JP2012191203A5 - - Google Patents

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Publication number
JP2012191203A5
JP2012191203A5 JP2012044983A JP2012044983A JP2012191203A5 JP 2012191203 A5 JP2012191203 A5 JP 2012191203A5 JP 2012044983 A JP2012044983 A JP 2012044983A JP 2012044983 A JP2012044983 A JP 2012044983A JP 2012191203 A5 JP2012191203 A5 JP 2012191203A5
Authority
JP
Japan
Prior art keywords
pwb
conductive
conductive plate
vertical axis
plates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012044983A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012191203A (ja
Filing date
Publication date
Priority claimed from US13/040,841 external-priority patent/US8717773B2/en
Application filed filed Critical
Publication of JP2012191203A publication Critical patent/JP2012191203A/ja
Publication of JP2012191203A5 publication Critical patent/JP2012191203A5/ja
Pending legal-status Critical Current

Links

JP2012044983A 2011-03-04 2012-03-01 マルチプレートの基板埋込みキャパシタ及びその製造方法 Pending JP2012191203A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/040,841 US8717773B2 (en) 2011-03-04 2011-03-04 Multi-plate board embedded capacitor and methods for fabricating the same
US13/040,841 2011-03-04

Publications (2)

Publication Number Publication Date
JP2012191203A JP2012191203A (ja) 2012-10-04
JP2012191203A5 true JP2012191203A5 (enExample) 2015-04-16

Family

ID=45841250

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012044983A Pending JP2012191203A (ja) 2011-03-04 2012-03-01 マルチプレートの基板埋込みキャパシタ及びその製造方法

Country Status (7)

Country Link
US (1) US8717773B2 (enExample)
EP (1) EP2496059B1 (enExample)
JP (1) JP2012191203A (enExample)
CN (1) CN102711374A (enExample)
AU (1) AU2012201295B2 (enExample)
CA (1) CA2769923C (enExample)
IN (1) IN2012DE00544A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8963615B1 (en) 2013-01-31 2015-02-24 General Electric Company Automatic bipolar signal switching
US20220104344A1 (en) * 2019-01-18 2022-03-31 Nano Dimension Technologies Ltd. Integrated printed circuit boards and methods of fabrication
US10984957B1 (en) * 2019-12-03 2021-04-20 International Business Machines Corporation Printed circuit board embedded capacitor
CN112435984B (zh) * 2020-11-24 2022-09-06 复旦大学 半导体衬底、制备方法以及电子元器件
CN113503939A (zh) * 2021-08-23 2021-10-15 石河子大学 非接触式种箱料位实时监测系统

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* Cited by examiner, † Cited by third party
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JP5089880B2 (ja) * 2005-11-30 2012-12-05 日本特殊陶業株式会社 配線基板内蔵用キャパシタ、キャパシタ内蔵配線基板及びその製造方法
KR100793916B1 (ko) 2006-04-05 2008-01-15 삼성전기주식회사 인쇄회로기판 내장형 커패시터의 제조방법
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