CN101137271B - 印刷电路板 - Google Patents

印刷电路板 Download PDF

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Publication number
CN101137271B
CN101137271B CN200610062434XA CN200610062434A CN101137271B CN 101137271 B CN101137271 B CN 101137271B CN 200610062434X A CN200610062434X A CN 200610062434XA CN 200610062434 A CN200610062434 A CN 200610062434A CN 101137271 B CN101137271 B CN 101137271B
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printed circuit
pcb
circuit board
holding wire
power
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Expired - Fee Related
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CN101137271A (zh
Inventor
张喨尧
许寿国
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to CN200610062434XA priority Critical patent/CN101137271B/zh
Priority to US11/760,800 priority patent/US20080053687A1/en
Publication of CN101137271A publication Critical patent/CN101137271A/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09336—Signal conductors in same plane as power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts

Abstract

一种印刷电路板，包括一接地层和一电源层，所述电源层包括两电源块和一信号线，所述信号线设置于所述两电源块之间并通过隔离块与所述两电源块隔离，所述信号线通过至少一过孔与所述接地层相连接。所述信号线、所述过孔和所述接地层形成一接地路径，所述接地路径使所述两电源块中的一电源块向另一电源块耦合的噪声传导至地，从而抑制所述两电源块间的噪声耦合。

Description

印刷电路板
技术领域
本发明涉及一种印刷电路板。
背景技术
在现今印刷电路板上，芯片往往需要多种不同的电压以支持不同的运算要求，因此，需要将印刷电路板的电源层切割成多个电源块，以提供不同的电压。由于不同的电源块的电压不同，故设置一个隔离块隔离相邻的电源块。此外，部份芯片为了避免来自其它芯片的噪声干扰，即使使用相同的电压，对应的电源块仍设置适当的隔离块。
如图1所示，传统的印刷电路板包括一接地层100、一电源层200和两电子元件A、B。所述电源层200包括两电源块210、220，和将两电源块隔离的隔离块230。所述电源层200与所述接地层100之间填充玻璃纤维材料，所述隔离块230为玻璃纤维材料。所述电子元件A、B位于所述印刷电路板的表层，并分别与所述电源块210、220电连接(图未示)。虽然两电源块210、220通过所述隔离块230相互隔离，但所述电子元件A输出的信号在高速切换操作时，仍有噪声通过所述隔离块230所存在的电容性耦合结构，从所述电源块210跨越该隔离块230，耦合至所述电源块220，使所述电子元件B输入的信号受到噪声干扰，从而可能造成所述电子元件B的误动作。
加宽所述电源块210、220之间的距离可有效抑制噪声耦合，然而，在保持所述电源层200面积不变的情况下加宽所述电源块210、220之间的距离，会减小所述电源层200承载电流的能力，在保持所述两电源块210、220面积不变的情况下加宽所述电源块210、220之间的距离，会增加所述电源层200的面积，影响印刷电路板的布线空间。
发明内容
鉴于以上内容，有必要提供一种可抑制电源块间噪声耦合的印刷电路板。
一种印刷电路板，包括一接地层和一电源层，所述电源层包括两电源块和一信号线，所述信号线设置于所述两电源块之间并通过隔离块与所述两电源块隔离，所述信号线通过至少一过孔与所述接地层相连接。
相较现有技术，每一电源块分别与所述信号线形成一电容性耦合结构，所述信号线、所述过孔和所述接地层形成一接地路径，使所述电容性耦合结构等效为一接地电容，因而，所述两电源块中的一电源块向另一电源块耦合的噪声，经过相应的等效的接地电容传导至地，从而抑制所述两电源块间的噪声耦合。
附图说明
图1是传统的印刷电路板示意图。
图2是本发明印刷电路板的第一较佳实施方式的示意图。
图3是本发明印刷电路板的第二较佳实施方式的示意图。
图4是本发明印刷电路板的第一、第二较佳实施方式与传统的印刷电路板的频率响应比较示意图。
具体实施方式
请参阅图2，本发明印刷电路板的第一较佳实施方式包括一接地层10、一电源层20和三个过孔30、40、50。所述电源层20包括两电源块21、22、将两电源块21、22隔离的两隔离块23和一位于两隔离块23之间的信号线24。所述电源层20与所述接地层10之间填充玻璃纤维材料，所述两隔离块23为玻璃纤维材料。所述电源层20包括一前缘20a和一后缘20b，所述两隔离块23从所述前缘20a延伸至所述后缘20b。所述信号线24设置于所述电源块21、22之间，从所述前缘20a延伸至所述后缘20b，并通过所述两隔离块23与所述电源块21、22隔离。所述过孔30、40、50连接所述信号线24与所述接地层10。
所述电源块21、22分别与所述信号线24形成一电容性耦合结构，所述信号线24通过所述过孔30、40、50和所述接地层10形成接地路径，使所述电容性耦合结构等效为一接地电容。因而，由电源块21向电源块22耦合的噪声，经过所述电源块21与所述信号线24形成的等效的接地电容传导至地，由电源块22向电源块21耦合的噪声，经过所述电源块22与所述信号线24形成的等效的接地电容传导至地。
所述印刷电路板中连接所述信号线24与所述接地层10的过孔个数不局限于三个，可以为一个、两个或更多个。
请参阅图3，本发明印刷电路板的第二较佳实施方式包括一接地层10’、一电源层20’和一过孔60’。所述电源层20’包括两电源块21’、22’、将两电源块21’、22’隔离的两隔离块23’和一信号线24’。所述信号线24’通过所述过孔60’与所述接地层10’相连接。
请参阅图4，在传统的印刷电路板和本发明印刷电路板的较佳实施方式上模拟插入损耗，曲线1为传统的印刷电路板频率响应曲线，曲线2、3分别为本发明印刷电路板第一较佳实施方式、第二较佳实施方式的频率响应曲线。对比曲线1和曲线2、3可以看出，在第一个共振频率出现前的频段(0～0.7GHz)内，本发明印刷电路板第一较佳实施方式、第二较佳实施方式的插入损耗值比传统的印刷电路板的插入损耗值要低12dB以上。而插入损耗值越低，则表示对噪声耦合的抑制效果越好。故本发明印刷电路板与传统的印刷电路板相比能够更好的抑制电源块间噪声耦合。
此外，将两电源块隔离的隔离块可为一个连续的整体，此时信号线被隔离块所围绕，而不与电源层前缘和后缘接触。

Claims (8)

1.一种印刷电路板，包括一接地层和一电源层，所述电源层包括两电源块，其特征在于，所述电源层还包括一信号线，所述信号线设置于所述两电源块之间并通过隔离块与所述两电源块隔离，所述信号线通过至少一过孔与所述接地层相连接。
2.如权利要求1所述的印刷电路板，其特征在于，所述电源层包括一前缘和一后缘，所述隔离块从所述前缘延伸至所述后缘。
3.如权利要求2所述的印刷电路板，其特征在于，所述信号线从所述前缘延伸至所述后缘。
4.如权利要求2所述的印刷电路板，其特征在于，所述信号线被隔离块所围绕而不与所述电源层的前缘和后缘接触。
5.如权利要求1所述的印刷电路板，其特征在于，所述电源层与所述接地层之间填充玻璃纤维材料。
6.如权利要求1所述的印刷电路板，其特征在于，所述隔离块为玻璃纤维材料。
7.如权利要求1所述的印刷电路板，其特征在于，每一电源块分别与所述信号线形成一电容性耦合结构。
8.如权利要求7所述的印刷电路板，其特征在于，所述信号线、所述过孔和所述接地层形成一接地路径。
CN200610062434XA 2006-09-01 2006-09-01 印刷电路板 Expired - Fee Related CN101137271B (zh)

Priority Applications (2)

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CN200610062434XA CN101137271B (zh) 2006-09-01 2006-09-01 印刷电路板
US11/760,800 US20080053687A1 (en) 2006-09-01 2007-06-11 Printed circuit board able to suppress simultaneous switching noise

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Application Number Priority Date Filing Date Title
CN200610062434XA CN101137271B (zh) 2006-09-01 2006-09-01 印刷电路板

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CN101137271B true CN101137271B (zh) 2011-06-08

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Publication number Priority date Publication date Assignee Title
KR20100084379A (ko) * 2009-01-16 2010-07-26 삼성전자주식회사 인쇄회로기판
CN102711362A (zh) * 2011-03-28 2012-10-03 鸿富锦精密工业（深圳）有限公司 印刷电路板
CN110086434A (zh) * 2019-02-28 2019-08-02 厦门优迅高速芯片有限公司 一种提升跨阻放大电路中rssi脚抗噪能力的电路
CN110492758A (zh) * 2019-09-26 2019-11-22 苏州英威腾电力电子有限公司 一种高压功率单元及高压变频器

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GB9526652D0 (en) * 1995-12-29 1996-02-28 Shine Thomas A Electrode assembly
ATE241228T1 (de) * 1999-08-31 2003-06-15 Sun Microsystems Inc System und verfahren zur analyse von störsignalen bei gleichzeitigem schalten
US6657130B2 (en) * 2001-09-20 2003-12-02 International Business Machines Corporation Electrical and physical design integration method and apparatus for providing interconnections on first level ceramic chip carrier packages

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