セラ株式会社 Chip-shaped composite electronic components
KR100384112B1 (en) * 2000-08-30 2003-05-14 주식회사 이노칩테크놀로지 Parallel complex chip of combining with resistor and capacitor and fabricating method therefor
US7054136B2 (en) 2002-06-06 2006-05-30 Avx Corporation Controlled ESR low inductance multilayer ceramic capacitor
JP4097268B2 (en) * 2004-02-26 2008-06-11 Ｔｄｋ株式会社 Multilayer capacitor
JP4086812B2 (en) 2004-05-31 2008-05-14 Ｔｄｋ株式会社 Multilayer capacitor
JP3832505B2 (en) * 2004-12-24 2006-10-11 株式会社村田製作所 Multilayer capacitor and its mounting structure
JP2007043093A (en) * 2005-07-05 2007-02-15 Taiyo Yuden Co Ltd Laminated capacitor

Also Published As

Publication number Publication date
JP4911133B2 (en) 2012-04-04
JP2009027172A (en) 2009-02-05
JP2007173838A (en) 2007-07-05
KR20070066996A (en) 2007-06-27
KR100872006B1 (en) 2008-12-05
TWI336481B (en) 2011-01-21
JP4213744B2 (en) 2009-01-21

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Legal Events

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GD4A Issue of patent certificate for granted invention patent