CN101562939B - 软性电路板 - Google Patents

软性电路板 Download PDF

Info

Publication number
CN101562939B
CN101562939B CN2008103012096A CN200810301209A CN101562939B CN 101562939 B CN101562939 B CN 101562939B CN 2008103012096 A CN2008103012096 A CN 2008103012096A CN 200810301209 A CN200810301209 A CN 200810301209A CN 101562939 B CN101562939 B CN 101562939B
Authority
CN
China
Prior art keywords
flexible circuit
circuit board
ground plane
differential pair
transmission lines
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2008103012096A
Other languages
English (en)
Other versions
CN101562939A (zh
Inventor
白育彰
许寿国
刘建宏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CN2008103012096A priority Critical patent/CN101562939B/zh
Priority to US12/211,057 priority patent/US20090260860A1/en
Publication of CN101562939A publication Critical patent/CN101562939A/zh
Application granted granted Critical
Publication of CN101562939B publication Critical patent/CN101562939B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0253—Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09236—Parallel layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09336—Signal conductors in same plane as power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0969—Apertured conductors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths

Abstract

一种软性电路板，包括至少一信号层，所述信号层的上方和下方分别设有一接地层，所述信号层与相邻的接地层之间均填充一层绝缘介质，所述信号层上布设一差分对，所述差分对包括两条差分传输线，每一接地层上与所述差分对垂直相对的部分为一挖空区域，每一接地层上挖空区域的两边缘分别与其相邻的差分传输线间具有一第一水平间距。所述软性电路板可传输高速信号，并消除现有技术中网格化接地层所衍生的共模噪音问题。所述软性电路板无需增加额外成本，只需调整现有布线方式即可实现。

Description

软性电路板
技术领域
本发明涉及一种软性电路板，特别涉及一种可传输高速差分信号的软性电路板。
背景技术
软性电路板是用柔性的绝缘基材制成的印刷电路板，具有许多硬性印刷电路板不具备的优点。例如软性电路板厚度较薄，可以自由弯曲、卷绕、折叠，可依照空间布局要求任意安排，并在三维空间任意移动和伸缩，从而达到元器件装配和导线连接的一体化。利用软性电路板可大大缩小电子产品的体积，适用电子产品向高密度、小型化、高可靠性方向发展的需要。因此，软性电路板在航天、军事、移动通讯、手提电脑、计算机外设、PDA、数码相机等领域或产品上得到了广泛的应用。
因为软性电路板厚度极薄，软性电路板上的传输线的阻抗偏低，因为传输高速信号要求较高的传输线阻抗，在软性电路板上，即使一般制程可达到的最细传输线宽度，例如4密尔(1密尔＝0.0254毫米)，也难以达到高速信号传输线阻抗的要求。
参考图1，现有技术提高传输线阻抗的方法，是将软性电路板50的接地层参考铜箔切割成网格状。但如果在信号层上传输差分对51时，会因为差分传输线52和差分传输线54对应的接地层铜箔网格排布不同，导致共模噪音的产生，这也是一般软性电路板无法传输高速差分信号的原因。
发明内容
鉴于上述内容，有必要提供一种可传输高速差分信号的软性电路板。
一种软性电路板，包括至少一信号层，所述信号层的上方和下方分别设有一接地层，所述信号层与相邻的接地层之间均填充一层绝缘介质，所述信号层上布设一差分对，所述差分对包括两条差分传输线，每一接地层上与所述差分对垂直相对的部分为一挖空区域，每一接地层上挖空区域的两边缘分别与其相邻的差分传输线间具有一第一水平间距。
所述软性电路板是在所述接地层上，将与所述差分对垂直对应的两相邻接地层部分挖空，避免差分对与相邻接地层的间距太近所导致的传输线阻抗偏低问题的产生。本发明软性电路板可传输高速信号，并消除现有技术中网格化接地层所衍生的共模噪音问题。本发明软性电路板无需增加额外成本，只需调整现有布线方式即可实现。
附图说明
下面参照附图结合具体实施方式对本发明作进一步的描述。
图1为现有技术软性电路板的结构示意图。
图2为本发明软性电路板较佳实施方式的结构示意图。
具体实施方式
请参照图2，本发明软性电路板的较佳实施方式包括一信号层10及分别位于所述信号层10上、下的两接地层30，在信号层10及每一接地层30之间填充一层绝缘介质20。一差分对11包括两条差分传输线12及14，并布线于所述信号层10上。每一接地层30上，与所述差分传输线12及14所垂直相对的部分作挖空处理，以避免差分对11与相邻接地层30之间的垂直距离太近所导致的传输线阻抗偏低问题的产生，每一接地层30未挖空的部分与其相邻差分传输线12或14具有一水平间距d1，图2中每一接地层30上覆盖的材料为铜箔，其中央的矩形挖空区域32即是将接地层30上的铜箔挖空所形成的。在所述信号层10上，所述差分对11的两侧平行设置有与差分对11长度相等的接地导电材料，本较佳实施方式中所述接地导电材料为铜箔16，每一接地铜箔16与其对应相邻的传输线12及14具有一水平间距d2。所述水平间距d1和d2根据差分对11传输的信号不同而不同，所述水平间距d1和d2可根据差分对11传输不同信号时的阻抗要求，考虑软性电路板上每条差分传输线12及14的线宽、两条差分传输线12及14的间距、信号层10上接地铜箔16的宽度，经由仿真软件仿真后确定。也可不在所述信号层10上布设接地铜箔，仅通过调整所述水平间距d1来调整所述差分传输线12及14的阻抗，以实现高速信号的传输。
若在所述软性电路板上布设多个差分对，即至少有一个接地层的上下两个相邻信号层上都布设有差分对，则在所述接地层上具有两个挖空区域，在实际操作中，为避免一个差分对的挖空区域对另一个差分对造成影响，而差生杂讯信号，所述两个挖空区域相邻的边缘之间的水平距离应该不小于填充在每一信号层与该接地层之间的绝缘介质厚度的三倍。
所述软性电路板是在布有差分对11的信号层10的上下两相邻的接地层30上，将与差分对11的两传输线12、14垂直对应的部分挖空，避免差分对11与相邻接地层30的间距太近所导致的传输线阻抗偏低问题的产生，并选择性地在差分对11的两侧平行设置接地铜箔16，通过仿真软体仿真后设定每一接地层30未挖空的部分与其相邻差分传输线12或14的水平间距d1，以及所述接地铜箔16与传输线12、14的水平间距d2。本发明软性电路板可传输高速信号，并消除现有技术中网格化接地层所衍生的共模噪音问题。本发明软性电路板无需增加额外成本，只需调整现有布线方式即可实现。

Claims (4)

1.一种软性电路板，包括至少一信号层，所述信号层的上方和下方分别设有一接地层，所述信号层与相邻的接地层之间均填充一层绝缘介质，所述信号层上布设一差分对，所述差分对包括两条差分传输线，其特征在于：每一接地层上与所述差分对垂直相对的部分为一挖空区域，每一接地层上挖空区域的两边缘分别与其相邻的差分传输线间具有一第一水平间距，所述信号层上还在所述差分对两侧分别平行设置有一条与差分对长度相等的接地导电材料，每一条接地导电材料与与其相邻的差分传输线间具有一第二水平间距。
2.如权利要求1所述的软性电路板，其特征在于：所述接地导电材料为铜箔。
3.如权利要求1所述的软性电路板，其特征在于：所述接地层上的材料为铜箔。
4.如权利要求1所述的软性电路板，其特征在于：所述软性电路板有两信号层，所述两信号层间的接地层对应所述两信号层的差分对所挖空区域的相邻边缘间的水平间距大于所述绝缘介质的厚度的三倍。 
CN2008103012096A 2008-04-18 2008-04-18 软性电路板 Expired - Fee Related CN101562939B (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2008103012096A CN101562939B (zh) 2008-04-18 2008-04-18 软性电路板
US12/211,057 US20090260860A1 (en) 2008-04-18 2008-09-15 Flexible printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2008103012096A CN101562939B (zh) 2008-04-18 2008-04-18 软性电路板

Publications (2)

Publication Number Publication Date
CN101562939A CN101562939A (zh) 2009-10-21
CN101562939B true CN101562939B (zh) 2011-05-04

Family

ID=41200165

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008103012096A Expired - Fee Related CN101562939B (zh) 2008-04-18 2008-04-18 软性电路板

Country Status (2)

Country Link
US (1) US20090260860A1 (zh)
CN (1) CN101562939B (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101102337B1 (ko) * 2008-05-28 2012-01-03 엘지전자 주식회사 연성필름
US8361896B2 (en) 2010-06-25 2013-01-29 Fci Signal transmission for high speed interconnections
JP5436361B2 (ja) * 2010-07-30 2014-03-05 日東電工株式会社 配線回路基板およびその製造方法
GB201119046D0 (en) * 2011-11-04 2011-12-14 Rolls Royce Plc Electrial harness
US9545003B2 (en) * 2012-12-28 2017-01-10 Fci Americas Technology Llc Connector footprints in printed circuit board (PCB)
KR101416159B1 (ko) * 2013-09-06 2014-07-14 주식회사 기가레인 접촉 패드를 구비하는 인쇄회로기판
CN104812159B (zh) * 2014-01-29 2018-02-23 株式会社起家来人 包含接触垫的印刷电路板
US10079158B2 (en) 2014-12-12 2018-09-18 Intel Corporation Vertical trench routing in a substrate
CN105430896B (zh) * 2015-12-29 2018-06-29 广东欧珀移动通信有限公司 柔性电路板及移动终端
CN111447724A (zh) * 2019-12-16 2020-07-24 瑞声科技(新加坡)有限公司 传输线
CN115023026B (zh) * 2021-10-27 2023-04-14 荣耀终端有限公司 电路板和电子设备

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006100384A (ja) * 2004-09-28 2006-04-13 Oki Data Corp プリント配線基板及びインタフェース制御装置
CN1852635A (zh) * 2005-04-23 2006-10-25 鸿富锦精密工业（深圳）有限公司 高频信号电路板的改进结构
JP2007150000A (ja) * 2005-11-29 2007-06-14 Canon Inc プリント配線板

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6556089B2 (en) * 1999-01-22 2003-04-29 Multigig Limited Electronic circuitry
TWI306009B (en) * 2003-11-11 2009-02-01 Hon Hai Prec Ind Co Ltd Arrangement of differential pairs for eliminating crosstalk in high speed digital circuit
US20060151869A1 (en) * 2005-01-10 2006-07-13 Franz Gisin Printed circuit boards and the like with improved signal integrity for differential signal pairs
JP2008300803A (ja) * 2007-06-04 2008-12-11 Toshiba Corp フレキシブル配線基板および電子機器
CN101370351B (zh) * 2007-08-17 2012-05-30 鸿富锦精密工业（深圳）有限公司 软性电路板
CN101378618B (zh) * 2007-08-31 2010-09-29 鸿富锦精密工业（深圳）有限公司 印刷电路板
CN101394707B (zh) * 2007-09-21 2011-11-30 鸿富锦精密工业（深圳）有限公司 软性电路板

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006100384A (ja) * 2004-09-28 2006-04-13 Oki Data Corp プリント配線基板及びインタフェース制御装置
CN1852635A (zh) * 2005-04-23 2006-10-25 鸿富锦精密工业（深圳）有限公司 高频信号电路板的改进结构
JP2007150000A (ja) * 2005-11-29 2007-06-14 Canon Inc プリント配線板

Also Published As

Publication number Publication date
CN101562939A (zh) 2009-10-21
US20090260860A1 (en) 2009-10-22

Similar Documents

Publication Publication Date Title
CN101370351B (zh) 软性电路板
CN101562939B (zh) 软性电路板
CN101861051B (zh) 软性电路板
CN101394707B (zh) 软性电路板
CN101861050A (zh) 软性电路板
CN101965096A (zh) 软性电路板
CN101568225B (zh) 软性电路板
CN101594732A (zh) 电路板
US9131602B2 (en) Printed circuit board for mobile platforms
CN103514996B (zh) 复合式软性电路排线
US20190198195A1 (en) Transmission line, flat cable, and electronic device
US7975378B1 (en) Method of manufacturing high speed printed circuit board interconnects
CN102083268A (zh) 软性电路板
CN203040005U (zh) 印制电路板
US8336203B2 (en) Printed circuit board and layout method thereof
US9905918B2 (en) Electronic apparatus and land grid array module
CN101909401B (zh) 印刷电路板结构
CN211297148U (zh) 一种pcb板结构及信号测试设备
CN108112162A (zh) 信号传输线及其设计方法、柔性印刷电路板
CN104752904A (zh) 连接器
CN112770493B (zh) 柔性线路板及电子设备
CN104619112A (zh) 多电路层电路板
TWI393514B (zh) 軟性電路板
CN106455300B (zh) 电路板及移动终端
CN112566353A (zh) 一种电路板及通信设备

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110504

Termination date: 20150418

EXPY Termination of patent right or utility model