WO2008096464A1 - プリント配線板及びそのプリント配線板の製造方法 - Google Patents

プリント配線板及びそのプリント配線板の製造方法 Download PDF

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Publication number
WO2008096464A1
WO2008096464A1 PCT/JP2007/065167 JP2007065167W WO2008096464A1 WO 2008096464 A1 WO2008096464 A1 WO 2008096464A1 JP 2007065167 W JP2007065167 W JP 2007065167W WO 2008096464 A1 WO2008096464 A1 WO 2008096464A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
electrodes
resisting
insulating layer
Prior art date
Application number
PCT/JP2007/065167
Other languages
English (en)
French (fr)
Inventor
Michimasa Takahashi
Yukinobu Mikado
Hiroyuki Yanagisawa
Original Assignee
Ibiden Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co., Ltd. filed Critical Ibiden Co., Ltd.
Priority to CN2007800216555A priority Critical patent/CN101467501B/zh
Priority to JP2008556989A priority patent/JP4702904B2/ja
Priority to TW096129632A priority patent/TWI389607B/zh
Publication of WO2008096464A1 publication Critical patent/WO2008096464A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09736—Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1453—Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

　本発明は、絶縁層と；前記絶縁層の一方側の表面側に埋め込まれ、前記絶縁層の一方側表面とともに部材搭載面を構成する複数の電極と；前記部材搭載面における前記電極の表面それぞれの一部領域を含む抵抗体形成領域上に形成された抵抗体と；前記部材搭載表面における抵抗体形成領域以外の領域であって、前記電極の表面の一部領域を含む領域上に、前記抵抗体と空隙によって隔てられているように形成された外部接続用導体パターンと；を備えるプリント配線板を提供する。これによって、高い抵抗値を有し、かつ、その抵抗値が安定して精度の良いものである抵抗素子、及びその抵抗素子を備えるプリント配線板を提供することができる。
PCT/JP2007/065167 2007-02-06 2007-08-02 プリント配線板及びそのプリント配線板の製造方法 WO2008096464A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2007800216555A CN101467501B (zh) 2007-02-06 2007-08-02 印制电路板及该印制电路板的制造方法
JP2008556989A JP4702904B2 (ja) 2007-02-06 2007-08-02 プリント配線板及びそのプリント配線板の製造方法
TW096129632A TWI389607B (zh) 2007-02-06 2007-08-10 印刷配線板及該印刷配線板之製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US88837707P 2007-02-06 2007-02-06
US60/888377 2007-02-06

Publications (1)

Publication Number Publication Date
WO2008096464A1 true WO2008096464A1 (ja) 2008-08-14

Family

ID=39675190

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/065167 WO2008096464A1 (ja) 2007-02-06 2007-08-02 プリント配線板及びそのプリント配線板の製造方法

Country Status (6)

Country Link
US (2) US7902463B2 (ja)
JP (1) JP4702904B2 (ja)
KR (1) KR101002500B1 (ja)
CN (1) CN101467501B (ja)
TW (1) TWI389607B (ja)
WO (1) WO2008096464A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020535629A (ja) * 2018-08-20 2020-12-03 エルジー・ケム・リミテッド 透明発光素子ディスプレイ用埋め込み型電極基板およびその製造方法

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US8125086B2 (en) * 2008-05-28 2012-02-28 Hynix Semiconductor Inc. Substrate for semiconductor package
CN102107559A (zh) * 2009-12-25 2011-06-29 山东华菱电子有限公司 一种热敏打印头的制造方法
JP2012028511A (ja) * 2010-07-22 2012-02-09 On Semiconductor Trading Ltd 回路基板およびその製造方法、回路装置およびその製造方法、絶縁層付き導電箔
CN102958275B (zh) * 2011-08-31 2017-02-15 鸿富锦精密工业（深圳）有限公司 电路板
CN103898498B (zh) * 2012-12-28 2016-06-01 富葵精密组件(深圳)有限公司 黑化药水及透明印刷电路板的制作方法
CN106576424B (zh) * 2014-08-29 2020-08-25 拓自达电线株式会社 柔性印刷配线板用增强部件和具备柔性印刷配线板用增强部件的柔性印刷配线板
CN109673099B (zh) * 2017-10-13 2020-09-01 欣兴电子股份有限公司 多层线路结构及其制作方法

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JPH0258890A (ja) * 1988-08-25 1990-02-28 Murata Mfg Co Ltd 銅張積層板
JPH045887A (ja) * 1990-04-23 1992-01-09 Mitsubishi Gas Chem Co Inc 印刷部品搭載プリント配線板の製造法
JPH1145955A (ja) * 1997-07-28 1999-02-16 Kyocera Corp 素子内蔵多層配線基板およびその製造方法
JPH11103170A (ja) * 1997-09-29 1999-04-13 Kyocera Corp 抵抗体内蔵多層セラミック回路基板
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Publication number Priority date Publication date Assignee Title
JPH0258890A (ja) * 1988-08-25 1990-02-28 Murata Mfg Co Ltd 銅張積層板
JPH045887A (ja) * 1990-04-23 1992-01-09 Mitsubishi Gas Chem Co Inc 印刷部品搭載プリント配線板の製造法
JPH1145955A (ja) * 1997-07-28 1999-02-16 Kyocera Corp 素子内蔵多層配線基板およびその製造方法
JPH11103170A (ja) * 1997-09-29 1999-04-13 Kyocera Corp 抵抗体内蔵多層セラミック回路基板
JP2003092460A (ja) * 2001-06-05 2003-03-28 Dainippon Printing Co Ltd 受動素子を備えた配線板の製造方法、受動素子を備えた配線板
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020535629A (ja) * 2018-08-20 2020-12-03 エルジー・ケム・リミテッド 透明発光素子ディスプレイ用埋め込み型電極基板およびその製造方法

Also Published As

Publication number Publication date
KR20080087083A (ko) 2008-09-30
US20080185172A1 (en) 2008-08-07
US20100021627A1 (en) 2010-01-28
CN101467501A (zh) 2009-06-24
TW200835404A (en) 2008-08-16
TWI389607B (zh) 2013-03-11
US7902463B2 (en) 2011-03-08
KR101002500B1 (ko) 2010-12-17
CN101467501B (zh) 2011-07-20
JPWO2008096464A1 (ja) 2010-05-20
JP4702904B2 (ja) 2011-06-15
US8621748B2 (en) 2014-01-07

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