JP4213744B2 - 積層コンデンサ及びその実装構造 - Google Patents

積層コンデンサ及びその実装構造 Download PDF

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Publication number
JP4213744B2
JP4213744B2 JP2006344989A JP2006344989A JP4213744B2 JP 4213744 B2 JP4213744 B2 JP 4213744B2 JP 2006344989 A JP2006344989 A JP 2006344989A JP 2006344989 A JP2006344989 A JP 2006344989A JP 4213744 B2 JP4213744 B2 JP 4213744B2
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Japan
Prior art keywords
conductor
conductors
terminal
external connection
internal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2006344989A
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English (en)
Japanese (ja)
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JP2007173838A (ja
Inventor
正明 富樫
崇 青木
武尊 吉田
ティー. バーケット クリス
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
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TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Priority claimed from US11/313,614 external-priority patent/US7088569B1/en
Priority claimed from US11/474,306 external-priority patent/US7428135B2/en
Application filed by TDK Corp filed Critical TDK Corp
Publication of JP2007173838A publication Critical patent/JP2007173838A/ja
Application granted granted Critical
Publication of JP4213744B2 publication Critical patent/JP4213744B2/ja
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/30Stacked capacitors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/228Terminals
    • H01G4/232Terminals electrically connecting two or more layers of a stacked or rolled capacitor

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
JP2006344989A 2005-12-22 2006-12-21 積層コンデンサ及びその実装構造 Active JP4213744B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/313,614 US7088569B1 (en) 2005-12-22 2005-12-22 Multilayer capacitor
US11/474,306 US7428135B2 (en) 2006-06-26 2006-06-26 Multilayer capacitor

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2008189059A Division JP4911133B2 (ja) 2005-12-22 2008-07-22 積層コンデンサ及びその実装構造

Publications (2)

Publication Number Publication Date
JP2007173838A JP2007173838A (ja) 2007-07-05
JP4213744B2 true JP4213744B2 (ja) 2009-01-21

Family

ID=38299890

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2006344989A Active JP4213744B2 (ja) 2005-12-22 2006-12-21 積層コンデンサ及びその実装構造
JP2008189059A Active JP4911133B2 (ja) 2005-12-22 2008-07-22 積層コンデンサ及びその実装構造

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2008189059A Active JP4911133B2 (ja) 2005-12-22 2008-07-22 積層コンデンサ及びその実装構造

Country Status (3)

Country Link
JP (2) JP4213744B2 (enExample)
KR (1) KR100872006B1 (enExample)
TW (1) TWI336481B (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100887124B1 (ko) * 2007-08-06 2009-03-04 삼성전기주식회사 적층형 칩 커패시터
JP4502007B2 (ja) * 2007-12-28 2010-07-14 Tdk株式会社 貫通型積層コンデンサアレイ
JP4502006B2 (ja) * 2007-12-28 2010-07-14 Tdk株式会社 貫通型積層コンデンサアレイ
JP4548492B2 (ja) * 2008-02-13 2010-09-22 Tdk株式会社 積層コンデンサアレイ
KR100925628B1 (ko) * 2008-03-07 2009-11-06 삼성전기주식회사 적층형 칩 커패시터
JP4957709B2 (ja) 2008-11-26 2012-06-20 株式会社村田製作所 積層コンデンサ
JP5343997B2 (ja) * 2011-04-22 2013-11-13 Tdk株式会社 積層コンデンサの実装構造
KR101376925B1 (ko) 2012-12-10 2014-03-20 삼성전기주식회사 적층 세라믹 커패시터 및 그 제조 방법
KR20140038912A (ko) 2013-10-01 2014-03-31 삼성전기주식회사 적층 세라믹 커패시터 및 그 실장 기판
WO2017033949A1 (ja) * 2015-08-26 2017-03-02 Tdk株式会社 電子デバイス

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5849430U (ja) * 1981-09-28 1983-04-04 京セラ株式会社 チツプ状複合電子部品
KR100384112B1 (ko) * 2000-08-30 2003-05-14 주식회사 이노칩테크놀로지 병렬형 저항-커패시터 복합 칩 및 그 제조 방법
US7054136B2 (en) 2002-06-06 2006-05-30 Avx Corporation Controlled ESR low inductance multilayer ceramic capacitor
JP4097268B2 (ja) * 2004-02-26 2008-06-11 Tdk株式会社 積層コンデンサ
JP4086812B2 (ja) 2004-05-31 2008-05-14 Tdk株式会社 積層コンデンサ
JP3832505B2 (ja) * 2004-12-24 2006-10-11 株式会社村田製作所 積層コンデンサおよびその実装構造
JP2007043093A (ja) * 2005-07-05 2007-02-15 Taiyo Yuden Co Ltd 積層コンデンサ

Also Published As

Publication number Publication date
JP2009027172A (ja) 2009-02-05
KR20070066996A (ko) 2007-06-27
JP2007173838A (ja) 2007-07-05
KR100872006B1 (ko) 2008-12-05
TWI336481B (en) 2011-01-21
JP4911133B2 (ja) 2012-04-04
TW200739625A (en) 2007-10-16

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