JP2012191203A - マルチプレートの基板埋込みキャパシタ及びその製造方法 - Google Patents

マルチプレートの基板埋込みキャパシタ及びその製造方法 Download PDF

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Publication number
JP2012191203A
JP2012191203A JP2012044983A JP2012044983A JP2012191203A JP 2012191203 A JP2012191203 A JP 2012191203A JP 2012044983 A JP2012044983 A JP 2012044983A JP 2012044983 A JP2012044983 A JP 2012044983A JP 2012191203 A JP2012191203 A JP 2012191203A
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JP
Japan
Prior art keywords
conductive
pwb
conductive plate
vertical axis
plates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012044983A
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English (en)
Japanese (ja)
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JP2012191203A5 (enExample
Inventor
Z Abawi Daniel
ダニエル・ジィー・アバウィ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of JP2012191203A publication Critical patent/JP2012191203A/ja
Publication of JP2012191203A5 publication Critical patent/JP2012191203A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/33—Thin- or thick-film capacitors (thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09618—Via fence, i.e. one-dimensional array of vias
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
JP2012044983A 2011-03-04 2012-03-01 マルチプレートの基板埋込みキャパシタ及びその製造方法 Pending JP2012191203A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/040,841 US8717773B2 (en) 2011-03-04 2011-03-04 Multi-plate board embedded capacitor and methods for fabricating the same
US13/040,841 2011-03-04

Publications (2)

Publication Number Publication Date
JP2012191203A true JP2012191203A (ja) 2012-10-04
JP2012191203A5 JP2012191203A5 (enExample) 2015-04-16

Family

ID=45841250

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012044983A Pending JP2012191203A (ja) 2011-03-04 2012-03-01 マルチプレートの基板埋込みキャパシタ及びその製造方法

Country Status (7)

Country Link
US (1) US8717773B2 (enExample)
EP (1) EP2496059B1 (enExample)
JP (1) JP2012191203A (enExample)
CN (1) CN102711374A (enExample)
AU (1) AU2012201295B2 (enExample)
CA (1) CA2769923C (enExample)
IN (1) IN2012DE00544A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022517370A (ja) * 2019-01-18 2022-03-08 ナノ ディメンション テクノロジーズ，リミテッド プリント回路基板の集積化および加工方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8963615B1 (en) 2013-01-31 2015-02-24 General Electric Company Automatic bipolar signal switching
US10984957B1 (en) * 2019-12-03 2021-04-20 International Business Machines Corporation Printed circuit board embedded capacitor
CN112435984B (zh) * 2020-11-24 2022-09-06 复旦大学 半导体衬底、制备方法以及电子元器件
CN113503939A (zh) * 2021-08-23 2021-10-15 石河子大学 非接触式种箱料位实时监测系统

Citations (7)

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JPS6224685A (ja) * 1985-07-24 1987-02-02 臼井　一紀 コンデンサ組込み配線基板
JPH0479203A (ja) * 1990-07-20 1992-03-12 Tdk Corp Ｌｃ共振器内蔵の多層基板
JPH05205966A (ja) * 1992-01-24 1993-08-13 Murata Mfg Co Ltd 積層コンデンサ
JPH0878804A (ja) * 1994-09-07 1996-03-22 Nikon Corp 配線基板
JP2004235374A (ja) * 2003-01-29 2004-08-19 Kyocera Corp コンデンサ内蔵基板及びチップ状コンデンサ
JP2007013186A (ja) * 2005-07-01 2007-01-18 Kofukin Seimitsu Kogyo (Shenzhen) Yugenkoshi プリント回路基板アセンブリー
JP2009032741A (ja) * 2007-07-24 2009-02-12 Nec Saitama Ltd 回路基板、回路基板装置、携帯電話装置および基板接続方法

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US5774326A (en) * 1995-08-25 1998-06-30 General Electric Company Multilayer capacitors using amorphous hydrogenated carbon
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JP4945842B2 (ja) * 2000-04-05 2012-06-06 イビデン株式会社 プリント配線板及びプリント配線板の製造方法
JP2002158135A (ja) * 2000-11-16 2002-05-31 Tdk Corp 電子部品
US6532143B2 (en) * 2000-12-29 2003-03-11 Intel Corporation Multiple tier array capacitor
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US6459561B1 (en) * 2001-06-12 2002-10-01 Avx Corporation Low inductance grid array capacitor
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KR100455890B1 (ko) 2002-12-24 2004-11-06 삼성전기주식회사 커패시터 내장형 인쇄회로기판 및 그 제조 방법
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KR100793916B1 (ko) 2006-04-05 2008-01-15 삼성전기주식회사 인쇄회로기판 내장형 커패시터의 제조방법
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JP2010052970A (ja) * 2008-08-27 2010-03-11 Murata Mfg Co Ltd セラミック組成物、セラミックグリーンシート、及びセラミック電子部品
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6224685A (ja) * 1985-07-24 1987-02-02 臼井　一紀 コンデンサ組込み配線基板
JPH0479203A (ja) * 1990-07-20 1992-03-12 Tdk Corp Ｌｃ共振器内蔵の多層基板
JPH05205966A (ja) * 1992-01-24 1993-08-13 Murata Mfg Co Ltd 積層コンデンサ
JPH0878804A (ja) * 1994-09-07 1996-03-22 Nikon Corp 配線基板
JP2004235374A (ja) * 2003-01-29 2004-08-19 Kyocera Corp コンデンサ内蔵基板及びチップ状コンデンサ
JP2007013186A (ja) * 2005-07-01 2007-01-18 Kofukin Seimitsu Kogyo (Shenzhen) Yugenkoshi プリント回路基板アセンブリー
JP2009032741A (ja) * 2007-07-24 2009-02-12 Nec Saitama Ltd 回路基板、回路基板装置、携帯電話装置および基板接続方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022517370A (ja) * 2019-01-18 2022-03-08 ナノ ディメンション テクノロジーズ，リミテッド プリント回路基板の集積化および加工方法

Also Published As

Publication number Publication date
CA2769923A1 (en) 2012-09-04
IN2012DE00544A (enExample) 2015-06-05
EP2496059B1 (en) 2025-05-21
US8717773B2 (en) 2014-05-06
AU2012201295A1 (en) 2012-09-20
EP2496059A3 (en) 2013-10-09
CA2769923C (en) 2020-01-07
AU2012201295B2 (en) 2015-05-14
US20120224333A1 (en) 2012-09-06
EP2496059A2 (en) 2012-09-05
CN102711374A (zh) 2012-10-03

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