CN101378618B - 印刷电路板 - Google Patents
印刷电路板 Download PDFInfo
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- CN101378618B CN101378618B CN2007102015529A CN200710201552A CN101378618B CN 101378618 B CN101378618 B CN 101378618B CN 2007102015529 A CN2007102015529 A CN 2007102015529A CN 200710201552 A CN200710201552 A CN 200710201552A CN 101378618 B CN101378618 B CN 101378618B
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- differential
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- circuit board
- wiring
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09236—Parallel layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09336—Signal conductors in same plane as power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09672—Superposed layout, i.e. in different planes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S439/00—Electrical connectors
- Y10S439/941—Crosstalk suppression
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
一种印刷电路板,包括两信号层及一介质层,所述介质层位于两信号层之间,所述两信号层内具有两差分对,所述两差分对中的正相位差分线位于所述两信号层中的一信号层内,所述两差分对中的负相位差分线位于所述两信号层中的另一信号层内,所述两差分对的差分线在所述两信号层内成交错式布线,每一信号层内位于差分线的两侧还设有用于提供电流回流路径的参考接地部。所述印刷电路板可大幅减少差分对间的串音干扰。
Description
技术领域
本发明涉及一种印刷电路板,特别涉及一种可降低串音干扰及节省布线空间的印刷电路板。
背景技术
串音干扰是电路板上走线之间、连接线之间,走线与连接线以及其他电子元件之间由于电磁场干扰而引起的电磁耦合。现有的印刷电路板布线方式,主要有直角布线、45度角布线、差分布线、蛇形布线等。由于差分信号主要应用在高速电路设计中,所以高速电路中最关键的信号都采用差分布线的方式。
如图1所示,为现有一种差分布线方式的局部布线图,在图中,信号层1 00位于介质层300与介质层400之间,信号层200位于介质层400与介质层500之间,介质层300又位于信号层100与参考接地层600之间,介质层500又位于信号层200与参考接地层700之间,差分对110的一正相位差分线TX+及一负相位差分线TX-同时在信号层100上布线,另一差分对1 20的一正相位差分线RX+及一负相位差分线RX-同时在信号层100上布线。所述参考接地层600用于为信号层100上的差分线TX+及TX-提供电流回流路径,所述参考接地层700用于为信号层200上的差分线RX+及RX-提供电流回流路径。
但现有差分布线存在以下的缺陷:每一差分对中的差分线均布线在同一信号层中,这种传统的布线方式使得相邻两信号层中的差分对之间不可避免地存在串音干扰,容易造成电路的误动,从而降低整个系统的性能,这是印刷电路板布线应所述避免的情形。且传统布线方式中的参考接地层为单独按层布线,故占据了一定的布线空间。
发明内容
鉴于以上内容,有必要提供一种可降低印刷电路板信号间串音串扰的印刷电路板。
一种印刷电路板,包括两信号层及一介质层,所述介质层位于两信号层之间,所述两信号层内具有两差分对,所述两差分对中的正相位差分线位于所述两信号层中的一信号层内,所述两差分对中的负相位差分线位于所述两信号层中的另一信号层内,所述两差分对的差分线在所述两信号层内成交错式布线,每一信号层内位于差分线的两侧还设有用于提供电流回流路径的参考接地部。
相较现有技术,印刷电路板中的差分对采用所述层间交错式布线,可大幅减少差分对间的串扰,有助于改善信号传输质量、提高整个系统性能。
附图说明
下面参考附图结合具体实施方式对本发明作进一步的说明。
图1为现有一种印刷电路板的局部布线图。
图2为本发明印刷电路板的较佳实施方式的局部布线图。
具体实施方式
请参考图2,本发明印刷电路板的较佳实施方式包括一第一信号层10、一第二信号层20、一第一介质层30、一第二介质层40及一第三介质层50。所述第一信号层10位于所述第一介质层30与第二介质层40之间,所述第二信号层20位于所述第二介质层40与第三介质层50之间。
所述第一信号层10与所述第二信号层20为相邻的信号层,所述两信号层内具有若干差分对,如差分对12(包括一正相位差分线TX+、一负相位差分线TX-)及差分对14(包括一正相位差分线RX+、一负相位差分线RX-),其他差分对未示出,本实施方式仅以上述两差分对举例说明,其他差分对布线可类推,这里不再赘述。
所述差分对12的正相位差分线TX+及差分对14的正相位差分线RX+位于所述第一信号层10内且其两侧设有参考接地部16,所述差分对12的负相位差分线TX-及差分对14的负相位差分线RX-位于所述第二信号层20内且其两侧设有参考接地部22,所述差分对12的差分线TX+、TX-及差分对14的差分线RX+、RX-在所述第一信号层10及第二信号层20内成交错式布线,即所述差分对12的正相位差分线TX+与负相位差分线TX-成对角交错布线,差分对14的正相位差分线RX+与负相位RX-也成对角交错布线,并且两相邻差分线间距离相等,亦即差分线TX+与RX+、RX+与TX-、TX-与RX-、RX-与TX+之间的垂直距离均相等。其中,所述参考接地部16用于为第一信号层10上的差分线TX+及RX+提供电流回流路径,所述参考接地部22用于为第二信号层20上的差分线TX-及RX-提供电流回流路径。
设所述差分线RX+对TX+的串扰系数为K21,差分线RX+对TX-的串扰系数为K24,差分线RX-对TX+的串扰系数为K31,差分线RX-对TX-的串扰系数为K34则所述差分对12与差分对14之间的串扰系数K=(K21-K24)-(K31-K34)。由于所述差分对12的差分线TX+、TX-及差分对14的差分线RX+、RX-在所述第一信号层10及第二信号层20内成正方形交错式布线,即结构上对称,且串扰系数与导线距离的平方成反比,则易知,K21=K24及K31=K34,故所述差分对12与差分对14之间的串扰系数K理论上等干零,此时差分串扰达到最小。
采用上述层间交错式布线方法,可以大幅减少差分对之间的串音干扰,有助于改善信号传输质量,提高整个系统性能;且所述布线中的参考接地部代替的传统布线方式中的参考接地层,且所述参考接地层是布线于信号层中而未单独按层布线,从而大大节省了印刷电路板布线空间。
Claims (2)
1.一种印刷电路板,包括两信号层及一介质层,所述介质层位于两信号层之间,其特征在于:所述两信号层内具有两差分对,所述两差分对中的正相位差分线位于所述两信号层中的一信号层内,所述两差分对中的负相位差分线位于所述两信号层中的另一信号层内,所述两差分对的差分线在所述两信号层内成交错式布线,每一信号层内位于差分线的两侧还设有用于提供电流回流路径的参考接地部。
2.如权利要求1所述的印刷电路板,其特征在于:所述两差分对中相邻两差分线间距离相等。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2007102015529A CN101378618B (zh) | 2007-08-31 | 2007-08-31 | 印刷电路板 |
US11/941,979 US7635814B2 (en) | 2007-08-31 | 2007-11-19 | Printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN2007102015529A CN101378618B (zh) | 2007-08-31 | 2007-08-31 | 印刷电路板 |
Publications (2)
Publication Number | Publication Date |
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CN101378618A CN101378618A (zh) | 2009-03-04 |
CN101378618B true CN101378618B (zh) | 2010-09-29 |
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CN2007102015529A Expired - Fee Related CN101378618B (zh) | 2007-08-31 | 2007-08-31 | 印刷电路板 |
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US (1) | US7635814B2 (zh) |
CN (1) | CN101378618B (zh) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101562939B (zh) * | 2008-04-18 | 2011-05-04 | 鸿富锦精密工业(深圳)有限公司 | 软性电路板 |
CN102316672A (zh) * | 2010-07-05 | 2012-01-11 | 鸿富锦精密工业(深圳)有限公司 | 印刷电路板 |
JP5211185B2 (ja) * | 2011-02-10 | 2013-06-12 | 株式会社フジクラ | プリント配線板 |
CN102566682B (zh) * | 2011-12-31 | 2014-04-09 | 曙光信息产业股份有限公司 | 刀片服务器主板 |
JP5904638B2 (ja) * | 2012-04-11 | 2016-04-13 | 株式会社日本マイクロニクス | 多層配線基板とその製造方法 |
US9545003B2 (en) * | 2012-12-28 | 2017-01-10 | Fci Americas Technology Llc | Connector footprints in printed circuit board (PCB) |
CN103902772B (zh) * | 2014-03-28 | 2017-01-18 | 清华大学 | 基于交错型引脚结构的等长差分对逃逸布线方法 |
KR102346406B1 (ko) * | 2015-05-13 | 2021-12-31 | 인텔 코포레이션 | 이중 층 유전체 구조물을 가진 패키지 |
CN105188266A (zh) * | 2015-08-27 | 2015-12-23 | 浪潮电子信息产业股份有限公司 | 一种dual模式高速信号线立体布线的方法 |
CN105472868B (zh) * | 2015-11-20 | 2019-02-12 | Oppo广东移动通信有限公司 | 一种柔性印制电路板及移动终端 |
CN109451651A (zh) | 2018-10-23 | 2019-03-08 | 惠科股份有限公司 | 一种电路板的差分走线及电路板 |
CN111385965B (zh) * | 2020-04-17 | 2023-03-03 | 歌尔光学科技有限公司 | 印制电路板 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
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US5357050A (en) * | 1992-11-20 | 1994-10-18 | Ast Research, Inc. | Apparatus and method to reduce electromagnetic emissions in a multi-layer circuit board |
US5966056A (en) * | 1996-01-26 | 1999-10-12 | Int Labs, Inc. | Method and apparatus for enabling the transmission of multiple wide bandwidth electrical signals |
US6089923A (en) | 1999-08-20 | 2000-07-18 | Adc Telecommunications, Inc. | Jack including crosstalk compensation for printed circuit board |
US6486405B2 (en) * | 2000-12-01 | 2002-11-26 | Hon Hai Precision Ind. Co., Ltd. | Arrangement of differential pair for eliminating crosstalk in high speed application |
US6994569B2 (en) * | 2001-11-14 | 2006-02-07 | Fci America Technology, Inc. | Electrical connectors having contacts that may be selectively designated as either signal or ground contacts |
TWI306009B (en) | 2003-11-11 | 2009-02-01 | Hon Hai Prec Ind Co Ltd | Arrangement of differential pairs for eliminating crosstalk in high speed digital circuit |
JP4206045B2 (ja) * | 2004-01-28 | 2009-01-07 | 株式会社ワイケーシー | 差動信号用帯域通過フィルター及びこれを複数備える多周波アンテナ |
US7166000B2 (en) * | 2004-12-07 | 2007-01-23 | Commscope Solutions Properties, Llc | Communications connector with leadframe contact wires that compensate differential to common mode crosstalk |
US7335976B2 (en) * | 2005-05-25 | 2008-02-26 | International Business Machines Corporation | Crosstalk reduction in electrical interconnects using differential signaling |
US7414322B2 (en) * | 2005-07-29 | 2008-08-19 | Lsi Corporation | High speed interface design |
US7621781B2 (en) * | 2007-03-20 | 2009-11-24 | Tyco Electronics Corporation | Electrical connector with crosstalk canceling features |
-
2007
- 2007-08-31 CN CN2007102015529A patent/CN101378618B/zh not_active Expired - Fee Related
- 2007-11-19 US US11/941,979 patent/US7635814B2/en not_active Expired - Fee Related
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Publication number | Publication date |
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CN101378618A (zh) | 2009-03-04 |
US7635814B2 (en) | 2009-12-22 |
US20090056983A1 (en) | 2009-03-05 |
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