CN100574553C - 印刷电路板 - Google Patents

印刷电路板 Download PDF

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Publication number
CN100574553C
CN100574553C CNB2006100632882A CN200610063288A CN100574553C CN 100574553 C CN100574553 C CN 100574553C CN B2006100632882 A CNB2006100632882 A CN B2006100632882A CN 200610063288 A CN200610063288 A CN 200610063288A CN 100574553 C CN100574553 C CN 100574553C
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pcb
circuit board
printed circuit
via hole
power module
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Expired - Fee Related
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CN101170866A (zh
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张喨尧
许寿国
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to CNB2006100632882A priority Critical patent/CN100574553C/zh
Priority to US11/829,974 priority patent/US20080099231A1/en
Publication of CN101170866A publication Critical patent/CN101170866A/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09618—Via fence, i.e. one-dimensional array of vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

一种印刷电路板，包括一接地层和一电源层，所述电源层包括被一隔离块隔离的两电源块，所述印刷电路板还包括若干连接所述电源层与接地层的过孔，所述过孔分布于所述两电源块上邻近所述隔离块处并被绝缘材料环绕而不与相应的电源块接触。所述电源块、所述过孔和所述接地层形成一接地路径，所述接地路径使所述两电源块中的一电源块向另一电源块耦合的噪声传导至地，从而抑制所述两电源块间的噪声耦合。

Description

印刷电路板
技术领域
本发明涉及一种印刷电路板。
背景技术
在现今印刷电路板上，芯片往往需要多种不同的电压以支持不同的运算要求，因此，需要将印刷电路板的电源层切割成多个电源块，以提供不同的电压。由于不同的电源块的电压不同，故设置一个隔离块隔离相邻的电源块。此外，部分芯片为了避免来自其它芯片的噪声干扰，即使使用相同的电压，对应的电源块仍设置适当的隔离块。
如图1所示，传统的印刷电路板包括一接地层100、一电源层200和两电子元件A、B。所述电源层200包括两电源块210、220，和将两电源块隔离的隔离块230。所述电源层200与所述接地层100之间填充玻璃纤维材料(图未示)，所述隔离块230为玻璃纤维材料。所述电子元件A、B位于所述印刷电路板的表层，并分别与所述电源块210、220电连接(图未示)。虽然两电源块210、220通过所述隔离块230相互隔离，但所述电子元件A输出的信号在高速切换操作时，仍有噪声通过所述隔离块230所存在的电容性耦合结构，从所述电源块210跨越该隔离块230，耦合至所述电源块220，使所述电子元件B输入的信号受到噪声干扰，从而可能造成所述电子元件B的误动作。
加宽所述电源块210、220之间的距离可有效抑制噪声耦合，然而，在保持所述电源层200面积不变的情况下加宽所述电源块210、220之间的距离，会减小所述电源层200承载电流的能力，在保持所述两电源块210、220面积不变的情况下加宽所述电源块210、220之间的距离，会增加所述电源层200的面积，影响印刷电路板的布线空间。
发明内容
鉴于以上内容，有必要提供一种可抑制电源块间噪声耦合的印刷电路板。
一种印刷电路板，包括一接地层和一电源层，所述电源层包括被一隔离块隔离的两电源块，所述印刷电路板还包括若干连接所述电源层与接地层的过孔，所述过孔分布于所述两电源块上邻近所述隔离块处并被绝缘材料环绕而不与相应的电源块接触，每一电源块通过所述过孔与所述接地层形成接地路径。
相较现有技术，每一电源块分别与对应过孔形成一电容性耦合结构，所述电源块、所述过孔和所述接地层形成一接地路径，使所述电容性耦合结构等效为一接地电容，因而，所述两电源块中的一电源块向另一电源块耦合的噪声，经过相应的等效的接地电容传导至地，从而抑制所述两电源块间的噪声耦合。
附图说明
图1是传统的印刷电路板示意图。
图2是本发明印刷电路板的较佳实施方式的示意图。
图3是图2的俯视图。
图4是本发明印刷电路板的较佳实施方式与图1所示的印刷电路板的频率响应比较示意图。
具体实施方式
请参阅图2及图3，本发明印刷电路板的较佳实施方式包括一接地层10、一电源层20和若干过孔24。所述电源层20包括两电源块21、22及将两电源块21、22隔离的一隔离块23。所述两电源块21、22共用所述接地层10。所述电源层20与所述接地层10之间填充玻璃纤维材料(图未示)，所述隔离块23为玻璃纤维材料。所述过孔24连接所述电源层20及所述接地层10，所述过孔24分布于所述两电源块21、22上邻近所述隔离块23，还被绝缘材料形成的圆环26环绕而不与所述电源块21、22接触。位于所述电源块21上的过孔24与位于所述电源块22上的过孔24相对所述隔离块23呈对称分布，形成过孔栅栏。
所述电源块21、22分别与所述过孔栅栏形成一电容性耦合结构，所述电源块21、22分别通过所述过孔栅栏和所述接地层10形成接地路径，使所述电容性耦合结构等效为一接地电容。因而，由电源块21向电源块22耦合的噪声，经过所述电源块21与所述过孔栅栏的等效的接地电容传导至地，由电源块22向电源块21耦合的噪声，经过所述电源块22与所述过孔栅栏形成的等效的接地电容传导至地。
所述印刷电路板中过孔24的个数没有限制，位于所述电源块21上的过孔的数量与位于所述电源块22上的过孔数量可任意设定，但采用位于所述电源块21上的过孔24与位于所述电源块22上的过孔24相对所述隔离块23成对称分布的排列方式对噪声的抑制效果较好。
请参阅图4，在传统的印刷电路板和本发明印刷电路板的较佳实施方式上模拟插入损耗，曲线1为图1所示的传统的印刷电路板频率响应曲线，曲线2为采用本发明较佳实施方式且具有8个过孔24的印刷电路板的频率响应曲线，曲线3为采用本发明另一较佳实施方式且具有52个过孔24的印刷电路板的频率响应曲线。对比曲线1和曲线2、3可以看出，在第一个共振频率出现前的频段(0～0.9GHz)内，具有接地过孔栅栏的结构，无论接地过孔数量多少，相较于传统的印刷电路板，插入损耗值均有所降低。而插入损耗值越低，则表示对噪声耦合的抑制效果越好。而具有52个过孔的印刷电路板插入损耗值比传统的印刷电路板的插入损耗值要低4.5dB以上。故本发明印刷电路板与传统的印刷电路板相比能够更好的抑制电源块间噪声耦合，而且，过孔24的数量越多排列越密集时，抑制噪声的效果越好。

Claims (6)

1.一种印刷电路板，包括一接地层和一电源层，所述电源层包括被一隔离块隔离的两电源块，其特征在于，所述印刷电路板还包括若干连接所述电源层与接地层的过孔，所述过孔分布于所述两电源块上邻近所述隔离块处并被绝缘材料环绕而不与相应的电源块接触，每一电源块通过所述过孔与所述接地层形成接地路径。
2.如权利要求1所述的印刷电路板，其特征在于，所述过孔密集排列形成过孔栅栏。
3.如权利要求1所述的印刷电路板，其特征在于，所述过孔以所述隔离块为中心对称分布。
4.如权利要求1所述的印刷电路板，其特征在于，所述电源层与所述接地层之间填充玻璃纤维材料。
5.如权利要求1所述的印刷电路板，其特征在于，所述隔离块为玻璃纤维材料。
6.如权利要求2所述的印刷电路板，其特征在于，每一电源块分别与所述过孔栅栏形成一电容性耦合结构。
CNB2006100632882A 2006-10-25 2006-10-25 印刷电路板 Expired - Fee Related CN100574553C (zh)

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CNB2006100632882A CN100574553C (zh) 2006-10-25 2006-10-25 印刷电路板
US11/829,974 US20080099231A1 (en) 2006-10-25 2007-07-30 Printed circuit board able to suppress simultaneous switching noise

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CNB2006100632882A CN100574553C (zh) 2006-10-25 2006-10-25 印刷电路板

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CN100574553C true CN100574553C (zh) 2009-12-23

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109922594A (zh) * 2017-12-12 2019-06-21 广达电脑股份有限公司 印刷电路板结构

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CN101188902B (zh) * 2006-11-17 2011-08-24 鸿富锦精密工业（深圳）有限公司 印刷电路板
CN102711362A (zh) * 2011-03-28 2012-10-03 鸿富锦精密工业（深圳）有限公司 印刷电路板
US20130021739A1 (en) * 2011-07-20 2013-01-24 International Business Machines Corporation Multi-layer Printed Circuit Board With Power Plane Islands To Isolate Noise Coupling
TW201316895A (zh) * 2011-10-14 2013-04-16 Hon Hai Prec Ind Co Ltd 可抑制電磁干擾的電路板
CN107318215A (zh) * 2016-04-26 2017-11-03 鸿富锦精密电子(天津)有限公司 印刷电路板及应用该印刷电路板的电子装置

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CN1809249A (zh) * 2005-01-12 2006-07-26 三星电子株式会社 多层印刷电路板

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US5714801A (en) * 1995-03-31 1998-02-03 Kabushiki Kaisha Toshiba Semiconductor package
CN2549687Y (zh) * 2002-06-14 2003-05-07 威盛电子股份有限公司 一种包含有平滑弧状边界的电源区块的电源层
CN1809249A (zh) * 2005-01-12 2006-07-26 三星电子株式会社 多层印刷电路板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109922594A (zh) * 2017-12-12 2019-06-21 广达电脑股份有限公司 印刷电路板结构

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